TI SN74LV540APWR

 SCLS409H − APRIL 1998 − REVISED APRIL 2005
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
OE2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
A1
A2
A3
A4
A5
A6
A7
A8
1
20
19 OE2
18 Y1
2
3
17 Y2
16 Y3
4
5
15 Y4
14 Y5
6
7
SN54LV540A . . . FK PACKAGE
(TOP VIEW)
A2
A1
OE1
VCC
VCC
20
2
A3
A4
A5
A6
A7
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
13 Y6
12 Y7
8
9
10
11
Y8
1
SN74LV540A . . . RGY PACKAGE
(TOP VIEW)
OE1
OE1
A1
A2
A3
A4
A5
A6
A7
A8
GND
All Ports
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
Y1
Y2
Y3
Y4
Y5
A8
GND
Y8
Y7
Y6
SN54LV540A . . . J OR W PACKAGE
SN74LV540A . . . DB, DGV, DW, NS,
OR PW PACKAGE
(TOP VIEW)
D
GND
D
D Support Mixed-Mode Voltage Operation on
OE2
D 2-V to 5.5-V VCC Operation
D Max tpd of 8.5 ns at 5 V
D Typical VOLP (Output Ground Bounce)
description/ordering information
The ’LV540A devices are octal buffers/drivers designed for 2-V to 5.5-V VCC operation.
ORDERING INFORMATION
QFN − RGY
SN74LV540ARGYR
Tube of 25
SN74LV540ADW
Reel of 2000
SN74LV540ADWR
SOP − NS
Reel of 2000
SN74LV540ANSR
74LV540A
SSOP − DB
Reel of 2000
SN74LV540ADBR
LV540A
Tube of 70
SN74LV540APW
Reel of 2000
SN74LV540APWR
Reel of 250
SN74LV540APWT
TVSOP − DGV
Reel of 2000
SN74LV540ADGVR
LV540A
CDIP − J
Tube of 20
SNJ54LV540AJ
SNJ54LV540AJ
CFP − W
Tube of 85
SNJ54LV540AW
SNJ54LV540AW
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Reel of 1000
SOIC − DW
−40°C
85°C
−40
C to 85
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV540A
LV540A
LV540A
LCCC − FK
Tube of 55
SNJ54LV540AFK
SNJ54LV540AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
!"#$%& "!&'& &(!)$'!& "#))%& ' !( *#+,"'!& '%- )!#" "!&(!)$ !
*%"("'!& *%) % %)$ !( %.' &)#$%& '&') /'))'&0)!#"!& *)!"%&1 !% &! &%"%'),0 &",#% %&1 !( ',,
*')'$%%)POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS409H − APRIL 1998 − REVISED APRIL 2005
description/ordering information (continued)
These devices are ideal for driving bus lines or buffer memory address registers. They feature inputs and
outputs on opposite sides of the package to facilitate printed circuit board layout.
The 3-state control gate is a two-input AND gate with active-low inputs so that, if either output
enable (OE1 or OE2) input is high, all corresponding outputs are in the high-impedance state. The outputs
provide inverted data when they are not in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(each buffer/driver)
INPUTS
OE1
OE2
A
OUTPUT
Y
L
L
L
H
L
L
H
L
H
X
X
Z
X
H
X
Z
logic diagram (positive logic)
OE1
1
19
OE2
A1
18
2
Y1
To Seven Other Channels
2
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SCLS409H − APRIL 1998 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range applied in the high or low state, VO (see Notes 1 and 2) . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
(see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
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SCLS409H − APRIL 1998 − REVISED APRIL 2005
recommended operating conditions (see Note 5)
SN54LV540A
VCC
VIH
Supply voltage
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
IOL
∆t/∆v
High-level output current
Low-level output current
Input transition rise or fall rate
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
SN74LV540A
MIN
MAX
2
5.5
1.5
MIN
MAX
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
0.5
0
High or low state
0
3-state
0
VCC × 0.3
5.5
VCC
5.5
V
0.5
VCC × 0.3
VCC × 0.3
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
V
1.5
VCC × 0.7
VCC × 0.7
VCC = 2 V
VCC = 2.3 V to 2.7 V
UNIT
VCC × 0.3
VCC × 0.3
0
0
0
VCC × 0.3
5.5
V
V
VCC
5.5
V
µA
VCC = 2 V
VCC = 2.3 V to 2.7 V
−50
−50
−2
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
−8
−8
−16
−16
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
8
8
16
16
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
200
200
100
100
VCC = 4.5 V to 5.5 V
20
20
mA
µA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
&(!)$'!& "!&"%)& *)!#" & % (!)$'2% !)
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*%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)2% % )1 !
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4
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SCLS409H − APRIL 1998 − REVISED APRIL 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV540A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
MIN
2 V to 5.5 V
IOH = −8 mA
IOH = −16 mA
IOL = 50 µA
IOL = 2 mA
IOL = 8 mA
IOL = 16 mA
VI = 5.5 V or GND
VO = VCC or GND
ICC
Ioff
VI = VCC or GND,
VI or VO = 0 to 5.5 V
IO = 0
SN74LV540A
TYP
MAX
VCC−0.1
2
3V
2.48
2.48
4.5 V
3.8
TYP
MAX
UNIT
V
3.8
2 V to 5.5 V
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
±5
±5
µA
5.5 V
20
20
µA
5
µA
0
VI = VCC or GND
MIN
VCC−0.1
2
2.3 V
II
IOZ
Ci
VCC
5
3.3 V
2.5
2.5
5V
2.5
2.5
V
pF
switching characteristics over recommended operating free-air temperature range,
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
OE
Y
tdis
OE
Y
tpd
A
Y
ten
OE
Y
OE
Y
PARAMETER
tdis
LOAD
CAPACITANCE
TA = 25°C
MIN
TYP
MAX
CL = 15 pF
CL = 50 pF
SN54LV540A
SN74LV540A
MIN
MAX
MIN
MAX
5.6*
12*
1*
14.5*
1
14.5
7.8*
17.4*
1*
21*
1
21
5.7*
16*
1*
19*
1
19
7.9
16.8
1
18.5
1
18.5
10.1
22.2
1
25.5
1
25.5
8.1
22.3
1
25.5
1
25.5
tsk(o)
∗ On products compliant to MIL-PRF-38535, this parameter is not production tested.
2
UNIT
ns
ns
2
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
TO
(OUTPUT)
tpd
A
Y
4.1*
7*
ten
OE
Y
5.6*
10.5*
tdis
OE
Y
4.2*
tpd
A
Y
ten
OE
Y
tdis
OE
Y
LOAD
CAPACITANCE
TA = 25°C
TYP
MAX
FROM
(INPUT)
PARAMETER
MIN
CL = 15 pF
CL = 50 pF
SN54LV540A
SN74LV540A
MAX
MIN
1*
8.5*
1
8.5
1*
12.5*
1
12.5
10.5*
1*
12.5*
1
12.5
5.8
10.5
1
12
1
12
7.3
14
1
16
1
16
5.8
15.4
1
17.5
1
17.5
tsk(o)
∗ On products compliant to MIL-PRF-38535, this parameter is not production tested.
1.5
MIN
MAX
UNIT
ns
ns
1.5
&(!)$'!& "!&"%)& *)!#" & % (!)$'2% !)
%1& *'% !( %2%,!*$%&- ')'"%)" '' '& !%)
*%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)2% % )1 !
"'&1% !) "!&&#% %% *)!#" /!# &!"%-
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5
SCLS409H − APRIL 1998 − REVISED APRIL 2005
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
LOAD
CAPACITANCE
TA = 25°C
TYP
MAX
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
3*
5*
ten
OE
Y
4.1*
7.2*
tdis
OE
Y
2.9*
tpd
A
Y
ten
OE
Y
tdis
OE
Y
PARAMETER
MIN
CL = 15 pF
CL = 50 pF
SN54LV540A
SN74LV540A
MAX
MIN
1*
6*
1
6
1*
8.5*
1
8.5
7*
1*
8*
1
8
4.2
7
1
8
1
8
5.3
9.2
1
10.5
1
10.5
3.5
8.8
1
10
1
10
tsk(o)
∗ On products compliant to MIL-PRF-38535, this parameter is not production tested.
MIN
MAX
1
UNIT
ns
ns
1
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6)
SN74LV540A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.5
0.8
V
Quiet output, minimum dynamic VOL
−0.3
−0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
3
High-level dynamic input voltage
V
2.3
V
VIL(D)
Low-level dynamic input voltage
NOTE 6: Characteristics are for surface-mount packages only.
0.97
V
VCC
3.3 V
TYP
UNIT
5V
11
operating characteristics, TA = 25°C
PARAMETER
TEST CONDITIONS
Outputs enabled
Cpd
Power dissipation capacitance
Outputs enabled
CL = 50 pF,
&(!)$'!& "!&"%)& *)!#" & % (!)$'2% !)
%1& *'% !( %2%,!*$%&- ')'"%)" '' '& !%)
*%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)2% % )1 !
"'&1% !) "!&&#% %% *)!#" /!# &!"%-
6
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f = 10 MHz
10
pF
SCLS409H − APRIL 1998 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
VCC
Open
S1
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
Input
50% VCC
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
50% VCC
VOH
50% VCC
VOL
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
0V
Output
Waveform 1
S1 at VCC
(see Note B)
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
50% VCC
tPZL
tPHL
tPHL
Out-of-Phase
Output
0V
VCC
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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7
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV540ADBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ADBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ADBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ADGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ADGVRE4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ADGVRG4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ADWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ADWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ADWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ADWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ADWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ANSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540APW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540APWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540APWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540APWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540APWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540APWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540APWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540APWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540APWTG4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV540ARGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LV540ARGYRG4
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
19-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LV540ADBR
DB
20
MLA
330
16
8.2
7.5
2.5
12
16
Q1
SN74LV540ADGVR
DGV
20
MLA
330
12
7.0
5.6
1.6
8
12
Q1
SN74LV540ADWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN74LV540ANSR
NS
20
MLA
330
24
8.2
13.0
2.5
12
24
Q1
SN74LV540APWR
PW
20
MLA
330
16
6.95
7.1
1.6
8
16
Q1
SN74LV540ARGYR
RGY
20
MLA
180
12
3.8
4.8
1.6
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LV540ADBR
DB
20
MLA
342.9
336.6
28.58
SN74LV540ADGVR
DGV
20
MLA
338.1
340.5
20.64
SN74LV540ADWR
DW
20
MLA
333.2
333.2
31.75
SN74LV540ANSR
NS
20
MLA
333.2
333.2
31.75
SN74LV540APWR
PW
20
MLA
342.9
336.6
28.58
SN74LV540ARGYR
RGY
20
MLA
190.0
212.7
31.75
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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