SS8047 2.5V 1A Positive Voltage Regulator Features General Description Output current in excess of 1A Output voltage accuracy +3%/-1% Quiescent current, typically 600µA Internal short-circuit current-limit Internal over-temperature protection The SS8047 positive 2.5V voltage regulator features the ability to source 1A of output current. The typical quiescent current is 0.6mA. Familiar regulator features such as over-temperature and over-current protection circuits are provided to prevent it from being damaged by abnormal operating conditions. Applications n n n n n PC motherboard ADSL/Cable Modem Set -Top Box LAN switch/Hub Router Ordering Information The SS8047 is only available with Pb-free lead finish. SS8047GTXXXX Packing Type Pin Option Package Type PACKAGE TYPE PIN OPTION GT3 : TO 220 Pb-free GT4 : TO 252 Pb-free GT5 : TO 263 Pb-free GT6 : SOT 223 Pb-free 1 1 : V OUT 2 : V OUT 3 : GND 4 : GND 5 : V IN 6 : V IN Typical Application PACKING 2 GND V IN V OUT V IN GND V OUT 3 V IN GND V IN V OUT V OUT GND TR : Tape & Reel TB : Tubes Pin Configuration [Note 4] : Type of COUT IO VIN SS8047 C1 1µF IQ VOUT C OUT 10µF Top View 1 2 1 3 TO-220 Rev.2.02 7/06/2004 Top View 2 3 TO-252 and TO-263 www.SiliconStandard.com Top View 1 2 3 SOT-223 1 of 11 SS8047 Absolute Maximum Ratings (Note 1) Input Voltage…………………………………....................................................................…..…..…7V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature…..……………............................................................…….…..150°C Storage Temperature Range….……......................................................................................…..-65°C ≤ TJ ≤+150°C Lead Temperature, Time for Wave Soldering TO 220 Package………………………….........................................................................…………260°C, 10s TO 252, TO 263, SOT 223 Pac kage…………......................................................................…...260°C, 4s Continuous Power Dissipation (TA = + 25°C) SOT 223(1) ………………………................................................................…….….……….………..0.8W TO 252(1) ………..……………................................................................……….……….….………..1.0W TO 263(1) ………..……………….………................................................................…….….………..1.6W Note (1): See Recommended Minimum Footprint. Operating Conditions (Note 1) Input Voltage…………………………….....................................................................…………….3.3V~6V Temperature Range………………...............................................................................…………0°C ≤ TJ ≤125°C Electrical Characteristics VIN =5V, IO = 1A, CIN = 1µF, COUT =10 µF, All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER Output Voltage Line Regulation Load Regulation Output Impedance Quiescent Current Ripple Rejection Dropout Voltage CONDITIONS V IN = 5V, 10mA < IO < 1A V IN = 3.3V, 10mA < IO < 500mA 3.3V < V IN < 6V, IO = 10mA V IN = 5V, 10mA < IO < 1A V IN = 3.3V, 10mA < IO < 500mA 200mA DC and 100mA AC, fo = 120Hz V IN = 5V f i = 120Hz,V ripple =2V P-P , Io = 100mA IO = 1A IO = 500mA IO = 100mA MIN TYP MAX UNITS 2.475 2.50 2.575 V 3 35 25 80 0.6 46 1.15 420 200 1.6 150 30 50 mV mV mV mΩ mA dB V mV mV A Short Circuit Current Over Temperature °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the SS8047 in SOT 223 package, θJA is 156°C/W; in TO 263 package, θJA is 75°C/W, and in the TO 252 package, θJA is 125°C/W (See recommend minimum footprint). The safe operation in SOT 223,TO 252 & TO 263 package, it can see “Typical Performance Characteristics” (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum. Rev.2.02 7/06/2004 www.SiliconStandard.com 2 of 11 SS8047 Definitions Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value. Dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Rev.2.02 7/6/2004 Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. www.SiliconStandard.com 3 of 11 SS8047 Typical Performance Characteristics (V IN= +5V, CIN=1µF, COUT=10µF, TA=25°C, unless otherwise noted.) Line Transient Load Transient Ch1: Iout (1A/div) Ch2: Vout (offset=2.50V) Ch1: Vin (offset=5.0V) Ch2: Vout (offset=2.50V) CIN = 1uF Iout=100mA Dropout Voltage vs. Load Current Output Voltage vs. Load Current 2.600 1200 1100 Dropout Voltage (mV) Ootput Voltage (V) 2.580 2.560 2.540 2.520 2.500 1000 900 800 700 600 500 400 300 200 100 2.480 0 0 100 200 300 400 500 600 700 800 900 1000 0 100 Load Current (mA) 200 300 400 500 600 700 800 900 1000 Load Current (mA) Ground Current vs. Load Current 2.00 Ground Current (mA) 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Rev.2.02 7/6/2004 www.SiliconStandard.com 4 of 11 SS8047 Typical Performance Characteristics (V IN= +3.3V, CIN=1µF, COUT=10µF, TA=25°C, unless otherwise noted.) Line Transient Load Transient Ch1: Vin (offset=3.3V) Ch2: Vout (offset=2.50V) CIN = 1uF Iout=100mA Ch1: Iout (400mA/div) Ch2: Vout is AC coupled Dropout Voltage vs. Load Current 500 2.545 450 Dropout Voltage (mV) Ootput Voltage (V) Output Voltage vs. Load Current 2.550 2.540 2.535 2.530 2.525 2.520 2.515 2.510 400 350 300 250 200 150 100 50 2.505 0 2.500 0 50 100 150 200 250 300 350 400 450 500 550 600 0 50 100 150 200 250 300 350 400 450 500 550 600 Load Current (mA) Load Current (mA) Ground Current vs. Load Current 2.00 Ground Current (mA) 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 0 100 200 300 400 500 600 Load Current (mA) Rev.2.02 7/06/2004 www.SiliconStandard.com 5 of 11 SS8047 Safe Operating Area of SOT-223 Power Dissipation of SOT-223 1200 1.0 800 0.9 1oz Copper on SOT-223 Package Mounted on recommended mimimum footprint (R£ cJ A=156°C/W) 0.8 Power Dissipation (W) Output Current (mA) 1000 T A=25°C,Still Air Maximum Recommended Output Current TA=25¢ J 600 TA=55¢ J TA=85¢ J 400 200 Still Air 1oz Copper on SOT-223 Package Mounted on recommend mimimum footprint (R£ cJ A=156°C/W) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 25 35 Input-Output Voltage Differential VIN-V OUT (V) 45 55 65 75 85 95 105 115 125 Amibent Temperature TA (°C) Note: VI N(max) <= 6.5V Power Dissipation of TO-252 Safe Operating Area of TO-252 1200 1.2 T A=25°C,Still Air 1.1 1oz Copper on TO-252 Package Mounted on recommended mimimum footprint (R£ cJ A=125°C/W) Maximum Recommended Output Current 1.0 0.9 800 TA=25¢ J 600 TA=55¢ J TA=85¢ J 400 200 Power Dissipation (W) Output Current (mA) 1000 0.8 0.7 0.6 0.5 0.4 Still Air 1oz Copper on TO-252 Package Mounted on recommend mimimum 0.3 0.2 footprint (R£ cJ A=125°C/W) 0.1 0 0.0 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 Input-Output Voltaage Differential VIN-VOUT (V) 25 35 45 55 65 75 85 95 105 115 125 Amibent Temperature TA (°C) Note: VIN(max) <= 6.5V Rev.2.02 7/6/2004 www.SiliconStandard.com 6 of 11 SS8047 Power Dissipation of TO-263 Safe Operating Area of TO-263 1200 2.0 TA=25°C,Still Air 800 TA=25¢ J TA=55¢ J TA=85¢ J 600 400 200 Still Air 1oz Copper on TO-263 Package Mounted on recommend mimimum footprint (R£ cJA =75°C/W) 1.6 Power Dissipation (W) Output Current (mA) 1.8 Maximum Recommended Output Current 1000 1oz Copper on TO-263 Package Mounted on recommended mimimum footprint (R£ cJ A=75°C/W) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0.0 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 25 35 45 Input-Output Voltaage Differential VIN-VOUT (V) 55 65 75 85 95 105 115 125 Amibent Temperature TA (°C) Note: VIN(max) <= 6.5V Recommend Minimum Footprint Rev.2.02 7/06/2004 www.SiliconStandard.com 7 of 11 SS8047 Package Information The SS8047 is only available with Pb-free lead finish. E A E1 E1 R F d D D1 I L e C A1 b e1 b1 TO-220 (T3) Package SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A 4.318 4.826 0.170 0.190 A1 2.46 2.72 0.097 0.107 b 0.69 0.94 0.027 0.037 b1 1.143 1.397 0.045 0.055 C 0.304 0.460 0.012 0.018 D 3.429 3.683 0.135 0.145 D1 8.53 9.04 0.336 0.356 d 2.62 2.87 0.103 0.113 E 9.906 10.40 0.390 0.410 E1 2.84 5.13 0.112 0.202 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 F 1.143 1.397 0.045 0.055 I 3.454 3.962 0.136 0.156 L 13.589 14.351 0.535 0.565 Rev.2.02 7/6/2004 www.SiliconStandard.com 8 of 11 SS8047 E A F E1 L1 H D L2 A1 L3 θ b e C e1 The SS8047 is only available with Pb-free lead finish. TO-252 (T4) Package SYMBOL MILLIMETERS INCHES MIN. MAX. MIN. MAX. A 2.19 2.38 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.64 0.89 0.025 0.035 C 0.46 0.58 0.018 0.023 D 5.97 6.22 0.235 0.245 E 6.35 6.73 0.250 0.265 E1 5.21 5.46 0.205 e 2.26BSC 0.215 0.09BSC e1 3.96 5.18 0.156 0.204 F 0.46 0.58 0.018 0.023 L1 0.89 2.03 0.035 0.080 L2 0.64 1.02 0.025 0.040 L3 2.40 2.80 0.095 0.110 H 9.40 10.40 0.370 0.410 θ 0° 4° 0° 4° Rev.2.02 7/06/2004 www.SiliconStandard.com 9 of 11 SS8047 A D α B1 C 13 °(4X ) H E L L2 e e1 The SS8047 is only available with Pb-free lead finish. 13 °(4X ) A1 B SOT-223 (T6) Package SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A 1.55 1.80 0.061 0.071 A1 0.02 0.12 0.0008 0.0047 B 0.60 0.80 0.024 0.031 B1 2.90 3.10 0.114 0.122 C 0.24 0.32 0.009 0.013 D 6.30 6.70 0.248 0.264 E 3.30 3.70 0.130 e 2.30 BSC e1 H 4.60 BSC 6.70 L a 0.181 BSC 7.30 0.264 0.90 MIN L2 0.287 0.036 MIN 0.06 BSC 0º 0.146 0.090 BSC 0.0024 BSC 10º 0º 10º Package Orientation Feed Direction T O 2 5 2¡ 2 B6 3 P a c k a g e O r i e n t a t i o n Rev.2.02 7/06/2004 Feed Direction SOT 223 Package Orientation www.SiliconStandard.com 10 of 11 SS8047 A E A1 L3 D H C L1 e L L2 A2 e1 b b1 The SS8047 is only available with Pb-free lead finish. TO-263 (T5) Package SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A 4.30 4.70 0.169 0.185 A1 1.22 1.32 0.048 0.055 A2 2.45 2.69 0.104 0.106 b 0.69 0.94 0.027 0.037 b1 1.22 1.40 0.048 0.055 C 0.36 0.56 0.014 0.022 D 8.64 9.652 0.340 0.380 E 9.70 10.54 0.382 0.415 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 H 14.60 15.78 0.575 0.625 L 4.70 5.84 0.185 0.230 L1 1.20 1.778 0.047 0.070 L2 2.24 2.84 0.088 0.111 L3 1.40MAX 0.055MAX Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. Rev.2.02 7/06/2004 www.SiliconStandard.com 11 of 11