SCLS408H − APRIL 1998 − REVISED APRIL 2005
SN54LV374A . . . J OR W PACKAGE
SN74LV374A . . . DB, DGV, DW, NS,
OR PW PACKAGE
(TOP VIEW)
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
SN54LV374A . . . FK PACKAGE
(TOP VIEW)
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
1Q
1D
2D
2Q
3Q
3D
4D
4Q
20
1D
1Q
OE
VCC
1
2D
2Q
3Q
3D
4D
19 8Q
18 8D
2
3
17 7D
16 7Q
4
5
15 6Q
14 6D
6
7
13 5D
12 5Q
8
9
10
11
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
8D
7D
7Q
6Q
6D
4Q
GND
CLK
5Q
5D
20
VCC
1
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SN74LV374A . . . RGY PACKAGE
(TOP VIEW)
CLK
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
D
OE
D
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
GND
D
D Ioff Supports Partial-Power-Down Mode
8Q
D 2-V to 5.5-V VCC Operation
D Max tpd of 9.5 ns at 5 V
D Typical VOLP (Output Ground Bounce)
description/ordering information
The ’LV374A devices are octal edge-triggered D-type flip-flops designed for 2-V to 5.5-V VCC operation.
ORDERING INFORMATION
QFN − RGY
TOP-SIDE
MARKING
Reel of 1000
SN74LV374ARGYR
Tube of 25
SN74LV374ADW
Reel of 2000
SN74LV374ADWR
SOP − NS
Reel of 2000
SN74LV374ANSR
74LV374A
SSOP − DB
Reel of 2000
SN74LV374ADBR
LV374A
Tube of 70
SN74LV374APW
LV374A
Reel of 2000
SN74LV374APWR
LV374A
Reel of 250
SN74LV374APWT
LV374A
TVSOP − DGV
Reel of 2000
SN74LV374ADGVR
LV374A
VFBGA − GQN
Reel of 1000
SN74LV374AGQNR
LV374A
CDIP − J
Tube of 20
SNJ54LV374AJ
SNJ54LV374AJ
CFP − W
Tube of 85
SNJ54LV374AW
SNJ54LV374AW
LCCC − FK
Tube of 55
SNJ54LV374AFK
SOIC − DW
−40°C to 85°C
TSSOP − PW
−55°C
−55
C to 125
125°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV374A
LV374A
SNJ54LV374AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
!"#$% !%&% %'(#&% !"(($% & ' )"*+!&% &$, ("! !%'(# )$!'!&% )$( $ $(# ' $-& %("#$% &%&( .&((&%/,
("!% )(!$%0 $ % %$!$&(+/ %!+"$ $%0 ' &++
)&(&#$$(,
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1
SCLS408H − APRIL 1998 − REVISED APRIL 2005
description/ordering information (continued)
These devices feature 3-state outputs designed specifically for driving highly capacitive or relatively
low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers.
On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D)
inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or high-impedance state. In the high-impedance state, the outputs neither load nor drive the
bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines
without need for interface or pullup components.
OE does not affect internal operations of the latch. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
GQN PACKAGE
(TOP VIEW)
1
2
3
terminal assignments
4
1
2
3
4
A
A
1Q
OE
B
2D
7D
VCC
1D
8Q
B
C
C
3Q
2Q
6Q
7Q
D
D
4D
5D
3D
6D
E
E
GND
4Q
CLK
5Q
FUNCTION TABLE
(each flip-flop)
INPUTS
2
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
L
X
Q0
H
X
X
Z
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8D
SCLS408H − APRIL 1998 − REVISED APRIL 2005
logic diagram (positive logic)
OE
CLK
1
11
C1
1D
3
1D
2
1Q
To Seven Other Channels
Pin numbers shown are for the DB, DGV, DW, FK, J, NS, PW, RGY, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance or
power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
(see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 3): GQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
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SCLS408H − APRIL 1998 − REVISED APRIL 2005
recommended operating conditions (see Note 5)
SN54LV374A
VCC
VIH
Supply voltage
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
IOL
∆t/∆v
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
MIN
MAX
2
5.5
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
High or low state
0
3-state
0
UNIT
V
V
0.5
0.5
VCC × 0.3
VCC × 0.3
VCC × 0.3
VCC × 0.3
VCC × 0.3
5.5
0
Input transition rise or fall rate
MAX
1.5
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Low-level output current
MIN
1.5
VCC = 2 V
VCC = 2.3 V to 2.7 V
High-level output current
SN74LV374A
0
VCC
5.5
VCC × 0.3
5.5
0
0
V
V
VCC
5.5
V
µA
VCC = 2 V
VCC = 2.3 V to 2.7 V
−50
−50
−2
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
−8
−8
−16
−16
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
8
8
16
16
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
200
200
100
100
VCC = 4.5 V to 5.5 V
20
20
mA
µA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV374A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
VI = VCC or GND,
VI or VO = 0 to 5.5 V
Ci
VI = VCC or GND
IO = 0
MIN
3V
2.48
2.48
4.5 V
3.8
TYP
MAX
UNIT
V
3.8
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
±5
±5
µA
5.5 V
20
20
µA
0
5
5
µA
3.3 V
2.9
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4
MAX
VCC−0.1
2
2 V to 5.5 V
IOL = 8 mA
IOL = 16 mA
ICC
Ioff
TYP
SN74LV374A
VCC−0.1
2
2.3 V
IOL = 50 µA
IOL = 2 mA
VI = 5.5 V or GND
VO = VCC or GND
MIN
2 V to 5.5 V
IOH = −8 mA
IOH = −16 mA
II
IOZ
VCC
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2.9
V
pF
SCLS408H − APRIL 1998 − REVISED APRIL 2005
timing requirements over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
SN54LV374A
MIN
MAX
SN74LV374A
MIN
MAX
UNIT
tw
Pulse duration, CLK high or low
6
7
7
ns
tsu
Setup time, data before CLK↑
5
5.5
5.5
ns
th
Hold time, data after CLK↑
2.5
2.5
2.5
ns
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
tw
Pulse duration, CLK high or low
tsu
Setup time, data before CLK↑
th
Hold time, data after CLK↑
SN54LV374A
MIN
MAX
SN74LV374A
MIN
MAX
UNIT
5
5.5
5.5
ns
4.5
4.5
4.5
ns
2
2
2
ns
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
tw
SN54LV374A
MIN
MAX
SN74LV374A
MIN
MAX
UNIT
Pulse duration, CLK high or low
5
5
5
ns
tsu
Setup time, data before CLK↑
3
3
3
ns
th
Hold time, data after CLK↑
2
2
2
ns
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
CLK
Q
ten
OE
Q
tdis
OE
tpd
free-air
TA = 25°C
TYP
MAX
temperature
SN54LV374A
SN74LV374A
LOAD
CAPACITANCE
MIN
CL = 15 pF
60*
105*
50*
50
CL = 50 pF
50
85
40
40
MIN
MAX
range,
MIN
MAX
MHz
9.7*
16.3*
1*
19*
1
19
8.9*
15.9*
1*
19*
1
19
Q
6.3*
12.6*
1*
15*
1
15
CLK
Q
11.8
19.3
1
23
1
23
ten
OE
Q
10.9
18.8
1
22
1
22
tdis
tsk(o)
OE
Q
8.2
17.3
1
19
1
19
CL = 15 pF
CL = 50 pF
2
UNIT
ns
ns
2
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
%'(#&% !%!$(% )("! % $ '(#&1$ (
$0% )&$ ' $1$+)#$%, &(&!$(! && &% $(
)$!'!&% &($ $0% 0&+, $-& %("#$% ($$(1$ $ (0 !&%0$ ( !%%"$ $$ )("! ." %!$,
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SCLS408H − APRIL 1998 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
CLK
free-air
TA = 25°C
TYP
MAX
temperature
SN54LV374A
SN74LV374A
LOAD
CAPACITANCE
MIN
CL = 15 pF
80*
150*
70*
70
CL = 50 pF
55
110
50
50
Q
CL = 15 pF
MIN
MAX
range,
MIN
MAX
MHz
6.8*
12.7*
1*
15*
1
15
6.3*
11*
1*
13*
1
13
ten
OE
Q
tdis
OE
Q
4.7*
10.5*
1*
12.5*
1
12.5
tpd
CLK
Q
8.3
16.2
1
18.5
1
18.5
ten
OE
Q
7.7
14.5
1
16.5
1
16.5
OE
Q
5.9
14
1
16
1
16
tdis
tsk(o)
CL = 50 pF
UNIT
1.5
ns
ns
1.5
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
CLK
Q
ten
OE
Q
tdis
OE
tpd
free-air
TA = 25°C
TYP
MAX
temperature
SN54LV374A
SN74LV374A
LOAD
CAPACITANCE
MIN
CL = 15 pF
130*
205*
110*
110
CL = 50 pF
85
170
75
75
MIN
MAX
range,
MIN
MAX
MHz
4.9*
8.1*
1*
9.5*
1
9.5
4.6*
7.6*
1*
9*
1
9
Q
3.4*
6.8*
1*
8*
1
8
CLK
Q
5.9
10.1
1
11.5
1
11.5
ten
OE
Q
5.5
9.6
1
11
1
11
tdis
tsk(o)
OE
Q
4
8.8
1
10
1
10
CL = 15 pF
CL = 50 pF
UNIT
1
ns
ns
1
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6)
SN74LV374A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
Quiet output, maximum dynamic VOL
0.6
0.8
V
VOL(V)
Quiet output, minimum dynamic VOL
−0.5
−0.8
V
VOH(V)
Quiet output, minimum dynamic VOH
2.9
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
V
2.31
V
0.99
V
VCC
3.3 V
TYP
UNIT
5V
22.8
NOTE 6: Characteristics are for surface-mount packages only.
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
Outputs enabled
CL = 50 pF,
%'(#&% !%!$(% )("! % $ '(#&1$ (
$0% )&$ ' $1$+)#$%, &(&!$(! && &% $(
)$!'!&% &($ $0% 0&+, $-& %("#$% ($$(1$ $ (0 !&%0$ ( !%%"$ $$ )("! ." %!$,
6
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• DALLAS, TEXAS 75265
f = 10 MHz
21.1
pF
SCLS408H − APRIL 1998 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
tsu
VCC
50% VCC
Input
50% VCC
0V
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
0V
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
50% VCC
0V
tPLZ
tPZL
≈VCC
50% VCC
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
tPZH
tPLH
50% VCC
VCC
Output
Control
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LV374ADBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ADBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ADGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ADGVRE4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ADWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ADWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ADWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374AGQNR
ACTIVE
GQN
20
1000
SNPB
Level-1-240C-UNLIM
SN74LV374ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ANSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374APW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374APWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374APWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374APWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374APWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374APWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ARGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LV374ARGYRG4
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LV374ATDB
ACTIVE
SSOP
DB
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ATDBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ATDW
ACTIVE
SOIC
DW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ATDWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ATNS
ACTIVE
SO
NS
20
CU NIPDAU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
70
25
40
Addendum-Page 1
TBD
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV374ATNSR
ACTIVE
SO
NS
20
SN74LV374ATPW
ACTIVE
TSSOP
PW
20
70
SN74LV374ATPWE4
ACTIVE
TSSOP
PW
20
70
SN74LV374ATPWR
ACTIVE
TSSOP
PW
SN74LV374ATPWRE4
ACTIVE
TSSOP
SN74LV374ATPWT
ACTIVE
SN74LV374ATPWTE4
MSL Peak Temp (3)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV374ATRGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LV374ATRGYRG4
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LV374AZQNR
ACTIVE
ZQN
20
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
2000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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