TAK CHEONG SEM ICONDUCTOR 500 mW DO-35 Hermetically Sealed Glass Fast Switching Diodes AXIAL LEAD DO35 Absolute Maximum Ratings Symbol TA = 25°C unless otherwise noted Parameter PD Power Dissipation TSTG Storage Temperature Range TJ Operating Junction Temperature Value Units 500 mW -65 to +200 °C +175 °C WIV Working Inverse Voltage 75 V IO Average Rectified Current 150 mA IFM Non-repetitive Peak Forward Current 450 mA 2 A IFSURGE Peak Forward Surge Current DEVICE MARKING DIAGRAM L xx xx L TC1Nxxxx : Logo : Device Code These ratings are limiting values above which the serviceability of the diode may be impaired. Specification Features: Fast Switching Device (TRR <4.0 nS) DO-35 Package (JEDEC) Through-Hole Device Type Mounting Anode Cathode Hermetically Sealed Glass Compression Bonded Construction All external surfaces are corrosion resistant and leads are readily solderable ELECTRICAL SYMBOL Cathode indicated by polarity band Electrical Characteristics Parameter Symbol BV IR VF TRR TA = 25°C unless otherwise noted Breakdown Voltage Reverse Leakage Current Forward Voltage Reverse Recovery Time Test Condition Limits Min IR=100µA 100 IR=5µA 75 Max Unit Volts VR=20V 25 nA VR=75V 5 µA TC1N4448, TC1N914B IF=5mA TC1N4148, TC1N4148 IF=10mA 1.0 TC1N4448, TC1N914B IF=100mA 1.0 0.62 0.72 Volts IF=IR=10mA RL=100Ω 4 nS 4 pF IRR=1mA C Capacitance VR=0V, f=1MHZ March 2002 / A Page 1 TC1N4148/TC1N4448/TC1N914B ® ® TAK CHEONG SEM ICONDUCTOR Electrical Symbol Definition Symbol Typical Characteristics I Parameter (mA) IF BV Breakdown Voltage @ IR IR Reverse Leakage Current @ VR IR (V) VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF (mV) VR BV VF V IR (nA) (µA) Ordering Information Device Package Quantity TC1Nxxxx Bulk 10,000 TC1Nxxxx.TB Tape and Ammo 5,000 TC1Nxxxx.TR Tape and Reel 10,000 TC1Nxxxx Others (…contact Tak Cheong sales representatives) Axial-Lead Tape Packaging Standards This axial-lead component’s packaging requirements use in automatic testing and assembly equipment. And this standard practices for lead-tape packaging of axial-lead components meets the requirements of EIA Standard RS-296-D “Lead-taping of Components on Axial Lead Configuration for Automatic Insertion”. March 2002 / A Page 2 ® TAK CHEONG SEM ICONDUCTOR Tape & Reel Packaging Information Tape & Reel Outline Reel Dimensions DIM Millimeters D1 356 D2 30 D3 84 W1 77.5 PKG Type Quantity Per Reel DO-35 10,000 Quantity Per Reel March 2002 / A Page 3 ® TAK CHEONG SEM ICONDUCTOR Tape & Ammo Packaging Information Tape & Ammo Outline 250mm x 80mm x 80mm Quantity Per Ammo Box PKG Type Quantity Per Box DO-35 5,000 Taping Dimensions Description Standard Width Millimeters 52 26 Tape Spacing (B) 52 ± 0.69 26 +0.5 / -0 Component Pitch (C) 5.08 ± 0.4 5.08 ± 0.4 Untaped Lead (L1 – L2) ± 0.69 ± 0.69 Glass Offset (F) ± 0.69 ± 0.69 Bent (D) Tape Width (G) Tape Mismatch (E) Taped Lead (G) Lead Beyond Tape (H) 1.2 Max 1.2 Max 6.138 ± 0.576 6.138 ± 0.576 0.55 Max 0.55 Max 3.2 Min 3.2 Min 0 0 March 2002 / A Page 4 ® TAK CHEONG SEM ICONDUCTOR Bulk Packaging Information Plastic Bag Quantity Per Plastic Bag Bulk Outline DO-35 1000 x 10 Plastic Bag 250mm x 80mm x 80mm PKG Type Quantity Per Box DO-35 10,000 Quantity Per Box March 2002 / A Page 5 WWW.ALLDATASHEET.COM Copyright © Each Manufacturing Company. All Datasheets cannot be modified without permission. This datasheet has been download from : www.AllDataSheet.com 100% Free DataSheet Search Site. Free Download. No Register. Fast Search System. www.AllDataSheet.com