TI SN74ABTH16244DLR

SN54ABTH16244, SN74ABTH16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS677D – SEPTEMBER 1996 – REVISED MARCH 2000
D
D
D
D
D
D
D
D
D
D
SN54ABTH16244 . . . WD PACKAGE
SN74ABTH16244 . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Members of the Texas Instruments
Widebus Family
State-of-the-Art EPIC-ΙΙB  BiCMOS Design
Significantly Reduces Power Dissipation
1OE
1Y1
1Y2
GND
1Y3
1Y4
VCC
2Y1
2Y2
GND
2Y3
2Y4
3Y1
3Y2
GND
3Y3
3Y4
VCC
4Y1
4Y2
GND
4Y3
4Y4
4OE
Latch-Up Performance Exceeds 500 mA Per
JESD 17
Typical VOLP (Output Ground Bounce)
<1 V at VCC = 5 V, TA = 25°C
Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB
Layout
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Package Options Include Plastic Shrink
Small-Outline (DL), Thin Shrink
Small-Outline (DGG), Thin Very
Small-Outline (DGV) Packages, and 380-mil
Fine-Pitch Ceramic Flat (WD) Packages
description
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
2OE
1A1
1A2
GND
1A3
1A4
VCC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
VCC
4A1
4A2
GND
4A3
4A4
3OE
The ’ABTH16244 devices are 16-bit buffers and
line drivers designed specifically to improve both
the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented
receivers and transmitters. These devices can be
used as four 4-bit buffers, two 8-bit buffers, or one
16-bit buffer. These devices provide true outputs
and symmetrical active-low output-enable (OE)
inputs.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN54ABTH16244 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74ABTH16244 is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated.
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54ABTH16244, SN74ABTH16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS677D – SEPTEMBER 1996 – REVISED MARCH 2000
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
logic symbol†
1OE
2OE
1
EN1
48
25
3OE
4OE
1A1
1A2
1A3
1A4
2A1
2A2
2A3
2A4
3A1
3A2
3A3
3A4
4A1
4A2
4A3
4A4
24
EN2
EN3
EN4
47
1
1
46
3
44
5
43
6
41
40
1
2
8
9
38
11
37
12
36
13
35
1
3
14
33
16
32
17
30
1
4
19
29
20
27
22
26
23
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
2
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1Y1
1Y2
1Y3
1Y4
2Y1
2Y2
2Y3
2Y4
3Y1
3Y2
3Y3
3Y4
4Y1
4Y2
4Y3
4Y4
SN54ABTH16244, SN74ABTH16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS677D – SEPTEMBER 1996 – REVISED MARCH 2000
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2A3
2A4
1
3OE
47
2
46
3
44
5
43
6
1Y1
3A1
1Y2
3A2
1Y3
3A3
1Y4
3A4
48
4OE
41
8
40
9
38
11
37
12
2Y1
4A1
2Y2
4A2
2Y3
4A3
2Y4
4A4
25
36
13
35
14
33
16
32
17
3Y1
3Y2
3Y3
3Y4
24
30
19
29
20
27
22
26
23
4Y1
4Y2
4Y3
4Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
Current into any output in the low state, IO: SN54ABTH16244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74ABTH16244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54ABTH16244, SN74ABTH16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS677D – SEPTEMBER 1996 – REVISED MARCH 2000
recommended operating conditions (see Note 3)
SN54ABTH16244
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
IOH
IOL
High-level output current
∆t/∆v
Input transition rise or fall rate
High-level input voltage
SN74ABTH16244
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
2
2
0.8
Input voltage
0
Low-level output current
Outputs enabled
0
V
V
0.8
VCC
–24
UNIT
VCC
–32
V
V
mA
48
64
mA
10
10
ns/V
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V,
II = –18 mA
IOH = –3 mA
VCC = 5 V,
VCC = 4
4.5
5V
VOL
VCC = 4
4.5
5V
Vhys
II
VCC = 5.5 V,
5V
VCC = 4
4.5
IOZH
IOZL
VCC = 5.5 V,
VCC = 5.5 V,
Ioff
VCC = 0,
VCC = 5.5 V,
VO = 5.5 V
IO‡
VCC = 5.5 V,
ICC
VCC = 5.5 V,
IO = 0,
VI = VCC or GND
MIN
–1.2
MAX
SN74ABTH16244
MIN
–1.2
2.5
2.5
IOH = –3 mA
IOH = –24 mA
3
3
3
2
2
IOH = –32 mA
IOL = 48 mA
2*
IOL = 64 mA
VI = VCC or GND
VI = 0.8 V
VI = 2 V
VO = 2.7 V
0.55
100
–40
–40
–40
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
10
10
–10
–10
±100
50
–100
Outputs disabled
Ci
±1
100
Outputs low
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
±1
100
Outputs high
POST OFFICE BOX 655303
V
mV
±1
–50
V
V
0.55
0.55*
VO = 0.5 V
VI or VO ≤ 4.5 V
VO = 2.5 V
Outputs high
UNIT
2
0.55
–180
50
–50
–180
–50
µA
µA
10
µA
–10
µA
±100
µA
50
µA
–180
mA
3
3
3
32
32
32
3
3
3
1.5
1.5
1.5
mA
mA
3
pF
8
pF
* On products compliant to MIL-PRF-38535, this parameter does not apply.
† All typical values are at VCC = 5 V.
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
§ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
4
MAX
–1.2
2.5
∆ICC§
Co
SN54ABTH16244
100
II(hold)
I(h ld)
ICEX
TA = 25°C
MIN TYP†
MAX
• DALLAS, TEXAS 75265
SN54ABTH16244, SN74ABTH16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS677D – SEPTEMBER 1996 – REVISED MARCH 2000
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
PARAMETER
VCC = 5 V,
TA = 25°C
SN54ABTH16244
SN74ABTH16244
MIN
TYP
MAX
MIN
MAX
MIN
MAX
1
2.3
3.2
0.7
3.6
1
3.5
1
2.6
3.7
0.5
4.2
1
4.1
1
3
3.8
0.7
4.9
1
4.8
1
3.2
4
0.9
5.3
1
4.8
1
3.6
4.4
0.7
5.3
1
4.8
1
2.9
3.7
1
4.6
1
4.1
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
5
SN54ABTH16244, SN74ABTH16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS677D – SEPTEMBER 1996 – REVISED MARCH 2000
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
S1
7V
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
3V
th
3V
Input
1.5 V
1.5 V
0V
Data Input
1.5 V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
VOH
1.5 V
Output
1.5 V
VOL
VOH
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
1.5 V
0V
tPZL
tPLZ
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLH
tPHL
Output
3V
Output
Control
tPHL
tPLH
1.5 V
Output
Waveform 2
S1 at Open
(see Note B)
1.5 V
3.5 V
VOL + 0.3 V
VOL
tPHZ
tPZH
1.5 V
VOH – 0.3 V
VOH
≈0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
1
5962-9762401QXA
ACTIVE
CFP
WD
48
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ABTH16244DGGRG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ABTH16244DLRG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABTH16244DGGR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABTH16244DL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABTH16244DLG4
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABTH16244DLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54ABTH16244WD
ACTIVE
CFP
WD
48
TBD
A42 SNPB
MSL Peak Temp (3)
74ABTH16244DGGRE4
1
TBD
Lead/Ball Finish
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74ABTH16244DGGR
DGG
48
SITE 41
330
24
8.6
15.8
1.8
12
24
Q1
SN74ABTH16244DLR
DL
48
SITE 41
330
32
11.35
16.2
3.1
16
32
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74ABTH16244DGGR
DGG
48
SITE 41
346.0
346.0
41.0
SN74ABTH16244DLR
DL
48
SITE 41
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997
WD (R-GDFP-F**)
CERAMIC DUAL FLATPACK
48 LEADS SHOWN
0.120 (3,05)
0.075 (1,91)
0.009 (0,23)
0.004 (0,10)
1.130 (28,70)
0.870 (22,10)
0.370 (9,40)
0.250 (6,35)
0.390 (9,91)
0.370 (9,40)
0.370 (9,40)
0.250 (6,35)
48
1
0.025 (0,635)
A
0.014 (0,36)
0.008 (0,20)
25
24
NO. OF
LEADS**
48
56
A MAX
0.640
(16,26)
0.740
(18,80)
A MIN
0.610
(15,49)
0.710
(18,03)
4040176 / D 10/97
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification only
Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA
GDFP1-F56 and JEDEC MO -146AB
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated