SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES365H – AUGUST 2001 – REVISED JUNE 2005 FEATURES • • • • • • • • • • • DCT OR DCU PACKAGE (TOP VIEW) Available in the Texas Instruments NanoStar™ and NanoFree™ Packages Supports 5-V VCC Operation Max tpd of 3.7 ns at 3.3 V Low Power Consumption, 10-µA Max ICC ±24-mA Output Drive at 3.3 V Input and Open-Drain Output Accepts Voltages up to 5.5 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) 1A 3Y 2A GND 1 8 2 7 3 6 4 5 VCC 1Y 3A 2Y YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) GND 2A 3Y 1A 4 5 3 6 2 7 1 8 2Y 3A 1Y VCC DESCRIPTION/ORDERING INFORMATION This triple buffer/driver is designed for 1.65-V to 5.5-V VCC operation. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. ORDERING INFORMATION PACKAGE (1) TA ORDERABLE PART NUMBER NanoStar™ – WCSP (DSBGA) 0.17-mm Small Bump – YEA NanoFree™ – WCSP (DSBGA) 0.17-mm Small Bump – YZA (Pb-free) –40°C to 85°C NanoStar™ – WCSP (DSBGA) 0.23-mm Large Bump – YEP SN74LVC3G07YEAR SN74LVC3G07YZAR Reel of 3000 VSSOP – DCU (1) (2) _ _ _CV_ SN74LVC3G07YEPR NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free) SSOP – DCT TOP-SIDE MARKING (2) SN74LVC3G07YZPR Reel of 3000 SN74LVC3G07DCTR Reel of 3000 SN74LVC3G07DCUR Reel of 250 SN74LVC3G07DCUT C07_ _ _ C07_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001–2005, Texas Instruments Incorporated SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES365H – AUGUST 2001 – REVISED JUNE 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y H H L L LOGIC DIAGRAM (POSITIVE LOGIC) 1A 2A 3A 1 7 3 5 6 2 1Y 2Y 3Y Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 6.5 V state (2) (3) –0.5 UNIT VO Voltage range applied to any output in the high or low 6.5 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range DCT package 220 DCU package 227 YEA/YZA package 140 YEP/YZP package (1) (2) (3) (4) 2 °C/W 102 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES365H – AUGUST 2001 – REVISED JUNE 2005 Recommended Operating Conditions VCC (1) Operating Supply voltage Data retention only 1.65 5.5 1.7 VCC = 3 V to 3.6 V 0.7 × VCC VCC = 1.65 V to 1.95 V Low-level input voltage V V 2 VCC = 4.5 V to 5.5 V VIL UNIT 0.65 × VCC VCC = 2.3 V to 2.7 V High-level input voltage MAX 1.5 VCC = 1.65 V to 1.95 V VIH MIN 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 VCC = 4.5 V to 5.5 V V 0.3 × VCC VI Input voltage 0 5.5 V VO Output voltage 0 5.5 V VCC = 1.65 V 4 VCC = 2.3 V IOL Low-level output current ∆t/∆v 8 16 VCC = 3 V Input transition rise or fall rate VCC = 4.5 V 32 VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 VCC = 3.3 V ± 0.3 V 10 VCC = 5 V ± 0.5 V TA (1) mA 24 ns/V 5 Operating free-air temperature –40 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOL = 100 µA VOL 1.65 V 0.45 IOL = 8 mA 2.3 V 0.3 0.4 3V IOL = 32 mA VI = 5.5 V or GND VI or VO = 5.5 V ICC VI = 5.5 V or GND, IO = 0 ∆ICC One input at VCC – 0.6 V, Other inputs at VCC or GND Ci VI = VCC or GND UNIT V 0.55 4.5 V Ioff (1) MAX IOL = 4 mA IOL = 24 mA A inputs MIN TYP (1) 0.1 IOL = 16 mA II VCC 1.65 V to 5.5 V 0.55 0 to 5.5 V ±5 µA 0 ±10 µA 1.65 V to 5.5 V 10 µA 3 V to 5.5 V 500 µA 3.3 V 3.5 pF All typical values are at VCC = 3.3 V, TA = 25°C. 3 SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES365H – AUGUST 2001 – REVISED JUNE 2005 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V MIN MAX MIN MAX MIN MAX MIN MAX 1.5 7.8 1 4.3 1.1 3.7 1 2.9 UNIT ns Operating Characteristics TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance TEST CONDITIONS f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V TYP TYP TYP TYP 3 3 4 5 UNIT pF SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES365H – AUGUST 2001 – REVISED JUNE 2005 PARAMETER MEASUREMENT INFORMATION (OPEN DRAIN) VLOAD RL From Output Under Test S1 Open TEST GND CL (see Note A) RL S1 tPZL (see Notes E and F) VLOAD tPLZ (see Notes E and G) VLOAD tPHZ/tPZH VLOAD LOAD CIRCUIT INPUT VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VM tr/tf VI ≤ 2 ns ≤ 2 ns ≤ 2.5 ns ≤ 2.5 ns VCC VCC 3V VCC VCC/2 VCC/2 1.5 V VCC/2 VLOAD CL 2 × VCC 2 × VCC 6V 2 × VCC 30 pF 30 pF 50 pF 50 pF RL V∆ 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu th VI VM Input VM VM VM Data Input 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VI VM Input VM 0V tPHL tPLH VOH VM Output VM VOL tPHL tPLH VOH Output VM VI VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VI Output Control Output Waveform 1 S1 at VLOAD (see Note B) Output Waveform 2 S1 at VLOAD (see Note B) VM VM 0V tPZL tPLZ VLOAD/2 VM tPZH VOL + V∆ VOL tPHZ VM VLOAD/2 VLOAD/2 − V∆ ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd. F. tPZL is measured at VM. G. tPLZ is measured at VOL + V∆. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 5 PACKAGE OPTION ADDENDUM www.ti.com 6-Jun-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC3G07DCTR ACTIVE SM8 DCT 8 3000 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCUR ACTIVE US8 DCU 8 3000 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCURE4 ACTIVE US8 DCU 8 3000 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCUT ACTIVE US8 DCU 8 250 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCUTE4 ACTIVE US8 DCU 8 250 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07YEAR ACTIVE WCSP YEA 8 3000 TBD SNPB Level-1-260C-UNLIM SN74LVC3G07YEPR ACTIVE WCSP YEP 8 3000 TBD SNPB Level-1-260C-UNLIM SN74LVC3G07YZAR ACTIVE WCSP YZA 8 3000 Pb-Free (RoHS) SNAGCU Level-1-260C-UNLIM SN74LVC3G07YZPR ACTIVE WCSP YZP 8 3000 Pb-Free (RoHS) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDS049B – MAY 1999 – REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 8 0,13 M 5 0,15 NOM ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ 2,90 2,70 4,25 3,75 Gage Plane PIN 1 INDEX AREA 1 0,25 4 0° – 8° 3,15 2,75 0,60 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 NOTES: A. B. C. D. 4188781/C 09/02 All linear dimensions are in millimeters. This drawing is subject to change without notice. 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