PHILIPS TDA8735

INTEGRATED CIRCUITS
DATA SHEET
TDA8735
PLL frequency synthesizer
Product specification
Supersedes data of September 1994
File under Integrated Circuits, IC01
1998 Oct 23
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
FEATURES
• Complete 30 MHz single-chip tuning system
• Loop amplifier included
• 2-level current amplifier (charge pump) for adjusting the
loop gain
• A powerful digital memory phase detector
GENERAL DESCRIPTION
• Programmable reference frequencies of 1 kHz, 10 kHz
or 25 kHz
The TDA8735 is a single-chip PLL synthesizer designed
for satellite receivers. The device can be set to two
different addresses which can be used in applications
where independently tuned VCOs are required.
• I2C-bus interface
• Programmable address select input
• Software controlled switch output.
To adapt to different frequency accuracy, 3 reference
frequencies are selectable via the I2C-bus. The charge
pump current can be set to 2 values with a ratio of 1 : 100
via the I2C-bus.
APPLICATIONS
• Satellite sound receiver
A programmable switch (open-collector) is integrated to
enable mode or normal switching, or other types of
application.
• Radio receiver: LW, MW and SW.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCC1
supply voltage (pin 3)
4.5
5.0
5.5
V
VCC2
supply voltage (pin 16)
VCC1
8.5
12
V
ICC1
supply current (pin 3)
outputs unloaded
12
20
28
mA
ICC2
supply current (pin 16)
outputs unloaded
0.2
0.5
1
mA
fi(max)
maximum input frequency
30
−
−
MHz
fi(min)
minimum input frequency
−
−
512
kHz
Vi(rms)
input voltage (RMS value)
30
−
500
mV
Ptot
total power dissipation
−
0.14
−
W
Tamb
operating ambient temperature
−30
−
+85
°C
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8735
DIP16
plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
TDA8735T
SO16
plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
1998 Oct 23
2
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PRESCALER
3:4
DIGITAL
PHASE
DETECTOR
2
3−1
MULTIPLEXER
4-BIT
SWALLOW
COUNTER
3
VCC1
3
VEE
4
serial data
input (SDA)
10
serial clock
input (SCL)
11
address
select
input
12
POWER
SUPPLY
FREQUENCY
LATCHES
REFERENCE
COUNTER
REFERENCE
OSCILLATOR
SWITCH
PROGRAMMABLE
CURRENT
AMPLIFIER
1
reference
oscillator
input
reference
oscillator
output
16
VCC2
15
external loop
filter output
14
tuning voltage
amplifier input
Philips Semiconductors
6
13-BIT
PROGRAMMABLE
DIVIDER
PLL frequency synthesizer
prescaler
decoupling
unit
7
BLOCK DIAGRAM
ok, full pagewidth
1998 Oct 23
VCO
input
I2C-BUS
CONTROL
TDA8735
SWITCH
8
band switch
output
MGH651
Product specification
TDA8735
Fig.1 Block diagram.
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
PINNING
SYMBOL
PIN
DESCRIPTION
XTAL1
1
reference oscillator output
XTAL2
2
reference oscillator input
VCC1
3
supply voltage 1
XTAL1
1
16 VCC2
VEE
4
ground
XTAL2
2
15 LOOPO
n.c.
5
not connected
VCC1
3
14 LOOPI
DEC
6
prescaler decoupling
7
VCO input frequency
VEE
4
VCOFI
BS
8
band switch output
n.c.
5
12 AS
n.c.
9
not connected
DEC
6
11 SCL
SDA
10
serial data input (I2C-bus)
VCOFI
7
10 SDA
SCL
11
serial clock input (I2C-bus)
BS
8
9
AS
12
address select input (I2C-bus)
n.c.
13
not connected
LOOPI
14
tuning voltage amplifier input
LOOPO
15
external loop filter output
VCC2
16
supply voltage 2
handbook, halfpage
13 n.c.
TDA8735
n.c.
MGH650
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION
Controls
The TDA8735 contains the following parts and facilities:
The TDA8735 is controlled via the 2-wire I2C-bus. As slave
receiver for programming there is one module address, a
logic 0 (R/W bit), a subaddress byte and four data bytes.
The subaddress determines which one of the four data
bytes is transmitted first. The module address contains a
programmable address bit (D1) which with address select
input AS (pin 12) makes it possible to operate two
TDA8735 in one system.
• Input amplifier VCO signal
• A prescaler with the divisors 3 : 4 and a 2-bit
programmable swallow counter
• A 13-bit programmable counter
• A digital memory phase detector
• A reference frequency channel comprised of a 4 MHz
crystal oscillator followed by a reference counter; the
reference frequency can be 1, 10 or 25 kHz and is
applied to the digital memory phase detector
The auto increment facility of the I2C-bus allows
programming of the TDA8735 within one transmission
(address + subaddress + 4 data bytes).
• An I2C-bus interface with data latches and control logic;
the I2C-bus is intended for communication between
microcontrollers and different ICs or modules. Detailed
information on the I2C-bus specification is available on
request.
The TDA8735 can also be partially programmed.
Transmission must then be ended by a stop condition.
The bit organization of the 4 data bytes is illustrated in
Fig.3 and is described below.
• A software-controlled switch output
The divider number is defined by 15-bit words, bits
S0 to S14. To calculate the lock frequency, the divider
number has to be multiplied by the selected reference
frequency.
• A programmable current amplifier (charge pump) which
consists of a 5 and a 500 µA current source, this allows
adjustment of loop gain, thus providing high-current
high-speed tuning and low current-stable tuning.
The output at the loop amplifier can deliver a tuning
voltage of up to 10.5 V (VCC2 − 1.5 V).
1998 Oct 23
4
Philips Semiconductors
Product specification
PLL frequency synthesizer
Table 1
TDA8735
Divider number setting; note 1
ON
DIVIDER NUMBER SETTING
INPUT
0
(S0 + S1) × 21 to + S13 × 213 + S14 × 214
ON
Note
1. Where the minimum divider ratio is: 26 = 64 to 215 − 1 = 32761.
Table 2
Bit CP (used to control the charge pump;
DB0 : D0)
Table 4
Bit OPAMP (used to control the switch in the
tuning voltage amplifier output circuitry;
DB2 : D4)
CP
CURRENT
0
LOW
OPAMP
SWITCH
1
HIGH
1
on
0
off
Table 3
Bits REF1 and REF2 (used to set the reference
frequency applied to the phase detector;
DB2 : D7 and D6)
Table 5
Bit BS (used to control the open-collector switch
output; DB2 : D2)
REF1
REF2
FREQUENCY (kHz)
BS
SWITCH OUTPUT
0
0
1
1
sink current
0
1
10
0
floating
1
0
25
1
1
0
1998 Oct 23
The data byte DB3 must be set to 0 to 0. It is also used for
test purposes (see Fig.3).
5
Philips Semiconductors
Product specification
PLL frequency synthesizer
handbook, full pagewidth
START
condition
programmable address bit (D1)
acknowledge
R/W
MSB
MODULE
ADDRESS
BYTE
S
A7
TDA8735
A
SUBADDRESS A
BYTE
A0
STOP condition
LSB MSB
DATA BYTE 0
D7
A
LSB MSB
DATA BYTE 1
D0 D7
LSB MSB
DATA BYTE 2
A
D0 D7
1
1
0
0
0
1
1/0
0
A0
A7
0
SUBADDRESS
0
0
0
0
0
0/1
0/1
MSB
DATA BYTE 0 (DB0)
DATA BYTE 1 (DB1)
DATA BYTE 2 (DB2)
DATA BYTE 3 (DB3)
S6
LSB
S5
S4
S3
S2
S1
S0
CP
D7
D0
MSB
LSB
S14
S13
S12
S11
S10
S9
S8
S7
D7
D0
MSB
LSB
REF 1
REF 2
0
NOT
USED
1
BS
NU
NU
D7
D0
MSB
LSB
T1
T2
T3
NOT
USED
NOT
USED
NOT
USED
NOT
USED
NOT
USED
D0
D7
examples using auto-increment facility
S
ADDRESS
A
SUBADDRESS
02 A
DB2
A
DB3
A P
S
ADDRESS
A
SUBADDRESS
00 A
DB0
A
DB1
A P
S
ADDRESS
A
SUBADDRESS
03 A
DB3
A
DB0
A
DB1
A
DB2
A
P
MGL509
Fig.3 Bit organization.
1998 Oct 23
6
DATA BYTE 3
D0 D7
LSB
MSB
MODULE ADDRESS
A
LSB
D0
A P
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VCC1
supply voltage (pin 3)
−0.3
+5.5
V
VCC2
supply voltage (pin 16)
VCC1
12.5
V
Ptot
total power dissipation
−
0.85
W
Tamb
operating ambient temperature
−30
+85
°C
Tstg
storage temperature
−65
+150
°C
HANDLING
Every pin withstands the ESD test in accordance with “MIL-STD-883C category B” (2000 V).
CHARACTERISTICS
VCC1 = 5 V; VCC2 = 8.5 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VCC1
supply voltage (pin 3)
4.5
5.0
5.5
V
VCC2
supply voltage (pin 16)
VCC1
8.5
12
V
ICC1
supply current (pin 3)
no outputs loaded
12
20
28
mA
ICC2
supply current (pin 16)
no outputs loaded
0.2
0.5
1
mA
TDA8735T only
0.7
1
1.5
mA
I2C-bus inputs (SDA and SCL)
VIH
HIGH-level input voltage
3.0
−
5.0
V
VIL
LOW-level input voltage
−0.3
−
+1.5
V
IIH
HIGH-level input current
−
−
10
µA
IIL
LOW-level input current
−
−
10
µA
SDA output
LOW-level output voltage
open-collector;
IOL = 3.0 mA
−
−
0.4
V
VIH
HIGH-level input voltage
AS = C6
3.0
−
5.0
V
VIL
LOW-level input voltage
AS = C4
−0.3
−
+1.0
V
IIH
HIGH-level input current
−
−
10
µA
IIL
LOW-level input current
−
−
10
µA
fi(max)
maximum input frequency
30
−
−
MHz
fi(min)
minimum input frequency
−
−
512
kHz
Vi(rms)
input voltage (RMS value)
30
−
500
mV
Ri
input resistance
−
5.9
−
kΩ
Ci
input capacitance
−
2
−
pF
VOL
AS input
RF input
1998 Oct 23
measured in Fig.4
7
Philips Semiconductors
Product specification
PLL frequency synthesizer
SYMBOL
PARAMETER
TDA8735
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Oscillator (XTAL1 and XTAL2)
Rxtal
crystal resonance
resistance (4 MHz)
−
−
150
Ω
logic 0
3
5
7
µA
logic 1
400
500
600
µA
logic 0;
TDA8735T only
3
5
9
µA
see Fig.5
Programmable charge pump
ICHP
output current to loop filter
bit CP
Ripple rejection
RR
∆V CC1
20 log -----------------∆V O
fripple = 100 Hz
40
50
−
dB
∆V CC2
20 log -----------------∆V O
fripple = 100 Hz
40
50
−
dB
Band switch output (pin 8)
VOH
HIGH-level output voltage
−
−
12
V
VOL
LOW-level output voltage
IOL = 3 mA
−
−
0.8
V
ILO
output leakage current
VOH = 12 V
−
−
10
µA
Tuning voltage amplifier output (pin 15)
Vo(max)
maximum output voltage
Isource = 0.5 mA
VCC2 − 1.5 −
−
V
Vo(min)
minimum output voltage
Isink = 1 mA
−
−
0.8
V
Isource
maximum output source current
0.5
−
−
mA
Isink
maximum output sink current
1.0
−
−
mA
Zo(off)
impedance of switched off output
5
−
−
MΩ
Ibias
input bias current (absolute value)
−
1
5
nA
1998 Oct 23
8
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
VCC1
handbook, full pagewidth
3
50 Ω
coaxial
AM
sine wave
generator
HYBRID
JUNCTION
−3 dB
+
−
−3 dB
4
50 Ω
coaxial
V
TDA8735
R = 50 Ω
50 Ω
coaxial
10 nF
7
6
50 Ω
50 Ω
10 nF
MGL510
Fig.4 Prescaler input sensitivity (set-up measurement).
handbook, halfpage
1
2
4 MHz
TDA8735
27 pF
MGL511
Fig.5 Crystal connection (4 MHz).
1998 Oct 23
9
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
APPLICATION INFORMATION
handbook, full pagewidth
Ct
XTAL1
1
16
2
15
47 µF
C2
VCC2
+12 V
27 pF 4 MHz
XTAL2
LOOPO
R1
+5 V
VCC1
3
14
10 kΩ
LOOPI
C3
220 nF
C1
47 µF
VEE
4
n.c.
13
+5 V
TDA8735
5
n.c.
C5
3.9 nF
12
programmable address
J1: A1 = 1; Addr. = C6H
J2: A1 = 0; Addr. = C4H
AS J1
J2
CDEC
DEC
6
11
SCL
10 nF
I2C-BUS
VCO CAM VCOFI 7
input
22 nF
BS
band switch
output
10 kΩ
Rbs
8
10
9
SDA
n.c.
MGL512
+5 V
Loop filter depends on VCO parameters.
Fig.6 Application example.
1998 Oct 23
tuning
voltage
output
10
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
w M
(e 1)
b
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
2.2
inches
0.19
0.020
0.15
0.055
0.045
0.021
0.015
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT38-1
050G09
MO-001AE
1998 Oct 23
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-10-02
95-01-19
11
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
HE
y
v M A
Z
9
16
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.41
0.40
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT162-1
075E03
MS-013AA
1998 Oct 23
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
12
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1998 Oct 23
13
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1998 Oct 23
14
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
NOTES
1998 Oct 23
15
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Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/750/02/pp16
Date of release: 1998 Oct 23
Document order number:
9397 750 04641