INTEGRATED CIRCUITS DATA SHEET TDA8446 Fast RGB/YC switch for digital decoding Product specification Supersedes data of August 1992 File under Integrated Circuits, IC02 Philips Semiconductors 1995 Feb 16 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding TDA8446 FEATURES DESCRIPTION • R, G, B clamped inputs The TDA8446 is a video switch which has been designed for use in Digital Multistandard System Decoders (DMSD) in digital video system. The device is intended for matrixing incoming RGB signals and for switching between luminance signals. It generates a SYNC signal and TTL clamping pulses from any video signal with sync pulses. • Luminance and chrominance difference matrix • Y-clamped inputs • Fast switching between internal and external Y • Chrominance input • Amplifier with selectable gain • 3-state switch for chrominance output. APPLICATIONS • Digital TV systems • Desktop video architecture. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VCC supply voltage 10.8 − 13.2 V Tamb operating ambient temperature 0 − +70 °C ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA8446 DIP20 plastic dual in-line package; 20 leads; (300 mil) SOT146-1 TDA8446T SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 1995 Feb 16 2 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding BLOCK DIAGRAM Fig.1 Block diagram (TDA8446). 1995 Feb 16 3 TDA8446 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding TDA8446 PINNING PIN SYMBOL DESCRIPTION DIP20 SO28 SOUT 1 1 synchronization signal output; this output provides the synchronization information extracted from the incoming signal at pin 2 (SIN). SIN 2 2 synchronization signal input; CSYNC or CVBS signal from the peri-connector CCL 3 3 clamping capacitor connection; the clamping pulse is generated by external circuitry connected to this pin, the generated pulse clamps the RGB inputs. n.c. − 4 not connected CLO 4 5 clamping pulse output n.c. − 6 not connected BIN 5 7 B-signal input GIN 6 8 G-signal input RIN 7 9 R-signal input SW1 8 10 clamping control signal input; this TTL signal is used to select the clamp signal, a LOW level at this input forces the circuit to output the generated clamping pulse. n.c. − 11 not connected CLI 9 12 clamping pulse input; this TTL signal indicates the black level clamping period for the incoming Y signal (active-HIGH). CIN 10 13 chrominance signal input COUT 11 14 chrominance signal output YIN 12 15 luminance signal input; this input also accepts the CVBS signal FS 13 16 fast switching signal input; this signal is used to control fast switching of the luminance signals, a HIGH level at this input forces the circuit to output the internal Y signal. n.c. − 17 not connected n.c. − 18 not connected SW2 14 19 gain control signal input; this TTL signal is used to set the gain of the chrominance amplifiers (A), a LOW level at this input forces the gain A to 6 dB (HIGH forces to 0 dB). n.c. − 20 not connected −(R-Y) 15 21 −(R−Y) signal output YOUT 16 22 luminance signal output −(B−Y) 17 23 −(B−Y) signal output n.c. − 24 not connected n.c. − 25 not connected VCC 18 26 positive supply voltage (+12 V) VINT 19 27 internal decoupling VEE 20 28 ground 1995 Feb 16 4 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding Fig.2 Pin configuration (DIP20). 1995 Feb 16 TDA8446 Fig.3 Pin configuration (SO28). 5 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding TDA8446 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VCC supply voltage −0.3 +14 VI input voltage −0.3 +12.3 V Tstg storage temperature −55 +125 °C V HANDLING Each pin will withstand the ESD test in accordance with MIL-STD-883C class 2 (2000 V to 2999 V). Method 3015 (Human body model: R = 1500 Ω; C = 100 pF) 3 pulses positive and 3 pulses negative on each pin as a function of ground. The IC will withstand 500 V in accordance with UZW-BO/FQ-B302 (Machine model: R = 0 Ω; C = 200 pF; L = 2.5 µH) 3 pulses positive and 3 pulses negative. OPERATING CHARACTERISTICS SYMBOL PARAMETER MIN. TYP. MAX. UNIT Supply/temperature VCC supply voltage 10.8 − 13.2 V Tamb operating ambient temperature 0 − +70 °C TTL inputs (SW1, SW2 and CLI) VIH HIGH level input voltage 2 − VCC V VIL LOW level input voltage −0.3 − +0.8 V 0.2 − 2.5 V SYNC signal (SIN) VS(p-p) sync amplitude (peak-to-peak value) Fast Switching input (FS) VIH HIGH level input voltage 1 − 3 V VIL LOW level input voltage 0 − 0.4 V Video inputs (RIN, GIN, BIN, CIN, YIN) Vi(p-p) video amplitude on RIN, GIN and BIN inputs (peak-to-peak value) − 0.7 1 V CI input capacitance − 100 − nF Clamping pulse generator (CCL) Rclamp clamping resistance − 4.7 − kΩ Cclamp clamping capacitance − 1 − nF 1995 Feb 16 6 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding TDA8446 CHARACTERISTICS VCC = 12 V; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT − − 75 mA note 1 30 − − dB VCC = 6 V; VI = 0 V 0.3 − − mA Supply ICC supply current SVRR supply voltage rejection ratio Y and R, G, B channels ICL input clamping current II input current VI = 9 V −1.5 +0.5 +1.5 µA GA gain of amplifier A fi = 1 MHz; VSW2 = 2 V −1 0 +1 dB fi = 1 MHz; VSW2 = 0.8 V 5 6 7 dB fi = 1 MHz −1 0 +1 dB GB gain of amplifier B RGB matrixed according to the following equations: Y = 0.30R + 0.59G + 0.11B R−Y = 0.70R − 0.59G − 0.11B B−Y = −0.30R − 0.59G + 0.89B ∆Gdiff relative gain difference note 2 − 0 10 % |∆G| maximum gain variation 100 kHz < fi < 8 MHz − 3 − dB RO output resistance − 15 − Ω ∆t time difference at output fi = 1 MHz; note 3 − − 25 ns VO DC output level VCCL = 6 V − 4.2 − V tfsd fast switching delay see Fig.4 − 20 − ns tfs fast switching time see Fig.4 − 10 − ns IIFS input current on fast switching control (pin 13) VI = 0.4 V − 0.7 − µA VI = 1 V − 0.5 − µA − 50 − kΩ − 5 − V Chrominance channel (CIN, COUT) Ri internal input resistance VO DC output level II = 0 GA gain of amplifier A fi = 1 MHz; VSW1 = VSW2 = 2 V −1 0 +1 dB fi = 1 MHz; VSW2 = 0.8 V 5 6 7 dB 100 kHz < fi < 8 MHz − 3 − dB |∆G| maximum gain variation αoff isolation (off state) fi = 5 MHz; VSW1 = VSW2 = 0.8 V − 60 − dB Zo output impedance VSW1 = VSW2 = 0.8 V 100 − − kΩ Ro output resistance − 7 − Ω TTL inputs (SW1, SW2, CLI) IIH HIGH level input current VIH = 2 V − − 10 µA IIL LOW level input current VIL = 0.8 V − − −600 µA 1995 Feb 16 7 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding SYMBOL PARAMETER CONDITIONS TDA8446 MIN. TYP. MAX. UNIT Clamp output (CLO) VOL LOW level output voltage IOL = 2 mA − − 0.4 V VOH HIGH level output voltage IOH = 10 µA 2.4 − − V 0.2 − 1.5 V Synchronization channel (SOUT) Vo(p-p) output amplitude (peak-to-peak value) Notes V R ( CC ) 1. Supply voltage rejection ratio = 20log ------------------VR ( O) 2. The relative gain difference is measured when only one input signal (R, G or B) is present. 3. The inputs RIN, GIN and BIN are interconnected; ∆t is the maximum time coincidence error between the luminance and the chrominance signals. Fig.4 Fast switching times. 1995 Feb 16 8 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding APPLICATION INFORMATION Fig.5 Typical application circuit. 1995 Feb 16 9 TDA8446 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding TDA8446 PACKAGE OUTLINES DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D (1) e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 1995 Feb 16 REFERENCES IEC JEDEC EIAJ SC603 10 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding TDA8446 SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.050 0.42 0.39 0.055 0.043 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE 1995 Feb 16 EIAJ EUROPEAN PROJECTION ISSUE DATE 91-08-13 95-01-24 11 o 8 0o Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding TDA8446 A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. SOLDERING Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 °C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 °C. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 °C, it must not be in contact for more than 10 s; if between 300 and 400 °C, for not more than 5 s. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 °C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED SOLDER TOOL) Plastic small outline packages During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 °C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 °C. (Pulse-heated soldering is not recommended for SO packages.) Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 °C within 6 s. Typical dwell time is 4 s at 250 °C. For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.59+ BY WAVE 1995 Feb 16 12 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding TDA8446 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1995 Feb 16 13 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding NOTES 1995 Feb 16 14 TDA8446 Philips Semiconductors Product specification Fast RGB/YC switch for digital decoding NOTES 1995 Feb 16 15 TDA8446 Philips Semiconductors – a worldwide company Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SÃO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. 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(09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Philips Semiconductors Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546. Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc, 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366. Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494. Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. 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(02)92 0601 Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD38 © Philips Electronics N.V. 1994 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 533061/1500/01/pp16 Document order number: Date of release: 1995 Feb 16 9397 750 00009