The SN74LS16 is obsolete
and is no longer supplied.
SDLS020E − MAY 1990 − REVISED FEBRUARY 2004
D Convert TTL Voltage Levels to MOS Levels
D High Sink-Current Capability
D Input Clamping Diodes Simplify System
D
D
SN54LS06 . . . J PACKAGE
SN74LS06, SN74LS16 . . . D, DB, N, OR NS PACKAGE
(TOP VIEW)
Design
Open-Collector Driver for Indicator Lamps
and Relays
Inputs Fully Compatible With Most TTL
Circuits
1A
1Y
2A
2Y
3A
3Y
GND
description/ordering information
These hex inverter buffers/drivers feature
high-voltage open-collector outputs to interface
with high-level circuits (such as MOS), or for
driving high-current loads, and also are
characterized for use as inverter buffers for driving
TTL inputs. The ’LS06 devices have a rated output
voltage of 30 V, and the SN74LS16 has a rated
output voltage of 15 V. The maximum sink current
for the SN54LS06 is 30 mA, and for the
SN74LS06 and SN74LS16 it is 40 mA.
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
6A
6Y
5A
5Y
4A
4Y
1Y
1A
NC
VCC
6A
SN54LS06 . . . FK PACKAGE
(TOP VIEW)
2A
NC
2Y
NC
3A
3
2
1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
6Y
NC
5A
NC
5Y
3Y
GND
NC
4Y
4A
These devices are compatible with most TTL
families. Inputs are diode-clamped to minimize
transmission effects, which simplifies design.
Typical power dissipation is 175 mW, and average
propagation delay time is 8 ns.
4
NC − No internal connection
ORDERING INFORMATION
PDIP − N
0°C
0
C to 70
70°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
TOP-SIDE
MARKING
Tube
SN74LS06N
Tube
SN74LS06D
Tape and reel
SN74LS06DR
SOP − NS
Tape and reel
SN74LS06NSR
74LS06
SSOP − DB
Tape and reel
SN74LS06DBR
LS06
Tube
SN54LS06J
SN54LS06J
Tube
SNJ54LS06J
SNJ54LS06J
Tube
SNJ54LS06FK
SNJ54LS06FK
SOIC − D
CDIP − J
−55°C
−55
C to 125
125°C
C
LCCC − FK
SN74LS06N
LS06
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB
design guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!"#$%&" ' ()##*& %' "! +),-(%&" .%&*/
#".)(&' ("!"#$ &" '+*(!(%&"' +*# &0* &*#$' "! *1%' '&#)$*&'
'&%.%#. 2%##%&3/ #".)(&" +#"(*''4 ."*' "& *(*''%#-3 (-).*
&*'&4 "! %-- +%#%$*&*#'/
+#".)(&' ("$+-%& &" 5676 %-- +%#%$*&*#' %#* &*'&*.
)-*'' "&0*#2'* "&*./ %-- "&0*# +#".)(&' +#".)(&"
+#"(*''4 ."*' "& *(*''%#-3 (-).* &*'&4 "! %-- +%#%$*&*#'/
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
The SN74LS16 is obsolete
and is no longer supplied.
SDLS020E − MAY 1990 − REVISED FEBRUARY 2004
logic diagram (positive logic)
1A
2A
3A
4A
5A
6A
1
2
1Y
3
4
2Y
5
6
9
8
11
10
13
12
3Y
4Y
5Y
6Y
Pin numbers shown are for the D, DB, J, N, and NS packages.
schematic (each gate)
VCC
9 kΩ
2.5 kΩ
15 kΩ
1 kΩ
Output
2.5 kΩ
Input
2 kΩ
2 kΩ
GND
Resistor values shown are nominal.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
The SN74LS16 is obsolete
and is no longer supplied.
SDLS020E − MAY 1990 − REVISED FEBRUARY 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Output voltage, VO (see Notes 1 and 2): SN54LS06, SN74LS06 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
SN74LS16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. This is the maximum voltage that should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4)
SN74LS06
SN74LS16
SN54LS06
VCC
VIH
Supply voltage
VIL
Low-level input voltage
High-level input voltage
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.75
5
5.25
2
2
’LS06
VOH
High-level output voltage
IOL
TA
Low-level output current
0.8
0.8
30
30
15
30
−55
125
V
V
SN74LS16
Operating free-air temperature
UNIT
MIN
0
V
V
40
mA
70
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
MIN
VIK
VCC = MIN,
SN74LS06
SN74LS16
SN54LS06
TEST CONDITIONS‡
PARAMETER
TYP§
II = −12 mA
IOH
VCC = MIN,
VIL = 0.8 V
’LS06, VOH = 30 V
SN74LS16, VOH = 15 V
VOL
VCC = MIN,
VIH = 2 V
IOL = 16 mA
IOL = 30 mA
IOL = 40 mA
MAX
MIN
TYP§
UNIT
MAX
−1.5
−1.5
0.25
0.25
0.25
0.25
0.4
0.25
V
mA
0.4
0.7
V
0.7
II
IIH
VCC = MAX,
VCC = MAX,
VI = 7 V
VI = 2.4 V
1
1
20
20
µA
IIL
ICCH
VCC = MAX,
VCC = MAX
VI = 0.4 V
−0.2
−0.2
mA
18
18
mA
60
mA
ICCL
VCC = MAX
60
‡ For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
§ All typical values are at VCC = 5 V, and TA = 25°C.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
mA
3
The SN74LS16 is obsolete
and is no longer supplied.
SDLS020E − MAY 1990 − REVISED FEBRUARY 2004
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)
4
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
POST OFFICE BOX 655303
TEST CONDITIONS
RL = 110 Ω,
• DALLAS, TEXAS 75265
CL = 15 pF
MIN
MAX
7
15
10
20
UNIT
ns
The SN74LS16 is obsolete
and is no longer supplied.
SDLS020E − MAY 1990 − REVISED FEBRUARY 2004
PARAMETER MEASUREMENT INFORMATION
VCC
Test
Point
VCC
RL
(see Note B)
From Output
Under Test
CL
(see Note A)
High-Level
Pulse
1.3 V
S2
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
3V
Timing
Input
1.3 V
5 kΩ
Test
Point
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT
FOR 2-STATE TOTEM-POLE OUTPUTS
S1
(see Note B)
CL
(see Note A)
RL
CL
(see Note A)
RL
From Output
Under Test
VCC
From Output
Under Test
Test
Point
1.3 V
0V
tw
Low-Level
Pulse
1.3 V
tsu
0V
In-Phase
Output
(see Note D)
3V
1.3 V
1.3 V
0V
tPZL
tPLZ
tPHL
VOH
1.3 V
1.3 V
Waveform 1
(see Notes C
and D)
VOL
tPZH
tPLH
VOH
1.3 V
1.3 V
VOL
Waveform 2
(see Notes C
and D)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
≈1.5 V
1.3 V
VOL
tPHL
Out-of-Phase
Output
(see Note D)
1.3 V
0V
Output
Control
(low-level
enabling)
1.3 V
tPLH
1.3 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.3 V
3V
Data
Input
1.3 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
th
VOL + 0.5 V
tPHZ
VOH
1.3 V
VOH − 0.5 V
≈1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns.
G. The outputs are measured one at a time, with one input transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9861701Q2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9861701QCA
ACTIVE
CDIP
J
14
1
TBD
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
SN54LS06J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
SN74LS06D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
SN74LS06DBLE
OBSOLETE
SSOP
DB
14
SN74LS06DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS06DBRG4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS06DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS06DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS06DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS06DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS06DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS06N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS06NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS06NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS06NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS06NSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TBD
Call TI
Level-1-260C-UNLIM
Call TI
SN74LS16D
OBSOLETE
SOIC
D
14
TBD
Call TI
Call TI
SN74LS16DR
OBSOLETE
SOIC
D
14
TBD
Call TI
Call TI
Call TI
Call TI
SN74LS16N
OBSOLETE
PDIP
N
14
SNJ54LS06FK
ACTIVE
LCCC
FK
20
1
TBD
TBD
SNJ54LS06J
ACTIVE
CDIP
J
14
1
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS06DBR
DB
14
SITE 41
330
16
8.2
6.6
2.5
12
16
Q1
SN74LS06DR
D
14
SITE 41
330
16
6.5
9.0
2.1
8
16
Q1
SN74LS06NSR
NS
14
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LS06DBR
DB
14
SITE 41
346.0
346.0
33.0
SN74LS06DR
D
14
SITE 41
346.0
346.0
33.0
SN74LS06NSR
NS
14
SITE 41
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated