M TCM811/TCM812 4-Pin Microcontroller Reset Monitors Features General Description • Precision VDD Monitor for 2.0V, 2.8V, 3.0V, 3.3V, 5.0V Nominal Supplies • Manual Reset Input • 140 msec Minimum RESET Output Duration • RESET Output Valid to V DD = 1.0V (TCM811) • Low 6 µA (typ.) Supply Current • VDD Transient Immunity • Small 4-Pin SOT-143 Package • No External Components • Replacement for MAX811/812 and Offers a Lower Threshold Voltage Option • Push-Pull RESET Output • Temperature Range: - Commercial (C) -40°C to +85°C The TCM811 and TCM812 are cost effective system supervisory circuits designed to monitor VDD in digital systems and provide a reset signal to the host controller when necessary. A manual reset input is provided to override the reset monitor and is suitable for use as a push-button reset. No external components are required. Applications • • • • Computers Embedded Systems Battery Powered Equipment Critical Microcontroller Power Supply Monitoring VDD 4 3 MR RESET GND 1 PIC Microcontroller TCM811 PUSH BUTTON Package Types: 2 GND 2002 Microchip Technology Inc. RESET INPUT (Active Low) 4 VDD 3 MR TCM811 or TCM812 VDD VDD The TCM811/TCM812 are optimized to reject fast transient glitches on the VDD line. A low supply current of 6 µA (VDD = 3.3V) makes these devices ideal for battery powered applications. SOT-143 Typical Application Circuit 0.1µF The reset output is driven active within 20 µsec (5 µsec for F version) of VDD falling through the reset voltage threshold. RESET is maintained active for a minimum of 140 msec after VDD rises above the reset threshold. The TCM812 has an active high RESET output while the TCM811 has an active low RESET output. The output of the TCM811 is valid down to VDD = 1V. Both devices are available in a 4-Pin SOT-143 package, specified with a temperature range of -40°C to +85°C. TCM811 RESET TCM812 (RESET) 2 GND DS21615B-page 1 TCM811/TCM812 1.0 ELECTRICAL CHARACTERISTICS PIN FUNCTION TABLE NAME ABSOLUTE MAXIMUM RATINGS* Supply Voltage (VDD to GND).........................................+6.0V GND Ground RESET (TCM811) RESET push-pull output remains low while VDD is below the reset voltage threshold, and for at least 140 msec (min.) after VDD rises above reset threshold. RESET (TCM812) RESET push-pull output remains high while VDD is below the reset voltage threshold, and for at least 140 msec (min.) after VDD rises above reset threshold. MR Manual Reset input generates a reset when MR is below VIL. VDD Supply Voltage RESET, RESET.................................... - 0.3V to (VDD + 0.3V) Input Current, VDD .........................................................20 mA Output Current, RESET, RESET...................................20 mA Operating Temperature Range...................... – 40°C to +85°C Storage Temperature Range....................... – 65°C to +150°C Maximum Junction Temperature, TS .............................. 150°C *Notice: Stresses beyond those listed under “Absolute Maximun Ratings” may cause permanenet damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximun rating conditions for extended periods may affect device reliability. FUNCTION ELECTRICAL CHARACTERISTICS VDD = 5V for L/M versions, V DD = 3.3V for T/S versions, VDD = 3V for R version, VDD = 2.0V for F version. TA = –40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. (Note 1) Parameters Sym Min Typ Max Units VDD Range VDD 1.0 1.1 — — 5.5 5.5 V TCM811 TCM812 Supply Current ICC — — 6 4.75 15 10 µA TCM81_L/M, VDD = 5.5V, IOUT = 0 TCM81_R/S/T/F, VDD = 3.6V, IOUT =0 Reset Threshold VTH 4.54 4.50 4.63 — 4.72 4.75 V TCM81_L: 4.30 4.25 4.38 — 4.46 4.50 TCM81_M: TA = +25°C TA = –40°C to +85°C 3.03 3.00 3.08 — 3.14 3.15 TCM81_T: 2.88 2.85 2.93 — 2.98 3.00 TCM81_S: TA = +25°C TA = –40°C to +85°C 2.58 2.55 2.63 — 2.68 2.70 TCM81_R: TA = +25°C TA = –40°C to +85°C 1.71 1.70 1.75 — 1.79 1.80 TCM81_F: TA = +25°C TA = –40°C to +85°C Reset Threshold Tempco — 30 — ppm/°C VDD to Reset Delay — — 20 5 — — µsec VDD = V TH to VTH –125 mV; L, M, R, S, T, F VDD = VTH(MAX) Reset Active Timeout Period tRP 140 280 560 msec MR Minimum Pulse Width tMR 10 — — µsec — 100 — nsec — 0.5 — µsec MR Glitch Immunity MR to Reset Propagation Delay tMD Conditions TA = +25°C TA = –40°C to +85°C TA = +25°C TA = –40°C to +85°C Note 1: Production testing done at TA = +25°C and +85°C, over temperature limits are tested with periodic QA tests in production. DS21615B-page 2 2002 Microchip Technology Inc. TCM811/TCM812 VDD = 5V for L/M versions, V DD = 3.3V for T/S versions, VDD = 3V for R version, VDD = 2.0V for F version. TA = –40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. (Note 1) Parameters MR Input Threshold Sym Min Typ Max Units VIH VIL 2.3 — — — — 0.8 V VDD > VTH(MAX), TCM81_L/M VIH VIL 0.7 VDD — — — — 0.25 VDD V VDD > V TH(MAX), TCM81_R/S/T/F 10 20 40 kΩ — — 0.3 V TCM811R/S/T only; ISINK = 1.2 mA, VDD = VTH(MIN) — — 0.4 V — — 0.3 V TCM811F only; ISINK = 500 µA, VDD = VTH(MIN) TCM811L/M only; ISINK = 3.2 mA, VDD = VTH(MIN) ISINK = 3.2 mA, VDD = VTH(MIN) 0.8 VDD — — V TCM811R/S/T/F only; ISOURCE = 500 µA, VDD > VTH(MAX) VDD - 1.5 — — V TCM811L/M only; ISOURCE = 800 µA, VDD > VTH(MAX) — — 0.2 V TCM812F only, ISINK = 500 µA, VDD = V TH(MAX) — — 0.3 TCM812R/S/T only, ISINK = 1.2 mA, VDD = V TH(MAX) — — 0.4 TCM812L/M only, ISINK = 1.2 mA, VDD = V TH(MAX) 0.8 VDD — — MR Pull-up Resistance RESET Output Voltage Low (TCM811) RESET Output Voltage High (TCM811) RESET Output Voltage Low (TCM812) RESET Output Voltage High (TCM812) VOL VOH VOL VOH V Conditions ISOURCE = 150 µA, VDD ≤ VTH(MIN) Note 1: Production testing done at TA = +25°C and +85°C, over temperature limits are tested with periodic QA tests in production. 2002 Microchip Technology Inc. DS21615B-page 3 TCM811/TCM812 2.0 APPLICATIONS INFORMATION The TCM811/TCM812 provides accurate VDD monitoring and reset timing during power-up, power-down, and brownout/sag conditions. These devices also reject negative-going transients (glitches) on the power supply line. Figure 2-1 shows the maximum transient duration vs. maximum negative excursion (overdrive) for glitch rejection. Any combination of duration and overdrive that is under the curve will not generate a reset signal. Combinations above the curve are detected as a brownout or power-down. Transient immunity can be improved by adding a 0.1 µF capacitor in close proximity to the VDD pin of the TCM811/812. (100 kΩ will be suitable for most applications). Similarly, a pull-up resistor to VDD is required for the TCM812 to ensure a valid high RESET for VDD below 1.1V. VDD 4 VDD 0.1µF TCM811 2 RESET R1 100 kΩ VDD GND 1 VTH Overdrive = VD D FIGURE 2-2: The addition of R1 at the RESET output of the TCM811 ensures that the RESET output is valid to VDD = 0V. MAXIMUM TRANSIENT DURATION (µsec) Duration 400 2.2 TA = +25˚C 320 Some microcontrollers have bi-directional reset pins. Depending on the current drive capability of the controller pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a 4.7 kΩ resistor in series with the output of the TCM811/ TCM812 (Figure 2-3). If there are other components in the system which require a reset signal, they should be buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the microcontroller, the buffer should be connected as shown with the solid line. 240 160 TCM81xL/M 80 TCM81xR/S/T 0 1 10 1000 100 RESET COMPARATOR OVERDRIVE, VTH - VDD (mV) FIGURE 2-1: Maximum Transient Duration Overdrive for Glitch Rejection at 25°C. 2.1 Controllers and Processors With Bidirectional I/O Pins Buffered RESET To Other System Components vs. BUFFER RESET Signal Integrity During PowerDown The TCM811 RESET push-pull output is valid to VDD = 1.0V. Below this voltage the output becomes an "open circuit" and does not sink current. This means CMOS logic inputs to the microcontroller will be floating at an undetermined voltage. Most digital systems are completely shutdown well above this voltage. However, in situations where RESET must be maintained valid to VDD = 0V, a pull-down resistor must be connected from RESET to ground to discharge stray capacitances and hold the output low (Figure 2-2). This resistor value, though not critical, should be chosen such that it does not appreciably load RESET under normal operation DS21615B-page 4 VDD 4 0.1µF Micro controller TCM811 4.7 kΩ RESET GND 1 2 RESET GND FIGURE 2-3: Interfacing the TCM811 to a Bidirectional Reset I/O. 2002 Microchip Technology Inc. TCM811/TCM812 3.0 TYPICAL PERFORMANCE CHARACTERISTICS Note: The graphs provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 8 14 SUPPLY CURRENT (µA) 12 SUPPLY CURRENT (µA) TCM81xR/S/T/F No Load 10 VDD = 5V 8 VDD = 3V 6 4 VDD = 1V TCM81xL/M No Load 6 VDD = 5V 4 VDD = 3V VDD = 1V 2 2 0 –40 –20 0 40 20 60 0 –40 85 –20 0 TEMPERATURE (˚C) FIGURE 3-1: Supply Current vs. Temperature. FIGURE 3-4: TCM81xF 40 30 VOD = 20 mV 20 10 VOD = 100 mV VOD = 200 mV –20 0 40 20 60 POWER-DOWN RESET DELAY (µsec) POWER-DOWN RESET DELAY (µsec) 85 Supply Current vs. Temperature. 85 VOD = 20 mV VOD = 100 mV 40 VOD = 200 mV 30 20 10 TCM81xL/M 0 –40 –20 TEMPERATURE (˚C) FIGURE 3-2: Temperature. Power-Down Reset Delay vs. FIGURE 3-5: Temperature. POWER-DOWN RESET DELAY (µsec) TCM81xL/M 240 TCM81xR/S/T/F 235 230 –20 0 20 40 Power-Up Reset 2002 Microchip Technology Inc. 60 85 Power-Down Reset 60 85 Delay vs. TCM81x/R/S/T 40 30 20 VOD = 200 mV VOD = 100 mV VOD = 20 mV 10 0 –40 TEMPERATURE (˚C) FIGURE 3-3: Temperature. 40 20 50 245 225 –40 0 TEMPERATURE (˚C) 250 POWER-UP RESET TIMEOUT (msec) 60 50 50 0 –40 40 20 TEMPERATURE (˚C) –20 0 20 40 60 85 TEMPERATURE (˚C) Timeout vs. FIGURE 3-6: Temperature. Power-Down Reset Delay vs. DS21615B-page 5 TCM811/TCM812 1.0030 NORMALIZED THRESHOLD (V) 1.0020 1.0010 1.0000 0.9990 0.9980 0.9970 0.9960 0.9950 0.9940 –40 FIGURE 3-7: Temperature. –15 35 10 TEMPERATURE (˚C) Normalized DS21615B-page 6 Reset 60 Threshold 65 vs. 2002 Microchip Technology Inc. TCM811/TCM812 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 4-Pin SOT-143 1 Part Number Legend: Note: 1 2 3 4 2 3 4 (V) Code TCM811LERC 4.63 U1 TCM811MERC 4.38 U2 TCM811TERC 3.08 U3 TCM811SERC 2.93 U4 TCM811RERC 2.63 U5 TCM811FERC 1.75 U7 TCM812LERC 4.63 V1 TCM812MERC 4.38 V2 TCM812TERC 3.08 V3 TCM812SERC 2.93 V4 TCM812RERC 2.63 V5 TCM812FERC 1.75 V7 Part Number + temperature range and voltage (two-digit code) Part Number + temperature range and voltage (two-digit code) Year and two-month period code Lot ID number In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. 2002 Microchip Technology Inc. DS21615B-page 7 TCM811/TCM812 4.2 Package Dimensions Component Taping Orientation for 4-Pin SOT-143 Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size: Package 4-Pin SOT-143 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8 mm 4 mm 3000 7 in. .079 (2.00) .071 (1.80) .055 (1.40) .047 (1.20) .098 (2.50) .083 (2.10) .080 (2.03) .070 (1.78) .120 (3.05) .105 (2.67) .040 (1.02) .031 (0.79) .006 (0.15) .004 (0.09) 8 MAX. .004 (0.10) .001 (0.02) .021 (0.54) .015 (0.38) .010 (0.25) .005 (0.13) .037 (0.94) .030 (0.77) DS21615B-page 8 2002 Microchip Technology Inc. TCM811/TCM812 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web (WWW) site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape or Microsoft Explorer. Files are also available for FTP download from our FTP site. Connecting to the Microchip Internet Web Site Systems Information and Upgrade Hot Line The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive any currently available upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. 013001 The Microchip web site is available by using your favorite Internet browser to attach to: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: • Latest Microchip Press Releases • Technical Support Section with Frequently Asked Questions • Design Tips • Device Errata • Job Postings • Microchip Consultant Program Member Listing • Links to other useful web sites related to Microchip Products • Conferences for products, Development Systems, technical information and more • Listing of seminars and events 2002 Microchip Technology Inc. DS21615B-page 9 TCM811/TCM812 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this Data Sheet. To: Technical Publications Manager RE: Reader Response Total Pages Sent From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: TCM811/TCM812 Y N Literature Number: DS21615B Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this data sheet easy to follow? If not, why? 4. What additions to the data sheet do you think would enhance the structure and subject? 5. What deletions from the data sheet could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? 8. How would you improve our software, systems, and silicon products? DS21615B-page 10 2002 Microchip Technology Inc. TCM811/TCM812 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X X XXXX Device VDD Temperature Range Package Reset Threshold Device: TCM811: Supervisor Circuit with active-low RESET output TCM812: Supervisor Circuit with active-high RESET output VDD Reset Threshold: L M T S R F = = = = = = Temperature Range: E = -40°C to +85°C Package: RCTR = SOT-143, 4-pin (Tape and Reel) 4.63V 4.38V 3.08V 2.93V 2.63V 1.75V Examples: a) TCM811LERCTR: SOT-143, Microcontroller 4.63V Reset Monitor, -40°C to +85°C, Tape and Reel. b) TCM811MERCTR: SOT-143, Microcontroller 4.38V Reset Monitor, -40°C to +85°C, Tape and Reel. a) TCM812FERCTR: SOT-143, Microcontroller 1.75V Reset Monitor, -40°C to +85°C, Tape and Reel. b) TCM812SERCTR: SOT-143, Microcontroller 2.93V Reset Monitor, -40°C to +125°C, Tape and Reel. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21615B-page11 TCM811/TCM812 NOTES: DS21615B-page 12 2002 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microID, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Term Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs and microperipheral products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. 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