SN74LVC861A 10-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS309I – MARCH 1993 – REVISED FEBRUARY 2005 FEATURES • • • • • • • • • Operates From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 6.4 ns at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC) Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) DB, DGV, DW, NS, OR PW PACKAGE (TOP VIEW) OEBA A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 GND 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 OEAB DESCRIPTION/ORDERING INFORMATION This 10-bit bus transceiver is designed for 1.65-V to 3.6-V VCC operation. The SN74LVC861A is designed for asynchronous communication between data buses. The control-function implementation allows for maximum flexibility in timing. This device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic levels at the output-enable (OEAB and OEBA) inputs. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION PACKAGE (1) TA Reel of 2000 SN74LVC861ADWR SOP – NS Reel of 2000 SN74LVC861ANSR LVC861A SSOP – DB Reel of 2000 SN74LVC861ADBR LC861A Tube of 60 SN74LVC861APW Reel of 2000 SN74LVC861APWR Reel of 250 SN74LVC861APWT Reel of 2000 SN74LVC861ADGVR TSSOP – PW TVSOP – DGV (1) TOP-SIDE MARKING SN74LVC861ADW SOIC – DW –40°C to 85°C ORDERABLE PART NUMBER Tube of 25 LVC861A LC861A LC861A Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1993–2005, Texas Instruments Incorporated SN74LVC861A 10-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS309I – MARCH 1993 – REVISED FEBRUARY 2005 FUNCTION TABLE INPUTS OEAB OEBA OPERATION L H A data to B bus H L B data to A bus H H Isolation L L Latch A and B (A = B) LOGIC DIAGRAM (POSITIVE LOGIC) OEBA OEAB A1 1 13 2 23 To Nine Other Channels 2 B1 SN74LVC861A 10-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com Absolute Maximum Ratings SCAS309I – MARCH 1993 – REVISED FEBRUARY 2005 (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V –0.5 6.5 V –0.5 VCC + 0.5 state (2) (3) UNIT VO Voltage range applied to any output in the high-impedance or power-off VO Voltage range applied to any output in the high or low state IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Package thermal impedance (4) DB package 63 DGV package 86 DW package 46 NS package 65 PW package Tstg (1) (2) (3) (4) Storage temperature range V °C/W 88 –65 °C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) VCC Supply voltage VIH High-level input voltage Operating Data retention only VCC = 1.65 V to 1.95 V MIN MAX 1.65 3.6 1.5 Low-level input voltage VI 1.7 VCC = 2.7 V to 3.6 V 2 VO Output voltage 0.35 × VCC 0.7 VCC = 2.7 V to 3.6 V 0.8 0 5.5 High or low state 0 VCC 3-state 0 5.5 VCC = 1.65 V IOH High-level output current Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) V V V –4 VCC = 2.3 V –8 VCC = 2.7 V –12 VCC = 3 V –24 VCC = 1.65 V IOL V VCC = 2.3 V to 2.7 V Input voltage V 0.65 × VCC VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VIL UNIT mA 4 VCC = 2.3 V 8 VCC = 2.7 V 12 VCC = 3 V 24 –40 mA 10 ns/V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 3 SN74LVC861A 10-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS309I – MARCH 1993 – REVISED FEBRUARY 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA VOH 1.65 V to 3.6 V 1.65 V 1.2 IOH = –8 mA 2.3 V 1.7 2.7 V 2.2 3V 2.4 IOH = –24 mA 3V 2.2 IOL = 100 µA 1.65 V to 3.6 V 0.2 IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.7 IOL = 12 mA 2.7 V 0.4 3V 0.55 IOL = 24 mA II Control inputs VI = 0 to 5.5 V UNIT VCC – 0.2 IOH = –4 mA IOH = –12 mA VOL MIN TYP (1) MAX VCC V V 3.6 V ±5 µA Ioff VI or VO = 5.5 V 0 ±10 µA IOZ (2) VO = 0 to 5.5 V 3.6 V ±10 µA VI = VCC or GND ICC IO = 0 3.6 V ≤ VI ≤ 5.5 V (3) ∆ICC 10 3.6 V One input at VCC – 0.6 V, Other inputs at VCC or GND 10 2.7 V to 3.6 V 500 µA µA Ci Control inputs VI = VCC or GND 3.3 V 5 pF Cio A or B ports VO = VCC or GND 3.3 V 7 pF (1) (2) (3) All typical values are at VCC = 3.3 V, TA = 25°C. For I/O ports, the parameter IOZ includes the input leakage current. This applies in the disabled state only. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd A or B ten OEAB or OEBA PARAMETER tdis OEAB or OEBA VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V MIN MAX MIN MAX B or A (1) (1) (1) A or B (1) (1) A or B (1) (1) VCC = 2.7 V MIN VCC = 3.3 V ± 0.3 V MIN MAX (1) 6.8 1.3 6.4 ns (1) (1) 8.2 1 7 ns (1) (1) 6.6 1.7 5.9 ns 1 ns tsk(o) (1) UNIT MAX This information was not available at the time of publication. Operating Characteristics TA = 25°C PARAMETER Cpd (1) 4 Power dissipation capacitance per transceiver TEST CONDITIONS Outputs enabled Outputs disabled This information was not available at the time of publication. f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) (1) 29 (1) (1) 5 UNIT pF SN74LVC861A 10-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS309I – MARCH 1993 – REVISED FEBRUARY 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VM VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 5 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC861ADBLE OBSOLETE SSOP DB 24 SN74LVC861ADBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861ADBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861ADGVR ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861ADGVRE4 ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861ADW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861ADWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861ADWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861ADWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861ANSR ACTIVE SO NS 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861ANSRE4 ACTIVE SO NS 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861APW ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861APWE4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861APWLE OBSOLETE TSSOP PW 24 TBD Call TI SN74LVC861APWR ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861APWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861APWT ACTIVE TSSOP PW 24 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC861APWTE4 ACTIVE TSSOP PW 24 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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