SCLS409H − APRIL 1998 − REVISED APRIL 2005 D <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2.3 V at VCC = 3.3 V, TA = 25°C 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE2 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 A1 A2 A3 A4 A5 A6 A7 A8 1 20 19 OE2 18 Y1 2 3 17 Y2 16 Y3 4 5 15 Y4 14 Y5 6 7 SN54LV540A . . . FK PACKAGE (TOP VIEW) A2 A1 OE1 VCC VCC 20 2 A3 A4 A5 A6 A7 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 13 Y6 12 Y7 8 9 10 11 Y8 1 SN74LV540A . . . RGY PACKAGE (TOP VIEW) OE1 OE1 A1 A2 A3 A4 A5 A6 A7 A8 GND All Ports Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) Y1 Y2 Y3 Y4 Y5 A8 GND Y8 Y7 Y6 SN54LV540A . . . J OR W PACKAGE SN74LV540A . . . DB, DGV, DW, NS, OR PW PACKAGE (TOP VIEW) D GND D D Support Mixed-Mode Voltage Operation on OE2 D 2-V to 5.5-V VCC Operation D Max tpd of 8.5 ns at 5 V D Typical VOLP (Output Ground Bounce) description/ordering information The ’LV540A devices are octal buffers/drivers designed for 2-V to 5.5-V VCC operation. ORDERING INFORMATION QFN − RGY SN74LV540ARGYR Tube of 25 SN74LV540ADW Reel of 2000 SN74LV540ADWR SOP − NS Reel of 2000 SN74LV540ANSR 74LV540A SSOP − DB Reel of 2000 SN74LV540ADBR LV540A Tube of 70 SN74LV540APW Reel of 2000 SN74LV540APWR Reel of 250 SN74LV540APWT TVSOP − DGV Reel of 2000 SN74LV540ADGVR LV540A CDIP − J Tube of 20 SNJ54LV540AJ SNJ54LV540AJ CFP − W Tube of 85 SNJ54LV540AW SNJ54LV540AW TSSOP − PW −55°C −55 C to 125 125°C C TOP-SIDE MARKING Reel of 1000 SOIC − DW −40°C 85°C −40 C to 85 C ORDERABLE PART NUMBER PACKAGE† TA LV540A LV540A LV540A LCCC − FK Tube of 55 SNJ54LV540AFK SNJ54LV540AFK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2005, Texas Instruments Incorporated !"#$%& "!&'& &(!)$'!& "#))%& ' !( *#+,"'!& '%- )!#" "!&(!)$ ! *%"("'!& *%) % %)$ !( %.' &)#$%& '&') /'))'&0)!#"!& *)!"%&1 !% &! &%"%'),0 &",#% %&1 !( ',, *')'$%%)POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS409H − APRIL 1998 − REVISED APRIL 2005 description/ordering information (continued) These devices are ideal for driving bus lines or buffer memory address registers. They feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout. The 3-state control gate is a two-input AND gate with active-low inputs so that, if either output enable (OE1 or OE2) input is high, all corresponding outputs are in the high-impedance state. The outputs provide inverted data when they are not in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE (each buffer/driver) INPUTS OE1 OE2 A OUTPUT Y L L L H L L H L H X X Z X H X Z logic diagram (positive logic) OE1 1 19 OE2 A1 18 2 Y1 To Seven Other Channels 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS409H − APRIL 1998 − REVISED APRIL 2005 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Output voltage range applied in the high or low state, VO (see Notes 1 and 2) . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W (see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W (see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W (see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W (see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W (see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 4. The package thermal impedance is calculated in accordance with JESD 51-5. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCLS409H − APRIL 1998 − REVISED APRIL 2005 recommended operating conditions (see Note 5) SN54LV540A VCC VIH Supply voltage High-level input voltage VIL Low-level input voltage VI Input voltage VO Output voltage IOH IOL ∆t/∆v High-level output current Low-level output current Input transition rise or fall rate VCC = 2 V VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V SN74LV540A MIN MAX 2 5.5 1.5 MIN MAX 2 5.5 VCC × 0.7 VCC × 0.7 VCC × 0.7 VCC × 0.7 0.5 0 High or low state 0 3-state 0 VCC × 0.3 5.5 VCC 5.5 V 0.5 VCC × 0.3 VCC × 0.3 VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V V 1.5 VCC × 0.7 VCC × 0.7 VCC = 2 V VCC = 2.3 V to 2.7 V UNIT VCC × 0.3 VCC × 0.3 0 0 0 VCC × 0.3 5.5 V V VCC 5.5 V µA VCC = 2 V VCC = 2.3 V to 2.7 V −50 −50 −2 −2 VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V −8 −8 −16 −16 VCC = 2 V VCC = 2.3 V to 2.7 V 50 50 2 2 VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V 8 8 16 16 VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V 200 200 100 100 VCC = 4.5 V to 5.5 V 20 20 mA µA mA ns/V TA Operating free-air temperature −55 125 −40 85 °C NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. &(!)$'!& "!&"%)& *)!#" & % (!)$'2% !) %1& *'% !( %2%,!*$%&- ')'"%)" '' '& !%) *%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)2% % )1 ! "'&1% !) "!&&#% %% *)!#" /!# &!"%- 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS409H − APRIL 1998 − REVISED APRIL 2005 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) SN54LV540A PARAMETER VOH VOL TEST CONDITIONS IOH = −50 µA IOH = −2 mA MIN 2 V to 5.5 V IOH = −8 mA IOH = −16 mA IOL = 50 µA IOL = 2 mA IOL = 8 mA IOL = 16 mA VI = 5.5 V or GND VO = VCC or GND ICC Ioff VI = VCC or GND, VI or VO = 0 to 5.5 V IO = 0 SN74LV540A TYP MAX VCC−0.1 2 3V 2.48 2.48 4.5 V 3.8 TYP MAX UNIT V 3.8 2 V to 5.5 V 0.1 0.1 2.3 V 0.4 0.4 3V 0.44 0.44 4.5 V 0.55 0.55 0 to 5.5 V ±1 ±1 µA 5.5 V ±5 ±5 µA 5.5 V 20 20 µA 5 µA 0 VI = VCC or GND MIN VCC−0.1 2 2.3 V II IOZ Ci VCC 5 3.3 V 2.5 2.5 5V 2.5 2.5 V pF switching characteristics over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd A Y ten OE Y tdis OE Y tpd A Y ten OE Y OE Y PARAMETER tdis LOAD CAPACITANCE TA = 25°C MIN TYP MAX CL = 15 pF CL = 50 pF SN54LV540A SN74LV540A MIN MAX MIN MAX 5.6* 12* 1* 14.5* 1 14.5 7.8* 17.4* 1* 21* 1 21 5.7* 16* 1* 19* 1 19 7.9 16.8 1 18.5 1 18.5 10.1 22.2 1 25.5 1 25.5 8.1 22.3 1 25.5 1 25.5 tsk(o) ∗ On products compliant to MIL-PRF-38535, this parameter is not production tested. 2 UNIT ns ns 2 switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) TO (OUTPUT) tpd A Y 4.1* 7* ten OE Y 5.6* 10.5* tdis OE Y 4.2* tpd A Y ten OE Y tdis OE Y LOAD CAPACITANCE TA = 25°C TYP MAX FROM (INPUT) PARAMETER MIN CL = 15 pF CL = 50 pF SN54LV540A SN74LV540A MAX MIN 1* 8.5* 1 8.5 1* 12.5* 1 12.5 10.5* 1* 12.5* 1 12.5 5.8 10.5 1 12 1 12 7.3 14 1 16 1 16 5.8 15.4 1 17.5 1 17.5 tsk(o) ∗ On products compliant to MIL-PRF-38535, this parameter is not production tested. 1.5 MIN MAX UNIT ns ns 1.5 &(!)$'!& "!&"%)& *)!#" & % (!)$'2% !) %1& *'% !( %2%,!*$%&- ')'"%)" '' '& !%) *%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)2% % )1 ! "'&1% !) "!&&#% %% *)!#" /!# &!"%- POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SCLS409H − APRIL 1998 − REVISED APRIL 2005 switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) LOAD CAPACITANCE TA = 25°C TYP MAX FROM (INPUT) TO (OUTPUT) tpd A Y 3* 5* ten OE Y 4.1* 7.2* tdis OE Y 2.9* tpd A Y ten OE Y tdis OE Y PARAMETER MIN CL = 15 pF CL = 50 pF SN54LV540A SN74LV540A MAX MIN 1* 6* 1 6 1* 8.5* 1 8.5 7* 1* 8* 1 8 4.2 7 1 8 1 8 5.3 9.2 1 10.5 1 10.5 3.5 8.8 1 10 1 10 tsk(o) ∗ On products compliant to MIL-PRF-38535, this parameter is not production tested. MIN MAX 1 UNIT ns ns 1 noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6) SN74LV540A PARAMETER MIN TYP MAX UNIT VOL(P) VOL(V) Quiet output, maximum dynamic VOL 0.5 0.8 V Quiet output, minimum dynamic VOL −0.3 −0.8 V VOH(V) VIH(D) Quiet output, minimum dynamic VOH 3 High-level dynamic input voltage V 2.3 V VIL(D) Low-level dynamic input voltage NOTE 6: Characteristics are for surface-mount packages only. 0.97 V VCC 3.3 V TYP UNIT 5V 11 operating characteristics, TA = 25°C PARAMETER TEST CONDITIONS Outputs enabled Cpd Power dissipation capacitance Outputs enabled CL = 50 pF, &(!)$'!& "!&"%)& *)!#" & % (!)$'2% !) %1& *'% !( %2%,!*$%&- ')'"%)" '' '& !%) *%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)2% % )1 ! "'&1% !) "!&&#% %% *)!#" /!# &!"%- 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 10 MHz 10 pF SCLS409H − APRIL 1998 − REVISED APRIL 2005 PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 kΩ From Output Under Test Test Point VCC Open S1 TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input 0V tw tsu VCC 50% VCC Input 50% VCC th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC 50% VCC Input 50% VCC tPLH In-Phase Output 50% VCC VOH 50% VCC VOL VOH 50% VCC VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 50% VCC 0V Output Waveform 1 S1 at VCC (see Note B) tPLZ ≈VCC 50% VCC tPZH tPLH 50% VCC 50% VCC tPZL tPHL tPHL Out-of-Phase Output 0V VCC Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time, with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 28-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LV540ADBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ADBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ADGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ADGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ADGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ADW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ADWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ADWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ANSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ANSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540APW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540APWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540APWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540APWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540APWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540APWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV540ARGYR ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LV540ARGYRG4 ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 28-May-2007 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 19-May-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LV540ADBR DB 20 MLA 330 16 8.2 7.5 2.5 12 16 Q1 SN74LV540ADGVR DGV 20 MLA 330 12 7.0 5.6 1.6 8 12 Q1 SN74LV540ADWR DW 20 MLA 330 24 10.8 13.0 2.7 12 24 Q1 SN74LV540ANSR NS 20 MLA 330 24 8.2 13.0 2.5 12 24 Q1 SN74LV540APWR PW 20 MLA 330 16 6.95 7.1 1.6 8 16 Q1 SN74LV540ARGYR RGY 20 MLA 180 12 3.8 4.8 1.6 8 12 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74LV540ADBR DB 20 MLA 342.9 336.6 28.58 SN74LV540ADGVR DGV 20 MLA 338.1 340.5 20.64 SN74LV540ADWR DW 20 MLA 333.2 333.2 31.75 SN74LV540ANSR NS 20 MLA 333.2 333.2 31.75 SN74LV540APWR PW 20 MLA 342.9 336.6 28.58 SN74LV540ARGYR RGY 20 MLA 190.0 212.7 31.75 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 Pack Materials-Page 3 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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