STMICROELECTRONICS STGW45NC60WD

STGW45NC60WD
45 A - 600 V ultra fast IGBT
Features
■
Low CRES / CIES ratio (no cross conduction
susceptibility)
■
Very soft ultra fast recovery anti parallel diode
Applications
2
■
High frequency inverters, UPS
■
Motor drivers
■
HF, SMPS and PFC in both hard switch and
resonant topologies
■
Welding
■
Induction heating
3
1
TO-247 long leads
Figure 1.
Description
Internal schematic diagram
This IGBT utilizes the advanced Power MESH™
process resulting in an excellent trade-off
between switching performance and low on-state
behavior.
Table 1.
Device summary
Order code
Marking
Package
Packaging
STGW45NC60WD
GW45NC60WD
TO-247 long leads
Tube
June 2008
Rev 1
1/14
www.st.com
14
Contents
STGW45NC60WD
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................ 7
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
STGW45NC60WD
1
Electrical ratings
Electrical ratings
Table 2.
Symbol
Parameter
Value
Unit
VCES
Collector-emitter voltage (VGS = 0)
600
V
IC (1)
Collector current (continuous) at TC=25 °C
90
A
Collector current (continuous) at TC=100 °C
45
A
ICL (2)
Turn-off latching current
230
A
ICP(3)
Pulsed collector current
230
A
VGE
Gate-emitter voltage
±20
V
Diode RMS forward current at TC=25 °C
30
A
IFSM
Surge non repetitive forward current tp=10 ms
sinusoidal
120
A
PTOT
Total dissipation at TC = 25 °C
285
W
– 55 to 150
°C
Value
Unit
IC
(1)
IF
Tj
1.
Absolute maximum ratings
Operating junction temperature
Calculated according to the iterative formula:
T
–T
JMAX
C
I ( T ) = ----------------------------------------------------------------------------------------------------C C
R
× V
(T , I )
THJ – C
CESAT ( MAX ) C C
2. Vclamp = 80% VCES , Tj = 150 °C, RG = 10 Ω, VGE= 15 V
3. Pulse width limited by max junction temperature allowed
Table 3.
Symbol
Thermal resistance
Parameter
Rthj-case
Thermal resistance junction-case IGBT
0.437
°C/W
Rthj-case
Thermal resistance junction-case diode
1.5
°C/W
Rthj-amb
Thermal resistance junction-ambient max
50
°C/W
3/14
Electrical characteristics
2
STGW45NC60WD
Electrical characteristics
(TCASE = 25 °C unless otherwise specified)
Table 4.
Symbol
Parameter
Test conditions
V(BR)CES
Collector-emitter breakdown
IC = 1 mA
voltage (VGE = 0)
VCE(sat)
Collector-emitter saturation
voltage
VGE= 15 V, IC= 30 A
VGE(th)
Gate threshold voltage
VCE= VGE, IC= 250 µA
ICES
Collector-emitter leakage
current (VGE = 0)
VCE = 600 V
IGES
gfs (1)
1.
Min. Typ. Max. Unit
600
V
2.1
1.9
2.6
V
V
5.75
V
VCE = 600 V, Tc=125 °C
500
5
µA
mA
Gate-emitter leakage
current (VCE = 0)
VGE = ± 20 V
±100
nA
Forward transconductance
VCE = 15 V, IC= 30 A
VGE= 15 V, IC= 30 A, Tc= 125 °C
3.75
20
S
Pulsed: pulse duration = 300 ìs, duty cycle 1.5%
Table 5.
Symbol
Cies
Coes
Cres
Qg
Qge
Qgc
4/14
Static (electrical characteristics)
Dynamic (electrical characteristics)
Parameter
Input capacitance
Output capacitance
Reverse transfer
capacitance
Total gate charge
Gate-emitter charge
Gate-collector charge
Test conditions
VCE = 25 V, f = 1 MHz, VGE= 0
VCE = 390 V, IC = 30 A,
VGE = 15 V,
(see Figure 18)
Min. Typ. Max. Unit
2900
298
59
pF
pF
pF
126
16
46
nC
nC
nC
STGW45NC60WD
Table 6.
Symbol
td(on)
tr
(di/dt)on
td(on)
tr
(di/dt)on
tr(Voff)
td(off)
tf
tr(Voff)
td(off)
tf
Table 7.
Symbol
Electrical characteristics
Switching on/off (inductive load)
Parameter
Turn-on delay time
Current rise time
Turn-on current slope
Turn-on delay time
Current rise time
Turn-on current slope
Test conditions
Min.
VCC = 390 V, IC = 30 A
RG= 10 Ω, VGE= 15 V,
(see Figure 17)
VCC = 390V, IC = 30A
RG= 10Ω, VGE= 15V,
TC= 125 °C
Typ.
Max. Unit
33
12
2600
ns
ns
A/µs
32
14
2300
ns
ns
A/µs
26
168
36
ns
ns
ns
54
213
67
ns
ns
ns
(see Figure 17)
Off voltage rise time
Turn-off delay time
Current fall time
Off voltage rise time
Turn-off delay time
Current fall time
Vcc = 390 V, IC = 30 A,
RGE = 10 Ω, VGE =15 V,
(see Figure 17)
Vcc = 390 V, IC = 30 A,
RGE=10 Ω, VGE =15 V,
TC=125 °C
(see Figure 17)
Switching energy (inductive load)
Parameter
Eon (1)
Eoff(2)
Ets
Turn-on switching losses
Turn-off switching losses
Total switching losses
Eon (1)
Eoff (2)
Ets
Turn-on switching losses
Turn-off switching losses
Total switching losses
Test conditions
VCC = 390 V, IC = 30 A
RG= 10 Ω, VGE= 15 V,
(see Figure 17)
VCC = 390 V, IC = 30 A
RG= 10 Ω, VGE= 15 V,
TC = 125 °C
Min.
Typ.
Max.
Unit
302
349
651
µJ
µJ
µJ
553
750
1303
µJ
µJ
µJ
(see Figure 17)
1. Eon is the turn-on losses when a typical diode is used in the test circuit in Figure 20 Eon include diode
recovery energy. If the IGBT is offered in a package with a co-pak diode, the co-pack diode is used as
external diode. IGBTs & Diode are at the same temperature (25°C and 125°C)
2. Turn-off losses include also the tail of the collector current
5/14
Electrical characteristics
Table 8.
Symbol
Collector-emitter diode
Parameter
VF
Forward on-voltage
trr
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Qrr
Irrm
trr
Qrr
Irrm
6/14
STGW45NC60WD
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Test conditions
IF = 30 A
IF = 30 A, TC = 125 °C
IF = 30 A, VR = 50 V,
di/dt =100 A/µs
(see Figure 20)
IF = 30 A, VR = 50 V,
TC= 125 °C,
di/dt =100 A/µs
(see Figure 20)
Min
Typ.
Max
Unit
2.4
1.8
V
V
45
56
2.55
ns
nC
A
100
290
5.8
ns
nC
A
STGW45NC60WD
Electrical characteristics
2.1
Electrical characteristics (curves)
Figure 2.
Output characteristics
Figure 3.
Transfer characteristics
Figure 4.
Transconductance
Figure 5.
Collector-emitter on voltage vs
temperature
Figure 6.
Collector-emitter on voltage vs
collector current
Figure 7.
Normalized gate threshold vs
temperature
7/14
Electrical characteristics
Figure 8.
Normalized breakdown voltage vs
temperature
Figure 10. Capacitance variations
STGW45NC60WD
Figure 9.
Gate charge vs gate-emitter voltage
Figure 11. Switching losses vs temperature
Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector
current
8/14
STGW45NC60WD
Electrical characteristics
Figure 14. Thermal impedance
Figure 15. Turn-off SOA
Figure 16. Emitter-collector diode
characteristics
IFM(A)
120
110
Tj=125°C
(Maximum values)
100
90
80
Tj=125°C
(Typical values)
70
60
Tj=25°C
(Maximum values)
50
40
30
20
10
VFM(V)
0
0
1
2
3
4
5
6
9/14
Test circuit
3
STGW45NC60WD
Test circuit
Figure 17. Test circuit for inductive load
switching
Figure 18. Gate charge test circuit
Figure 19. Switching waveforms
Figure 20. Diode recovery times waveform
10/14
STGW45NC60WD
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
11/14
Package mechanical data
STGW45NC60WD
TO-247 long leads mechanical data
mm
Dim.
Min.
A
D
E
F
F1
F2
F3
F4
G
H
L
L1
L2
L3
L4
L5
M
V
V2
DIAM
Typ.
Max.
4.85
2.2
0.4
1
5.16
2.6
0.8
1.4
3
2
1.9
3
2.4
3.4
10.9
15.45
19.85
3.7
18.3
14.2
34.05
5.35
2
16.03
21.09
4.3
19.13
20.3
41.38
6.3
3
5°
60°
3.55
3.65
V
5
H
L1
L4
L2
L
DIA
L5
A
F2
F1
L3
F3
D
F4
V2
F(X3)
M
E
G
=
12/14
=
7395426_Rev_D
STGW45NC60WD
5
Revision history
Revision history
Table 9.
Document revision history
Date
Revision
05-Jun-2008
1
Changes
First release
13/14
STGW45NC60WD
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2008 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
14/14