TI SN74ABT573ADW

SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
LE
1D
2D
3D
4D
5D
6D
7D
8D
20
2D
1D
OE
VCC
1
SN54ABT573 . . . FK PACKAGE
(TOP VIEW)
19 1Q
18 2Q
2
3
3D
4D
5D
6D
7D
17 3Q
16 4Q
4
5
15 5Q
14 6Q
6
7
13 7Q
12 8Q
8
9
10
11
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
2Q
3Q
4Q
5Q
6Q
8D
GND
LE
8Q
7Q
20
VCC
1
LE
OE
1D
2D
3D
4D
5D
6D
7D
8D
GND
JEDEC Standard JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
SN74ABT573A . . . RGY PACKAGE
(TOP VIEW)
OE
SN54ABT573 . . . J OR W PACKAGE
SN74ABT573A . . . DB, DW, N, NS,
OR PW PACKAGE
(TOP VIEW)
D
GND
D
D
D Latch-Up Performance Exceeds 500 mA Per
<1 V at VCC = 5 V, TA = 25°C
High-Drive Outputs (−32-mA IOH, 64-mA IOL)
Ioff Supports Partial-Power-Down Mode
Operation
1Q
D Typical VOLP (Output Ground Bounce)
description/ordering information
These 8-bit latches feature 3-state outputs designed specifically for driving highly capacitive or relatively
low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers.
ORDERING INFORMATION
Tube
SN74ABT573AN
SN74ABT573AN
QFN − RGY
Tape and reel
SN74ABT573ARGYR
AB573A
Tube
SN74ABT573ADW
Tape and reel
SN74ABT573ADWR
SOP − NS
Tape and reel
SN74ABT573ANSR
ABT573A
SSOP − DB
Tape and reel
SN74ABT573ADBR
AB573A
Tube
SN74ABT573APW
Tape and reel
SN74ABT573APWR
TSSOP − PW
VFBGA − GQN
VFBGA − ZQN (Pb-free)
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
PDIP − N
SOIC − DW
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
ABT573A
AB573A
SN74ABT573AGQNR
Tape and reel
SN74ABT573AZQNR
AB573A
CDIP − J
Tube
SNJ54ABT573J
SNJ54ABT573J
CFP − W
Tube
SNJ54ABT573W
SNJ54ABT573W
LCCC − FK
Tube
SNJ54ABT573FK
SNJ54ABT573FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
! "#$ ! %#&'" ($)
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POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
description/ordering information (continued)
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus
lines without need for interface or pullup components.
OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
SN74ABT573A . . . GQN OR ZQN PACKAGE
(TOP VIEW)
1
2
3
terminal assignments
4
1
2
3
4
A
A
1D
OE
B
3D
3Q
VCC
2D
1Q
B
C
C
5D
4D
5Q
4Q
D
D
7D
7Q
6D
6Q
E
E
GND
8D
LE
8Q
2Q
FUNCTION TABLE
(each latch)
INPUTS
OE
LE
D
OUTPUT
Q
L
H
H
H
L
H
L
L
L
L
X
Q0
H
X
X
Z
logic diagram (positive logic)
OE
LE
1
11
C1
1D
2
19
1D
To Seven Other Channels
Pin numbers shown are for the DB, DW, FK, J, N, NS, PW, RGY, and W packages.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1Q
SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V
Current into any output in the low state, IO: SN54ABT573 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74ABT573A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 2): GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
(see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
(see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
SN54ABT573
MAX
MIN
MAX
4.5
5.5
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
IOH
IOL
High-level output current
VCC
−24
Low-level output current
∆t/∆v
Input transition rise or fall rate
High-level input voltage
SN74ABT573A
MIN
2
2
0.8
Input voltage
0
Outputs enabled
V
V
0.8
0
UNIT
V
VCC
−32
mA
V
48
64
mA
5
5
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V,
II = −18 mA
IOH = −3 mA
VCC = 5 V,
VCC = 4.5 V
VOL
VCC = 4.5 V
Vhys
II
TA = 25°C
TYP†
MAX
SN54ABT573
MIN
MAX
−1.2
SN74ABT573A
MIN
−1.2
MAX
−1.2
2.5
2.5
2.5
IOH = −3 mA
IOH = −24 mA
3
3
3
2
2
IOH = −32 mA
IOL = 48 mA
2*
IOL = 64 mA
0.55
0.55*
Ioff
ICEX
IO§
VI = VCC or GND
VO = 2.7 V
VCC = 5.5 V,
VCC = 0,
VO = 0.5 V
VI or VO ≤ 4.5 V
VCC = 5.5 V,
VCC = 5.5 V,
VO = 5.5 V
VO = 2.5 V
0.55
ICC
∆ICC¶
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
Ci
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
±1
10‡
−10‡
±100
Outputs high
VCC = 5.5 V, IO = 0,
VI = VCC or GND
V
mV
±1
10‡
−10‡
50
−50
V
2
0.55
VCC = 5.5 V,
VCC = 5.5 V,
UNIT
V
100
IOZH
IOZL
Co
MIN
50
−50
−180
−50
±1
10‡
−10‡
µA
±100
µA
50
µA
−180
mA
µA
µA
−100
−180
Outputs high
1
250
250
250
µA
Outputs low
24
30
30
30
mA
Outputs disabled
0.5
250
250
250
µA
1.5
1.5
1.5
mA
3.5
pF
6.5
pF
* On products compliant to MIL-PRF-38535, this parameter does not apply.
† All typical values are at VCC = 5 V.
‡ This data sheet limit may vary among suppliers.
§ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
SN54ABT573
VCC = 5 V,
TA = 25°C
MIN
4
tw
Pulse duration, LE high
tsu
Setup time, data before LE↓
th
Hold time, data after LE↓
POST OFFICE BOX 655303
MIN
UNIT
MAX
3.3
3.3
High
1.9
2.5
Low
1.5
2.5
1
2.5
• DALLAS, TEXAS 75265
MAX
ns
ns
ns
SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
SN74ABT573A
VCC = 5 V,
TA = 25°C
MIN
tw
tsu
Pulse duration, LE high
Setup time, data before LE↓
MIN
UNIT
MAX
3.3
3.3
High
1.9
1.9
Low
1.5
1.8†
1.5
1.8†
th
Hold time, data after LE↓
† This data-sheet limit may vary among suppliers.
MAX
ns
ns
ns
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54ABT573
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
D
Q
tPLH
tPHL
LE
Q
tPZH
tPZL
OE
Q
tPHZ
tPLZ
OE
Q
VCC = 5 V,
TA = 25°C
MIN
MAX
MIN
TYP
MAX
1.9
3.2
5.4
1.4
6.4
2.2
4.2
5.7
1.6
6.7
2.2
4
6.1
2
7.1
3.2
5.2
6.7
2.8
7.5
1.2
3.2
4.7
0.8
6.2
2.7
4.7
6.2
2
7.2
2.5
4.9
6.4
2.2
7.7
2
4.2
6
1.4
7
UNIT
ns
ns
ns
ns
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN74ABT573A
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
D
Q
tPLH
tPHL
LE
Q
tPZH
tPZL
OE
Q
tPHZ
tPLZ
OE
Q
VCC = 5 V,
TA = 25°C
MIN
MAX
MIN
TYP
MAX
1.9
3.2
5.4
1.9
5.9
2.2
4.2
5.7
2.2
6.2
2.2
4
6.1
2.2
6.6
3.2
5.2
6.7
3.2
7.2
1.2
2.5†
3.2
4.7
6.2
1.2
2.5†
5.2
4.7
2.5
4.9
6.4
2.5
6.7
7.1†
2
4.2
6
2
6.5
UNIT
ns
ns
ns
ns
† This data-sheet limit may vary among suppliers.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCBS190F − JANUARY 1991 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
S1
7V
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
3V
th
3V
Input
1.5 V
1.5 V
0V
Data Input
1.5 V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
3V
1.5 V
Input
1.5 V
0V
1.5 V
1.5 V
VOL
Output
tPLZ
3.5 V
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at Open
(see Note B)
VOL + 0.3 V
VOL
tPHZ
tPZH
VOH
1.5 V
1.5 V
0V
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLH
tPHL
1.5 V
tPZL
VOH
Output
3V
Output
Control
tPHL
tPLH
1.5 V
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9321901Q2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9321901QRA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
1
TBD
Call TI
N / A for Pkg Type
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
5962-9321901QSA
ACTIVE
CFP
W
20
SN74ABT573ADBLE
OBSOLETE
SSOP
DB
20
SN74ABT573ADBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573ADBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573ADBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573ADWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573ADWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573ADWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573ADWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573ADWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573AGQNR
NRND
GQN
20
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74ABT573AN
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ABT573ANE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ABT573ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573ANSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573ANSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573APW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573APWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573APWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573APWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
SN74ABT573APWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573APWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT573APWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Addendum-Page 1
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2008
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74ABT573ARGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74ABT573ARGYRG4
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74ABT573AZQNR
ACTIVE
ZQN
20
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SNJ54ABT573FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54ABT573J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54ABT573W
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74ABT573ADBR
SN74ABT573ADWR
SN74ABT573AGQNR
Package Package Pins
Type Drawing
SSOP
SOIC
BGA MI
CROSTA
R JUNI
OR
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
GQN
20
1000
330.0
12.4
3.3
4.3
1.5
8.0
12.0
Q1
SN74ABT573APWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
SN74ABT573ARGYR
QFN
RGY
20
1000
180.0
12.4
3.8
4.8
1.6
8.0
12.0
Q1
ZQN
20
1000
330.0
12.4
3.3
4.3
1.5
8.0
12.0
Q1
SN74ABT573AZQNR
BGA MI
CROSTA
R JUNI
OR
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ABT573ADBR
SSOP
DB
20
2000
346.0
346.0
33.0
SN74ABT573ADWR
SOIC
DW
20
2000
346.0
346.0
41.0
SN74ABT573AGQNR
BGA MICROSTAR
JUNIOR
GQN
20
1000
346.0
346.0
29.0
SN74ABT573APWR
TSSOP
PW
20
2000
346.0
346.0
33.0
SN74ABT573ARGYR
QFN
RGY
20
1000
190.5
212.7
31.8
SN74ABT573AZQNR
BGA MICROSTAR
JUNIOR
ZQN
20
1000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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