PHILIPS TDA4863J

INTEGRATED CIRCUITS
DATA SHEET
TDA4863J; TDA4863AJ
Vertical deflection booster
Product specification
File under Integrated Circuits, IC02
2000 Aug 17
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
FEATURES
GENERAL DESCRIPTION
• Power amplifier with differential inputs
The TDA4863J and TDA4863AJ are deflection boosters
for use in vertical deflection systems for frame frequencies
up to 200 Hz.
• Output current up to 3 A (p-p)
• High vertical deflection frequency up to 200 Hz
The TDA4863J needs a separate flyback supply voltage,
so the supply voltages are independently adjustable to
optimize power consumption and flyback time.
• High linear sawtooth signal amplification
• Flyback generator:
– TDA4863J: separate adjustable flyback supply
voltage up to 60 V
For the TDA4863AJ the flyback supply voltage will be
generated internally by doubling the supply voltage and
therefore a separate flyback supply voltage is not needed.
– TDA4863AJ: internally doubled supply voltage
(two supply voltages only for DC-coupled outputs).
Both circuits provide differential input stages and fit well
with the TDA485X monitor deflection controller family.
QUICK REFERENCE DATA
Measurements referenced to ground (pin GND).
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP1
supply voltage 1 (pin 1)
9
−
30
V
VP2
supply voltage 2 for vertical output
(pin 3)
VP1 − 1
−
60
V
VFB
flyback supply voltage of TDA4863J
(pin 2)
VP1 − 1
−
60
V
VP3
flyback generator output voltage of
TDA4863AJ (pin 2)
0
−
VP1 + 2.2 V
I5(p-p)
vertical output current (pin 5)
(peak-to-peak value)
−
−
3
A
IP1
supply current 1 (pin 1)
during scan
−
6
10
mA
IP2
quiescent supply current 2 (pin 3)
I5 = 0
−
25
60
mA
VINP
input voltage (pin 7)
1.6
−
VP1 − 0.5 V
VINN
input voltage (pin 6)
1.6
−
VP1 − 0.5 V
Tamb
ambient temperature
−20
−
+75
I5 = −1.5 A
°C
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TDA4863J
DBS7P
DESCRIPTION
TDA4863AJ
plastic DIL-bent-SIL power package; 7 leads
(lead length 12/11 mm); exposed die pad
2000 Aug 17
2
VERSION
SOT524-1
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
BLOCK DIAGRAM
handbook, full pagewidth
THERMAL
PROTECTION
DIFFERENTIAL
INPUT
STAGE
TDA4863J
VERTICAL
OUTPUT
FLYBACK
GENERATOR
REFERENCE
CIRCUIT
7
6
5
4
3
2
1
INP
INN
V-OUT
GND
VP2
VFB
VP1
D1
RS1 CS1
C1
RP
R3
C4
C2
deflection
coil
R4
from TDA485X
R2
R1
VN
Fig.1 Block diagram of TDA4863J.
2000 Aug 17
3
VF
VP
MHB714
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
handbook, full pagewidth
THERMAL
PROTECTION
DIFFERENTIAL
INPUT
STAGE
TDA4863AJ
FLYBACK
GENERATOR
VERTICAL
OUTPUT
7
6
5
INP
INN
V-OUT
4
3
GND
VP2
REFERENCE
CIRCUIT
2
1
VP3
VP1
CF
RS1 CS1
D1
RP
R3
deflection
coil
C1
R6
from TDA485X
R2
R1
VN
Fig.2 Block diagram of TDA4863AJ.
2000 Aug 17
C2
R5
4
VP
MHB715
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
PINNING
PIN
SYMBOL
DESCRIPTION
TDA4863J
TDA4863AJ
VP1
1
1
VFB
2
−
flyback supply voltage
VP3
−
2
flyback generator output
VP2
3
3
supply voltage 2 for vertical output
GND
4
4
ground or negative supply voltage
V-OUT
5
5
vertical output
INN
6
6
inverted input of differential input stage
INP
7
7
non-inverted input of differential input stage
positive supply voltage 1
handbook, halfpage
handbook, halfpage
VP1
1
VP1
1
VFB
2
VP3
2
VP2
3
VP2
3
GND
4
GND
4
V-OUT
5
V-OUT
5
INN
6
INN
6
INP
7
INP
7
TDA4863J
MHB716
MHB717
Fig.3 Pin configuration of TDA4863J.
2000 Aug 17
TDA4863AJ
Fig.4 Pin configuration of TDA4863AJ.
5
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
FUNCTIONAL DESCRIPTION
Flyback generator
Both the TDA4863J and TDA4863AJ consist of a
differential input stage, a vertical output stage, a flyback
generator, a reference circuit and a thermal protection
circuit.
The flyback generator supplies the vertical output stage
during flyback.
The TDA4863J is used with separate flyback supply
voltage to achieve a short flyback time with minimized
power dissipation.
The TDA4863J operates with a separate flyback supply
voltage (see Fig.1) while the TDA4863AJ generates the
flyback voltage internally by doubling the supply voltage
(see Fig.2).
The TDA4863AJ needs a capacitor CF between
pins 2 and 3 (see Fig.2). Capacitor CF is charged during
scan, using the external diode D1 and resistor R5. During
flyback the cathode of capacitor CF is connected to the
positive supply voltage and the flyback voltage is then
twice the supply voltage. For the TDA4863AJ the
resistor R6 in the positive supply line can be used to
reduce the power consumption.
Differential input stage
The differential sawtooth input signal (e.g. coming from the
deflection controller family TDA485X) is connected to the
inputs (inverted signal to pin 6 and non-inverted signal to
pin 7). The vertical feedback signal is superimposed on
the inverted signal on pin 6.
In parallel with the deflection coil a damping resistor RP
and an RC combination (RS1 = 5.6 Ω and CS1 = 100 nF)
are needed. Furthermore, another additional
RC combination (RS2 = 5.6 Ω and CS2 = 47 to 150 nF)
can be used to minimize the noise effect and the flyback
time (see Figs 9 and 10).
Vertical output and thermal protection
The vertical output stage is a quasi-complementary
class-B amplifier with a high linearity.
The output stage is protected against thermal overshoots.
For a junction temperature Tj > 150 °C this protection will
be activated and will reduce then the deflection current (I5).
2000 Aug 17
6
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages referenced to ground (pin 4); unless
otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP1
supply voltage 1 (pin 1)
−
40
V
VP2
supply voltage 2 (pin 3)
−
60
V
VFB
flyback supply voltage of TDA4863J (pin 2)
−
60
V
VP3
flyback generator output voltage of TDA4863AJ (pin 2)
0
VP1 + 3
V
Vi(6,7)
input voltage on pins 6 and 7
−
VP1
V
Vo(5)
output voltage on pin 5
−
62
V
IP2
supply current 2 (pin 3)
−
±1.8
A
Io(5)
output current (pin 5)
−
±1.8
A
I2
flyback current on pin 2
−
±1.8
A
Tstg
storage temperature
−25
+150
°C
Tamb
ambient temperature
−20
+75
°C
Tj
junction temperature
note 1
−
150
°C
Ves
electrostatic discharge voltage on all pins
note 2
−300
+300
V
note 1
Notes
1. Internally limited by thermal protection; will be activated for Tj ≥ 150 °C.
2. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-mb)
PARAMETER
CONDITIONS
thermal resistance from junction to mounting base
note 1
VALUE
UNIT
6
K/W
Note
1. To minimize the thermal resistance from mounting base to heatsink [Rth(mb-h)] follow the recommended mounting
instruction: screw mounting preferred; torque = 40 Ncm; use heatsink compound; isolation plate increases Rth(mb-h).
2000 Aug 17
7
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
CHARACTERISTICS
VP1 = 25 V; V4 = 0 V; Tamb = 25 °C; voltages referenced to ground (pin 4); unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VP1
supply voltage 1 (pin 1)
9
−
30
V
VP2
supply voltage 2 (pin 3)
VP1 − 1
−
60
V
VFB
flyback supply voltage of TDA4863J
(pin 2)
VP1 − 1
−
60
V
VP3
flyback generator output voltage of
TDA4863AJ (pin 2)
I5 = −1.5 A
0
−
VP1 + 2.2 V
IP1
supply current 1 (pin 1)
during scan
−
6
10
mA
IP2
quiescent supply current 2 (pin 3)
I5 = 0
−
25
60
mA
Differential input stage
VINP
input voltage (pin 7)
1.6
−
VP1 − 0.5 V
VINN
input voltage (pin 6)
1.6
−
VP1 − 0.5 V
IINP
input quiescent current (pin 7)
−
−100
−500
nA
IINN
input quiescent current (pin 6)
−
−100
−500
nA
−
−
±1.5
A
Flyback generator
I2
current during flyback
V3-2
voltage drop during flyback of
TDA4863J
V2-1
reverse
I5 = −1 A
−
−1.5
−
V
I5 = −1.5 A
−
−2
−
V
forward
I5 = 1 A
−
2.2
−
V
I5 = 1.5 A
−
2.5
−
V
I5 = −1 A
−
−1.5
−
V
I5 = −1.5 A
−
−2
−
V
I5 = 1 A
−
2.2
−
V
I5 = 1.5 A
−
2.5
−
V
voltage drop during flyback of
TDA4863AJ
reverse
forward
Vertical output stage; see Fig.5
I5
vertical deflection output current
−
−
±1.5
A
I5(p-p)
vertical deflection output current on
pin 5 (peak-to-peak value)
−
−
3
A
V5-4
output saturation voltage to ground
I5 = 1 A
−
1.4
1.7
V
I5 = 1.5 A
−
1.8
2.3
V
V5-3
output saturation voltage to VP2
I5 = 1 A
−2.3
−2
−
V
I5 = 1.5 A
−2.8
−2.3
−
V
note 1
−
−
1
%
LIN
non-linearity of output signal
Note
1. Deviation of the output slope at a constant input slope.
2000 Aug 17
8
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
handbook, full pagewidth
input signal
on pin INN
t
input signal
on pin INP
t
VFB(1)
output voltage
on pin V-OUT V
P1
GND
t
deflection current
through the coil
t
MHB718
(1) VFB for TDA4863J; 2VP1 for TDA4863AJ.
Fig.5 Timing diagram.
2000 Aug 17
9
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
INTERNAL PIN CONFIGURATION
handbook, full pagewidth
INP
INN
7
6
V-OUT GND
5
VP2
VFB
VP1
3
2
1
4
TDA4863J
MHB719
Fig.6 Internal circuits of TDA4863J.
handbook, full pagewidth
INP
INN
7
6
V-OUT GND
5
VP2
VP3
VP1
3
2
1
4
TDA4863AJ
MHB720
Fig.7 Internal circuits of TDA4863AJ.
2000 Aug 17
10
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
APPLICATION INFORMATION
VF
handbook, full pagewidth
VP
2
> 1 kΩ
1N4448
TDA4863J
2.2 Ω
5
guard output
HIGH = error
3.3 kΩ
BC548
BC556
22 µF
220 kΩ
vertical
output
signal
MHB721
Fig.8 Application circuit with TDA4863J for external guard signal generation.
handbook, full pagewidth
THERMAL
PROTECTION
DIFFERENTIAL
INPUT
STAGE
TDA4863J
VERTICAL
OUTPUT
FLYBACK
GENERATOR
REFERENCE
CIRCUIT
7
6
5
4
3
2
INP
INN
V-OUT
GND
VP2
VFB
1
RS1 CS1
(1)
CS2
R3
RS2
5.6 Ω
RP
270 Ω
5.6 Ω 100
nF
deflection
coil
1.8 kΩ
from TDA485X
R2
R1
1Ω
(1 W)
BYV27
470 µF
470 µF
470 µF
VN
−8 V
4.3 Ω
VF
+50 V
VP
+9 V
MHB722
1.8 kΩ
Attention: the heatsink of the IC must be isolated against ground of the application (it is connected to pin 4).
(1) With CS2 (typical value between 47 and 150 nF) the flyback time and the noise behaviour can be optimized.
Fig.9 Application circuit with TDA4863J.
2000 Aug 17
VP1
D1
11
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
handbook, full pagewidth
THERMAL
PROTECTION
DIFFERENTIAL
INPUT
STAGE
TDA4863AJ
VERTICAL
OUTPUT
FLYBACK
GENERATOR
REFERENCE
CIRCUIT
7
6
5
4
3
2
1
INP
INN
V-OUT
GND
VP2
VP3
VP1
CS2(1)
R3
RS2
5.6 Ω
RP
270 Ω
RS1 CS1
CF
5.6 Ω 100
nF
100 µF
deflection
coil
1.8 kΩ
R1
1Ω
(1 W)
BYV27
470 µF
240 Ω (2 W)
470 µF
from TDA485X
R2
R5 (2)
D1
VN
−12.5 V
1.8 kΩ
3.9 Ω
(2 W)
R6 (3)
VP
+12.5 V
MHB723
Attention: the heatsink of the IC must be isolated against ground of the application (it is connected to pin 4).
(1) With CS2 (typical value between 47 and 150 nF) the flyback time and the noise behaviour can be optimized.
(2) With R5 capacitor CF will be charged during scan and the value (typical value between 150 and 270 Ω) depends on Idefl, tflb and CF.
(3) R6 reduces the power dissipation of the IC. The maximum possible value depends on the application.
Fig.10 Application circuit with TDA4863AJ.
2000 Aug 17
12
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
Example for both TDA4863J and TDA4863AJ
Calculation formulae for power consumption:
Table 1
P IC = P tot – P defl
Values given from application
SYMBOL
VALUE
UNIT
Idefl(max)
0.71
Ldeflcoil
6
mH
Rdeflcoil
6
Ω
RP
270
Ω
R1
1
Ω
R2
1.8
kΩ
1.8
kΩ
R3
(1)
I defl(max)
I defl(max)
P tot = ( V P1 – U D1 ) × ------------------- + V N × -------------------4
4
A
+ ( V P1 – V N ) × 0.01 A + 0.2 W
R deflcoil + R1 2
P defl = -------------------------------- × I defl(max)
3
where
VFB
50
V
PIC = power dissipation of the IC
Tamb
60
°C
Ptot = total power dissipation
Tdeflcoil
75
°C
Pdefl = power dissipation of the deflection coil.
Rth(j-mb)
6
K/W
Rth(mb-amb)
8
K/W
Calculation formulae for maximum required thermal
resistance for the heatsink at Tj(max) = 110 °C:
Note
1. For TDA4863J only.
T j(max) – T amb
R th(mb-amb) =  ----------------------------------- – R th(j-mb) = 19 K/W (max.)


P IC
Table 2
Table 3
Calculated values
VALUE
SYMBOL
UNIT
TDA4863J
TDA4863AJ
VP1
9
12.5
V
VN
−8
−12.5
V
Ptot
3.2
4.4
W
Pdefl
1.2
1.2
W
PIC
2
3.2
W
Rth(tot)
14
14
Tj(max)
88
105
tflb (µs)
VFB (V)
350
30
250
40
210
50
Table 4
tflb as a function of VP1 and VN for TDA4863AJ
tflb (µs)
VP1 (V)
VN (V)
PIC (W)
R6 (Ω)
K/W
360
10
−10
2.5
1
°C
290
12.5
−12.5
3.2
3.9
240
15
−15
3.9
6.8
VP1, VN and VFB are referenced to ground of application;
voltages are calculated with +10% tolerances.
Calculation formulae for supply voltages:
VP1 = −V5-3 + (R1 + Rdeflcoil) × Idefl(max) − U’L + UD1
VN = V5-4 + (R1 + Rdeflcoil) × Idefl(max) + U’L
where
U’L = Ldeflcoil × 2Idefl(max) × fv
fv = vertical deflection frequency
UD1 = forward voltage drop across D1.
2000 Aug 17
tflb as a function of VFB for TDA4863J
13
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
PACKAGE OUTLINE
DBS7P: plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad
SOT524-1
q1
non-concave
x
Eh
Dh
D
D1
view B: mounting base side
P
A2
k
q2
B
E
q
L2
L3
L1
L
1
7
Z
e1
e
Q
w M
bp
0
5
scale
DIMENSIONS (mm are the original dimensions)
UNIT A2(2) bp
mm
c
D(1) D1(2) Dh E(1) Eh
2.7 0.80 0.58 13.2 6.2
2.3 0.65 0.48 12.8 5.8
3.5
10 mm
v M
c
e2
m
e
e1
e2
L
L1
L2
L3
m
14.7
3.0 12.4 11.4 6.7
3.5 2.54 1.27 5.08
14.3
2.0 11.0 10.0 5.5
4.5
3.7
2.8
k
P
Q
q
q1
q2
3.4 1.15 17.5
4.85 3.8
3.1 0.85 16.3
3.6
v
0.8
w
x
0.3 0.02
Z(1)
2.92
2.37
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
98-11-12
00-07-03
SOT524-1
2000 Aug 17
EUROPEAN
PROJECTION
14
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
The total contact time of successive solder waves must not
exceed 5 seconds.
SOLDERING
Introduction to soldering through-hole mount
packages
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
DBS, DIP, HDIP, SDIP, SIL
WAVE
suitable(1)
suitable
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2000 Aug 17
15
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
DATA SHEET STATUS
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Aug 17
16
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
NOTES
2000 Aug 17
17
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
NOTES
2000 Aug 17
18
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
NOTES
2000 Aug 17
19
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Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 70
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753504/01/pp20
Date of release: 2000
Aug 17
Document order number:
9397 750 07125