STPS15L25D/G ® LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 15 A VRRM 25 V Tj (max) 150 °C VF (max) 0.35 V K A A FEATURES NC K VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION AND REDUCED HEATSINK OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH MEANS THE HIGHEST EFFICIENCY IN THE APPLICATIONS TO-220AC STPS15L25D D2PAK STPS15L25G DESCRIPTION Single Schottky rectifier suited for Switched Mode Power Supplies and high frequency DC to DC converters (VRMS). Packaged in TO-220AC or D2PAK, this device is especially intended for use as a Rectifier at the secondary of 3.3V SMPS and DC/DC units. ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 25 V IF(RMS) RMS forward current 30 A IF(AV) Average forward current Tc = 145°C δ = 0.5 15 A IFSM Surge non repetitive forward current tp = 10ms Sinusoidal 250 A IRRM Repetitive peak reverse current tp=2µs square F=1kHz 1 A IRSM Non repetitive peak reverse current tp = 100µs square 4 A Tstg Storage temperature range - 65 to + 150 °C 150 °C 10000 V/µs Tj Maximum operating junction temperature * dV/dt Critical rate of rise of reverse voltage dPtot 1 < * : thermal runaway condition for a diode on its own heatsink Rth(j−a) dTj June 1999 - Ed : 4B 1/5 STPS15L25D/G THERMAL RESISTANCES Symbol Rth(j-c) Parameter Junction to case Value Unit 1 °C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Parameters Test conditions Reverse leakage current Tj = 25°C Min. Typ. VR = VRRM Tj = 125°C VF * Forward voltage drop 225 Tj = 25°C IF = 15A Tj = 125°C IF = 15A Tj = 25°C IF = 30A Tj = 125°C IF = 30A 0.3 Max. Unit 1.3 mA 450 mA 0.46 V 0.35 0.56 0.41 0.46 Pulse test : * tp = 380 µs, δ < 2% To evaluate the maximum conduction losses use the following equation : P = 0.24 x IF(AV) + 0.0073 IF2(RMS) Fig.1 : Average forward power dissipation versus average forward current. Fig.2 : Average forward current versus ambient temperature ( δ = 0.5). IF(av)(A) PF(av)(W) 16 8 δ = 0.1 δ = 0.05 7 δ = 0.2 14 δ = 0.5 6 12 5 10 4 8 δ=1 Rth(j-a)=50°C/W 6 3 T 2 1 0 Rth(j-a)=Rth(j-c) δ=tp/T IF(av) (A) 0 2/5 2 4 6 8 10 12 2 tp 14 T 4 16 0 δ=tp/T 0 Tamb(°C) tp 25 50 75 100 125 150 STPS15L25D/G Fig.3 : Non repetitive surge peak forward current versus overload duration (maximum values). Fig.4 : Relative variation of thermal impedance junction to case versus pulse duration. IM(A) Zth(j-c)/Rth(j-c) 350 1.0 300 0.8 250 200 Tc=25°C 150 Tc=75°C 0.6 0.4 δ = 0.2 100 Tc=100°C IM 50 t 0 1E-3 T δ = 0.1 0.2 t(s) δ=0.5 t(s) Single pulse 1E-2 1E-1 1E+0 Fig.5 : Reverse leakage current versus reverse voltage applied (typical values). 1E+3 δ = 0.5 0.0 1.0E-4 1.0E-3 δ=tp/T 1.0E-2 1.0E-1 tp 1.0E+0 Fig.6 : Junction capacitance versus reverse voltage applied (typical values). C(nF) IR(mA) 5.0 Tj=150°C F=1MHz Tj=25°C Tj=125°C 1E+2 1E+1 1.0 1E+0 Tj=25°C 1E-1 VR(V) 1E-2 0 5 10 15 20 25 Fig.7 : Forward voltage drop versus forward current (maximum values). 200.0 100.0 0.1 2 5 10 20 30 Fig.8 : Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 µm). (STPS15L25G only) IFM(A) Rth(j-a) (°C/W) 80 70 Typical values Tj=150°C 60 10.0 50 Tj=125°C 40 30 Tj=25°C 1.0 20 10 VFM(V) 0.1 0.0 VR(V) 1 0.2 0.4 0.6 0.8 0 1.0 1.2 1.4 S(Cu) (cm²) 0 4 8 12 16 20 24 28 32 36 40 3/5 STPS15L25D/G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E C2 L2 D L L3 A1 B2 R C B G A2 2.0 MIN. FLAT ZONE V2 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C C2 0.45 1.23 0.60 1.36 0.017 0.048 0.024 0.054 D E 8.95 10.00 9.35 10.40 0.352 0.393 0.368 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° FOOT PRINT DIMENSIONS (in millimeters) Cooling method: by conduction (method C) 16.90 10.30 5.08 1.30 3.70 8.90 4/5 STPS15L25D/G PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. A H2 C L5 L7 ØI L6 L2 D L9 F1 L4 M F E G Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 G 1.14 4.95 1.70 5.15 0.044 0.194 0.066 0.202 H2 L2 10.00 10.40 16.40 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 0.393 0.409 0.645 typ. 2.6 typ. 3.75 0.102 typ. 3.85 0.147 0.151 Cooling method : C Recommended torque value : 0.55 m.N Maximum torque value : 0.70 m.N Ordering type Marking Package Weight Base qty Delivery mode STPS15L25D STPS15L25D TO-220AC 1.86g 50 Tube STPS15L25G STPS15L25G D2PAK 1.48g 50 Tube STPS15L25G-TR STPS15L25G D2PAK 1.48g 1000 Tape & reel Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 5/5