SN74LVC1G06-EP SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT www.ti.com SCES669A – JULY 2006 – REVISED MARCH 2007 FEATURES • • • • • • • • (1) Controlled Baseline – One Assembly Site – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) Available in the Texas Instruments NanoStar™ and NanoFree™ Packages Supports 5-V VCC Operation Input and Open-Drain Output Accept Voltages up to 5.5 V Max tpd of 4 ns at 3.3 V Low Power Consumption, 10-µA Max ICC ±24-mA Output Drive at 3.3 V Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) • • • • • • Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. DCK PACKAGE (TOP VIEW) NC 1 A 2 GND 3 5 VCC 4 Y See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION The SN74LVC1G06 is a single inverter buffer/driver that is designed for 1.65-V to 5.5-V VCC operation. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. The output of the SN74LVC1G06 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2007, Texas Instruments Incorporated SN74LVC1G06-EP SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT www.ti.com SCES669A – JULY 2006 – REVISED MARCH 2007 ORDERING INFORMATION (1) PACKAGE (2) TA –55°C to 125°C (1) (2) (3) (4) ORDERABLE PART NUMBER SOT (SC-70) – DCK Reel of 3000 SN74LVC1G06MDCKREP (4) TOP-SIDE MARKING (3) CBA For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. The actual top-side marking has one additional character that designates the assembly/test site. Product Preview FUNCTION TABLE INPUT A OUTPUT Y H L L H LOGIC DIAGRAM (POSITIVE LOGIC) Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC MIN MAX Supply voltage range –0.5 6.5 UNIT V range (2) VI Input voltage –0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 6.5 V VO Voltage range applied to any output in the high or low state (2) (3) –0.5 6.5 V IIK Input clamp current VI < 0 V –50 mA IOK Output clamp current VO < 0 V –50 mA IO Continuous output current ±50 mA ±100 mA 252 °C/W 150 °C Continuous current through VCC or GND θJA Package thermal Tstg Storage temperature range (1) (2) (3) (4) impedance (4) –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) VCC Supply voltage Operating Data retention only VCC = 1.65 V to 1.95 V VIH High-level input voltage VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V (1) 2 MIN MAX 1.65 5.5 1.5 V 0.65 × VCC 1.7 2 0.7 × VCC All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback UNIT V SN74LVC1G06-EP SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT www.ti.com SCES669A – JULY 2006 – REVISED MARCH 2007 Recommended Operating Conditions (continued) MIN MAX UNIT 0.35 × VCC VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 VIL Low-level input voltage VI Input voltage 0 5.5 V VO Output voltage 0 5.5 V 0.3 × VCC VCC = 4.5 V to 5.5 V VCC = 1.65 V 4 VCC = 2.3 V IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature V 8 16 VCC = 3 V mA 24 VCC = 4.5 V 32 VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 VCC = 3.3 V ± 0.3 V 10 VCC = 5 V ± 0.5 V ns/V 5 –55 125 °C Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOL = 100 µA VOL 0.1 IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.3 0.4 3V IOL = 24 mA IOL = 32 mA A input MAX 1.65 V to 5.5 V IOL = 16 mA II MIN TYP (1) VCC UNIT V 0.55 4.5 V 0.55 0 V to 5.5 V ±1 µA 0V ±10 µA 1.65 V to 5.5 V 10 µA 3 V to 5.5 V 500 µA VI = 5.5 V or GND Ioff VI or VO = 5.5 V ICC VI = 5.5 V or GND, IO = 0 ∆ICC One input at VCC – 0.6 V, Other inputs at VCC or GND Ci VI = VCC or GND 3.3 V 4 pF Co VO = VCC or GND 3.3 V 5 pF (1) All typical values are at VCC = 3.3 V, TA = 25°C. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) A Y tpd VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V MIN MAX MIN MAX MIN MAX MIN MAX 2.2 8 1.1 6 1.2 6 1 5.5 UNIT ns Operating Characteristics TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V TYP TYP TYP TYP 3 3 4 6 Submit Documentation Feedback UNIT pF 3 SN74LVC1G06-EP SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT www.ti.com SCES669A – JULY 2006 – REVISED MARCH 2007 PARAMETER MEASUREMENT INFORMATION (Open Drain) VLOAD S1 RL From Output Under Test Open TEST GND RL CL (see Note A) S1 tPZL (see Notes E and F) VLOAD tPLZ (see Notes E and G) VLOAD tPHZ/tPZH VLOAD LOAD CIRCUIT INPUT VCC VI 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VM tr/tf ≤ 2 ns ≤ 2 ns ≤ 2.5 ns ≤ 2.5 ns VCC VCC 3V VCC VLOAD VCC/2 VCC/2 1.5 V VCC/2 2 × VCC 2 × VCC 6V 2 × VCC CL RL V∆ 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu th VI VM Input VM VM VM Data Input 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VI VM Input VM 0V Output VM VOL tPHL tPLZ VLOAD/2 VM tPZH VOH Output VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH VM VM tPZL VOH VM VI Output Control tPHL tPLH VI VM VOL Output Waveform 2 S1 at VLOAD (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + V∆ VOL tPHZ VM VLOAD/2 − V∆ VLOAD/2 ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd. F. tPZL is measured at VM. G. tPLZ is measured at VOL + V∆. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC1G06MDCKREP ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/06655-01XE ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. 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