SCDS025R − MAY 1995 − REVISED JANUARY 2004
D 5-Ω Switch Connection Between Two Ports
D TTL-Compatible Input Levels
D Designed to Be Used in Level-Shifting
Applications
SN54CBTD3384 . . . JT OR W PACKAGE
SN74CBTD3384 . . . DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
VCC
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
1A2
1B2
1B3
NC
1A3
1A4
1B4
5
4
2B5
2A5
24
2
1A1
1B1
1OE
NC
V CC
1
3 2 1 28 27 26
25
6
24
7
23
8
22
9
21
10
20
11
19
12 13 14 15 16 17 18
2A4
2B4
2B3
NC
2A3
2A2
2B2
1B5
1A5
GND
NC
2OE
2A1
2B1
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
SN54CBTD3384 . . . FK PACKAGE
(TOP VIEW)
NC − No internal connection
description/ordering information
The ’CBTD3384 devices provide ten bits of high-speed TTL-compatible bus switching. The low on-state
resistance of the switches allows connections to be made without adding propagation delay. A diode to VCC is
integrated on the die to allow for level shifting from 5-V signals at the device inputs to 3.3-V signals at the device
outputs.
These devices are organized as two 5-bit switches with separate output-enable (OE) inputs. When OE is low,
the switch is on, and port A is connected to port B. When OE is high, the switch is open, and the high-impedance
state exists between the two ports.
ORDERING INFORMATION
SN74CBTD3384DW
Tape and reel
SN74CBTD3384DWR
SSOP − DB
Tape and reel
SN74CBTD3384DBR
CC384
SSOP (QSOP) − DBQ
Tape and reel
SN74CBTD3384DBQR
CBTD3384
Tube
SN74CBTD3384PW
Tape and reel
SN74CBTD3384PWR
TVSOP − DGV
Tape and reel
SN74CBTD3384DGVR
CC384
CDIP − JT
Tube
SNJ54CBTD3384JT
SNJ54CBTD3384JT
CFP − W
Tube
SNJ54CBTD3384W
SNJ54CBTD3384W
LCCC − FK
Tube
SNJ54CBTD3384FK
SNJ54CBTD3384FK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube
SOIC − DW
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
CBTD3384
CC384
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%).
"!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%&
&%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-)
%)&%3 ! $,, *$"$#)%)"&.
*"!-('%& '!#*,$% %! 4
$,, *$"$#)%)"& $") %)&%)(,)&& !%/)"1&) !%)-. $,, !%/)" *"!-('%& *"!-('%!
*"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCDS025R − MAY 1995 − REVISED JANUARY 2004
FUNCTION TABLE
(each 5-bit bus switch)
INPUTS
INPUTS/OUTPUTS
1OE
2OE
1B1−1B5
2B1−2B5
L
L
1A1−1A5
2A1−2A5
L
H
1A1−1A5
Z
H
L
Z
2A1−2A5
H
H
Z
Z
logic diagram (positive logic)
3
2
11
10
1A1
1A5
1OE
2A1
1B5
1
14
15
22
23
2A5
2OE
1B1
2B1
2B5
13
Pin numbers shown are for the DB, DBQ, DGV, DW, JT, PW, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCDS025R − MAY 1995 − REVISED JANUARY 2004
recommended operating conditions (see Note 3)
SN54CBTD3384
VCC
VIH
Supply voltage
VIL
TA
Low-level control input voltage
High-level control input voltage
SN74CBTD3384
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
2
2
0.8
Operating free-air temperature
−55
125
−40
UNIT
V
V
0.8
V
85
°C
In applications with fast edge rates, multiple outputs switching, and operating at high frequencies, the output may have little or no level-shifting
effect.
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
SN54CBTD3384
TYP†
MAX
TEST CONDITIONS
MIN
VIK
VOH
VCC = 4.5 V,
See Figure 2
II = −18 mA
II
ICC
VCC = 5.5 V,
VCC = 5.5 V,
VI = 5.5 V or GND
IO = 0,
VI = VCC or GND
∆ICC‡
Control inputs
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
Ci
Control inputs
Cio(OFF)
ron§
VI = 3 V or 0
VO = 3 V or 0,
VCC = 4.5 V
OE = VCC
VI = 0
II = 64 mA
II = 30 mA
SN74CBTD3384
TYP†
MAX
MIN
UNIT
−1.2
−1.2
V
±1
±1
µA
1.5
1.5
mA
2.5
2.5
mA
3
3
pF
3.5
3.5
5
5
7
5
5
7
pF
Ω
VI = 2.4 V,
II = 15 mA
35
35
50
† Typical values are at VCC = 5 V, TA = 25°C.
‡ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
§ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lowest voltage of the two (A or B) terminals.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54CBTD3384
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd¶
A or B
B or A
ten
OE
A or B
2.2
9.7
tdis
OE
A or B
1.5
8.6
MIN
MAX
SN74CBTD3384
MIN
0.25
MAX
UNIT
0.25
ns
2.3
7
ns
1.7
5.3
ns
¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCDS025R − MAY 1995 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
7V
500 Ω
From Output
Under Test
S1
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
Output
Control
LOAD CIRCUIT
1.5 V
1.5 V
0V
tPZL
3V
Input
1.5 V
1.5 V
0V
tPLH
1.5 V
3.5 V
1.5 V
tPZH
tPHL
VOH
Output
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLZ
1.5 V
VOL
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH
VOH − 0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCDS025R − MAY 1995 − REVISED JANUARY 2004
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
4
3.25
100 µA
3.75
6 mA
12 mA
3.5
24 mA
3
2.75
2.5
2.25
2
1.75
1.5
4.5
VOH − Output Voltage High − V
3.5
TA = 25°C
100 µA
6 mA
12 mA
24 mA
3.25
3
2.75
2.5
2.25
2
1.75
4.75
5
5.25
5.5
5.75
1.5
4.5
4.75
VCC − Supply Voltage − V
5
5.25
5.5
5.75
VCC − Supply Voltage − V
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
4
TA = 0°C
3.75
VOH − Output Voltage High − V
VOH − Output Voltage High − V
3.75
4
TA = 85°C
3.5
100 µA
3.25
6 mA
12 mA
3
24 mA
2.75
2.5
2.25
2
1.75
1.5
4.5
4.75
5
5.25
5.5
VCC − Supply Voltage − V
5.75
Figure 2. VOH Values
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
5962-9752701Q3A
ACTIVE
LCCC
FK
28
1
TBD
Call TI
Call TI
-55 to 125
59629752701Q3A
SNJ54CBTD
3384FK
5962-9752701QKA
ACTIVE
CFP
W
24
1
TBD
Call TI
Call TI
-55 to 125
5962-9752701QK
A
SNJ54CBTD3384W
5962-9752701QLA
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Call TI
-55 to 125
5962-9752701QL
A
SNJ54CBTD3384J
T
74CBTD3384DBQRE4
ACTIVE
SSOP
DBQ
24
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CBTD3384
74CBTD3384DBQRG4
ACTIVE
SSOP
DBQ
24
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CBTD3384
74CBTD3384DGVRE4
ACTIVE
TVSOP
DGV
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CC384
74CBTD3384DGVRG4
ACTIVE
TVSOP
DGV
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CC384
SN74CBTD3384DBLE
OBSOLETE
SSOP
DB
24
TBD
Call TI
Call TI
-40 to 85
SN74CBTD3384DBQR
ACTIVE
SSOP
DBQ
24
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CBTD3384
SN74CBTD3384DBR
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CC384
SN74CBTD3384DBRG4
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CC384
SN74CBTD3384DGVR
ACTIVE
TVSOP
DGV
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CC384
SN74CBTD3384DW
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBTD3384
SN74CBTD3384DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBTD3384
SN74CBTD3384DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBTD3384
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
11-Apr-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
SN74CBTD3384DWR
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBTD3384
SN74CBTD3384DWRE4
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBTD3384
SN74CBTD3384DWRG4
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBTD3384
SN74CBTD3384PW
ACTIVE
TSSOP
PW
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CC384
SN74CBTD3384PWE4
ACTIVE
TSSOP
PW
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CC384
SN74CBTD3384PWG4
ACTIVE
TSSOP
PW
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CC384
SN74CBTD3384PWLE
OBSOLETE
TSSOP
PW
24
TBD
Call TI
Call TI
-40 to 85
SN74CBTD3384PWR
ACTIVE
TSSOP
PW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CC384
SN74CBTD3384PWRE4
ACTIVE
TSSOP
PW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CC384
SN74CBTD3384PWRG4
ACTIVE
TSSOP
PW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CC384
SNJ54CBTD3384FK
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629752701Q3A
SNJ54CBTD
3384FK
SNJ54CBTD3384JT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9752701QL
A
SNJ54CBTD3384J
T
SNJ54CBTD3384W
ACTIVE
CFP
W
24
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9752701QK
A
SNJ54CBTD3384W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54CBTD3384, SN74CBTD3384 :
• Catalog: SN74CBTD3384
• Military: SN54CBTD3384
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74CBTD3384DBQR
Package Package Pins
Type Drawing
SSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DBQ
24
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74CBTD3384DBR
SSOP
DB
24
2000
330.0
16.4
8.2
8.8
2.5
12.0
16.0
Q1
SN74CBTD3384DGVR
TVSOP
DGV
24
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74CBTD3384DWR
SOIC
DW
24
2000
330.0
24.4
10.75
15.7
2.7
12.0
24.0
Q1
SN74CBTD3384PWR
TSSOP
PW
24
2000
330.0
16.4
6.95
8.3
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74CBTD3384DBQR
SSOP
DBQ
24
2500
367.0
367.0
38.0
SN74CBTD3384DBR
SSOP
DB
24
2000
367.0
367.0
38.0
SN74CBTD3384DGVR
TVSOP
DGV
24
2000
367.0
367.0
35.0
SN74CBTD3384DWR
SOIC
DW
24
2000
367.0
367.0
45.0
SN74CBTD3384PWR
TSSOP
PW
24
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUARY 1997
JT (R-GDIP-T**)
CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
PINS **
A
13
24
B
1
24
28
A MAX
1.280
(32,51)
1.460
(37,08)
A MIN
1.240
(31,50)
1.440
(36,58)
B MAX
0.300
(7,62)
0.291
(7,39)
B MIN
0.245
(6,22)
0.285
(7,24)
DIM
12
0.070 (1,78)
0.030 (0,76)
0.100 (2,54) MAX
0.320 (8,13)
0.290 (7,37)
0.015 (0,38) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.014 (0,36)
0.008 (0,20)
0.100 (2,54)
4040110/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
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MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24)
CERAMIC DUAL FLATPACK
0.375 (9,53)
0.340 (8,64)
Base and Seating Plane
0.006 (0,15)
0.004 (0,10)
0.090 (2,29)
0.045 (1,14)
0.045 (1,14)
0.026 (0,66)
0.395 (10,03)
0.360 (9,14)
0.360 (9,14)
0.240 (6,10)
1
0.360 (9,14)
0.240 (6,10)
24
0.019 (0,48)
0.015 (0,38)
0.050 (1,27)
0.640 (16,26)
0.490 (12,45)
0.030 (0,76)
0.015 (0,38)
12
13
30° TYP
1.115 (28,32)
0.840 (21,34)
4040180-5 / B 03/95
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
Index point is provided on cap for terminal identification only.
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MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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