SCLS386J − SEPTEMBER 1997 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Max tpd of 10 ns at 5 V
D Typical VOLP (Output Ground Bounce)
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
6A
6Y
5A
5Y
4A
4Y
1Y
2A
2Y
3A
3Y
14
1Y
1A
NC
VCC
6A
1
13 6A
2
3
12 6Y
4
11 5A
10 5Y
9 4A
5
6
7
8
SN54LV14A . . . FK PACKAGE
(TOP VIEW)
2A
NC
2Y
NC
3A
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
6Y
NC
5A
NC
5Y
3Y
GND
NC
4Y
4A
1
VCC
1A
1Y
2A
2Y
3A
3Y
GND
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SN74LV14A . . . RGY PACKAGE
(TOP VIEW)
4Y
SN54LV14A . . . J OR W PACKAGE
SN74LV14A . . . D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
D
1A
D
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
GND
D
D Ioff Supports Partial-Power-Down Mode
NC − No internal connection
description/ordering information
These hex Schmitt-trigger inverters are designed for 2-V to 5.5-V VCC operation.
The ’LV14A devices contain six independent inverters. These devices perform the Boolean function Y = A.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
ORDERING INFORMATION
QFN − RGY
SN74LV14ARGYR
Tube of 50
SN74LV14AD
Reel of 2500
SN74LV14ADR
SOP − NS
Reel of 2000
SN74LV14ANSR
74LV14A
SSOP − DB
Reel of 2000
SN74LV14ADBR
LV14A
Tube of 90
SN74LV14APW
Reel of 2000
SN74LV14APWR
Reel of 250
SN74LV14APWT
TVSOP − DGV
Reel of 2000
SN74LV14ADGVR
LV14A
CDIP − J
Tube of 25
SNJ54LV14AJ
SNJ54LV14AJ
CFP − W
Tube of 150
SNJ54LV14AW
SNJ54LV14AW
TSSOP − PW
−55°C
125°C
−55
C to 125
C
TOP-SIDE
MARKING
Reel of 1000
SOIC − D
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV14A
LV14A
LV14A
LCCC − FK
Tube of 55
SNJ54LV14AFK
SNJ54LV14AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
!"#$ $%$ &
$'("%$ !((#$ % ' )!*+%$ %#, &(! $'(" )#'%$ )#( # #(" ' #-% $(!"#$ %$%( .%((%$/,
&(!$ )(#$0 # $ $##%(+/ $+!# #$0 ' %++
)%(%"##(,
POST OFFICE BOX 655303
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1
SCLS386J − SEPTEMBER 1997 − REVISED APRIL 2005
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
logic diagram, each inverter (positive logic)
A
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
(see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
2
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• DALLAS, TEXAS 75265
SCLS386J − SEPTEMBER 1997 − REVISED APRIL 2005
recommended operating conditions (see Note 5)
SN54LV14A
SN74LV14A
MIN
MAX
MIN
MAX
UNIT
VCC
VI
Supply voltage
2
5.5
2
5.5
V
Input voltage
0
5.5
0
5.5
V
VO
Output voltage
0
VCC
−50
0
VCC
−50
µA
IOH
IOL
VCC = 2 V
VCC = 2.3 V to 2.7 V
High-level output current
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
Low-level output current
V
−2
−6
−6
−12
−12
50
50
2
2
6
6
mA
µA
mA
VCC = 4.5 V to 5.5 V
12
12
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV14A
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
SN74LV14A
MAX
MIN
TYP
MAX
VT+
Positive-going
threshold
2.5 V
1.75
1.75
3.3 V
2.31
2.31
5V
3.5
3.5
VT−
Negative-going
threshold
2.5 V
0.75
0.75
3.3 V
0.99
0.99
5V
1.5
1.5
2.5 V
0.25
1
0.25
1
3.3 V
0.33
1.32
0.33
1.32
5V
0.5
2
0.5
2
∆VT
Hysteresis (VT+ − VT−)
VOH
VOL
IOH = −50 µA
IOH = −2 mA
2.3 V
IOH = −6 mA
IOH = −12 mA
IOL = 50 µA
IOL = 2 mA
IOL = 6 mA
IOL = 12 mA
II
ICC
VI = VCC or GND
VI = VCC or GND,
Ioff
VI or VO = 0 to 5.5 V
Ci
2 V to 5.5 V
IO = 0
VCC − 0.1
2
UNIT
V
V
V
VCC − 0.1
2
3V
2.48
2.48
4.5 V
3.8
3.8
V
2 V to 5.5 V
0.1
2.3 V
0.4
0.1
0.4
3V
0.44
0.44
4.5 V
V
0.55
0.55
0 V to 5.5 V
±1
±1
µA
5.5 V
20
20
µA
0V
5
5
µA
3.3 V
2.3
2.3
5V
2.3
2.3
VI = VCC or GND
pF
& & $'("%$ $#($ )(! $ # '("%1# (
#0$ )%# ' #1#+)"#$, %(%#( %% %$ #(
)#'%$ %(# #0$ 0%+, #-% $(!"#$ (##(1# # (0 %$0# ( $$!# ## )(! .! $#,
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3
SCLS386J − SEPTEMBER 1997 − REVISED APRIL 2005
switching characteristics over recommended operating free-air temperature range,
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
LOAD
CAPACITANCE
MIN
TA = 25°C
TYP
MAX
SN54LV14A
SN74LV14A
MIN
MAX
MIN
MAX
CL = 15 pF
10.2*
19.7*
1*
22*
1
22
CL = 50 pF
13.3
24
1
27
1
27
UNIT
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
LOAD
CAPACITANCE
TA = 25°C
MIN
TYP
MAX
CL = 15 pF
7.3*
CL = 50 pF
9.6
SN54LV14A
SN74LV14A
MIN
MAX
MIN
MAX
12.8*
1*
15.9*
1
15
16.3
1
19.4
1
18.5
UNIT
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
LOAD
CAPACITANCE
MIN
TA = 25°C
TYP
MAX
SN54LV14A
SN74LV14A
MIN
MAX
MIN
MAX
CL = 15 pF
5.1*
8.6*
1*
10*
1
10
CL = 50 pF
6.7
10.6
1
12
1
12
UNIT
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6)
SN74LV14A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.2
0.8
V
Quiet output, minimum dynamic VOL
−0.1
−0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
3.1
High-level dynamic input voltage
V
2.31
V
VIL(D)
Low-level dynamic input voltage
NOTE 6: Characteristics are for surface-mount packages only.
0.99
V
VCC
3.3 V
TYP
UNIT
5V
9.6
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
& & $'("%$ $#($ )(! $ # '("%1# (
#0$ )%# ' #1#+)"#$, %(%#( %% %$ #(
)#'%$ %(# #0$ 0%+, #-% $(!"#$ (##(1# # (0 %$0# ( $$!# ## )(! .! $#,
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 10 MHz
8.8
pF
SCLS386J − SEPTEMBER 1997 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
VCC
Open
S1
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
Input
50% VCC
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
50% VCC
VOH
50% VCC
VOL
50% VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
0V
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
VOH
50% VCC
VOL
50% VCC
tPLZ
tPZL
tPHL
tPHL
Out-of-Phase
Output
0V
VCC
Output
Control
≈VCC
50% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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5
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV14AD
ACTIVE
SOIC
D
14
SN74LV14ADBLE
OBSOLETE
SSOP
DB
14
SN74LV14ADBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ADBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ADE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ADGVR
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ADGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ADR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ADRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ADRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ANSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ANSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ANSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14APW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14APWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14APWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14APWLE
OBSOLETE
TSSOP
PW
14
SN74LV14APWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14APWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14APWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14APWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14APWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14APWTG4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV14ARGYR
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LV14ARGYRG4
ACTIVE
QFN
RGY
14
50
Green (RoHS &
no Sb/Br)
TBD
TBD
Addendum-Page 1
TBD
Lead/Ball Finish
CU NIPDAU
Call TI
Call TI
Call TI
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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