PHILIPS TDA7056AT

INTEGRATED CIRCUITS
DATA SHEET
TDA7056AT
3 W mono BTL audio amplifier with
DC volume control
Product specification
File under Integrated Circuits, IC01
1998 Feb 23
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
FEATURES
GENERAL DESCRIPTION
• DC volume control
The TDA7056AT is a mono Bridge-Tied Load (BTL) output
amplifier with DC volume control. It is designed for use in
TVs and monitors, but is also suitable for battery-fed
portable recorders and radios. The device is contained in
a 20-lead small outline package.
• Few external components
• Mute mode
• Thermal protection
• Short-circuit proof
A Missing Current Limiter (MCL) is built in. The MCL circuit
is activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(300 mA typ.). This level of 100 mA allows for
Single-Ended (SE) headphone applications.
• No switch-on or switch-off clicks
• Good overall stability
• Low power consumption
• Low HF radiation
• ESD protected on all pins.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
supply voltage
4.5
−
18
V
Po
output power
VP = 12 V; RL = 16 Ω
3
3.5
−
W
Gv(max)
maximum total voltage gain
VP = 12 V; RL = 16 Ω
34.5
35.5
36.5
dB
∆Gv
voltage gain control range
75
80
−
dB
Iq(tot)
total quiescent current
VP = 12 V; RL = ∞
−
8
16
mA
THD
total harmonic distortion
Po = 0.5 W
−
0.3
1
%
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
DESCRIPTION
VERSION
TDA7056AT
SO20
plastic small outline package with 20 leads; body width 7.5 mm
SOT163-1
1998 Feb 23
2
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
BLOCK DIAGRAM
handbook, full pagewidth
positive input
DC volume control
VP
n.c.
1 to 3, 8 to 13,
16, 18 to 20
4
TDA7056AT
I + i
14
+
I − i
17
−
+
7
−
+
Vref
STABILIZER
TEMPERATURE
PROTECTION
6
15
MGM576
signal
ground
Fig.1 Block diagram.
1998 Feb 23
positive output
5
3
power
ground
negative output
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
PINNING
SYMBOL
PIN
DESCRIPTION
n.c.
1
not connected
n.c.
2
not connected
n.c.
3
not connected
VP
4
positive supply voltage
VI
5
positive input
GND1
6
VC
n.c.
handbook, halfpage
n.c. 1
20 n.c.
n.c. 2
19 n.c.
signal ground
n.c. 3
18 n.c.
7
DC volume control
VP 4
17 OUT−
8
not connected
VI 5
16 n.c.
TDA7056AT
n.c.
9
not connected
GND1 6
15 GND2
n.c.
10
not connected
VC 7
14 OUT+
n.c.
11
not connected
n.c. 8
13 n.c.
n.c.
12
not connected
n.c.
13
not connected
n.c. 9
12 n.c.
OUT+
14
positive output
n.c. 10
11 n.c.
GND2
15
power ground
n.c.
16
not connected
OUT−
17
negative output
n.c.
18
not connected
n.c.
19
not connected
n.c.
20
not connected
1998 Feb 23
MGM577
Fig.2 Pin configuration.
4
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
The maximum gain of the amplifier is fixed at 35.5 dB.
The DC volume control stage has a logarithmic control
characteristic.
FUNCTIONAL DESCRIPTION
The TDA7056AT is a mono BTL output amplifier with DC
volume control. It is designed for use in TVs and monitors
but is also suitable for battery-fed portable recorders and
radios.
The total gain can be controlled from +35.5 to −44 dB.
If the DC volume control voltage is below 0.3 V, the device
switches to the mute mode.
In conventional DC volume circuits the control or input
stage is AC-coupled to the output stage via external
capacitors to keep the offset voltage low. In the
TDA7056AT the DC volume control stage is integrated into
the input stage so that no coupling capacitors are required.
With this configuration, a low offset voltage is still
maintained and the minimum supply voltage remains low.
The amplifier is short-circuit proof to ground, VP and
across the load. A thermal protection circuit is also
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, thereby reducing the
output power. Special attention is given to switch-on and
switch-off clicks, low HF radiation and a good overall
stability.
The BTL principle offers the following advantages:
• Lower peak value of the supply current
Power dissipation
• The frequency of the ripple on the supply voltage is twice
the signal frequency.
Assume VP = 12 V; RL = 16 Ω.
The maximum sine wave dissipation is 1.8 W.
Consequently, a reduced power supply with smaller
capacitors can be used which also results in cost
reductions. For portable applications there is a trend to
decrease the supply voltage, resulting in a reduction of
output power at conventional output stages. Using the BTL
principle increases the output power.
The Rth vj-a of the package is 60 K/W.
Therefore Tamb(max) = 150 − 60 × 1.8 = 42 °C.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage
−
18
V
V5, 7
input voltage pins 5 and 7
−
5
V
IORM
repetitive peak output current
−
1.25
A
IOSM
non-repetitive peak output current
−
1.5
A
Ptot
total power dissipation
−
1.5
W
Tamb
operating ambient temperature
−40
+85
°C
Tstg
storage temperature
−55
+150
°C
Tvj
virtual junction temperature
−
150
°C
tsc
short-circuit time
−
1
h
Tcase < 60 °C
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
1998 Feb 23
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
5
in free air
VALUE
UNIT
60
K/W
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
CHARACTERISTICS
VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 Ω; Tamb = 25 °C; unless otherwise specified (see Fig.14).
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
supply voltage
Iq(tot)
total quiescent current
RL = ∞; note 1
4.5
−
18
V
−
8
16
mA
Maximum gain (V7 = 1.4 V)
Po
output power
THD = 10%; RL = 16 Ω
3
3.5
−
W
THD
total harmonic distortion
Po = 0.5 W
−
0.3
1
%
Gv(max)
maximum total voltage gain
34.5
35.5
36.5
dB
Vi(rms)
input signal handling (RMS value)
0.5
0.65
−
V
VVC = 0.8 V; THD < 1%
Vn(o)(rms)
noise output voltage (RMS value)
f = 500 kHz; note 2
−
210
−
µV
B
bandwidth
at −1 dB
−
0.02 to 300
−
kHz
SVRR
supply voltage ripple rejection
note 3
38
46
−
dB
∆VOS
DC output offset voltage
V17 − v14
−
0
150
mV
Zi
input impedance (pin 3)
15
20
25
kΩ
−
−44
−
dB
note 4
−
20
30
µV
VVC ≤ 0.3 V;
VI = 600 mV; note 4
−
35
45
µV
75
80
−
dB
60
70
80
µA
Minimum gain (V7 = 0.5 V)
Gv
voltage gain
Vo(n)(rms)
noise output voltage (RMS value)
Mute position
Vo(mute)
output voltage in mute position
DC volume control
∆Gv
voltage gain control range
IVC
control current
VVC = 0 V
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (Vn(o)(rms)) at f = 500 kHz, is measured with Rs = 0 Ω and B = 5 kHz.
3. The ripple rejection is measured with Rs = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage (Vripple = 200 mV RMS)
is applied to the positive supply rail.
4. The noise output voltage (Vn(o)(rms)) is measured with Rs = 5 kΩ unweighted.
1998 Feb 23
6
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
MGM578
20
MGM579
12
THD
(%)
10
handbook, halfpage
handbook, halfpage
Iq
(mA)
16
8
12
6
8
4
4
2
(1)
0
0
4
8
12
16
0
10−1
20
VP (V)
V5 = 1.4 V; no load.
Fig.3
1
10
Po (W)
VDC = 1.4 V.
(1) VP = 12 V; RL = 16 Ω.
Quiescent current as a function of the
supply voltage.
Fig.4 THD as a function of output power.
MGM580
8
MGM581
100
handbook, halfpage
handbook, halfpage
RR
(dB)
THD
(%)
80
6
(1)
60
(2)
4
40
(3)
2
20
(1)
0
10
102
103
104
f (Hz)
0
10
105
103
104
f (Hz)
105
VP = 12 V; RL = 16 Ω; Vr = 200 mV.
(1) V7 = 0.3 V; Rs = 5 kΩ.
(2) V7 = 1.4 V; Rs = 0 Ω.
(3) V7 = 1.4 V; Rs = 5 kΩ.
VP = 12 V, Po = 0.5 W, VDC = 1.4 V.
(1) RL = 16 Ω.
Fig.5 THD as a function of frequency.
1998 Feb 23
102
Fig.6 Ripple rejection as a function of frequency.
7
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
MGM583
MGM582
1000
Vn
(µV)
handbook,40
halfpage
handbook, halfpage
gain
(dB)
20
800
0
600
−20
400
−40
200
−60
−80
0
0
0.4
0.8
1.2
1.6
2.0
0
0.4
1.2
0.8
2.0
1.6
V7 (V)
V7 (V)
Measured with Rs = 5 kΩ unweighted; f = 22 Hz to 22 kHz.
Fig.7
Gain control as a function of DC volume
control.
Fig.8
Noise output voltage as a function of DC
volume control.
MGM585
MGM584
5
1000
Vi
handbook, halfpage
handbook, halfpage
Po
(W)
(mV)
800
4
600
3
400
2
200
1
(1)
0
0
4
8
12
16
0
4
8
12
16
20
VP (V)
Measured at THD = 10%. The maximum output power is limited by
the maximum power dissipation and the maximum available output
current.
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(3) RL = 25 Ω.
Tamb = 25 °C; THD = 1%; RL = 16 Ω; VDC = 0.8 V.
Input signal handling as a function of the
supply voltage.
1998 Feb 23
(3)
0
20
VP (V)
Fig.9
(2)
Fig.10 Output power as a function of the supply
voltage.
8
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
MGM587
MGM586
3
100
handbook, halfpage
handbook, halfpage
I5
(µA)
P
(W)
60
2
(1)
(2)
20
(3)
−20
1
−60
−100
0
0
4
8
12
16
20
VP (V)
0
0.4
0.8
1.2
1.6
2.0
V7 (V)
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(3) RL = 25 Ω.
Fig.11 Total worst case power dissipation as a
function of supply voltage.
1998 Feb 23
Fig.12 Control current as a function of DC volume
control.
9
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
handbook, full pagewidth
a. Top view of bottom copper.
GND
+VP
220 µF
100 nF
−OUT
20
0.47 µF
IN
1
5 kΩ
TDA7056A/BT
100
nF
+OUT
D&A AUDIO POWER
CIC NIJMEGEN
volume
MGM591
b. Top view of component side.
Fig.13 Printed-circuit board layout.
1998 Feb 23
10
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
TEST AND APPLICATION INFORMATION
Thermal behaviour:
Test conditions
The measured thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductors manufacturers because the
application boards and test methods are not (yet)
standardized. The thermal performance of packages for a
specific application may also be different than presented
here, because the configuration of the application boards
(copper area) may be different. Philips Semiconductors
uses FR-4 type application boards with 1 oz copper traces
with solder coating. The measurements have been carried
out with vertical placed boards.
Tamb = 25 °C if not specified: VP = 12 V; VDC = 1.4 V;
f = 1 kHz; RL = 16 Ω; audio bandpass: 22 Hz to 22 kHz.
In Figures 5 and 6 a low-pass filter of 80 kHz was applied.
It should be noted that capacitive loads (100 pF and 5 nF)
connected between the output pins to a common ground
can cause oscillations. The BTL application circuit diagram
is shown in Fig.14. To avoid instabilities and too high
distortion, the input and power ground traces must be
separated as far as possible and connected together as
close as possible to the IC. The quiescent current has
been measured without load impedance.
Using a practical PCB layout with wider copper tracks and
some copper area to the IC pins and just under the IC, the
thermal resistance from junction to ambient can be
reduced. In the demonstration application PCB the
Rth(j-a) = 56 K/W for the SO20 plastic package. For a
maximum ambient temperature of Tamb = 50 °C the
following calculation can be made for the maximum power
( 150 K/W – 50 K/W )
dissipation: ------------------------------------------------------- = 1.79 W
56 K/W
Voltage gain
The maximum closed-loop voltage gain has been
internally fixed at 35.5 dB. The input sensitivity at
maximum gain for Po = 3 W (RL = 16 Ω) is 115 mV.
The gain bandwidth is 20 Hz to 300 kHz within 1 dB.
Output power
The output power as a function of supply voltage has been
measured at THD = 10%. The maximum output power is
limited by the maximum allowed power dissipation at
Tamb = 25 °C approximately 2 W, and the maximum
available output current is 1.25 A repetitive peak current.
For the application at VP = 12 V and RL = 16 Ω the worst
case sine wave dissipation is 1.85 W. Because in practice
the ‘music-power’ causes about the half of the sine wave
dissipation, this application (VP = 12 V; RL = 16 Ω) has
been allowed.
Switch-on/switch-off
Short-circuit protection:
The switch-on behaviour depends on the following:
The output pins (pins 14 and 17) can be short-circuited to
ground respectively to +VP. The Missing Current Limiter
(MCL) protection circuit will shut-off the amplifier.
Removing the short-circuit will reset the amplifier
automatically. Short-circuit across the load
(pins 14 and 17) will activate the thermal protection circuit;
this will result in reducing the short-circuit current.
• The rise time of the power supply (if tr > 40 ms for
VP = 0 to 12 V then the switch-on behaviour will be
good)
• The input capacitor and source impedance (a higher
source impedance and/or lower input capacitor value
will have a positive influence on the switch-on/switch-off
behaviour)
• The DC volume control pin (a capacitor of >0.1 µF
avoids disturbances).
1998 Feb 23
11
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
VP
handbook, full pagewidth
(1)
220 µF
100 nF
n.c.
0.47 µF
positive input
1 to 3, 8 to 13,
16, 18 to 20
4
TDA7056AT
I + i
14
+
5
+
7
RL = 16 Ω
−
I − i
17
−
+
Rs
5
kΩ
Vref
STABILIZER
TEMPERATURE
PROTECTION
DC
volume
control
6
15
MGM588
ground
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 2.
Fig.14 Test and application diagram.
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MLC) will be activated.
1998 Feb 23
12
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
VP = 12 V
handbook, halfpage
handbook, halfpage
82 kΩ
volume
control
7
TDA7056AT
7
1 µF
1 µF
100 kΩ
22 kΩ
GND
GND
MGM589
volume
control
Fig.15 Application with potentiometer as volume
control; maximum gain = 30 dB.
1998 Feb 23
TDA7056AT
MGM590
Fig.16 Application with potentiometer as volume
control; maximum gain = 36 dB.
13
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013AC
1998 Feb 23
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
14
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
SOLDERING
Wave soldering
Introduction
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1998 Feb 23
15
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Feb 23
16
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
NOTES
1998 Feb 23
17
TDA7056AT
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
NOTES
1998 Feb 23
18
TDA7056AT
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
NOTES
1998 Feb 23
19
TDA7056AT
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1998
SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/25/01/pp20
Date of release: 1998 Feb 23
Document order number:
9397 750 03253