TDA19978A Quad HDMI 1.3a receiver interface with equalizer (HDTV up to 1080p, up to UXGA for PC formats) Rev. 03 — 16 April 2010 Product data sheet 1. General description The TDA19978A is a four input HDMI 1.3a compliant receiver with embedded EDID memory. The built in auto-adaptive equalizer improves signal quality and allows the use of cable lengths up to 25 m (laboratory tested with a 0.5 mm (24 AWG) cable at 2.05 gigasamples per second). The HDCP key set is stored in non-volatile One Time Programmable (OTP) memory for maximum security. In addition, the TDA19978A is delivered with software drivers to ease configuration and use. The TDA19978A supports: • TV resolutions: – 480i (1440 × 480i at 60 Hz), 576i (1440 × 576i at 50 Hz) to HDTV (up to 1920 × 1080p at 50/60 Hz) – WUXGA (1920 × 1200p at 60 Hz) reduced blanking format • PC resolutions: – VGA (640 × 480p at 60 Hz) to UXGA (1600 × 1200p at 60 Hz) • Deep Color mode in 10-bit and 12-bit (up to 205 MHz TMDS clock) • Gamut boundary description • IEC 60958/IEC 61937, One Bit Audio (in SACD), DST (in compressed DSD) and HBR stream The TDA19978A includes: • An enhanced PC and TV format recognition system • Generation of a 128/256/512 × fs system clock allowing the use of simple audio DACs without an integrated PLL (such as the UDA1334BTS) • An embedded oscillator (an external crystal can also be used) • Improved audio clock generation using an external reference clock • One Bit Audio (in SACD), DST (in compressed DSD) and HBR stream support The TDA19978A converts HDMI streams with or without HDCP into RGB or YCbCr digital signals. The YCbCr digital output signal can be 4:4:4 or 4:2:2 semi-planar format based on the ITU-R BT.601 standard or 4:2:2 based on the ITU-R BT.656 format. The device can adjust the output timing of the video port by altering the values for tsu(Q) and th(Q). In addition, all settings are controllable using the I2C-bus. TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 2. Features and benefits TDA19978A_3 Product data sheet Complies with the HDMI 1.3a, DVI 1.0, CEA-861-D and HDCP 1.2 standards Four (quad) independent HDMI inputs, up to the HDMI frequency of 205 MHz Embedded auto-adaptive equalizer on all HDMI links EDID memory: 253 shared bytes and three bytes dedicated to each HDMI input Supports color depth processing (8-bit, 10-bit or 12-bit per color) Color gamut metadata packet with interrupt on each update, readable via the I2C-bus Up to four S/PDIF or I2S-bus outputs (eight channels) at a sampling rate up to 192 kHz with IEC 60958/IEC 61937 stream HBR audio stream up to 768 kHz with four demultiplexed S/PDIF or I2S-bus outputs HBR streams (e.g. DTS-HD master audio and Dolby TrueHD up to eight channels due to HBR packet for stream with a frame rate up to 768 kHz) support DSD and DST audio stream up to six DSD channels output for SACD with DST Audio Packet support Channel status decoder supports multi-channel reception Improved audio clock generation using an external reference clock System/master clock output (128/256/512 × fs) enables the use of the UDA1334BTS The HDMI interface supports: All HDTV formats up to 1920 × 1080p at 50/60 Hz and WUXGA (1920 × 1200p at 60 Hz) with support for reduced blanking PC formats up to UXGA (1600 × 1200p at 60 Hz) Embedded oscillator (an external crystal can be used) Frame and field detection for interlaced video signal Sync timing measurements for format recognition Improved system for measurements of blanking and video active area allowing an accurate recognition of PC and TV formats HDCP with repeater capability Embedded non-volatile memory storage of HDCP keys Programmable color space input signal conversion from RGB-to-YCbCr or YCbCr-to-RGB Output formats: RGB 4:4:4, YCbCr 4:4:4, YCbCr 4:2:2 semi-planar based on the ITU-R BT.601 standard and YCbCr 4:2:2 ITU-R BT.656 8-bit, 10-bit or 12-bit output formats selectable using the I2C-bus (8-bit and 10-bit only in 4:4:4 format) I2C-bus adjustable timing of video port (tsu(Q) and th(Q)) Downsampling-by-two with selectable filters on Cb and Cr channels in 4:2:2 mode Internal video and audio pattern generator Controllable using the I2C-bus; 5 V tolerant and bit rate up to 400 kbit/s DDC-bus inputs 5 V tolerant and bit rate up to 400 kbit/s LV-TTL outputs Power-down mode CMOS process 1.8 V and 3.3 V power supplies Lead-free (Pb) HLQFP144 package All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 2 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 3. Applications HDTV YCbCr or RGB high-speed video digitizer Projector, plasma and LCD TV Rear projection TV High-End TV Home theater amplifier DVD recorder AVR and HDMI splitter 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Digital inputs: pins RXxC+, RXxC− fclk(max) Min Typ Max Unit 205 - - MHz pin VCLK 165 - - MHz pin ACLK 25 - - MHz pin SYSCLK 50 - - MHz [1] maximum clock frequency Clock timing output: pins VCLK, ACLK and SYSCLK fclk(max) maximum clock frequency Supplies VDDH(3V3) HDMI supply voltage (3.3 V) 3.135 3.3 3.465 V VDDH(1V8) HDMI supply voltage (1.8 V) 1.71 1.89 VDDI(3V3) input supply voltage (3.3 V) VDDC(1V8) core supply voltage (1.8 V) VDDO(3V3) output supply voltage (3.3 V) P power dissipation Pcons power consumption active mode x = A, B, C or D. At 30 % activity on video port output. 1.71 1.89 1.8 V 3.465 V [2] 720p at 60 Hz - 0.75 - W 1080p at 60 Hz - 1.13 - W 1080p at 60 Hz; Deep Color mode - 1.63 - W pin PD = HIGH - 1 - mW I2C-bus; - 4 - mW - 150 - mW Power-down mode EDID and HDCP memory power-up EDID; activity detection and HDCP memory power-up [2] V 3.465 V 3.135 3.3 I2C-bus; [1] 1.8 3.135 3.3 5. Ordering information Table 2. Ordering information Type number TDA19978AHV TDA19978A_3 Product data sheet Package Name Description Version HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm; exposed die pad SOT612-3 All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 3 of 38 xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x RRX1 HDMI C (channel C) RRX2 HDMI D (channels 0/1/2) HDMI D (channel D) XTALIN/MCLK XTALOUT EQUALIZER PACKET EXTRACTION HDMI RECEIVER AND HDCP COLOR DEPTH UNPACKING TERMINATION RESISTANCE CONTROL CRYSTAL OSCILLATOR EDID MEMORY AUDIO FIFO VP[29:0] VIDEO OUTPUT FORMATTER VCLK POWER MANAGEMENT TDA19978A SYNC TIMING MEASUREMENT Block diagram HS/HREF VS/VREF CS/FREF HSDAA/ HSDAB/ HSDAC/ HSDAD/ HSCLA HSCLB HSCLC HSCLD 001aah366 TDA19978A 4 of 38 © NXP B.V. 2010. All rights reserved. Fig 1. DE VHREF TIMING GENERATOR I2C-BUS SLAVE INTERFACE SDA/SCL ACLK SYSCLK/AP5 OTP MEMORY TERMINATION RESISTANCE CONTROL AP0 to AP3 Quad HDMI 1.3a receiver with digital processing Rev. 03 — 16 April 2010 All information provided in this document is subject to legal disclaimers. HDMI C (channels 0/1/2) TERMINATION RESISTANCE CONTROL UPSAMPLER HDMI B (channel B) AUDIO FORMATTER EQUALIZER DEREPEATER HDMI B (channels 0/1/2) AUDIO PLL NXP Semiconductors HDMI A (channel A) TERMINATION RESISTANCE CONTROL 6. Block diagram TDA19978A_3 Product data sheet WS/AP4 HDMI A (channels 0/1/2) TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 7. Pinning information 109 144 7.1 Pinning 1 TDA19978AHV Fig 2. 73 72 37 36 108 001aah367 Pin configuration (HLQFP144) 7.2 Pin description Table 3. TDA19978A_3 Product data sheet Pin description Symbol Pin Type[1] Description VSSC 1 G ground for the digital core PD 2 I power-down control input (active HIGH) VDDH(3V3) 3 P HDMI receiver supply voltage; 3.3 V RXDC+ 4 I HDMI input D positive clock channel RXDC− 5 I HDMI input D negative clock channel VSSH 6 G HDMI receiver ground RXCC− 7 I HDMI input C negative clock channel RXCC+ 8 I HDMI input C positive clock channel VDDH(3V3) 9 P HDMI receiver supply voltage; 3.3 V RXD0+ 10 I HDMI input D positive data channel 0 RXD0− 11 I HDMI input D negative data channel 0 VSSH 12 G HDMI receiver ground RXC0− 13 I HDMI input C negative data channel 0 RXC0+ 14 I HDMI input C positive data channel 0 VDDH(1V8) 15 P HDMI receiver supply voltage; 1.8 V RXD1+ 16 I HDMI input D positive data channel 1 RXD1− 17 I HDMI input D negative data channel 1 VSSH 18 G HDMI receiver ground RXC1− 19 I HDMI input C negative data channel 1 RXC1+ 20 I HDMI input C positive data channel 1 VDDH(3V3) 21 P HDMI receiver supply voltage; 3.3 V RXD2+ 22 I HDMI input D positive data channel 2 RXD2− 23 I HDMI input D negative data channel 2 All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 5 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 3. Pin description …continued Symbol Pin Type[1] Description VSSH 24 G HDMI receiver ground RXC2− 25 I HDMI input C negative data channel 2 RXC2+ 26 I HDMI input C positive data channel 2 VPP 27 P OTP memory programming voltage[2] VDDC(1V8) 28 P digital core supply voltage; 1.8 V VDDO(3V3) 29 P video port output supply voltage; 3.3 V VCLK 30 O video clock output VSSO 31 G video port output ground CS/FREF 32 O composite synchronization output composite field output signal VS/VREF 33 O vertical synchronization output vertical reference output HS/HREF 34 O horizontal synchronization output reference output TDA19978A_3 Product data sheet DE 35 O data enable output VP[0] 36 O video port output bit 0 VSSC 37 G digital core ground VP[1] 38 O video port output bit 1 VP[2] 39 O video port output bit 2 VP[3] 40 O video port output bit 3 VDDO(3V3) 41 P video port output supply voltage; 3.3 V VDDC(1V8) 42 P digital core supply voltage; 1.8 V VSSO 43 G video port output ground VP[4] 44 O video port output bit 4 VP[5] 45 O video port output bit 5 VP[6] 46 O video port output bit 6 VP[7] 47 O video port output bit 7 VP[8] 48 O video port output bit 8 VP[9] 49 O video port output bit 9 VP[10] 50 O video port output bit 10 VP[11] 51 O video port output bit 11 VDDO(3V3) 52 P video port output supply voltage; 3.3 V VP[12] 53 O video port output bit 12 VSSO 54 G video port output ground VP[13] 55 O video port output bit 13 VP[14] 56 O video port output bit 14 VP[15] 57 O video port output bit 15 VP[16] 58 O video port output bit 16 VP[17] 59 O video port output bit 17 VP[18] 60 O video port output bit 18 VP[19] 61 O video port output bit 19 All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 6 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 3. Pin description …continued Symbol Pin Type[1] Description VP[20] 62 O video port output bit 20 VDDO(3V3) 63 P video port output supply voltage; 3.3 V VDDC(1V8) 64 P digital core supply voltage; 1.8 V VSSO 65 G video port output ground VP[21] 66 O video port output bit 21 VP[22] 67 O video port output bit 22 VP[23] 68 O video port output bit 23 VP[24] 69 O video port output bit 24 VP[25] 70 O video port output bit 25 VP[26] 71 O video port output bit 26 VP[27] 72 O video port output bit 27 VSSC 73 G digital core ground VDDO(3V3) 74 P video port output supply voltage; 3.3 V VP[28] 75 O video port output bit 28 VP[29] 76 O video port output bit 29 VSSO 77 G video port output ground ACLK 78 O audio clock output AP0 79 O audio port 0 output AP1 80 O audio port 1 output AP2/CTL0 81 O audio port 2 output CTL0 control (DVI mode) output AP3/CTL1 82 O audio port 3 output CTL1 control (DVI mode) output AP4/WS/CTL2 83 O audio port 4 output word select output CTL2 control (DVI mode) output VDDO(3V3) 84 P video port output supply voltage; 3.3 V AP5/SYSCLK/CTL3 85 O audio port 5 output system clock audio output CTL3 control (DVI mode) output VSSO 86 G video port output ground VDDH(3V3) 87 P HDMI audio PLL supply voltage; 3.3 V VDDH(3V3) 88 P HDMI audio PLL supply voltage; 3.3 V VSSH 89 G HDMI audio PLL ground VDDH(1V8) 90 P HDMI audio PLL supply voltage; 1.8 V VSSH 91 G HDMI audio PLL ground VDDC(1V8) 92 P digital core supply voltage; 1.8 V XTALOUT 93 O crystal oscillator output XTALIN/MCLK 94 I crystal oscillator input test pattern clock input VDDI(3V3) TDA19978A_3 Product data sheet 95 P digital inputs supply voltage; 3.3 V All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 7 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 3. TDA19978A_3 Product data sheet Pin description …continued Symbol Pin Type[1] Description VAI 96 O video activity indication output (open-drain); warns the external microprocessor that a special event has occurred; must be connected to a pull-up resistor; 5 V tolerant (active LOW) SDA 97 I/O I2C-bus serial data input/output SCL 98 I I2C-bus serial clock input HSDAA 99 I/O HDMI input/output A HDCP DDC-bus serial data HSCLA 100 I HDMI input A HDCP DDC-bus serial clock HSDAB 101 I/O HDMI input/output B HDCP DDC-bus serial data HSCLB 102 I HDMI input B HDCP DDC-bus serial clock TEST0 103 I reserved for test; connect to digital inputs ground (VSSC) VDDH(3V3) 104 P HDMI deep PLL supply voltage; 3.3 V VSSH 105 G HDMI deep PLL ground RRX1 106 I HDMI inputs A and B termination resistance control VDDC(1V8) 107 P digital core supply voltage; 1.8 V VDDH(1V8) 108 P HDMI receiver supply voltage; 1.8 V VSSC 109 G digital core ground A0 110 I I2C-bus address control input VDDH(3V3) 111 P HDMI receiver supply voltage; 3.3 V RXBC+ 112 I HDMI input B positive clock channel RXBC− 113 I HDMI input B negative clock channel VSSH 114 G HDMI receiver ground RXAC− 115 I HDMI input A negative clock channel RXAC+ 116 I HDMI input A positive clock channel VDDH(3V3) 117 P HDMI receiver supply voltage; 3.3 V RXB0+ 118 I HDMI input B positive data channel 0 RXB0− 119 I HDMI input B negative data channel 0 VSSH 120 G HDMI receiver ground RXA0− 121 I HDMI input A negative data channel 0 RXA0+ 122 I HDMI input A positive data channel 0 VDDH(1V8) 123 P HDMI receiver supply voltage; 1.8 V RXB1+ 124 I HDMI input B positive data channel 1 RXB1− 125 I HDMI input B negative data channel 1 VSSH 126 G HDMI receiver ground RXA1− 127 I HDMI input A negative data channel 1 RXA1+ 128 I HDMI input A positive data channel 1 VDDH(3V3) 129 P HDMI receiver supply voltage; 3.3 V RXB2+ 130 I HDMI input B positive data channel 2 RXB2− 131 I HDMI input B negative data channel 2 VSSH 132 G HDMI receiver ground RXA2− 133 I HDMI input A negative data channel 2 RXA2+ 134 I HDMI input A positive data channel 2 All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 8 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 3. Pin description …continued Symbol Pin Type[1] Description VSSH 135 G HDMI receiver ground VDDC(1V8) 136 P digital core supply voltage; 1.8 V VDDC(1V8) 137 P digital core supply voltage; 1.8 V HSDAC 138 I/O HDMI input/output C HDCP DDC-bus serial data HSCLC 139 I HDMI input C HDCP DDC-bus serial clock HSDAD 140 I/O HDMI input/output D HDCP DDC-bus serial data HSCLD 141 I HDMI input D HDCP DDC-bus serial clock VDDI(3V3) 142 P digital inputs supply voltage; 3.3 V RRX2 143 I HDMI inputs C and D termination resistance control VDDH(1V8) 144 P HDMI receiver supply voltage; 1.8 V Exposed die pad central G exposed die pad; connect to digital core ground (VSSC) [1] P = power supply; G = ground; I = input; O = output and I/O = input/output. [2] Connected to the ground of the HDMI receiver (VSSH) in normal operation. 8. Functional description The TDA19978A converts digital data streams input by the HDMI sources into parallel digital data for use by media and video signal processing integrated circuits in devices for HDTV. Data streams can be decoded with or without HDCP protection. Outputs from the TDA19978A can be RGB 4:4:4, YCbCr 4:4:4, YCbCr 4:2:2 semi-planar format based on the ITU-R BT.601 standard or YCbCr 4:2:2 based on the ITU-R BT.656 format. Inputs can be both progressive and interlaced formats. The TDA19978A comprises a color space conversion block, downsampling filters and an embedded timing code function. In addition, the HDCP repeater function enables other HDMI devices to be connected to form an extended “total application”. 8.1 Software Drivers Software drivers are provided for easy configuration and use of the TDA19978A. These drivers can be integrated with a large range of processors, with or without an operating system. They control activity detection, input selection, video mode identification, color conversion, Power-down modes, HDCP and InfoFrame notification. 8.2 HDMI inputs Control of the four HDMI inputs can be automatic using activity detection or using the I2C-bus. The HDMI receiver inputs are defined by pins RXx0+, RXx0−, RXx1+, RXx1−, RXx2+, RXx2−, RXxC+, RXxC−, RRXx, HSCLx and HSDAx. In the pin names, x equals A, B, C or D (as applicable). 8.3 Termination resistance control The HDMI receiver input contains a termination resistance control set by an external resistor connected between pins RRXx and VDDH(3V3). In RRXx, x equals 1 for inputs A and B or 2 for inputs C and D. Typically, the characteristic impedance is 50 Ω and the default value of the external terminal control resistor is 12 kΩ ± 1 %. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 9 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 8.4 Equalizer The auto-adaptive equalizer automatically measures and selects the settings which provide the best signal quality for each cable. This improves signal quality and enables the use of cable lengths up to 25 m (laboratory tested, contact NXP for detailed information). The equalizer is fully automatic and consequently does not need any external control. 8.5 Activity detection The TDA19978A uses activity detection to automatically select the active HDMI input. An internal, fully programmable, frequency filter controls activity detection. It sees only the activity on the HDMI inputs with a frequency range between minimal 22.5 MHz and maximal 205 MHz. This activity detection can generate an interrupt enabling users to manage each HDMI input. 8.6 High-bandwidth digital content protection The HDMI receiver also contains the HDCP decryption function. The keys provided by the One Time Programmable, non-volatile memory in encrypted format are decrypted and then stored in the HDCP module. This is particularly suitable for repeater applications. The TDA19978A controls all HDCP repeater functions based on the HDCP 1.2 specification. Four DDC-buses HSCLA/HSDAA; HSCLB/HSDAB; HSCLC/HSDAC and HSCLD/HSDAD are integrated into the HDCP function, one bus for each HDMI input. The DDC-bus connected to the HDCP block is automatically selected based on the active HDMI input. The unused inputs are disconnected from the DDC-bus (no acknowledge). No additional CPU processing is required because the authentication phase and the rekey calculation are fully managed by the TDA19978A. 8.7 Color depth unpacking In Deep Color mode, the TDA19978A receives several fragments of a pixel group at the HDMI link frequency. This block translates the received pixel group into pixels at the pixel frequency. This operation is fully automatic and does not need any external control. 8.8 Derepeater The HDMI source uses pixel repetition to increase the transmitted pixel clock for transmitting video formats at native pixel rates below 25 megapixels per second or to increase the number of audio sample packets in each line. The derepeater function discards repeated pixels and divides the clock to reproduce the native video format. 8.9 Upsample The HDMI source can use YCbCr 4:2:2 pixel encoding which enables the number of bits allocated per component to be increased up to 12. The upsample function transforms this 12-bit YCbCr 4:2:2 data stream into a 12-bit YCbCr 4:4:4 data stream by repeating or linearly interpolating the chrominance pixels Cb and Cr. Upsampling mode is selected using the I2C-bus. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 10 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 8.10 Packet extraction Information sent during the Data Island periods are extracted from the HDMI data stream. Audio clock regeneration, general control and InfoFrames can be read using the I2C-bus while audio samples are sent to the audio FIFO. The TDA19978A can receive the new HDMI 1.3a packets, general control and color gamut metadata info packets. In audio applications, the TDA19978A manages HBR packets for high bit rate compressed audio streams (IEC 61937), One Bit Audio samples and DST packets for One Bit Audio and SACD with DSD and DST audio streams. The TDA19978A includes a two channel status decoder supporting multi-channel reception for Audio Sample Packets. This enables the user to obtain channel status information from the IEC 60958/IEC 61937 stream such as: • The audio stream type (non-linear as IEC 61937 or L-PCM as IEC 60958) • Copyright protection • Sampling frequency Refer to IEC 60958/IEC 61937 specifications for more details. An update of each InfoFrame or the channel status content is indicated by a register bit and the HIGH-to-LOW transition on output pin VAI. This makes CPU polling unnecessary. 8.11 Audio PLL The TDA19978A generates a 128/256/512 × fs system clock enabling the use of simple audio DACs without an integrated PLL, such as the UDA1334BTS. The programming of the audio PLL can be either automatic, using the audio clock regeneration parameters found in the Data Islands or set manually using the I2C-bus. All standard audio sampling frequencies 32 kHz, 44.1 kHz, 88.2 kHz, 176.4 kHz, 48 kHz, 96 kHz and 192 kHz are accepted by the device. 8.12 Audio formatter Audio samples can be output in either S/PDIF, I2S-bus formats or DSD (SACD). In I2S-bus or S/PDIF modes, up to eight audio channels can be controlled using the audio port pins (AP0 to AP5). In DSD mode (SACD), up to six audio channels can be controlled using the these pins. The audio port mapping depends on the channel allocation (see Table 4, Table 5 and Table 6 for detailed information). In the following tables, all ports are LV-TTL compatible TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 11 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 4. Audio port Audio port configuration (Layout 0) Pin Layout 0 I2S-bus S/PDIF SYSCLK[1] AP5 85 SYSCLK[1] AP4 83 WS (word select) WS[1] AP3 82 AP2 81 AP1 80 AP0 79 SD S/PDIF ACLK OBA DSD channel 1 78 SCK (I2S-bus clock) master clock for 64 × fs DSD channel 0 S/PDIF[1] DSD clock 64 × fs 64 × fs 32 × fs [1] Can be activated with the I2C-bus (optional). Table 5. Audio port AP5 Audio port configuration (Layout 1) Pin 85 Layout 1 I2S-bus S/PDIF OBA SYSCLK[1] SYSCLK[1] DSD channel 5 DSD channel 4 AP4 83 WS (word select) WS[1] AP3 82 SD3 S/PDIF3 DSD channel 3 AP2 81 SD2 S/PDIF2 DSD channel 2 AP1 80 SD1 S/PDIF1 DSD channel 1 AP0 79 SD0 ACLK 78 SCK S/PDIF0 (I2S-bus clock) master clock for 64 × fs DSD channel 0 S/PDIF[1] DSD clock 64 × fs 64 × fs 32 × fs [1] Can be activated with the I2C-bus (optional). Table 6. Audio port Audio port configuration for HBR and DST packets Pin HBR demultiplexed DST I2S-bus S/PDIF SYSCLK[1] AP5 85 SYSCLK[1] AP4 83 WS (word select) WS[1] AP3 82 SDx+3 S/PDIFx+3 AP2 81 SDx+2 S/PDIFx+2 AP1 80 SDx+1 S/PDIFx+1 AP0 79 SDx S/PDIFx ACLK 78 SCK (I2S-bus clock) master clock for 64 × fs (ACR) 64 × fs 32 × fs (ACR) TDA19978A_3 Product data sheet [1] Can be activated with the I2C-bus (optional). [2] x in SDx and S/PDIFx relates to the actual frame. All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 frame_start DSD channel 0 S/PDIF[1] DSD clock 64 × fs 128 × fs © NXP B.V. 2010. All rights reserved. 12 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 8.13 Sync timing measurement To assist input format recognition, the vertical/horizontal periods and the horizontal pulse width are measured based on the externally generated MCLK frequency (27 MHz crystal). This function has an accuracy of 1 LSB = 1 × MCLK period. 8.14 Format measurement timing The TDA19978A includes an improved system for accurate recognition of PC and TV formats. This system measures the parameters of blanking and video active area. This function can be useful for example when the TDA19978A receives PC format data in HDMI or DVI modes. 8.15 Color space conversion The color space conversion enables an RGB signal from the HDMI input to be converted into a YCbCr signal or converting the YCbCr signal from the HDMI input into an RGB signal. The color space conversion formula is: C 11 C 12 C 13 ⎛ CY OO1 YG O11 ⎞⎟ ⎜ = + × + ⎜ ⎟ C 21 C 22 C 23 OO2 VR RV O12 ⎜ ⎟ OO3 UB BU O13 C 31 C 32 C 33 ⎝ ⎠ (1) Activation of the color space conversion function, programming of all coefficients and offsets is done using the I2C-bus. 8.16 4:2:2 downsampling filters These filters downsample the Cb and Cr signals by a factor of 2. A delay has been added to the G/Y channel corresponding to the downsample filters pipeline delay to make sure the Y channel is in phase with the Cb and Cr channels. Four different filters, from simple cut to ITU-R BT.601 compliant digital, can be selected using the I2C-bus. 8.17 Range control The range control function truncates the range of data to remove super-white and super-black pixels at specified ceiling and floor values. 8.18 Dithering function The error dispersal rounding (dithering) function can convert the color depth from 30-bit or 36-bit to reduced 30-bit or 24-bit color depth. When dithering is triggered, the TDA19978A applies round, truncate or noise-shaping algorithms. When the error dispersal rounding function is not used, the data coming from the filter are directly sent to the 4:2:2 formatter. The error dispersal rounding function works only with the active video signal. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 13 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 8.19 4:2:2 formatter The 4:2:2 formatter contains the YCbCr 4:2:2 semi-planar and the YCbCr 4:2:2 ITU-R BT.656 formatting functions. The selection of these functions is made using the I2C-bus. • In YCbCr 4:2:2 mode: the data frequency for the Y signal is equal to the pixel clock frequency. While the data frequency for the Cb and Cr signals is equal to half the pixel clock frequency • In semi-planar mode: the output clock should be the same as the pixel clock • In ITU-R BT.656 mode: the data frequency should be the same as the formatter clock frequency (e.g. pixel clock × 2) The Start Active Video (SAV) and End Active Video (EAV) timing reference codes can be included in the data stream based on the HREF, VREF and FREF positions from the VHREF timing generator. Specific codes programmed using the I2C-bus can replace the data stream during the blanking period to mask gain and clamp calibration. 8.20 Video port selection Each channel can be allocated to a specified video port using the I2C-bus (see Section 13 “Output video port formats (mapping examples)” on page 21) to optimize board layout at the interface with video processing ICs. For example: • • • • R, G or B in RGB 4:4:4 mode on VP[29:20] Y, Cb or Cr in YUV 4:4:4 mode on VP[19:10] Y or Cb-Cr in 4:2:2 semi-planar mode on VP[9:0] Cb-Y-Cr-Y in 4:2:2 ITU-R BT.656 mode on VP[9:0] Each video port can be set to high-impedance using the I2C-bus. 8.21 Output buffers The levels of the output buffers are LV-TTL compatible. Switching the outputs between active and high-impedance is set using the I2C-bus. The outputs HREF, VREF and FREF can be set to high-impedance (Z) or forced LOW (L), independently of the timing reference codes. 8.22 VHREF timing generator The VHREF timing generator outputs all of the timing signals used by the device: • VREF, HREF and FREF signals for SAV, EAV and active video area definition • VS and HS to change width and position compared with the HDMI inputs 8.23 I2C-bus serial interface The I2C-bus serial interface enables the internal registers of the device to be programmed. The slave address of the device is selected by pin A0. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 14 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 8.24 Power management The TDA19978A can use one of three Power-down modes: • level 0: full Power-down mode • level 1: internal EDID memory with I2C-bus serial interface active • level 2: internal EDID memory with I2C-bus serial interface and activity detection enabled The user can activate these different modes with pin PD or using I2C-bus registers: • level 0: PD pin is HIGH • level 1: settings defined in the I2C-bus registers • level 2: with settings defined in the I2C-bus registers 8.25 EDID memory management The TDA19978A embedded EDID memory can be shared with all HDMI inputs. The embedded EDID memory shares 253 bytes with the four HDMI inputs. In addition, three bytes are dedicated to the physical address and checksum for each HDMI input (see Figure 3). This memory is accessible in parallel by all HDMI inputs. You can share the EDID memory over zero, one, two, three or four HDMI input(s) as shown in Figure 4. The content of embedded volatile EDID memory must be programmed using the I2C-bus for each power-on of TDA19978A. The embedded EDID memory remains accessible on each HDMI input when the TDA19978A uses a different low-power mode. The “physical address” of each HDMI input can be easily changed with the TDA19978A without corrupting the integrity of each DDC-bus. 8.25.1 EDID memory shared over all four HDMI inputs EDID: 253 B I2C-bus TDA19978A 3B 3B 3B 3B HDMI INPUT HDMI INPUT HDMI INPUT HDMI INPUT CPU FLASH(1) EDID CONTENT 001aai137 (1) 253 bytes + 3 bytes input A + 3 bytes input B + 3 bytes input C + 3 bytes input D + 1 byte subPhys@ Fig 3. TDA19978A_3 Product data sheet An example of an application with EDID memory shared over all four HDMI inputs All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 15 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 8.25.2 EDID memory shared over three HDMI inputs EDID: 253 B I2C-bus TDA19978A 3B 3B 3B HDMI INPUT HDMI INPUT HDMI INPUT CPU EXTERNAL EDID: 256 B or 512 B DVI or HDMI INPUT FLASH(1) EDID CONTENT 001aai138 (1) 253 bytes + 3 bytes input B + 3 bytes input C + 3 bytes input D + 1 byte subPhys@ Fig 4. An example of an application with EDID shared over three HDMI inputs 9. I2C-bus protocol The TDA19978A is a slave I2C-bus device and the SCL pin is only an input pin. The timing and protocol for I2C-bus are standard. Bit A0 of the I2C-bus device address is externally selected by the A0 pin. The main device I2C-bus address is given in Table 7. Table 7. TDA19978A_3 Product data sheet I2C-bus slave address A6 A5 A4 A3 A2 A1 A0 R/W 1 0 0 1 1 0 A0 0/1 All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 16 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 10. Limiting values Table 8. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDDx(3V3) Conditions Min Max Unit supply voltage on all 3.3 V pins −0.5 +4.6 V VDDx(1V8) supply voltage on all 1.8 V pins −0.5 +2.5 V ΔVDD supply voltage difference −0.5 +0.5 V IO output current - 35 mA Tstg storage temperature −55 +150 °C Tamb ambient temperature 0 70 °C Tj junction temperature - 125 °C VESD electrostatic discharge voltage −2000 +2000 V HBM 11. Thermal characteristics Table 9. Thermal characteristics Symbol Parameter Rth(j-a) Rth(j-c) Conditions Typ Unit thermal resistance from junction to ambient in free air 22.8 K/W thermal resistance from junction to case 11.1 K/W 12. Characteristics Table 10. Characteristics VDDH(3V3) = 3.135 V to 3.465 V; VDDI(3V3) = 3.135 V to 3.465 V; VDDO(3V3) = 3.135 V to 3.465 V; VDDH(1V8) = 1.71 V to 1.89 V; VDDC(1V8) = 1.71 V to 1.89 V; Tamb = 0 °C to 70 °C; typical values measured at VDDH(3V3), VDDI(3V3) and VDDO(3V3) = 3.3 V; VDDH(1V8) and VDDC(1V8) = 1.8 V and Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 3.465 V Supplies VDDH(3V3) HDMI supply voltage (3.3 V) VDDH(1V8) HDMI supply voltage (1.8 V) 1.71 1.89 V VDDI(3V3) input supply voltage (3.3 V) 3.135 3.3 3.465 V VDDC(1V8) core supply voltage (1.8 V) 1.71 1.89 V VDDO(3V3) output supply voltage (3.3 V) IDDH(3V3) IDDH(1V8) IDDI(3V3) HDMI supply current (3.3 V) HDMI supply current (1.8 V) input supply current (3.3 V) TDA19978A_3 Product data sheet 3.135 3.3 1.8 1.8 3.135 3.3 3.465 V 720p at 60 Hz [1] - 103 - mA 1080p at 60 Hz [1] - 106 - mA 1080p at 60 Hz; Deep Color mode [1] - 110 - mA 720p at 60 Hz [1] - 48 - mA 1080p at 60 Hz [1] - 68 - mA 1080p at 60 Hz; Deep Color mode [1] - 85 - mA 720p at 60 Hz [1] - 1 - mA 1080p at 60 Hz [1] - 1 - mA 1080p at 60 Hz; Deep Color mode [1] - 1 - mA All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 17 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 10. Characteristics …continued VDDH(3V3) = 3.135 V to 3.465 V; VDDI(3V3) = 3.135 V to 3.465 V; VDDO(3V3) = 3.135 V to 3.465 V; VDDH(1V8) = 1.71 V to 1.89 V; VDDC(1V8) = 1.71 V to 1.89 V; Tamb = 0 °C to 70 °C; typical values measured at VDDH(3V3), VDDI(3V3) and VDDO(3V3) = 3.3 V; VDDH(1V8) and VDDC(1V8) = 1.8 V and Tamb = 25 °C; unless otherwise specified. Symbol Min Typ Max Unit 720p at 60 Hz [1] - 49 - mA 1080p at 60 Hz [1] - 78 - mA 1080p at 60 Hz; Deep Color mode [1] - 120 - mA 720p at 60 Hz [1] - 148 - mA 1080p at 60 Hz [1] - 283 - mA 1080p at 60 Hz; Deep Color mode [1] - 453 - mA ΔVDD(3V3-3V3) supply voltage difference between start-up and established conditions two 3.3 V supplies −100 - +100 mV ΔVDD(1V8-1V8) supply voltage difference between start-up and established conditions two 1.8 V supplies −100 - +100 mV - 0.75 - W IDDO(3V3) IDDC(1V8) P Parameter Conditions output supply current (3.3 V) core supply current (1.8 V) power dissipation active mode 720p at 60 Hz Pcons power consumption [1] 1080p at 60 Hz - 1.13 - W 1080p at 60 Hz; Deep Color mode - 1.63 - W Power-down mode pin PD = HIGH - 1 - mW I2C-bus; EDID and HDCP memory power-up - 4 - mW I2C-bus; EDID; activity detection and HDCP memory power-up - 150 - mW pin VCLK 165 - - MHz pin ACLK 25 - - MHz Clock timing output: pins VCLK, ACLK and SYSCLK fclk(max) δclk maximum clock frequency clock duty cycle pin SYSCLK 50 - - MHz pin VCLK - 50 - % pin ACLK - 50 - % pin SYSCLK - 50 - % Timing output: pins VP[29:0]; fs = 165 MHz; CL = 10 pF; see Figure 5 tsu(Q) data output set-up time 0.40 - 1.50 ns th(Q) data output hold time 0.80 - 2.00 ns td(pipe) pipeline delay time - 80 × Tclk - clock interval from inputs to outputs; all modes Timing output: pins AP[5:0] with respect to ACLK; fclk = 12.288 MHz; CL = 10 pF; see Figure 6 tsu(Q) data output set-up time 69 - - ns th(Q) data output hold time 2 - - ns LV-TTL digital outputs: pins VP[29:0], VCLK, AP[5:0], ACLK, DE, HS, VS, HREF, VREF, FREF; CL = 10 pF VOL LOW-level output voltage IOL = 2 mA - - 0.4 V VOH HIGH-level output voltage IOH = −2 mA 2.4 - - V TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 18 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 10. Characteristics …continued VDDH(3V3) = 3.135 V to 3.465 V; VDDI(3V3) = 3.135 V to 3.465 V; VDDO(3V3) = 3.135 V to 3.465 V; VDDH(1V8) = 1.71 V to 1.89 V; VDDC(1V8) = 1.71 V to 1.89 V; Tamb = 0 °C to 70 °C; typical values measured at VDDH(3V3), VDDI(3V3) and VDDO(3V3) = 3.3 V; VDDH(1V8) and VDDC(1V8) = 1.8 V and Tamb = 25 °C; unless otherwise specified. Symbol ILOZ Parameter Conditions OFF-state output leakage current Min Max Unit 0 - μA 10 - 100 μA −100 - −10 μA VO = VDDO(3V3) - 0 - μA RRRX1 = 12 kΩ ± 1 %; RRRX2 = 12 kΩ ± 1 % 150 - 1200 mV VO = VDDO(3V3) × 1⁄3 VO = VDDO(3V3) × Digital inputs: pins RXxC+, Typ - high-impedance state; VO = 0 V 2⁄ 3 [2] RXxC−[3] VI(dif) differential input voltage VI(cm) common-mode input voltage 2.735 - 3.475 V fclk(max) maximum clock frequency 205 - - MHz 150 - 1200 mV 2.735 - 3.475 V Digital inputs: pins RXx0+, RXx0−, RXx1+, RXx1−, RXx2+, RXx2−[3] RRRX1 = 12 kΩ ± 1 %; RRRX2 = 12 kΩ ± 1 % VI(dif) differential input voltage VI(cm) common-mode input voltage I2C-bus: pins SCL and SDA[5] fSCL SCL clock frequency - - 400 kHz Cb capacitive load for each bus line - - 400 pF Ci capacitance for each I/O pin - - 10 pF Standard-mode - - 100 kHz Fast-mode - - 400 kHz - - 10 pF DDC I2C-bus: pins HSCLx, HSDAx [3][4] fSCL SCL clock frequency capacitance for each I/O pin Ci [1] At 30 % activity on video port output. [2] In high-impedance state, the output buffer is set to repeater mode recopying the input logic state with a small current. The output current changes from most negative to the most positive value at the triggering level which is internally set to VDDO(3V3) / 2 (e.g. the value of a pull-up or pull-down resistor must be lower than 18 kΩ to have a stable output value of VDDO(3V3) or 0 V). [3] x = A, B, C or D. [4] 5 V tolerant. [5] Fast-mode, 5 V tolerant. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 19 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing VCLK 50 % tsu(Q) 2.4 V VP[29:0] 0.4 V th(Q) Fig 5. 001aah368 Output timing diagram pin VCLK on pins VP[29:0] ACLK 50 % tsu(Q) 2.4 V AP[5:0] 0.4 V th(Q) Fig 6. TDA19978A_3 Product data sheet 001aah369 Output timing diagram pin ACLK on pins AP[5:0] All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 20 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 13. Output video port formats (mapping examples) The following tables are examples of output formats that can be used with the video driver’s port swap function. Table 11. Output in 12-bit video port format (mapping example 1) Signal YCbCr 4:2:2 semi-planar[1] YCbCr 4:2:2 ITU-R BT.656[1] VP[29] Y0[11] Y1[11] Z/L Z/L Z/L Z/L VP[28] Y0[10] Y1[10] Z/L Z/L Z/L Z/L VP[27] Y0[9] Y1[9] Z/L Z/L Z/L Z/L VP[26] Y0[8] Y1[8] Z/L Z/L Z/L Z/L VP[25] Y0[7] Y1[7] Z/L Z/L Z/L Z/L VP[24] Y0[6] Y1[6] Z/L Z/L Z/L Z/L VP[23] Y0[5] Y1[5] Z/L Z/L Z/L Z/L VP[22] Y0[4] Y1[4] Z/L Z/L Z/L Z/L VP[21] Y0[3] Y1[3] Z/L Z/L Z/L Z/L VP[20] Y0[2] Y1[2] Z/L Z/L Z/L Z/L VP[19] Y0[1] Y1[1] Z/L Z/L Z/L Z/L VP[18] Y0[0] Y1[0] Z/L Z/L Z/L Z/L VP[17] Cb[11] Cr[11] Cb[11] Y0[11] Cr[11] Y1[11] VP[16] Cb[10] Cr[10] Cb[10] Y0[10] Cr[10] Y1[10] VP[15] Cb[9] Cr[9] Cb[9] Y0[9] Cr[9] Y1[9] VP[14] Cb[8] Cr[8] Cb[8] Y0[8] Cr[8] Y1[8] VP[13] Cb[7] Cr[7] Cb[7] Y0[7] Cr[7] Y1[7] VP[12] Cb[6] Cr[6] Cb[6] Y0[6] Cr[6] Y1[6] VP[11] Cb[5] Cr[5] Cb[5] Y0[5] Cr[5] Y1[5] VP[10] Cb[4] Cr[4] Cb[4] Y0[4] Cr[4] Y1[4] VP[9] Cb[3] Cr[3] Cb[3] Y0[3] Cr[3] Y1[3] VP[8] Cb[2] Cr[2] Cb[2] Y0[2] Cr[2] Y1[2] VP[7] Cb[1] Cr[1] Cb[1] Y0[1] Cr[1] Y1[1] VP[6] Cb[0] Cr[0] Cb[0] Y0[0] Cr[0] Y1[0] VP[5] Z/L Z/L Z/L Z/L Z/L Z/L VP[4] Z/L Z/L Z/L Z/L Z/L Z/L VP[3] Z/L Z/L Z/L Z/L Z/L Z/L VP[2] Z/L Z/L Z/L Z/L Z/L Z/L VP[1] Z/L Z/L Z/L Z/L Z/L Z/L VP[0] Z/L Z/L Z/L Z/L Z/L Z/L [1] Z = high-impedance; L = LOW-level; depending on the driver configuration. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 21 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 12. Output in 12-bit video port format (mapping example 2) Signal YCbCr 4:2:2 semi-planar[1] YCbCr 4:2:2 ITU-R BT.656[1] VP[29] Cb[11] Cr[11] Cb[11] Y0[11] Cr[11] Y1[11] VP[28] Cb[10] Cr[10] Cb[10] Y0[10] Cr[10] Y1[10] VP[27] Cb[9] Cr[9] Cb[9] Y0[9] Cr[9] Y1[9] VP[26] Cb[8] Cr[8] Cb[8] Y0[8] Cr[8] Y1[8] VP[25] Cb[7] Cr[7] Cb[7] Y0[7] Cr[7] Y1[7] VP[24] Cb[6] Cr[6] Cb[6] Y0[6] Cr[6] Y1[6] VP[23] Cb[5] Cr[5] Cb[5] Y0[5] Cr[5] Y1[5] VP[22] Cb[4] Cr[4] Cb[4] Y0[4] Cr[4] Y1[4] VP[21] Cb[3] Cr[3] Cb[3] Y0[3] Cr[3] Y1[3] VP[20] Cb[2] Cr[2] Cb[2] Y0[2] Cr[2] Y1[2] VP[19] Cb[1] Cr[1] Cb[1] Y0[1] Cr[1] Y1[1] VP[18] Cb[0] Cr[0] Cb[0] Y0[0] Cr[0] Y1[0] VP[17] Y0[11] Y1[11] Z/L Z/L Z/L Z/L VP[16] Y0[10] Y1[10] Z/L Z/L Z/L Z/L VP[15] Y0[9] Y1[9] Z/L Z/L Z/L Z/L VP[14] Y0[8] Y1[8] Z/L Z/L Z/L Z/L VP[13] Y0[7] Y1[7] Z/L Z/L Z/L Z/L VP[12] Y0[6] Y1[6] Z/L Z/L Z/L Z/L VP[11] Y0[5] Y1[5] Z/L Z/L Z/L Z/L VP[10] Y0[4] Y1[4] Z/L Z/L Z/L Z/L VP[9] Y0[3] Y1[3] Z/L Z/L Z/L Z/L VP[8] Y0[2] Y1[2] Z/L Z/L Z/L Z/L VP[7] Y0[1] Y1[1] Z/L Z/L Z/L Z/L VP[6] Y0[0] Y1[0] Z/L Z/L Z/L Z/L VP[5] Z/L Z/L Z/L Z/L Z/L Z/L VP[4] Z/L Z/L Z/L Z/L Z/L Z/L VP[3] Z/L Z/L Z/L Z/L Z/L Z/L VP[2] Z/L Z/L Z/L Z/L Z/L Z/L VP[1] Z/L Z/L Z/L Z/L Z/L Z/L VP[0] Z/L Z/L Z/L Z/L Z/L Z/L [1] Z = high-impedance; L = LOW-level; depending on the driver configuration. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 22 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 13. Output in 10-bit video port format (mapping example 1) Signal RGB YCbCr 4:4:4 YCbCr 4:2:2 semi-planar[1] YCbCr 4:2:2 ITU-R BT.656[1] VP[29] G[11] Y[11] Y0[11] Y1[11] Z/L Z/L Z/L Z/L VP[28] G[10] Y[10] Y0[10] Y1[10] Z/L Z/L Z/L Z/L VP[27] G[9] Y[9] Y0[9] Y1[9] Z/L Z/L Z/L Z/L VP[26] G[8] Y[8] Y0[8] Y1[8] Z/L Z/L Z/L Z/L VP[25] G[7] Y[7] Y0[7] Y1[7] Z/L Z/L Z/L Z/L VP[24] G[6] Y[6] Y0[6] Y1[6] Z/L Z/L Z/L Z/L VP[23] G[5] Y[5] Y0[5] Y1[5] Z/L Z/L Z/L Z/L VP[22] G[4] Y[4] Y0[4] Y1[4] Z/L Z/L Z/L Z/L VP[21] G[3] Y[3] Y0[3] Y1[3] Z/L Z/L Z/L Z/L VP[20] G[2] Y[2] Y0[2] Y1[2] Z/L Z/L Z/L Z/L VP[19] R[11] Cr[11] Cb[11] Cr[11] Cb[11] Y0[11] Cr[11] Y1[11] VP[18] R[10] Cr[10] Cb[10] Cr[10] Cb[10] Y0[10] Cr[10] Y1[10] VP[17] R[9] Cr[9] Cb[9] Cr[9] Cb[9] Y0[9] Cr[9] Y1[9] VP[16] R[8] Cr[8] Cb[8] Cr[8] Cb[8] Y0[8] Cr[8] Y1[8] VP[15] R[7] Cr[7] Cb[7] Cr[7] Cb[7] Y0[7] Cr[7] Y1[7] VP[14] R[6] Cr[6] Cb[6] Cr[6] Cb[6] Y0[6] Cr[6] Y1[6] VP[13] R[5] Cr[5] Cb[5] Cr[5] Cb[5] Y0[5] Cr[5] Y1[5] VP[12] R[4] Cr[4] Cb[4] Cr[4] Cb[4] Y0[4] Cr[4] Y1[4] VP[11] R[3] Cr[3] Cb[3] Cr[3] Cb[3] Y0[3] Cr[3] Y1[3] VP[10] R[2] Cr[2] Cb[2] Cr[2] Cb[2] Y0[2] Cr[2] Y1[2] VP[9] B[11] Cb[11] Z/L Z/L Z/L Z/L Z/L Z/L VP[8] B[10] Cb[10] Z/L Z/L Z/L Z/L Z/L Z/L VP[7] B[9] Cb[9] Z/L Z/L Z/L Z/L Z/L Z/L VP[6] B[8] Cb[8] Z/L Z/L Z/L Z/L Z/L Z/L VP[5] B[7] Cb[7] Z/L Z/L Z/L Z/L Z/L Z/L VP[4] B[6] Cb[6] Z/L Z/L Z/L Z/L Z/L Z/L VP[3] B[5] Cb[5] Z/L Z/L Z/L Z/L Z/L Z/L VP[2] B[4] Cb[4] Z/L Z/L Z/L Z/L Z/L Z/L VP[1] B[3] Cb[3] Z/L Z/L Z/L Z/L Z/L Z/L VP[0] B[2] Cb[2] Z/L Z/L Z/L Z/L Z/L Z/L [1] Z = high-impedance; L = LOW-level; depending on the driver configuration. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 23 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 14. Output in 10-bit video port format (mapping example 2) Signal RGB YCbCr 4:4:4 YCbCr 4:2:2 semi-planar[1] YCbCr 4:2:2 ITU-R BT.656[1] VP[29] B[11] Cb[11] Z/L Z/L Z/L Z/L Z/L Z/L VP[28] B[10] Cb[10] Z/L Z/L Z/L Z/L Z/L Z/L VP[27] B[9] Cb[9] Z/L Z/L Z/L Z/L Z/L Z/L VP[26] B[8] Cb[8] Z/L Z/L Z/L Z/L Z/L Z/L VP[25] B[7] Cb[7] Z/L Z/L Z/L Z/L Z/L Z/L VP[24] B[6] Cb[6] Z/L Z/L Z/L Z/L Z/L Z/L VP[23] B[5] Cb[5] Z/L Z/L Z/L Z/L Z/L Z/L VP[22] B[4] Cb[4] Z/L Z/L Z/L Z/L Z/L Z/L VP[21] B[3] Cb[3] Z/L Z/L Z/L Z/L Z/L Z/L VP[20] B[2] Cb[2] Z/L Z/L Z/L Z/L Z/L Z/L VP[19] G[11] Y[11] Y0[11] Y1[11] Z/L Z/L Z/L Z/L VP[18] G[10] Y[10] Y0[10] Y1[10] Z/L Z/L Z/L Z/L VP[17] G[9] Y[9] Y0[9] Y1[9] Z/L Z/L Z/L Z/L VP[16] G[8] Y[8] Y0[8] Y1[8] Z/L Z/L Z/L Z/L VP[15] G[7] Y[7] Y0[7] Y1[7] Z/L Z/L Z/L Z/L VP[14] G[6] Y[6] Y0[6] Y1[6] Z/L Z/L Z/L Z/L VP[13] G[5] Y[5] Y0[5] Y1[5] Z/L Z/L Z/L Z/L VP[12] G[4] Y[4] Y0[4] Y1[4] Z/L Z/L Z/L Z/L VP[11] G[3] Y[3] Y0[3] Y1[3] Z/L Z/L Z/L Z/L VP[10] G[2] Y[2] Y0[2] Y1[2] Z/L Z/L Z/L Z/L VP[9] R[11] Cr[11] Cb[11] Cr[11] Cb[11] Y0[11] Cr[11] Y1[11] VP[8] R[10] Cr[10] Cb[10] Cr[10] Cb[10] Y0[10] Cr[10] Y1[10] VP[7] R[9] Cr[9] Cb[9] Cr[9] Cb[9] Y0[9] Cr[9] Y1[9] VP[6] R[8] Cr[8] Cb[8] Cr[8] Cb[8] Y0[8] Cr[8] Y1[8] VP[5] R[7] Cr[7] Cb[7] Cr[7] Cb[7] Y0[7] Cr[7] Y1[7] VP[4] R[6] Cr[6] Cb[6] Cr[6] Cb[6] Y0[6] Cr[6] Y1[6] VP[3] R[5] Cr[5] Cb[5] Cr[5] Cb[5] Y0[5] Cr[5] Y1[5] VP[2] R[4] Cr[4] Cb[4] Cr[4] Cb[4] Y0[4] Cr[4] Y1[4] VP[1] R[3] Cr[3] Cb[3] Cr[3] Cb[3] Y0[3] Cr[3] Y1[3] VP[0] R[2] Cr[2] Cb[2] Cr[2] Cb[2] Y0[2] Cr[2] Y1[2] [1] Z = high-impedance; L = LOW-level; depending on the driver configuration. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 24 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 15. Output in 8-bit video port format (mapping example 1) Signal RGB YCbCr 4:4:4[1] YCbCr 4:2:2 semi-planar[1] YCbCr 4:2:2 ITU-R BT.656[1] VP[29] G[11] Y[11] Y0[11] Y1[11] Z/L Z/L Z/L Z/L VP[28] G[10] Y[10] Y0[10] Y1[10] Z/L Z/L Z/L Z/L VP[27] G[9] Y[9] Y0[9] Y1[9] Z/L Z/L Z/L Z/L VP[26] G[8] Y[8] Y0[8] Y1[8] Z/L Z/L Z/L Z/L VP[25] G[7] Y[7] Y0[7] Y1[7] Z/L Z/L Z/L Z/L VP[24] G[6] Y[6] Y0[6] Y1[6] Z/L Z/L Z/L Z/L VP[23] G[5] Y[5] Y0[5] Y1[5] Z/L Z/L Z/L Z/L VP[22] G[4] Y[4] Y0[4] Y1[4] Z/L Z/L Z/L Z/L VP[21] R[11] Cr[11] Cb[11] Cr[11] Cb[11] Y0[11] Cr[11] Y1[11] VP[20] R[10] Cr[10] Cb[10] Cr[10] Cb[10] Y0[10] Cr[10] Y1[10] VP[19] R[9] Cr[9] Cb[9] Cr[9] Cb[9] Y0[9] Cr[9] Y1[9] VP[18] R[8] Cr[8] Cb[8] Cr[8] Cb[8] Y0[8] Cr[8] Y1[8] VP[17] R[7] Cr[7] Cb[7] Cr[7] Cb[7] Y0[7] Cr[7] Y1[7] VP[16] R[6] Cr[6] Cb[6] Cr[6] Cb[6] Y0[6] Cr[6] Y1[6] VP[15] R[5] Cr[5] Cb[5] Cr[5] Cb[5] Y0[5] Cr[5] Y1[5] VP[14] R[4] Cr[4] Cb[4] Cr[4] Cb[4] Y0[4] Cr[4] Y1[4] VP[13] B[11] Cb[11] Z/L Z/L Z/L Z/L Z/L Z/L VP[12] B[10] Cb[10] Z/L Z/L Z/L Z/L Z/L Z/L VP[11] B[9] Cb[9] Z/L Z/L Z/L Z/L Z/L Z/L VP[10] B[8] Cb[8] Z/L Z/L Z/L Z/L Z/L Z/L VP[9] B[7] Cb[7] Z/L Z/L Z/L Z/L Z/L Z/L VP[8] B[6] Cb[6] Z/L Z/L Z/L Z/L Z/L Z/L VP[7] B[5] Cb[5] Z/L Z/L Z/L Z/L Z/L Z/L VP[6] B[4] Cb[4] Z/L Z/L Z/L Z/L Z/L Z/L VP[5] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L VP[4] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L VP[3] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L VP[2] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L VP[1] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L VP[0] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L [1] Z = high-impedance; L = LOW-level; depending on the driver configuration. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 25 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 16. Output in 8-bit video port format (mapping example 2) Signal RGB[1] YCbCr 4:4:4[1] YCbCr 4:2:2 semi-planar[1] YCbCr 4:2:2 ITU-R BT.656[1] VP[29] B[11] Cb[11] Z/L Z/L Z/L Z/L Z/L Z/L VP[28] B[10] Cb[10] Z/L Z/L Z/L Z/L Z/L Z/L VP[27] B[9] Cb[9] Z/L Z/L Z/L Z/L Z/L Z/L VP[26] B[8] Cb[8] Z/L Z/L Z/L Z/L Z/L Z/L VP[25] B[7] Cb[7] Z/L Z/L Z/L Z/L Z/L Z/L VP[24] B[6] Cb[6] Z/L Z/L Z/L Z/L Z/L Z/L VP[23] B[5] Cb[5] Z/L Z/L Z/L Z/L Z/L Z/L VP[22] B[4] Cb[4] Z/L Z/L Z/L Z/L Z/L Z/L VP[21] G[11] Y[11] Y0[11] Y1[11] Z/L Z/L Z/L Z/L VP[20] G[10] Y[10] Y0[10] Y1[10] Z/L Z/L Z/L Z/L VP[19] G[9] Y[9] Y0[9] Y1[9] Z/L Z/L Z/L Z/L VP[18] G[8] Y[8] Y0[8] Y1[8] Z/L Z/L Z/L Z/L VP[17] G[7] Y[7] Y0[7] Y1[7] Z/L Z/L Z/L Z/L VP[16] G[6] Y[6] Y0[6] Y1[6] Z/L Z/L Z/L Z/L VP[15] G[5] Y[5] Y0[5] Y1[5] Z/L Z/L Z/L Z/L VP[14] G[4] Y[4] Y0[4] Y1[4] Z/L Z/L Z/L Z/L VP[13] R[11] Cr[11] Cb[11] Cr[11] Cb[11] Y0[11] Cr[11] Y1[11] VP[12] R[10] Cr[10] Cb[10] Cr[10] Cb[10] Y0[10] Cr[10] Y1[10] VP[11] R[9] Cr[9] Cb[9] Cr[9] Cb[9] Y0[9] Cr[9] Y1[9] VP[10] R[8] Cr[8] Cb[8] Cr[8] Cb[8] Y0[8] Cr[8] Y1[8] VP[9] R[7] Cr[7] Cb[7] Cr[7] Cb[7] Y0[7] Cr[7] Y1[7] VP[8] R[6] Cr[6] Cb[6] Cr[6] Cb[6] Y0[6] Cr[6] Y1[6] VP[7] R[5] Cr[5] Cb[5] Cr[5] Cb[5] Y0[5] Cr[5] Y1[5] VP[6] R[4] Cr[4] Cb[4] Cr[4] Cb[4] Y0[4] Cr[4] Y1[4] VP[5] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L VP[4] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L VP[3] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L VP[2] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L VP[1] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L VP[0] Z/L Z/L Z/L Z/L Z/L Z/L Z/L Z/L [1] Z = high-impedance; L = LOW-level; depending on the driver configuration. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 26 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 14. Example of supported video formats Table 17. Example of supported video formats Standard Format Total pixels × total lines Horizontal rate Pixel clock (kHz) rate (MHz)[1] 576i[2] 1440 × 576i 50 Hz 1728 × 625 15.750 27.000[3] 480i[4] 1440 × 480i 59.94 Hz 1716 × 525 15.734 27.000[3] 1440 × 480i 60 Hz 1716 × 525 15.750 27.027[3] 576p 720 × 576p 50 Hz 864 × 625 31.250 27.000 480p 720 × 480p 59.94 Hz 858 × 525 31.469 27.000 720 × 480p 60 Hz 858 × 525 31.500 27.027 1280 × 720p 50 Hz 1980 × 750 37.500 74.250 1280 × 720p 59.94 Hz 1650 × 750 44.955 74.176 720p 1080i 45.000 74.250 28.125 74.250 1920 × 1080i 59.94 Hz 2200 × 1125 33.716 74.176 1920 × 1080i 60 Hz 2200 × 1125 33.750 74.250 1920 × 1080p 50 2640 × 1125 56.250 148.500 2200 × 1125 67.433 148.352 1920 × 1080p 60 2200 × 1125 67.500 148.500 640 × 480p 60 Hz 800 × 525 31.469 25.175 640 × 480p 72 Hz 832 × 520 37.861 31.500 640 × 480p 75 Hz 840 × 500 37.500 31.500 640 × 480p 85 Hz 832 × 509 43.269 36.000 800 × 600p 56 Hz 1024 × 625 35.156 36.000 800 × 600p 60 Hz 1056 × 628 37.879 40.000 800 × 600p 72 Hz 1040 × 666 48.077 50.000 800 × 600p 75 Hz 1056 × 625 46.875 49.500 800 × 600p 85 Hz 1048 × 631 53.674 56.250 0.48M3-R 800 × 600p 120 Hz 960 × 636 76.302 73.250 0.41M9 848 × 480p 60 Hz 1088 × 517 31.020 33.750 0.79M3 XGA 1024 × 768p 43 Hz 1264 × 817 35.522 44.900 1024 × 768p 60 Hz 1344 × 806 48.363 65.000 1024 × 768p 70 Hz 1328 × 806 56.476 75.000 1024 × 768p 75 Hz 1312 × 800 60.023 78.750 1024 × 768p 85 Hz 1376 × 808 68.677 94.500 1024 × 768p 120 Hz 1184 × 813 97.551 115.500 1.00M3 1152 × 864p 75 Hz 1600 × 900 67.500 108.000 0.98M9-R 1280 × 768p 60 Hz 1440 × 790 47.396 68.250 1280 × 768p 120 1440 × 813 97.396 140.250 0.31M3 VGA 0.48M3 SVGA 0.79M3-R XGA Product data sheet 1650 × 750 2640 × 1125 1920 × 1080p 59.94 Hz[5] 1080p TDA19978A_3 1280 × 720p 60 Hz 1920 × 1080i 50 Hz Hz[5] Hz[5] Hz[5] All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 27 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 17. Example of supported video formats …continued Standard Format Total pixels × total lines Horizontal rate Pixel clock (kHz) rate (MHz)[1] 0.98M9 1280 × 768p 60 Hz 1664 × 798 47.776 79.500 1280 × 768p 75 Hz 1696 × 805 60.289 102.250 1280 × 768p 85 Hz 1712 × 809 68.633 117.500 1280 × 800p 60 Hz 1440 × 823 49.306 71.000 1280 × 800p 120 1440 × 847 101.563 146.250 1.02MA-R 1.02MA 1.23M3 1280 × 800p 60 Hz 1680 × 831 49.702 83.500 1280 × 800p 75 Hz 1696 × 838 62.795 106.500 1280 × 800p 85 Hz 1712 × 843 71.554 122.500 1280 × 960p 60 Hz 1800 × 1000 60.000 108.000 Hz[5] 1728 × 1011 85.938 148.500 1280 × 1024p 60 Hz 1688 × 1066 63.981 108.000 1280 × 1024p 75 Hz 1688 × 1066 79.976 135.000 1280 × 1024p 85 1728 × 1072 91.146 157.500 1280 × 960p 85 1.31M4 SXGA Hz[5] Hz[5] 1.04M9 1360 × 768p 60 Hz 1792 × 795 47.712 85.500 1.04M9-R 1360 × 768p 120 Hz[5] 1520 × 813 97.533 148.250 1.47M3-R 1400 × 1050p 60 Hz 1560 × 1080 64.744 101.000 1.47M3 1400 × 1050p 60 Hz 1864 × 1089 65.317 121.750 1896 × 1099 82.278 156.000 1.29MA-R 1440 × 900p 60 Hz 1600 × 926 55.469 88.750 1.29MA 1440 × 900p 60 Hz 1904 × 934 55.935 106.500 1440 × 900p 75 Hz[5] 1936 × 942 70.635 136.750 1440 × 900p 85 Hz[5] 1400 × 1050p 75 Hz[5] 1952 × 948 80.430 157.000 1.92M3 UXGA 1600 × 1200p 60 Hz[5] 2160 × 1250 75.000 162.000 1.76MA-R 1680 × 1050p 60 Hz 1840 × 1080 64.674 119.000 1.76MA 1680 × 1050p 60 Hz[5] 2240 × 1089 65.290 146.250 2.30MA-R[6] 1920 × 1200p 60 Hz[5] 2080 × 1235 74.038 154.000 [1] Pixel clock rate corresponds to VCLK output for 4:4:4 format and 4:2:2 semi-planar; VCLK / 2 for 4:2:2 ITU-R BT.656 format. The pixel clock rate can be determined by: a) Total pixels × total lines × frame rate for the progressive format. b) Total pixels × total lines × frame rate / 2 for the interlaced format. TDA19978A_3 Product data sheet [2] Also called PAL. [3] Pixel-doubling. [4] Also called NTSC. [5] Only supports Deep Color mode 10-bit. [6] Also called WUXGA. All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 28 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 1.8VHDMI RRX2 12 kΩ 1 % 3.3VHDMI VDDI(3V3) 142 3.3VDIG_I HSCLD 141 HSDAD 140 HSCLC 139 HSDAC 138 VDDC(1V8) 1.8VDIG 137 VDDC(1V8) 1.8VDIG 136 VSSH 135 RXA2+ 134 RXA2− 133 VSSH 132 RXB2− 131 RXB2+ 130 VDDH(3V3) 3.3VHDMI 129 RXA1+ 128 RXA1− 127 VSSH 126 RXB1− 125 RXB1+ 124 VDDH(1V8) 1.8VHDMI 123 RXA0+ 122 RXA0− 121 VSSH 120 RXB0− 119 RXB0+ 118 VDDH(3V3) 3.3VHDMI 117 RXAC+ 116 RXAC− 115 VSSH 114 RXBC− 113 RXBC+ 112 VDDH(3V3) 3.3VHDMI 111 A0 110 VSSC GNDC 109 15. Application information HDMI inputs A and B 2 107 3 106 4 RXDC− 5 VSSH 6 RXCC− 7 RXCC+ 8 105 103 9 100 10 99 RXDC+ 3.3VHDMI VDDH(3V3) HDMI inputs C and D RXD0+ 104 102 101 RXD0− 11 VSSH 12 RXC0− 13 RXC0+ 14 1.8VHDMI VDDH(1V8) 98 97 96 95 94 15 RXD1+ 93 16 RXD1− 17 VSSH 18 RXC1− 19 RXC1+ 20 3.3VHDMI VDDH(3V3) RXD2+ 92 91 TDA19978AHV 90 89 21 88 22 87 RXD2− 23 VSSH 24 RXC2− 25 RXC2+ 26 VPP 27 1.8VDIG 3.3VDIG VDDC(1V8) VDDO(3V3) 86 85 84 83 GNDC 82 28 81 29 80 VCLK 30 VSSO 31 CS/FREF 32 VS/VREF 33 HS/HREF 34 DE 35 VP[0] 36 79 78 77 76 75 74 3.3VHDMI VSSH VDDH(3V3) TEST0 3.3VHDMI 0Ω GNDC HSCLB HSDAB HSCLA HSDAA SCL SDA VAI VDDI(3V3) 3.3VDIG_I XTALIN/MCLK XTALOUT VDDC(1V8) VSSH VDDH(1V8) VSSH VDDH(3V3) VDDH(3V3) VSSO 1.8VDIG 1.8VHDMI 3.3VHDMI 3.3VHDMI AP5/SYSCLK/CTL3 VDDO(3V3) 3.3VDIG AP4/WS/CTL2 AP3/CTL1 AP2/CTL0 AP1 AP0 ACLK VSSO VP[29] VP[28] VDDO(3V3) VSSC 3.3VDIG GNDC 72 71 70 69 68 67 66 65 1.8VHDMI 1.8VDIG RRX1 12 kΩ 1 % VP[27] VP[26] VP[25] VP[24] VP[23] VP[22] 64 VSSO VP[21] VDDC(1V8) VDDC(1V8) 1.8VDIG 62 61 60 59 58 57 56 55 63 3.3VDIG VDDO(3V3) VP[20] VP[19] VP[18] VP[17] VP[16] VP[15] VP[14] 53 54 VSSO VP[13] 51 52 VP[12] 50 49 48 47 45 44 46 3.3VDIG VDDO(3V3) VP[11] VP[10] VP[9] VP[8] VP[7] VP[6] VP[5] 42 43 VP[4] VSSO 1.8VDIG 40 41 VDDC(1V8) 3.3VDIG 39 VP[3] VDDO(3V3) 38 VP[2] VSSC GNDC VP[1] 37 73 VDDH(1V8) I2C-bus DDC A and B VDDH(3V3) 108 27 MHz 3.3VHDMI 1 HDMI audio output PD 144 VSSC GNDC 143 VDDH(1V8) DDC C and D control outputs and video port outputs 001aah370 Each supply voltage pin should be decoupled with a 100 nF capacitor. Fig 7. Application diagram TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 29 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 16. Package outline HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad SOT612-3 c y exposed die pad X A Dh 73 72 108 109 ZE e Eh E HE A A2 (A 3) A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) Dh E(1) Eh e mm 1.6 0.12 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 20.1 19.9 5.7 5.5 20.1 19.9 5.7 5.5 0.5 HD HE 22.15 22.15 21.85 21.85 L Lp v w y 1 0.75 0.45 0.2 0.08 0.08 ZD(1) ZE(1) 1.4 1.1 1.4 1.1 θ o 7 o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT612-3 Fig 8. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-07-12 04-07-05 MS-026 Package outline SOT612-3 (HLQFP144) TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 30 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 17. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 17.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 17.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 17.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 31 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 17.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 9) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 18 and 19 Table 18. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 19. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 9. TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 32 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 9. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 18. Abbreviations Table 20. TDA19978A_3 Product data sheet Abbreviations Acronym Description ACR Audio Clock Regeneration AVR Audio Video Receiver AWG American Wire Gage DAC Digital-to-Analog Converter DDC-bus Display Data Channel bus DSD Direct Stream Digital DST Direct Stream Transfer DTS-HD Digital Theater Systems High-Definition DVD Digital Versatile Disc DVI Digital Video Interface EDID Extended Display Identification Data HBM Human Body Model HBR High Bit Rate HDCP High-bandwidth Digital Content Protection HDMI High-Definition Multimedia Interface HDTV High-Definition TeleVision L-PCM Linear-Pulse Code Modulation LSB Least Significant Bit LV-TTL Low Voltage Transistor-Transistor Logic All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 33 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing Table 20. Abbreviations …continued Acronym Description OBA One Bit Audio OTP One Time Programmable PAL Phase-Alternation Line PLL Phase-Locked Loop RGB Red Green Blue SACD Super Audio CD SVGA Super Video Graphics Array SXGA Super eXtended Graphics Array S/PDIF Sony/Philips Digital Interface Format UXGA Ultra eXtended Graphics Array VGA Video Graphics Array WUXGA Wide Ultra eXtended Graphics Array XGA eXtended Graphics Array YCbCr Y = Luminance, Cb = Chroma blue, Cr = Chroma red YUV Y = Luminance, UV= Chroma 19. Revision history Table 21. Revision history Document ID Release date Data sheet status Change notice Supersedes TDA19978A_3 20100416 Product data sheet - TDA19978A_2 Modifications: • Section 1 “General description”: replaced 2.25 gigasamples per second by 2.05 gigasamples per second • • • • • • Section 1 “General description”: updated the Deep Color mode in 12-bit Section 2 “Features and benefits”: replaced 235 MHz by 205 MHz Table 1 “Quick reference data”: updated Section 8.5 “Activity detection”: replaced 235 MHz by 205 MHz Table 10 “Characteristics”: updated Table 17 “Example of supported video formats”: updated TDA19978A_2 20080818 Objective data sheet - TDA19978A_1 TDA19978A_1 20080421 Objective data sheet - - TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 34 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 20. Legal information 20.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 20.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 20.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or TDA19978A_3 Product data sheet malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 35 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 20.4 Licenses Purchase of NXP ICs with HDMI technology Use of an NXP IC with HDMI technology in equipment that complies with the HDMI standard requires a license from HDMI Licensing LLC, 1060 E. Arques Avenue Suite 100, Sunnyvale CA 94085, USA, e-mail: [email protected]. 20.5 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 21. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 36 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 22. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Quick reference data . . . . . . . . . . . . . . . . . . . . .3 Ordering information . . . . . . . . . . . . . . . . . . . . .3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .5 Audio port configuration (Layout 0) . . . . . . . . .12 Audio port configuration (Layout 1) . . . . . . . . .12 Audio port configuration for HBR and DST packets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Table 7. I2C-bus slave address . . . . . . . . . . . . . . . . . . .16 Table 8. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .17 Table 9. Thermal characteristics . . . . . . . . . . . . . . . . . .17 Table 10. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .17 Table 11. Output in 12-bit video port format (mapping example 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Table 12. Output in 12-bit video port format (mapping example 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 13. Output in 10-bit video port format (mapping example 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 14. Output in 10-bit video port format (mapping example 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 15. Output in 8-bit video port format (mapping example 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 16. Output in 8-bit video port format (mapping example 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 17. Example of supported video formats . . . . . . . 27 Table 18. SnPb eutectic process (from J-STD-020C) . . . 32 Table 19. Lead-free process (from J-STD-020C) . . . . . . 32 Table 20. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 33 Table 21. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 34 23. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Pin configuration (HLQFP144). . . . . . . . . . . . . . . .5 An example of an application with EDID memory shared over all four HDMI inputs . . . . . .15 An example of an application with EDID shared over three HDMI inputs . . . . . . . . . . . . . .16 Output timing diagram pin VCLK on pins VP[29:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Output timing diagram pin ACLK on pins AP[5:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Application diagram . . . . . . . . . . . . . . . . . . . . . . .29 Package outline SOT612-3 (HLQFP144) . . . . . .30 Temperature profiles for large and small components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 TDA19978A_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 16 April 2010 © NXP B.V. 2010. All rights reserved. 37 of 38 TDA19978A NXP Semiconductors Quad HDMI 1.3a receiver with digital processing 24. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.11 8.12 8.13 8.14 8.15 8.16 8.17 8.18 8.19 8.20 8.21 8.22 8.23 8.24 8.25 8.25.1 8.25.2 9 10 11 12 13 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 9 Software Drivers . . . . . . . . . . . . . . . . . . . . . . . . 9 HDMI inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Termination resistance control . . . . . . . . . . . . . 9 Equalizer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Activity detection. . . . . . . . . . . . . . . . . . . . . . . 10 High-bandwidth digital content protection. . . . 10 Color depth unpacking . . . . . . . . . . . . . . . . . . 10 Derepeater . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Upsample . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Packet extraction . . . . . . . . . . . . . . . . . . . . . . 11 Audio PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Audio formatter . . . . . . . . . . . . . . . . . . . . . . . . 11 Sync timing measurement . . . . . . . . . . . . . . . 13 Format measurement timing. . . . . . . . . . . . . . 13 Color space conversion . . . . . . . . . . . . . . . . . 13 4:2:2 downsampling filters . . . . . . . . . . . . . . . 13 Range control . . . . . . . . . . . . . . . . . . . . . . . . . 13 Dithering function . . . . . . . . . . . . . . . . . . . . . . 13 4:2:2 formatter . . . . . . . . . . . . . . . . . . . . . . . . 14 Video port selection . . . . . . . . . . . . . . . . . . . . 14 Output buffers . . . . . . . . . . . . . . . . . . . . . . . . . 14 VHREF timing generator . . . . . . . . . . . . . . . . 14 I2C-bus serial interface . . . . . . . . . . . . . . . . . . 14 Power management . . . . . . . . . . . . . . . . . . . . 15 EDID memory management . . . . . . . . . . . . . . 15 EDID memory shared over all four HDMI inputs . . . . . . . . . . . . . . . . . . . . . . . . . . 15 EDID memory shared over three HDMI inputs . . . . . . . . . . . . . . . . . . . . . . . . . . 16 I2C-bus protocol. . . . . . . . . . . . . . . . . . . . . . . . 16 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 Thermal characteristics . . . . . . . . . . . . . . . . . 17 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 17 Output video port formats (mapping examples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 14 15 16 17 17.1 17.2 17.3 17.4 18 19 20 20.1 20.2 20.3 20.4 20.5 21 22 23 24 Example of supported video formats . . . . . . Application information . . . . . . . . . . . . . . . . . Package outline. . . . . . . . . . . . . . . . . . . . . . . . Soldering of SMD packages . . . . . . . . . . . . . . Introduction to soldering. . . . . . . . . . . . . . . . . Wave and reflow soldering. . . . . . . . . . . . . . . Wave soldering . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Licenses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 29 30 31 31 31 31 32 33 34 35 35 35 35 36 36 36 37 37 38 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 16 April 2010 Document identifier: TDA19978A_3