INTEGRATED CIRCUITS DATA SHEET TDA8552T; TDA8552TS 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing Preliminary specification Supersedes data of 1998 Feb 26 File under Integrated Circuits, IC01 1998 Jun 02 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS FEATURES GENERAL DESCRIPTION • One pin digital volume control (for each channel) The TDA8552T is a two channel audio power amplifier that provides an output power of 2 × 1.4 W into an 8 Ω load using a 5 V power supply. The circuit contains two BTL power amplifiers, two digital volume controls and standby/mute logic. Volume and balance of the amplifiers are controlled using two digital input pins which can be driven by simple push-buttons or by a microcontroller. • Volume setting with up/down pulses • Auto repeat function on volume setting • Headphone sensing • Maximum gain set by selection pin • Low sensitivity for EMC radiation Using the selection pin (GAINSEL) the maximum gain can be set at 20 or 30 dB. The headphone sense input (HPS) can be used to detect if a headphone is plugged into the jack connector. If a headphone is plugged into the jack connector the amplifier switches from the BTL to the SE mode and the BTL loudspeakers are switched off. This also results in a reduction of quiescent current consumption. • Internal feedback resistors • Flexibility in use • Few external components • Low saturation voltage of output stage • Standby mode controlled by CMOS compatible levels • Low standby current • No switch-on/switch-off plops The TDA8552T is contained in a 20-pin small outline package. For the TDA8552TS, which is contained in a 20-pin very small outline package, the maximum output power is limited by the maximum allowed ambient temperature. More information can be found in Section “Thermal design considerations”. The SO20 package has the four corner leads connected to the die pad so that the thermal behaviour can be improved by the PCB layout. • High supply voltage ripple rejection • Protected against electrostatic discharge • Outputs short-circuit safe to ground, VDD and across the load • Thermally protected. APPLICATIONS • Portable consumer products • Notebook computers • Communication equipment. ORDERING INFORMATION TYPE NUMBER TDA8552T TDA8552TS 1998 Jun 02 PACKAGE NAME SO20 DESCRIPTION plastic small outline package; 20 leads; body width 7.5 mm SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm 2 VERSION SOT163-1 SOT266-1 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS QUICK REFERENCE DATA SYMBOL PARAMETER VDD supply voltage Iq quiescent supply current CONDITIONS MIN. TYP. MAX. UNIT 2.7 5 5.5 V BTL mode; VDD = 5 V − 14 20 mA BTL mode; VDD = 3.3 V − 10 15 mA SE mode; VDD = 5 V − 8.5 12 mA SE mode; VDD = 3.3 V − 5 8 mA − 1 10 µA Istb standby current Po output power THD = 10%; RL = 8 Ω; VDD = 5 V 1 1.4 − W Gv voltage gain low gain; maximum volume − 20 − dB low gain; minimum volume − −60 − dB high gain; maximum volume − 30 − dB high gain; minimum volume − −50 − dB − 64 − − 0.1 − % 50 − − dB Nstep number of volume steps THD total harmonic distortion SVRR supply voltage ripple rejection 1998 Jun 02 Po = 0.5 W 3 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS BLOCK DIAGRAM handbook, full pagewidth IN1 17 VDD1 VDD2 VDD3 VDD4 3 8 13 18 VOLUME CONTROL 20 kΩ 12 OUT1+ MASTER 0.5VDD 15 kΩ 20 dB 3.4 kΩ UP/DOWN COUNTER up UP/DOWN1 6 VDD 20 kΩ 1.6 kΩ down 0.5VDD INTERFACE 15 kΩ SVR 20 kΩ 30 dB 19 OUT1− SLAVE 0.5VDD 16 0.5VDD TDA8552T 15 kΩ IN2 15 VOLUME CONTROL 20 kΩ 2 OUT2+ MASTER 15 kΩ 0.5VDD 20 dB 3.4 kΩ UP/DOWN COUNTER up UP/DOWN2 7 VDD 20 kΩ 1.6 kΩ down INTERFACE 20 kΩ 30 dB 15 kΩ 0.5VDD 0.5VDD 9 OUT2− SLAVE 0.5VDD 15 kΩ MODE 5 HPS 4 GAIN SELECTION STANDBY/MUTE AND OPERATING 14 1, 10, 11, 20 GAINSEL GND1 to GND4 Fig.1 Block diagram. 1998 Jun 02 4 MGM608 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS PINNING PIN(1) DESCRIPTION GND1 1 ground 1, substrate/leadframe OUT2+ 2 positive loudspeaker terminal output channel 2 VDD1 3 supply voltage 1 HPS 4 digital input for headphone sensing MODE 5 digital trinary input for mode selection (standby, mute and operating) SYMBOL UP/DOWN1 6 handbook, halfpage digital trinary input for volume control channel 1 GND1 1 20 GND4 OUT2+ 2 19 OUT1− VDD1 3 18 VDD4 UP/DOWN2 7 digital trinary input for volume control channel 2 VDD2 8 supply voltage 2 UP/DOWN1 6 15 IN2 OUT2− 9 negative loudspeaker terminal output channel 2 UP/DOWN2 7 14 GAINSEL 17 IN1 HPS 4 16 SVR MODE 5 TDA8552T GND2 10 ground 2, substrate/leadframe VDD2 8 13 VDD3 GND3 11 ground 3, substrate/leadframe OUT2− 9 12 OUT1+ OUT1+ 12 positive loudspeaker terminal output channel 1 VDD3 13 supply voltage 3 GAINSEL 14 digital input for gain selection IN2 15 audio input channel 2 SVR 16 half supply voltage, decoupling ripple rejection IN1 17 audio input channel 1 VDD4 18 supply voltage 4 OUT1− 19 negative loudspeaker terminal output channel 1 GND4 20 ground 4, substrate/leadframe GND2 10 MGM610 Fig.2 Pin configuration. Note 1. For the SO20 (SOT163-1) package only: the ground pins 1, 10, 11 and 20 are mechanically connected to the leadframe and electrically to the substrate of the die. On the PCB the ground pins can be connected to a copper area to decrease the thermal resistance. 1998 Jun 02 11 GND3 5 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS FUNCTIONAL DESCRIPTION Volume control The TDA8552T is a 2 × 1.4 W BTL audio power amplifier capable of delivering 2 × 1.4 W output power into an 8 Ω load at THD = 10% using a 5 V power supply. The gain of the amplifier can be set by the digital volume control. The gain in the maximum volume setting is 20 dB (low gain) or 30 dB (high gain). This maximum gain can be selected by the gain selection pin. The headphone sense input (HPS) can be used to detect if a headphone is plugged into the jack connector. If a headphone is plugged into the jack connector the amplifier switches from the BTL to the SE mode and the BTL loudspeakers are switched off. This also results in a reduction of quiescent current consumption. Using the MODE pin the device can be switched to the standby condition, the mute condition or the normal operating condition. The device is protected by an internal thermal shutdown protection mechanism. Each attenuator is controlled with its own UP/DOWN pin (trinary input): • Floating UP/DOWN pin: volume remains unchanged • Negative pulses: decreasing volume • Positive pulses: increasing volume. Each pulse on the UP/DOWN pin results in a change in 80 gain of ------ = 1.25 dB (typical value). 64 In the basic application the UP/DOWN pin is switched to ground or VDD by a double push-button. When the supply voltage is initially connected, after a complete removal of the supply, the initial state of the volume control is an attenuation of 40 dB (low volume), so the gain of the total amplifier is −20 dB in the low gain setting or −10 dB in the high gain setting. After powering-up, some positive pulses have to be applied to the UP/DOWN pin for turning up to listening volume. Power amplifier The power amplifier is a Bridge-Tied Load (BTL) amplifier with a complementary CMOS output stage. The total voltage loss for both output power MOS transistors is within 1 V and with a 5 V supply and an 8 Ω loudspeaker an output power of 1.4 W can be delivered. The total gain of this power amplifier can be set at 20 or 30 dB by the gain selection pin. Auto repeat If the UP/DOWN pin is LOW or HIGH for the wait time (twait in seconds) (one of the keys is pressed) then the device starts making up or down pulses by itself with a frequency 1 given by -------- (repeat function). t rep Gain selection The gain selection can be used for a fixed gain setting, depending on the application. The gain selection pin must be hard wired to ground (20 dB) or to VDD (30 dB). Gain selecting during the operation is not advised, switching is not guaranteed plop free. The wait time and the repeat frequency are set using an internal RC oscillator with an accuracy of ±10%. Volume settings in standby mode When the device is switched with the MODE select pin to the mute or the standby condition, the volume control attenuation setting keeps its value, under the assumption that the voltage on the VDD pin does not fall below the minimum supply voltage. After switching the device back to the operation mode, the previous volume setting is maintained. In the standby mode the volume setting is maintained as long as the minimum supply voltage is available. The current consumption is very low, approximately 1 µA (typ.). In battery fed applications the volume setting can be maintained during battery exchange if there is a supply capacitor available. Input attenuator The volume control operates as a digitally controlled input attenuator between the audio input pin and the power amplifier. In the maximum volume control setting the attenuation is 0 dB and in the minimum volume control setting the typical attenuation is 80 dB. The attenuation can be set in 64 steps by the UP/DOWN pin. Both attenuators for channels 1 and 2 are separated from each other and are controlled by there own UP/DOWN pin. Balance control can be arranged by applying UP/DOWN pulses only on pins 6 and 7, see Fig.5. 1998 Jun 02 6 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing When no headphone is plugged in, the voltage level at the HPS pin will remain LOW. A voltage less than VDD − 1 V at the HPS pin will keep the device in the BTL mode, thus the loudspeakers can be operational. If the HPS pin is not connected then the device will remain in the BTL mode. Mode select pin The device is in the standby mode (with a very low current consumption) if the voltage at the MODE pin is between VDD and VDD − 0.5 V. At a mode select voltage level of less than 0.5 V the amplifier is fully operational. In the range between 1 V and VDD − 1 V the amplifier is in the mute condition. The mute condition is useful for using it as a ‘fast mute’, in this mode the output signal is suppressed, while the volume setting remains at its value. It is advised to keep the device in the mute condition while the input capacitor is being charged. This can be achieved by holding the MODE pin at a level of 0.5VDD, or by waiting approximately 100 ms before giving the first volume-UP pulses. When a headphone is plugged into the connector, the voltage at the HPS pin will be set to VDD. The device then switches to the Single-Ended (SE) mode, this means that the slave power amplifiers at the outputs OUT1− and OUT2− will be switched to the standby mode. This results in floating outputs OUT1− and OUT2−, the loudspeaker signal is thus attenuated by approximately 80 dB and only the headphone can operate. One of the benefits of this system is that the loudspeaker current does not flow through the jack connector switch, which could give some output power loss. The other benefit is that the quiescent current is reduced when the headphone jack is inserted. Headphone sense pin (HPS) A headphone can be connected to the amplifier by using a coupling capacitor for each channel. The common ground pin of the headphone is connected to the ground of the amplifier, see Fig.4. By using the HPS pin as illustrated in Fig.4, the TDA8552T detects if a headphone jack plug is inserted into the connector. 1998 Jun 02 TDA8552T; TDA8552TS 7 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDD supply voltage −0.3 +5.5 V Vi input voltage −0.3 VDD + 0.3 V IORM repetitive peak output current − 1 A Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −40 +85 °C Vsc AC and DC short-circuit safe voltage − 5.5 V Ptot maximum power dissipation SO20 − 2.2 W SSOP20 − 1.1 W operating THERMAL CHARACTERISTICS See Section “Thermal design considerations” in Chapter “Test and application information”. SYMBOL PARAMETER CONDITIONS VALUE UNIT 60 K/W extra copper 55 K/W in free air 110 K/W extra copper 80 K/W thermal resistance from junction to ambient Rth(j-a) for the TDA8552T (SO20) in free air for the TDA8552TS (SSOP20) Table 1 Power rating; note 1 MUSIC POWER VDD (V) RL (Ω) Po (W) THD = 10% Tamb(max) (°C) OPERATION Pmax (W) SO20 SSOP20 3.3 4 0.9 BTL 0.55 120 106 3.3 8 0.6 BTL 0.28 134 127 3.3 16 0.3 BTL 0.14 142 139 3.3 32SE 0.035 headphone 0.03 150 150 5.0 4 2.0 BTL 1.25 81 50 5.0 8 1.4 BTL 0.65 114 98 5.0 16 0.8 BTL 0.32 132 124 5.0 32SE 0.09 headphone 0.07 146 144 3.3 4 0.9 BTL 1.1 89 62 5 8 1.4 BTL 1.25 81 50 continuous sine wave Note 1. The power rating is based on Rth(j-a) with recommended copper pattern of at least 4 × 1 cm2 to the corner leads and copper under the IC package. 1998 Jun 02 8 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS QUALITY SPECIFICATION Quality specification in accordance with “SNW-FQ-611 part E”, if this type is used as an audio amplifier. DC CHARACTERISTICS VDD = 5 V; Tamb = 25 °C; RL = 8 Ω; VMODE = 0 V; total gain setting at 7 dB; according to Fig.4.; unless otherwise specified. SYMBOL PARAMETER VDD supply voltage IDD supply current CONDITIONS MIN. TYP. MAX. UNIT 2.7 5 5.5 V BTL mode; VDD = 5 V; RL = ∞; note 1 − 14 20 mA SE mode; VDD = 5 V − 8.5 12 mA BTL mode; VDD = 3.3 V; RL = ∞; note 1 − 10 15 mA SE mode; VDD = 3.3 V − 5 8 mA Istb standby current VMODE = VDD − 1 10 µA VO DC output voltage note 2 − 2.5 − V VOUT+ − VOUT− differential output offset voltage GAINSEL = 0 V − − 50 mV GAINSEL = VDD − − 150 mV VDD V Mode select pin VMODE input voltage standby VDD − 0.5 − mute 1 − VDD − 1.4 V operating 0 − 0.5 V IMODE input current 0 < VMODE < VDD − − 1 µA αmute mute attenuation note 3 80 tbf − dB low gain (20 dB) 0 − 0.6 V high gain (30 dB) 4.1 − VDD V − − 1 µA VDD − 1 − VDD V − − 1 µA Gain select pin VGAINSEL IGAINSEL input voltage input current Headphone sense pin VHPS input voltage IHPS input current 1998 Jun 02 SE mode; headphone detected 9 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing SYMBOL PARAMETER TDA8552T; TDA8552TS CONDITIONS MIN. TYP. MAX. UNIT Volume control tW pulse width 50 − − ns trep pulse repetition time 100 − − ns Vth(up) UP/DOWN pin UP threshold level 4.1 − VDD V Vfloat(max) UP/DOWN pin floating high level − − 3.4 V Vfloat(min) UP/DOWN pin floating low level 1.0 − − V Vth(down) UP/DOWN pin DOWN threshold level 0 − 0.6 V − − 200 µA − 500 − ms − 130 − ms low gain; maximum volume (including power amplifier) 19 20 21 dB low gain; minimum volume (including power amplifier) tbf −60 tbf dB high gain; maximum volume (including power amplifier) 29 30 31 dB high gain; minimum volume (including power amplifier) tbf −50 tbf dB Nstep number of gain steps − 64 − ∆Gv variation of gain per step − 1.25 − dB Zi input impedance 14 20 − kΩ Vi(max)(rms) maximum input voltage (RMS value) − − 1.75 V II(up/down) input current UP/DOWN pin twait auto repeat wait time trep repeat time 0 < VUP/DOWN < VDD key pressed Volume attenuator Gv(l) Gv(h) Notes 1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal DC output offset voltage to 2 × ---------------------------------------------------------------- RL 2. The DC output voltage with respect to ground is approximately 0.5VDD. 3. Output voltage in mute position is measured with an input of 1 V (RMS) in a bandwidth of 20 kHz, so including noise, gain select pin is LOW (0 V). 1998 Jun 02 10 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS AC CHARACTERISTICS (VDD = 3.3 V) Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; total gain setting at 7 dB; VMODE = 0 V; gain select pin is at 0 V (maximum gain = 20 dB); according to Fig.4. SYMBOL Po PARAMETER output power CONDITIONS MIN. TYP. MAX. UNIT THD = 10%; RL = 4 Ω − 0.9 − W THD = 10%; RL = 8 Ω − 0.6 − W THD = 10%; RL = 16 Ω − 0.3 − W THD = 0.5%; RL = 4 Ω − 0.6 − W THD = 0.5%; RL = 8 Ω − 0.4 − W THD = 0.5%; RL = 16 Ω − 0.2 − W THD total harmonic distortion Po = 0.1 W; note 1 − 0.1 − % Vo(n) noise output voltage note 2 − 60 − µV SVRR supply voltage ripple rejection note 3 tbf 55 − dB Vi(max) maximum input voltage THD = 1%; Gv = −50 to 0 dB − − 1.1 V αsup channel suppression VHPS = VDD; note 4 − 80 − dB αcs channel separation − 55 − dB Notes 1. Volume setting at maximum. 2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), Rsource = 0 Ω, gain select pin is LOW (0 V). 3. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 Ω at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V). 4. Channel suppression is measured at the output with a source impedance of Rsource = 0 Ω at the input and a frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 2 V (RMS). 1998 Jun 02 11 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS AC CHARACTERISTICS (VDD = 5 V) Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; total gain setting at 7 dB; VMODE = 0 V; Gain select pin is at 0 V (maximum gain = 20 dB); according to Fig.4; package is SO20. SYMBOL Po PARAMETER output power THD total harmonic distortion Vo(n) noise output voltage CONDITIONS MIN. TYP. MAX. UNIT THD = 10%; RL = 8 Ω 1.0 1.4 − W THD = 10%; RL = 16 Ω − 0.8 − W THD = 0.5%; RL = 8 Ω 0.6 1.0 − W THD = 0.5%; RL = 16 Ω − 0.6 − W Po = 0.1 W; note 1 − 0.15 0.4 % Po = 0.5 W; note 1 − 0.1 0.3 % GAINSEL. = 0 V; note 2 − 60 100 µV GAINSEL. = VDD; note 2 − 100 − µV SVRR supply voltage ripple rejection note 3 50 55 − dB Vi(max) a maximum input voltage THD = 1%; Gv = −50 to 0 dB − − 1.75 V αsup channel suppression VHPS = VDD; note 4 70 80 − dB αcs channel separation 50 − − dB Notes 1. Volume setting at maximum. 2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), Rsource = 0 Ω. 3. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 Ω at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V). 4. Channel suppression is measured at the output with a source impedance of Rsource = 0 Ω at the input and a frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 1 V (RMS). 1998 Jun 02 12 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS AC CHARACTERISTICS (FOR HEADPHONE; RL = 32 Ω; CONNECTED SE) VDD = 5 V; Tamb = 25 °C; f = 1 kHz; total gain setting at 20 dB; VMODE = 0 V; gain select pin is 0 V (maximum gain = 20 dB); according to Fig.4. SYMBOL PARAMETER CONDITIONS output power Po THD total harmonic distortion MIN. TYP. MAX. UNIT THD = 10%; VDD = 3.3 V − 35 − mW THD = 10%; VDD = 5.0 V − 90 − mW THD = 0.5%; VDD = 3.3 V − 25 − mW THD = 0.5%; VDD = 5.0 V − 60 − mW Po = 60 mW − 0.04 − % Vo(n) noise output voltage note 1 − 60 100 µV SVRR supply voltage ripple rejection note 2 50 55 − dB Vi(max) maximum input voltage THD = 1%; Gv = −50 to 0 dB − − 1.75 V αcs channel separation 50 − − dB Notes 1. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), Rsource = 0 Ω, gain select pin is LOW (0 V). 2. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 Ω at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V). handbook, full pagewidth tr trep tw VDD increasing volume Vth(UP) Vfloat(max) floating VUP/DOWN Vfloat(min) Vth(DOWN) decreasing volume 0 t tr trep tw MGM611 The rise time (tr) of the pulse may have any value. Fig.3 Timing UP/DOWN pin. 1998 Jun 02 13 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS TEST AND APPLICATION INFORMATION VDD = 5 V handbook, full pagewidth C1 IN1 17 330 nF VDD3, 4 13, 18 100 nF C3 C4 220 µF VOLUME CONTROL 20 kΩ VIN1 VDD1, 2 3, 8 C5 12 OUT1+ MASTER 220 µF 0.5VDD R1 1 kΩ 15 kΩ 20 dB up up volume control down 3.4 kΩ UP/DOWN COUNTER VDD R5 2.2 kΩ C7 UP/DOWN1 6 VDD C3 0.5VDD INTERFACE 19 OUT1− SLAVE 0.5VDD SVR 16 headphone jack tip 0.5VDD 220 µF C2 8Ω 20 kΩ 1.6 kΩ down 15 kΩ 100 nF 20 kΩ 30 dB 330 nF VOLUME CONTROL 20 kΩ VIN2 ring sleeve TDA8552T 15 kΩ IN2 15 C6 2 OUT2+ MASTER 220 µF R4 1 kΩ 15 kΩ 0.5VDD 20 dB 3.4 kΩ UP/DOWN COUNTER VDD 20 kΩ 30 dB up up volume control down R6 2.2 kΩ UP/DOWN2 7 1.6 kΩ down INTERFACE C8 100 nF 8Ω 20 kΩ VDD 15 kΩ 0.5VDD 0.5VDD 9 OUT2− SLAVE 0.5VDD 15 kΩ VDD standby mute MODE 5 operating HPS 4 GAIN SELECTION STANDBY/MUTE AND OPERATING 14 1, 10, 11, 20 GAINSEL GND1 to GND4 R3 100 kΩ VDD VDD R2 820 kΩ ground MGM609 Fig.4 Test and application diagram. 1998 Jun 02 14 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS Test conditions BTL application Tamb = 25°C if not specially mentioned; VDD = 5 V; f = 1 kHz, RL = 8 Ω, Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. The thermal resistance (in standard print, without extra copper) = 110 K/W for the SSOP20; the maximum sine wave power dissipation is: 150 – 25 ---------------------- = 1.14 W 110 The BTL application diagram is illustrated in Fig.4. The quiescent current has been measured without any load impedance. The total harmonic distortion as a function of frequency was measured with a low-pass filter of 80 kHz. The value of capacitor C3 influences the behaviour of the SVRR at low frequencies, increasing the value of C3 increases the performance of the SVRR. For Tamb = 60 °C the maximum total power dissipation is: Headphone application 150 – 60 ---------------------- = 0.82 W 110 Tamb = 25°C if not specially mentioned, VDD = 5 V, f = 1 kHz, RL = 32 Ω, Gv = 14 dB, audio band-pass 22 Hz to 22 kHz. Thermal design considerations For headphone application diagram see: Fig.4 The ‘measured’ thermal resistance of the IC package is highly dependent on the configuration and size of the application board. All surface mount packages rely on the traces of the PCB to conduct heat away from the package. To improve the heat flow, a significant area on the PCB must be attached to the (ground) pins. Data may not be comparable between different semiconductor manufacturers because the application boards and test methods are not (yet) standardized. Also, the thermal performance of packages for a specific application may be different than presented here, because the configuration of the application boards (copper area) may be different. Philips Semiconductors uses FR-4 type application boards with 1 oz copper traces with solder coating Solder Resist Mask (SRM). If a headphone is plugged into the headphone jack, the HPS pin will switch-off the outputs of the SLAVE output stage, this results in a mute attenuation >80 dB for the loudspeakers. In this condition the quiescent current will be reduced. General remarks Reduction of the value of capacitor C3 results in a decrease of the SVRR performance at low frequencies. The capacitor value of C5 and C6 in combination with the load impedance of the headphone determines the low frequency behaviour. To prevent against high output currents during inserting the headphone into the headphone jack, resistors of 5.1 Ω have to be connected in series with the SE output lines. The SSOP20 package has improved thermal conductivity which reduces the thermal resistance. Using a practical PCB layout (see Fig.18) with wider copper tracks to the corner pins and just under the IC, the thermal resistance from junction to ambient can be reduced to approximately 80 K/W. For Tamb = 60 °C the maximum total power The UP/DOWN pin can be driven by a 3-state logic output stage (microprocessor) without extra external components. If the UP/DOWN pin is driven by push-buttons, then it is advised to have an RC-filter between the buttons and the UP/DOWN pin. Advised values for the RC-filter are 2.2 kΩ and 100 nF. Resistor R4 is not necessary for basic operation, but is advised to keep C6 charged to a voltage of 0.5VDD This has the advantage that the plop noise when inserting the headphone plug is minimal. If the headphone sense function (HPS) is not used then the HPS-pin 4 should be hard-wired to ground. This pin should never be left unconnected. – 60 dissipation for this PCB layout is: 150 ---------------------- = 1.12 W 80 The thermal resistance for the SO20 is approximately 55 K/W if applied to a PCB with wider copper tracks to the corner pins and just under the body of the IC. The maximum total power dissipation for this practical application is: 150 – 60 ---------------------- = 1.63 W 55 1998 Jun 02 Using double push buttons, the volume step for both channels can be controlled. When for the balance control only a single contact is used, the balance steps are 1.25 dB. If double contacts are used for the balance buttons and the dashed connection is made, then the balance steps are 2.5 dB. 15 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS Application without volume control If pins 6, 7 and 8 are hardwired together the device operates with the volume control setting at maximum. When the supply voltage is connected and the device is switched from standby to mute or operating for the first time then the gain is ramped up from −20 dB to +20 dB. This takes approximately 5 s. This maximum gain setting is maintained until the supply voltage drops below the minimum value. balance left handbook, full pagewidth VDD up 2.2 kΩ VDD UP/DOWN1 6 100 nF TDA8552T volume 2.2 kΩ UP/DOWN2 7 100 nF down MGM612 VDD balance right Fig.5 Volume and balance control using buttons. 1998 Jun 02 16 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS MGR005 20 MGR006 40 handbook, halfpage handbook, halfpage G (dB) IDD (mA) 20 15 0 10 (1) −20 5 0 (2) −40 2 3 4 5 VDD (V) −60 6 0 20 40 60 volume steps 80 VDD = 5 V; RL = 8 Ω. (1) Gv = 30 dB (max.). (2) Gv = 20 dB (max.). RL = ∞. Fig.6 IDD as a function of VDD. Fig.7 Gain as a function of volume steps. MGR007 10 MGR008 10 handbook, halfpage handbook, halfpage THD (%) THD (%) 1 1 (1) (1) (2) (2) 10−1 10−2 10−2 (3) 10−1 (3) 10−1 1 Po (W) (4) 10−2 10−2 10 10−1 1 Po (W) VDD = 5 V; RL = 8 Ω; f = 1 kHz; Gv = 30 dB (max.). VDD = 5 V; RL = 8 Ω; f = 1 kHz; Gv = 20 dB (max.). (1) Gv = 0 dB. (2) Gv = 7 dB. (3) Gv = 20 dB. (1) (2) (3) (4) Fig.8 THD as a function of Po. 1998 Jun 02 Gv = 0 dB. Gv = 7 dB. Gv = 20 dB. Gv = 30 dB. Fig.9 THD as a function of Po. 17 10 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing MGR009 10 TDA8552T; TDA8552TS MGR010 10 handbook, halfpage handbook, halfpage THD (%) THD (%) (1) 1 (1) 1 (2) (2) 10−1 10−1 (3) (3) 10−2 10−2 10−1 1 Po (W) 10−2 10−2 10 VDD = 5 V; RL = 8 Ω; Gv = 20 dB (max.). (1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz. 10−1 1 Po (W) 10 VDD = 5 V; RL = 8 Ω; Gv = 30 dB (max.). (1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz. Fig.10 THD as a function of Po. Fig.11 THD as a function of Po. MGR011 10 MGR012 10 handbook, halfpage handbook, halfpage THD (%) THD (%) 1 1 (1) (1) (2) 10−1 (3) (2) 10−1 (3) 10−2 10 102 103 104 f (Hz) 10−2 10 105 VDD = 5 V; RL = 8 Ω; Po = 0.1 W; Gv = 20 dB (max.). (1) Gv = 0 dB. (2) Gv = 7 dB. (3) Gv = 20 dB. 103 104 f (Hz) 105 VDD = 5 V; RL = 8 Ω; Po = 0.1 W; Gv = 30 dB (max.). (1) Gv = 0 dB. (2) Gv = 7 dB. (3) Gv = 30 dB. Fig.12 THD as a function of frequency. 1998 Jun 02 102 Fig.13 THD as a function of frequency. 18 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing MGR013 0 MGR014 2.4 handbook, halfpage handbook, halfpage SVRR (dB) TDA8552T; TDA8552TS Vi (V) (1) (1) (2) 2 −20 (2) 1.6 (3) (4) −40 (5) 1.2 0.8 −60 (6) 0.4 −80 10 102 103 104 f (Hz) 0 −50 105 VDD = 5 V; RL = 8 Ω; Vref = 100 mV. (1) C3 = 10 µF; Gv = 20 dB. (2) C3 = 10 µF; Gv = 7 dB. (3) C3 = 100 µF; Gv = 20 dB. (4) C3 = 10 µF; Gv = 10 dB. (5) C3 = 100 µF; Gv = 7 dB. (6) C3 = 100 µF; Gv = 10 dB. −30 0 10 G (dB) Fig.15 Input voltage as a function of gain. MGL436 0 MGL435 0 handbook, halfpage handbook, halfpage αsup (dB) αcs (dB) −20 −20 −40 −40 −60 −60 (1) (2) (1) (2) −80 102 103 −80 104 −100 10 105 f (Hz) 102 103 104 105 f (Hz) VP = 5 V; Vo = 1 V; VHPS = VP. (1) Channel 1. (2) Channel 2. VP = 5 V; Vo = 1 V. (1) Gv = 30 dB. (2) Gv = 20 dB. Fig.16 Channel suppression as a function of frequency. Fig.17 Channel separation as a function of frequency. 1998 Jun 02 30 VDD = 5 V; RL = 8 Ω; f = 1 kHz; THD = 1%. (1) Gv = 20 dB (max.). (2) Gv = 30 dB (max.). Fig.14 SVRR as a function of frequency. −100 10 −10 19 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS 77 handbook, full pagewidth 79 top view bottom view +Vdd GND 220 µF 1.5 kΩ UP 100 nF IN1 820 kΩ MODE 100 kΩ 330 nF 20 1 150 nF 330 nF 220 µF 1.5 kΩ DOWN TDA8552/53TS IN2 20 dB 220 µF 30 dB 5Ω 1 kΩ TDA 8552/53TS 220 µF Analog Audio CIC – Nijmegen − OUT1 + HP 5Ω 1 kΩ − OUT2 + MGR015 Fig.18 Printed-circuit board layout. 1998 Jun 02 20 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1998 Jun 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 21 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 1.5 0.15 0 1.4 1.2 0.25 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-04-05 95-02-25 SOT266-1 1998 Jun 02 EUROPEAN PROJECTION 22 o Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS SOLDERING SSOP Introduction Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. If wave soldering cannot be avoided, the following conditions must be observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). • The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Reflow soldering Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. METHOD (SO AND SSOP) During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering SO Repairing soldered joints Wave soldering techniques can be used for all SO packages if the following conditions are observed: Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. 1998 Jun 02 23 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Jun 02 24 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing NOTES 1998 Jun 02 25 TDA8552T; TDA8552TS Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing NOTES 1998 Jun 02 26 TDA8552T; TDA8552TS Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing NOTES 1998 Jun 02 27 TDA8552T; TDA8552TS Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545102/1200/02/pp28 Date of release: 1998 Jun 02 Document order number: 9397 750 03733