SN74AC08-Q1 QUADRUPLE 2-INPUT POSITIVE-AND GATE SCAS789A − NOVEMBER 2004 − REVISED JANUARY 2008 D D D D Qualified for Automotive Applications 2-V to 6-V VCC Operation Inputs Accept Voltages to 6 V Max tpd of 7.5 ns at 5 V D OR PW PACKAGE (TOP VIEW) 1A 1B 1Y 2A 2B 2Y GND description/ordering information The SN74AC08 device is a quadruple 2-input positive-AND gate. This device performs the Boolean function Y = A B or Y = A + B in positive logic. 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y ORDERING INFORMATION† −40°C 40°C to 125°C ORDERABLE PART NUMBER PACKAGE‡ TA TOP-SIDE MARKING SOIC − D Tape and reel SN74AC08QDRQ1 AC08Q TSSOP − PW Tape and reel SN74AC08QPWRQ1 AC08Q † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. FUNCTION TABLE (each gate) INPUTS A B OUTPUT Y H H H L X L X L L logic diagram, each gate (positive logic) A Y B Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright © 2008, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74AC08-Q1 QUADRUPLE 2-INPUT POSITIVE-AND GATE SCAS789A − NOVEMBER 2004 − REVISED JANUARY 2008 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) VCC Supply voltage VCC = 3 V VIH High-level High level input voltage MIN MAX 2 6 Low-level Low level input voltage VI Input voltage VO Output voltage IOH IOL High-level High level output current Low-level Low level output current Δt/Δv Input transition rise or fall rate TA Operating free-air temperature V 2.1 VCC = 4.5 V 3.15 VCC = 5.5 V 3.85 VCC = 3 V VIL UNIT V 0.9 VCC = 4.5 V 1.35 VCC = 5.5 V 1.65 V 0 VCC V 0 VCC V VCC = 3 V −12 VCC = 4.5 V −24 VCC = 5.5 V −24 VCC = 3 V 12 VCC = 4.5 V 24 VCC = 5.5 V 24 8 −40 125 mA mA ns/V °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74AC08-Q1 QUADRUPLE 2-INPUT POSITIVE-AND GATE SCAS789A − NOVEMBER 2004 − REVISED JANUARY 2008 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TA = 25°C VCC MIN IOH = −50 50 μA VOH IOL = 50 μA VOL II A or B ports VI = VCC or GND ICC VI = VCC or GND, Ci VI = VCC or GND IO = 0 MIN MIN MAX 2.9 2.9 2.9 4.5 V 4.4 4.4 4.4 5.5 V 5.4 5.4 5.4 3V 2.56 2.4 2.46 4.5 V 3.86 3.7 3.76 5.5 V 4.86 4.7 UNIT MAX V 4.76 3V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 5.5 V 0.001 0.1 0.1 0.1 3V 0.36 0.5 0.44 4.5 V 0.36 0.5 0.44 5.5 V 0.36 0.5 0.44 5.5 V ±0.1 ±1 ±1 μA 5.5 V 2 40 20 μA IOL = 12 mA IOL = 24 mA MAX TA = −40°C TO 85°C 3V IOH = −12 mA IOH = −24 24 mA TYP TA = −40°C TO 125°C 5V 4.5 V pF switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V " 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL FROM (INPUT) TO (OUTPUT) A or B Y TA = 25°C TA = −40°C TO 125°C TA = −40°C TO 85°C UNIT MIN TYP MAX MIN MAX MIN MAX 1.5 7.5 9.5 1 12.5 1 10 1.5 7 8.5 1 11.5 1 9 ns switching characteristics over recommended operating free-air temperature range, VCC = 5 V " 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL FROM (INPUT) TO (OUTPUT) A or B Y TA = 25°C TA = −40°C TO 125°C TA = −40°C TO 85°C MIN TYP MAX MIN MAX MIN MAX 1.5 5.5 7.5 1 9 1 8.5 1.5 5.5 7 1 8.5 1 7.5 UNIT ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance CL = 50 pF, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz TYP 20 UNIT pF 3 SN74AC08-Q1 QUADRUPLE 2-INPUT POSITIVE-AND GATE SCAS789A − NOVEMBER 2004 − REVISED JANUARY 2008 PARAMETER MEASUREMENT INFORMATION TEST S1 tPLH/tPHL Open From Output Under Test CL = 50 pF (see Note A) S1 Open 50% VCC 50 % VCC 0V tPHL tPLH 2 × VCC 500 Ω VCC Input (see Note B) In-Phase Output 500 Ω 50% VCC tPLH tPHL Out-of-Phase Output LOAD CIRCUIT VOH 50% VCC VOL 50% VCC VOH 50% VCC VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr v 2.5 ns, tf v 2.5 ns. C. The outputs are measured one at a time, with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) SN74AC08QDRG4Q1 ACTIVE Package Type Package Drawing SOIC Pins Package Qty D 14 2500 Green (RoHS & no Sb/Br) Eco Plan (2) TBD Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-1-260C-UNLIM SN74AC08QDRQ1 ACTIVE SOIC D 14 SN74AC08QPWRG4Q1 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Call TI Call TI SN74AC08QPWRQ1 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74AC08-Q1 : Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 • Catalog: SN74AC08 • Enhanced Product: SN74AC08-EP • Military: SN54AC08 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Enhanced Product - Supports Defense, Aerospace and Medical Applications • Military - QML certified for Military and Defense Applications Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated