SN74AUC1G19 1-OF-2 DECODER/DEMULTIPLEXER www.ti.com SCES626D – MARCH 2005 – REVISED APRIL 2007 FEATURES • • • • • • • • Available in the Texas Instruments NanoFree™ Package Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation Ioff Supports Partial-Power-Down Mode Operation Sub-1-V Operable ±8-mA Output Drive at 1.8 V VCC DCK PACKAGE (TOP VIEW) DBV PACKAGE (TOP VIEW) A 1 • Max tpd of 3 ns at 1.8 V Low Power Consumption, 10-µA Max ICC Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) A 1 6 Y0 GND 2 5 VCC E 3 4 Y1 Y0 6 GND 2 5 VCC E 3 4 Y1 DRY PACKAGE (TOP VIEW) WY0 E GND 2 V5I VCC E Y1 4 EPR3 A 1 DRL PACKAGE (TOP VIEW) 6 A 1 6 Y0 GND 2 5 VCC E 3 4 Y1 YZP PACKAGE (BOTTOM VIEW) E 3 4 Y1 GND 2 5 VCC A 1 6 Y0 See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION This 1-of-2 decoder/demultiplexer is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The SN74AUC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it to the outputs Y0 (true) and Y1 (complement) when the enable (E) input signal is low. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2007, Texas Instruments Incorporated SN74AUC1G19 1-OF-2 DECODER/DEMULTIPLEXER www.ti.com SCES626D – MARCH 2005 – REVISED APRIL 2007 ORDERING INFORMATION PACKAGE (1) (2) TA –40°C to 85°C ORDERABLE PART NUMBER NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free) Reel of 3000 SN74AUC1G19YZPR U5_ SON – DRY Reel of 5000 SN74AUC1G19DRYR PREVIEW Reel of 3000 SN74AUC1G19DBVR U19_ Reel of 250 SN74AUC1G19DBVT U19_ Reel of 3000 SN74AUC1G19DCKR Reel of 250 SN74AUC1G19DCKT Reel of 4000 SN74AUC1G19DRLR SOT (SOT-23) – DBV SOT (SC-70) – DCK SOT (SOT-553) – DRL (1) (2) (3) U5_ U5_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE INPUTS OUTPUTS E A Y0 Y1 L L L H L H H L H X H H LOGIC DIAGRAM (POSITIVE LOGIC) A 6 4 E 2 TOP-SIDE MARKING (3) Submit Documentation Feedback Y0 Y1 SN74AUC1G19 1-OF-2 DECODER/DEMULTIPLEXER www.ti.com SCES626D – MARCH 2005 – REVISED APRIL 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 3.6 V VI Input voltage range (2) –0.5 3.6 V –0.5 3.6 V –0.5 VCC + 0.5 state (2) UNIT VO Voltage range applied to any output in the high-impedance or power-off VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±20 mA ±100 mA Continuous current through VCC or GND θJA Package thermal impedance (4) DBV package 206 DCK package 252 DRL package 142 DRY package 234 YZP package Tstg (1) (2) (3) (4) Storage temperature range V °C/W 132 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback 3 SN74AUC1G19 1-OF-2 DECODER/DEMULTIPLEXER www.ti.com SCES626D – MARCH 2005 – REVISED APRIL 2007 Recommended Operating Conditions (1) VCC Supply voltage High-level control input voltage MAX 0.8 2.7 VCC 3.6 0.65 × VCC 3.6 1.7 3.6 VCC = 1.1 V to 1.95 V 0 0.35 × VCC VCC = 2.3 V to 2.7 V 0 0.7 0 VCC VCC = 0.8 V VIH MIN VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 0.8 V VIL Low-level control input voltage VO Output voltage IOH High-level control output current IOL Low-level control output current Input transition rise or fall rate TA Operating free-air temperature (1) V V 0 VCC = 0.8 V –0.7 VCC = 1.1 V –3 VCC= 1.4 V –5 VCC = 1.65 V –8 VCC= 2.3 V –9 VCC = 0.8 V 0.7 VCC = 1.1 V 3 VCC = 1.4 V 5 VCC = 1.65 V 8 VCC= 2.3 V ∆t/∆v UNIT V V mA mA 9 VCC = 0.8 V to 1.95 V 20 VCC = 2.3 V to 2.7 V 15 –40 ns/V °C 85 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH VOL TEST CONDITIONS 4 MIN TYP (1) MAX 0.8 V to 2.7 V IOH = –0.7 mA 0.8 V IOH = –3 mA 1.1 V 0.8 IOH = –5 mA 1.4 V 1 IOH = –8 mA 1.65 V 1.2 IOH = –9 mA 2.3 V 1.8 IOL = 100 µA 0.8 V to 2.7 V IOL = 0.7 mA 0.8 V IOL = 3 mA 1.1 V 0.3 IOL = 5 mA 1.4 V 0.4 IOL = 8 mA 1.65 V 0.45 2.3 V 0.6 IOL = 9 mA (1) VCC IOH = –100 µA UNIT VCC – 0.1 0.55 V 0.2 0.25 V II VI = VCC or GND 0 to 2.7 V ±5 µA Ioff VI or VO = 2.7 V 0 ±10 µA ICC VI = VCC or GND, 10 µA CI VI = VCC or GND IO = 0 0.8 V to 2.7 V 2.5 V All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. Submit Documentation Feedback 3 pF SN74AUC1G19 1-OF-2 DECODER/DEMULTIPLEXER www.ti.com SCES626D – MARCH 2005 – REVISED APRIL 2007 Switching Characteristics over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd VCC = 1.1 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V FROM (INPUT) TO (OUTPUT) VCC = 0.8 V TYP MIN MAX MIN MAX MIN MAX MIN MAX A or E Y 7.5 0.5 4.6 0.4 3.0 0.3 2.4 0.2 1.7 UNIT ns Switching Characteristics over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A or E Y0 or Y1 VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V MIN MAX MIN MAX 0.5 2.8 0.4 2.0 UNIT ns Operating Characteristics TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS VCC = 0.8 V VCC = 1.2 V VCC = 1.5 V VCC =1.8 V VCC = 2.5 V TYP TYP TYP TYP TYP f = 10 MHz 13 13 13 13 14 Submit Documentation Feedback UNIT pF 5 SN74AUC1G19 1-OF-2 DECODER/DEMULTIPLEXER www.ti.com SCES626D – MARCH 2005 – REVISED APRIL 2007 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 RL From Output Under Test Open GND CL (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND RL LOAD CIRCUIT VCC CL RL V∆ 0.8 V 1.2 V ± 0.1 V 1.5 V ± 0.1 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 15 pF 15 pF 15 pF 15 pF 15 pF 30 pF 30 pF 2 kΩ 2 kΩ 2 kΩ 2 kΩ 2 kΩ 1 kΩ 500 Ω 0.1 V 0.1 V 0.1 V 0.15 V 0.15 V 0.15 V 0.15 V VCC Timing Input VCC/2 0V tw tsu th VCC VCC/2 Input VCC/2 VCC VCC/2 VCC/2 Data Input 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC VCC/2 Input VCC/2 0V tPHL tPLH VOH VCC/2 Output VCC/2 VOL tPHL VCC/2 VCC/2 VOL tPZL tPLZ VCC VCC/2 Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VCC/2 0V tPZH VOH Output Output Waveform 1 S1 at 2 × VCC (see Note B) tPLH VCC/2 VCC Output Control VOL + V∆ VOL tPHZ VCC/2 VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 22-Jul-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AUC1G19DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DBVRE4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DBVTE4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DCKTE4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DRLR ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19DRLRG4 ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G19YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 22-Jul-2008 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 22-Sep-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ SN74AUC1G19DBVR SOT-23 3000 180.0 9.2 DBV 6 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 SN74AUC1G19DBVT SOT-23 DBV 6 250 180.0 9.2 3.23 3.17 1.37 4.0 8.0 Q3 SN74AUC1G19DCKR SC70 DCK 6 3000 180.0 8.4 2.24 2.34 1.22 4.0 8.0 Q3 SN74AUC1G19DCKT SC70 DCK 6 250 180.0 8.4 2.24 2.34 1.22 4.0 8.0 Q3 SN74AUC1G19DRLR SOT DRL 6 4000 180.0 9.2 1.78 1.78 0.69 4.0 8.0 Q3 SN74AUC1G19YZPR DSBGA YZP 6 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 22-Sep-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AUC1G19DBVR SOT-23 DBV 6 3000 202.0 201.0 28.0 SN74AUC1G19DBVT SOT-23 DBV 6 250 202.0 201.0 28.0 SN74AUC1G19DCKR SC70 DCK 6 3000 202.0 201.0 28.0 SN74AUC1G19DCKT SC70 DCK 6 250 202.0 201.0 28.0 SN74AUC1G19DRLR SOT DRL 6 4000 202.0 201.0 28.0 SN74AUC1G19YZPR DSBGA YZP 6 3000 220.0 220.0 34.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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