STMICROELECTRONICS STPS30L40CG

STPS30L40CG/CT/CW

LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCTS CHARACTERISTICS
IF(AV)
2 x 15 A
VRRM
40 V
Tj (max)
150 °C
VF (max)
0.50 V
A1
K
K
A2
A2
FEATURES AND BENEFITS
A1
D2PAK
STPS30L40CG
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
LOW THERMAL RESISTANCE
AVALANCHERATED
DESCRIPTION
Dual center tap schottky rectifiers suited for
Switched Mode Power Supplies and high
frequencyDC to DC converters.
Packaged in TO-247, TO-220ABand D2PAK these
devices are intended for use in low voltage, high
frequency inverters, free-wheeling and polarity
protectionapplications.
A2
A2
A1
K
TO-220AB
STPS30L40CT
K
A1
TO-247
STPS30L40CW
ABSOLUTE RATINGS (limiting values, per diode)
Symbol
VRRM
IF(RMS)
Parameter
Repetitive peak reverse voltage
RMS forward current
Value
40
Unit
V
30
A
15
30
A
220
A
IF(AV)
Average forward current
Tc = 135°C
δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
IRRM
Repetitive peak reverse current
tp=2 µs square F=1kHz
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
3
A
Tstg
Storage temperature range
- 65 to + 150
°C
150
°C
10000
V/µs
Tj
dV/dt
* :
Per diode
Per device
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
1
dPtot
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth(j−a)
July 1999 - Ed: 3A
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STPS30L40CG/CT/CW
THERMAL RESISTANCES
Symbol
Parameter
Rth (j-c)
Per diode
Total
Coupling
Junction to case
Rth (c)
Value
Unit
1.60
0.85
0.10
°C/W
°C/W
When the diodes 1 and 2 are used simultaneously :
∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol
Parameter
IR *
VF *
Tests Conditions
Min.
Typ.
VR = VRRM
Reverse leakage
current
Tj = 25°C
Forward voltage drop
Tj = 25°C
IF = 15 A
Tj = 125°C
IF = 15 A
Tj = 25°C
IF = 30 A
Tj = 125°C
IF = 30 A
Max.
Unit
360
µA
50
mA
0.55
V
20
Tj = 100°C
0.42
0.50
0.74
0.59
0.67
Pulse test : * tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation :
P = 0.330 x I F(AV) + 0.011 IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
12
PF(av)(W)
δ = 0.2
δ = 0.1
18
16
14
12
10
8
6
4
2
0
δ = 0.5
8
δ=1
6
4
T
2
δ=tp/T
IF(av)A
0
2/6
2
ambient
IF(av)(A)
δ = 0.05
10
0
Fig. 2: Average current versus
temperature (δ=0.5) (per diode).
4
6
8
10
12
14
16
tp
18
20
Rth(j-a)=Rth(j-c)
Rth(j-a)=15°C/W
T
δ=tp/T
0
Tamb(°C)
tp
25
50
75
100
125
150
STPS30L40CG/CT/CW
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values) (per
diode).
Fig. 4: Relative variation of thermal transient
impedance junction to case versus pulse duration.
IM(A)
200
180
160
140
120
100
80
60
40 IM
20
0
1E-3
1.0
Zth(j-c)/Rth(j-c)
0.8
δ = 0.5
0.6
Tc=25°C
Tc=75°C
0.4
δ = 0.2
Tc=125°C
δ = 0.1
δ=0.5
1E-2
1E-1
1E+0
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values) (per diode).
IR(mA)
Single pulse
δ=tp/T
tp(s)
0.0
1.0E-4
1.0E-3
1.0E-2
1.0E-1
tp
1.0E+0
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values) (per diode).
2000
2E+2
1E+2
T
0.2
t(s)
t
C(pF)
F=1MHz
Tj=25°C
Tj=150°C
1000
Tj=100°C
1E+1
Tj=75°C
500
1E+0
1E-1
1E-2
200
Tj=25°C
VR(V)
0
5
10
15
20
25
30
35
40
Fig. 7: Forward voltage drop versus forward
current (maximum values) (per diode).
200
100
1
VR(V)
5
2
10
20
50
Fig. 8: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35µm)
(STPS30L40CGonly).
IFM(A)
Rth(j-a) (°C/W)
80
Typical values
Tj=150°C
100
70
60
50
40
10
Tj=125°C
30
20
Tj=25°C
10
VFM(V)
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0
S(Cu) (cm )
0
5
10
15
20
25
30
35
40
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STPS30L40CG/CT/CW
PACKAGE MECHANICAL DATA
TO-220AB
DIMENSIONS
REF.
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
F
M
G1
E
G
Cooling method : C
Recommended torque value : 0.55 m.N
Maximum torque value : 0.70 m.N
4/6
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
Millimeters
Min.
Max.
4.40
4.60
1.23
1.32
2.40
2.72
0.49
0.70
0.61
0.88
1.14
1.70
1.14
1.70
4.95
5.15
2.40
2.70
10
10.40
16.4 typ.
13
14
2.65
2.95
15.25
15.75
6.20
6.60
3.50
3.93
2.6 typ.
3.75
3.85
Inches
Min.
Max.
0.173
0.181
0.048
0.051
0.094
0.107
0.019
0.027
0.024
0.034
0.044
0.066
0.044
0.066
0.194
0.202
0.094
0.106
0.393
0.409
0.645 typ.
0.511
0.551
0.104
0.116
0.600
0.620
0.244
0.259
0.137
0.154
0.102 typ.
0.147
0.151
STPS30L40CG/CT/CW
PACKAGE MECHANICAL DATA
D2PAK
DIMENSIONS
REF.
Millimeters
Inches
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
Min.
Max.
4.40
4.60
2.49
2.69
0.03
0.23
0.70
0.93
1.14
1.70
0.45
0.60
1.23
1.36
8.95
9.35
10.00
10.40
4.88
5.28
15.00
15.85
1.27
1.40
1.40
1.75
2.40
3.20
0.40 typ.
0°
8°
Min.
Max.
0.173
0.181
0.098
0.106
0.001
0.009
0.027
0.037
0.045
0.067
0.017
0.024
0.048
0.054
0.352
0.368
0.393
0.409
0.192
0.208
0.590
0.624
0.050
0.055
0.055
0.069
0.094
0.126
0.016 typ.
0°
8°
A
E
C2
L2
D
L
L3
A1
B2
B
R
C
G
A2
M
*
V2
* FLAT ZONE NO LESSTHAN 2mm
Cooling method : by conduction (method C)
FOOT PRINT (in millimeters)
D2PAK
16.90
10.30
5.08
1.30
3.70
8.90
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STPS30L40CG/CT/CW
PACKAGE MECHANICAL DATA
TO-247
DIMENSIONS
REF.
Millimeters
Inches
V
Min. Typ. Max. Min. Typ. Max.
Dia.
V
A
H
L5
L
L2 L4
F2
F1
L1
F3
V2
F4
D
L3
F(x3)
M
G
=
E
=
A
4.85
5.15 0.191
0.203
D
2.20
2.60 0.086
0.102
E
0.40
0.80 0.015
0.031
F
1.00
1.40 0.039
0.055
F1
3.00
0.118
F2
2.00
0.078
F3 2.00
2.40 0.078
0.094
F4 3.00
3.40 0.118
0.133
G
10.90
0.429
H 15.45
15.75 0.608
0.620
L 19.85
20.15 0.781
0.793
L1 3.70
4.30 0.145
0.169
L2
18.50
0.728
L3 14.20
14.80 0.559
0.582
L4
34.60
1.362
L5
5.50
0.216
M
2.00
3.00 0.078
0.118
V
5°
5°
V2
60°
60°
Dia. 3.55
3.65 0.139
0.143
Cooling method : C
Recommended torque value : 0.8m.N
Maximum torque value : 1.0m.N
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS30L40CT
STPS30L40CT
TO-220AB
STPS30L40CG
STPS30L40CG
2g
50
Tube
2
1.8g
50
Tube
2
D PAK
STPS30L40CG-TR
STPS30L40CG
D PAK
1.8g
500
Tape & reel
STPS30L40CW
STPS30L40CW
TO-247
4.4g
30
Tube
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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