PHILIPS TDA8547T

INTEGRATED CIRCUITS
DATA SHEET
TDA8547
2 × 1 W BTL audio amplifier with
output channel switching
Preliminary specification
File under Integrated Circuits, IC01
1997 Oct 07
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
FEATURES
APPLICATIONS
• Selection between output channels
• Telecommunication equipment
• Flexibility in use
• Portable consumer products
• Few external components
• Personal computers
• Low saturation voltage of output stage
• Motor-driver (servo).
• Gain can be fixed with external resistors
• Standby mode controlled by CMOS compatible levels
GENERAL DESCRIPTION
• Low standby current
The TDA8547(T) is a two channel audio power amplifier
for an output power of 2 × 1 W with an 8 Ω load at a 5 V
supply. The circuit contains two BTL amplifiers with a
complementary PNP-NPN output stage and standby/mute
logic. The operating condition of all channels of the device
(standby, mute or on) is externally controlled by the
MODE pin. With the SELECT pin one of the output
channels can be switched in the standby condition. This
feature can be used for loudspeaker selection and also
reduces the quiescent current consumption.
The TDA8547T comes in a SO16 package and the
TDA8547 in a DIP16 package.
• No switch-on/switch-off plops
• High supply voltage ripple rejection
• Protected against electrostatic discharge
• Outputs short-circuit safe to ground, VCC and across the
load
• Thermally protected.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VCC
supply voltage
Iq
quiescent current
CONDITIONS
MIN.
TYP.
MAX.
18
UNIT
2.2
5
V
VCC = 5 V; 2 channels
−
15
22
mA
VCC = 5 V; 1 channel
−
8
12
mA
−
−
10
µA
Istb
standby current
Po
output power
THD = 10%; RL = 8 Ω; VCC = 5 V
1
−
−
W
THD
total harmonic distortion
Po = 0.5 W
−
0.15
−
%
SVRR
supply voltage ripple rejection
50
−
−
dB
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8547T
SO16
plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
TDA8547
DIP16
plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
1997 Oct 07
2
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
BLOCK DIAGRAM
VCC1 VCC2
handbook, full pagewidth
9
16
−
IN1−
IN1+
14
13
15
−
+
OUT1−
R
VCC1
R
−
−
20 kΩ
2
OUT1+
+
20 kΩ
STANDBY/MUTE LOGIC
TDA8547
−
IN2−
IN2+
11
12
10
−
+
OUT2−
R
VCC2
R
−
−
20 kΩ
SVRR
7
OUT2+
+
4
20 kΩ
MODE
SELECT
3
5
STANDBY/MUTE LOGIC
1
GND1
Fig.1 Block diagram.
1997 Oct 07
3
8
GND2
MGK697
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
PINNING
SYMBOL
PIN
DESCRIPTION
GND1
1
ground, channel 1
OUT1+
2
positive loudspeaker terminal,
channel 1
MODE
3
operating mode select (standby,
mute, operating)
SVRR
4
half supply voltage, decoupling
ripple rejection
SELECT
5
input for selection of operating
channel
n.c.
6
not connected
OUT2+
7
positive loudspeaker terminal,
channel 2
GND2
8
ground, channel 2
VCC2
9
supply voltage, channel 2
OUT2−
10
negative loudspeaker terminal,
channel 2
IN2−
11
negative input, channel 2
IN2+
12
positive input, channel 2
IN1+
13
positive input, channel 1
IN1−
14
negative input, channel 1
OUT1−
15
negative loudspeaker terminal,
channel 1
VCC1
16
supply voltage, channel 1
handbook, halfpage
GND1 1
16 VCC1
OUT1+ 2
15 OUT1−
MODE 3
14 IN1−
SVRR 4
13 IN1+
TDA8547
SELECT 5
12 IN2+
n.c. 6
11 IN2−
OUT2+ 7
10 OUT2−
GND2 8
9
VCC2
MGK696
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION
MODE pin
The TDA8547(T) is a 2 × 1 W BTL audio power amplifier
capable of delivering 2 × 1 W output power to an 8 Ω load
at THD = 10% using a 5 V power supply. Using the
MODE pin the device can be switched to standby and
mute condition. The device is protected by an internal
thermal shutdown protection mechanism. The gain can be
set within a range from 6 to 30 dB by external feedback
resistors.
The whole device (both channels) is in the standby mode
(with a very low current consumption) if the voltage at the
MODE pin is >(VCC − 0.5 V), or if this pin is floating. At a
MODE voltage level of less than 0.5 V the amplifier is fully
operational. In the range between 1.5 V and VCC − 1.5 V
the amplifier is in mute condition. The mute condition is
useful to suppress plop noise at the output caused by
charging of the input capacitor.
Power amplifier
SELECT pin
The power amplifier is a Bridge-Tied Load (BTL) amplifier
with a complementary PNP-NPN output stage.
The voltage loss on the positive supply line is the
saturation voltage of a PNP power transistor, on the
negative side the saturation voltage of a NPN power
transistor. The total voltage loss is <1 V and with a 5 V
supply voltage and an 8 Ω loudspeaker an output power of
1 W can be delivered.
If the voltage at the SELECT pin is in the range between
1.5 V and VCC − 1.5 V, or if it is kept floating, then both
channels can be operational. If the SELECT pin is set to a
LOW voltage or grounded, then only channel 2 can
operate and the power amplifier of channel 1 will be in the
standby mode. In this case only the loudspeaker at
channel 2 can operate and the loudspeaker at channel 1
will be switched off. If the SELECT pin is set to a
HIGH level or connected to VCC, then only channel 1 can
1997 Oct 07
4
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
operate and the power amplifier of channel 2 will be in the
standby mode. In this case only the loudspeaker at
channel 1 can operate and the loudspeaker at channel 2
will be switched off. Setting the SELECT pin to a LOW or
a HIGH voltage results in a reduction of quiescent current
consumption by a factor of approximately 2.
TDA8547
For plop-free channel selecting the device has first to be
set in mute condition with the MODE pin (between 1.5 V
and VCC − 1.5 V), then set the SELECT pin to the new
level, after a delay set the MODE pin to a LOW level.
The delay needed depends on the values of the input
capacitor and the feedback resistors. Time needed is
approx. 10 × C1 × (R1 + R2), so approximately 0.6 s. for
the values in Fig.4.
Switching with the SELECT pin during operating is not
plop-free, because the input capacitor of the channel
which is coming out of standby needs to be charged first.
Table 1 Control pins MODE and SELECT versus status of output channels
Voltage levels at control pins at VP = 5 V; for other supply voltages see Figs. 14 and 15.
CONTROL PIN
STATUS OF OUTPUT CHANNEL
MODE
SELECT
CHANNEL 1
CHANNEL 2
TYP. Iq
(mA)
HIGH(1)/NC(2)
X(3)
standby
standby
0
HVP(4)
HVP(4)/NC(2)
mute
mute
15
LOW(5)
HVP(4)/NC(2)
on
on
15
HVP(4)/LOW(5)
HIGH(1)
mute/on
standby
8
HVP(4)/LOW(5)
HVP(4)/NC(2)
mute/on
mute/on
15
HVP(4)/LOW(5)
LOW(5)
standby
mute/on
8
Notes
1. HIGH = Vpin > VCC − 0.5 V.
2. NC = not connected or floating.
3. X = don’t care.
4. HVP = 1.5 V < Vpin < VCC − 1.5 V.
5. LOW = Vpin < 0.5 V.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
−0.3
+18
V
input voltage
−0.3
VCC + 0.3
V
IORM
repetitive peak output current
−
1
A
Tstg
storage temperature
−55
+150
°C
Tamb
operating ambient temperature
−40
+85
°C
VPsc
AC and DC short-circuit safe voltage
−
10
V
Ptot
total power dissipation
SO16
−
1.2
W
DIP16
−
2.2
W
VCC
supply voltage
VI
operating
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611-E”. The number of the quality specification can be found in the “Quality Reference
Handbook”. The handbook can be ordered using the code 9397 750 00192.
1997 Oct 07
5
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
TDA8547T (SO16)
100
K/W
TDA8547 (DIP16)
55
K/W
thermal resistance from junction to ambient
Rth(j-a)
in free air
MGK698
2.5
handbook, halfpage
P
(W)
2.0
DIP16
1.5
SO16
1.0
0.5
0
0
40
80
120
160
Tamb (°C)
Fig.3 Power derating curve.
Table 2
Maximum ambient temperature at different conditions
CONTINUOUS SINE WAVE DRIVEN
VCC
(V)
RL
(Ω)
5
8
APPLICATION
OPERATION
MODE
2 channels
BTL
Po
(W)(1)
Tamb(max)
(°C)
Pmax
(W)
SO16
DIP16
2 × 1.2
1.4
−
73
5
8
1 channel
BTL
1.2
0.7
80
112
7.5
8
2 channels
BTL
2 × 2.4
3.0
−
−
7.5
8
1 channel
BTL
2.4
1.5
−
68
7.5
16
2 channels
BTL
2 × 1.2
1.8
−
50
7.5
16
1 channel
BTL
1.2
0.9
60
100
7.5
28
2 channels
BTL
2×1
1.0
50
95
7.5
28
1 channel
BTL
1
0.5
100
122
Note
1. At THD = 10%.
1997 Oct 07
6
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
DC CHARACTERISTICS
VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; VMODE = 0 V; gain = 20 dB; measured in BTL application circuit Fig.4; unless
otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCC
supply voltage
operating
2.2
5
18
V
Iq
quiescent current
BTL 2 channels;
note 1
−
15
22
mA
BTL 1 channel;
note 1
−
8
12
mA
10
µA
Istb
standby current
VMODE = VCC
−
−
VO
DC output voltage
note 2
−
2.2
−
V
VOUT+ − VOUT− differential output voltage
offset
−
−
50
mV
IIN+, IIN−
input bias current
−
−
500
nA
VMODE
input voltage MODE pin
operating
0
−
0.5
V
mute
1.5
−
VCC − 1.5 V
standby
VCC − 0.5 −
VCC
V
IMODE
input current MODE pin
0 V < VMODE < VCC
−
−
20
µA
VSELECT
input voltage SELECT pin
channel 1 = standby; 0
channel 2 = on
−
1
V
ISELECT
input current SELECT pin
channel 1 = on;
channel 2 = standby
VCC − 1
−
VCC
V
VSELECT = 0 V
−
−
100
µA
Notes
1. Measured with RL = ∞. With a load connected at the outputs the quiescent current will increase, the maximum of this
increase being equal to the DC output offset voltage divided by RL.
2. The DC output voltage with respect to ground is approximately 0.5VCC.
1997 Oct 07
7
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
AC CHARACTERISTICS
VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE = 0 V; gain = 20 dB; measured in BTL application circuit Fig.4;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1.2
−
W
0.6
0.9
−
W
−
0.15
0.3
%
6
−
30
dB
−
100
−
kΩ
−
−
100
µV
note 3
50
−
−
dB
note 4
40
−
−
dB
−
−
200
µV
−
−
dB
Po
output power
THD = 10%
1
THD
total harmonic distortion
THD = 0.5%
Po = 0.5 W
Gv
closed loop voltage gain
note 1
Zi
differential input impedance
Vno
noise output voltage
note 2
SVRR
supply voltage ripple rejection
Vo
output voltage
note 5
αcs
channel separation
VSELECT = 0.5VCC; note 6 40
Notes
R2
1. Gain of the amplifier is 2 × -------- in BTL application circuit Fig.4.
R1
2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a
source impedance of RS = 0 Ω at the input.
3. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 Ω at the input.
The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to
the positive supply rail.
4. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 Ω at the input.
The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS),
which is applied to the positive supply rail.
5. Output voltage in mute position is measured with a 1 V (RMS) input voltage in a bandwidth of 20 Hz to 20 kHz,
so including noise.
6. Channel separation is measured at the output with a source impedance of RS = 0 Ω at the input and a frequency of
1 kHz. The output power in the operating channel is set to 0.5 W.
1997 Oct 07
8
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
TEST AND APPLICATION INFORMATION
SE application
Test conditions
Tamb = 25 °C if not specially mentioned, VCC = 7.5 V,
f = 1 kHz, RL = 4 Ω, Gv = 20 dB, audio band-pass
22 Hz to 22 kHz.
Because the application can be either Bridge-Tied Load
(BTL) or Single-Ended (SE), the curves of each
application are shown separately.
The SE application circuit is illustrated in Fig.16.
Increasing the value of electrolytic capacitor C3 will result
in a better channel separation. Because the positive
output is not designed for high output current (2 × Io) at
low load impedance (≤16 Ω), the SE application with
output capacitors connected to ground is advised.
The capacitor value of C6/C7 in combination with the load
impedance determines the low frequency behaviour.
The THD as a function of frequency was measured using
a low-pass filter of 80 kHz. The value of capacitor C3
influences the behaviour of the SVRR at low frequencies:
increasing the value of C3 increases the performance of
the SVRR.
The thermal resistance = 55 K/W for the DIP16; the
maximum sine wave power dissipation for Tamb = 25 °C
150 – 25
is: ---------------------- = 2.3 W
55
For Tamb = 60 °C the maximum total power dissipation is:
150 – 60
---------------------- = 1.7 W
55
BTL application
Tamb = 25 °C if not specially mentioned, VCC = 5 V,
f = 1 kHz, RL = 8 Ω, Gv = 20 dB, audio band-pass
22 Hz to 22 kHz.
General remark
The BTL application circuit is illustrated in Fig.4.
The frequency characteristic can be adapted by
connecting a small capacitor across the feedback
resistor. To improve the immunity to HF radiation in radio
circuit applications, a small capacitor can be connected in
parallel with the feedback resistor (56 kΩ); this creates a
low-pass filter.
The quiescent current has been measured without any
load impedance and both channels driven. When one
channel is active the quiescent current will be halved.
The total harmonic distortion as a function of frequency
was measured using a low-pass filter of 80 kHz.
The value of capacitor C3 influences the behaviour of the
SVRR at low frequencies: increasing the value of C3
increases the performance of the SVRR.
The figure of the MODE voltage (VMODE) as a function of
the supply voltage shows three areas; operating, mute
and standby. It shows, that the DC-switching levels of the
mute and standby respectively depend on the supply
voltage level. The figure of the SELECT voltage (VSELECT)
as a function of the supply voltage shows the voltage
levels for switching the channels in the active, mute or
standby mode.
1997 Oct 07
9
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
BTL APPLICATION
handbook, full pagewidth
C1
1 µF
R2
R1
50 kΩ
IN1−
10 kΩ
Vi1
IN1+
16
VCC
C5
100 µF
C4
100 nF
9
14
15
OUT1−
13
C3
47 µF
RL1
2
OUT1+
OUT2−
C2
1 µF
50 kΩ
R4
R3
TDA8547
IN2−
10 kΩ
IN2+
Vi2
SVRR
MODE
SELECT
R2
Gain channel 1 = 2 × -------R1
11
10
12
OUT2−
RL2
4
7
3
5
1
OUT2+
8
GND
R4
Gain channel 2 = 2 × -------R3
MGK701
Fig.4 BTL application.
MGD890
30
MGD891
10
handbook, halfpage
handbook, halfpage
Iq
(mA)
THD
(%)
20
1
10
10−1
(2)
(1)
10−2
10−2
0
0
4
8
12
20
16
VCC (V)
1
Po (W)
f = 1 kHz; Gv = 20 dB.
(1) VCC = 5 V; RL = 8 Ω.
(2) VCC = 9 V; RL = 16 Ω.
RL = ∞.
Fig.5 Iq as a function of VCC.
1997 Oct 07
10−1
Fig.6 THD as a function of Po.
10
10
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
MGD892
10
TDA8547
MGK699
−60
handbook, halfpage
handbook, halfpage
αcs
(dB)
THD
(%)
(1)
−70
1
(2)
(1)
−80
(3)
(2)
10−1
−90
10−2
10
102
103
104
f (Hz)
−100
10
105
102
103
104
f (Hz)
105
VCC = 5 V; Vo = 2 V; RL = 8 Ω.
(1) Gv = 30 dB.
(2) Gv = 20 dB.
(3) Gv = 6 dB.
Po = 0.5 W; Gv = 20 dB.
(1) VCC = 5 V; RL = 8 Ω.
(2) VCC = 9 V; RL = 16 Ω.
Fig.8
Channel separation as a function of
frequency.
Fig.7 THD as a function of frequency.
MGD894
−20
MGD895
2.5
handbook, halfpage
handbook, halfpage
SVRR
(dB)
Po
(W)
2
−40
(1)
(2)
1.5
(1)
(2)
1
−60
(3)
0.5
−80
10
102
103
104
f (Hz)
0
105
0
VCC = 5 V; RS = 0 Ω; Vr = 100 mV.
(1) Gv = 30 dB.
(2) Gv = 20 dB.
(3) Gv = 6 dB.
8
VCC (V)
THD = 10%.
(1) RL = 8 Ω.
(2) RL = 16 Ω.
Fig.9 SVRR as a function of frequency.
1997 Oct 07
4
Fig.10 Po as a function of VCC.
11
12
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
MGD896
3
TDA8547
MGD897
3
handbook, halfpage
handbook, halfpage
(1)
P
(W)
P
(W)
2
2
(1)
(2)
(2)
1
1
0
0
4
0
8
VCC (V)
12
0.5
0
1
1.5
2.5
2
Po (W)
(1) RL = 8 Ω.
(2) RL = 16 Ω.
Sine wave of 1 kHz.
(1) VCC = 9 V; RL = 16 Ω.
(2) VCC = 5 V; RL = 8 Ω.
Fig.11 Worst case power dissipation as a function
of VCC (both channels on).
Fig.12 Power dissipation as a function of Po (both
channels on).
MGL211
10
o
(V)
1
MGL210
16
handbook,
V halfpage
handbook, halfpage
VMODE
(V)
12
10−1
standby
10−2
(1)
10−3
(2)
8
(3)
mute
10−4
4
10−5
operating
10−6
10−1
1
10
VMODE (V)
0
102
0
4
8
12
VP (V)
Band-pass = 22 Hz to 22 kHz.
(1) VCC = 3 V.
(2) VCC = 5 V.
(3) VCC = 12 V.
Fig.13 Vo as a function of VMODE.
1997 Oct 07
Fig.14 VMODE as a function of VP.
12
16
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
MGK700
20
handbook, full pagewidth
VSELECT
(V)
16
channel 2
standby
12
channel 1 + 2
on
8
VP
channel 1
on
channel 2
on
4
channel 1
standby
0
0
2
4
6
10
8
12
14
16
18
VP (V)
Fig.15 VSELECT as a function of VP.
SE APPLICATION
handbook, full pagewidth
C1
1 µF
R2
R1
100 kΩ
IN1−
10 kΩ
Vi1
IN1+
16
9
14
15
13
R4
R3
10 kΩ
Vi2
OUT1−
C3
47 µF
2
100 kΩ
IN2−
IN2+
SVRR
MODE
SELECT
TDA8547
11
10
12
OUT2−
3
5
C7
470 µF
4
7
1
OUT2+
8
GND
MGK702
Fig.16 SE application.
1997 Oct 07
RL1
OUT1+
R2
Gain channel 1 = -------R1
R4
Gain channel 2 = -------R3
VCC
C5
100 µF
C6
470 µF
OUT2−
C2
1 µF
C4
100 nF
13
RL2
20
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
MGD899
10
TDA8547
MGD900
10
handbook, halfpage
handbook, halfpage
THD
(%)
THD
(%)
1
1
(1)
(2)
10−1
10−1
(3)
(1)
(2)
(3)
10−2
10−2
10−1
1
Po (W)
10−2
10
10
102
f = 1 kHz; Gv = 20 dB.
(1) VCC = 7.5 V; RL = 4 Ω.
Po = 0.5 W; Gv = 20 dB.
(1) VCC = 7.5 V; RL = 4 Ω.
(2) VCC = 9 V; RL = 8 Ω.
(3) VCC = 12 V; RL = 16 Ω.
(2) VCC = 9 V; RL = 8 Ω.
(3) VCC = 12 V; RL = 16 Ω.
Fig.17 THD as a function of Po.
104
f (Hz)
105
Fig.18 THD as a function of frequency.
MGL244
−20
103
MGD902
−20
handbook, halfpage
handbook, halfpage
αcs
(dB)
SVRR
(dB)
−40
−40
−60
(1)
(2)
(1)
(2)
−80
−100
10
−60
(3)
(4)
102
103
(3)
104
f (Hz)
−80
10
105
Vo = 1 V; Gv = 20 dB.
(1) VCC = 7.5 V; RL = 4 Ω.
(2) VCC = 9 V; RL = 8 Ω.
(3) VCC = 12 V; RL = 16 Ω.
(4) VCC = 5 V; RL = 32 Ω.
103
104
f (Hz)
105
VCC = 7.5 V; RL = 4 Ω; RS = 0 Ω; Vr = 100 mV.
(1) Gv = 24 dB.
(2) Gv = 20 dB.
(3) Gv = 0 dB.
Fig.19 Channel separation as a function of
frequency.
1997 Oct 07
102
Fig.20 SVRR as a function of frequency.
14
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
MGD903
2
handbook, halfpage
Po
(W)
TDA8547
MGD904
3
handbook, halfpage
P
(W)
1.6
(1)
(2)
(3)
2
(1)
1.2
(2)
(3)
0.8
1
0.4
0
0
0
4
8
12
VCC (V)
0
16
(2) RL = 8 Ω.
(3) RL = 16 Ω.
12
VCC (V)
16
Fig.22 Worst case power dissipation as a function
of VCC (both channels on).
Fig.21 Po as a function of VCC.
MGD905
2.4
handbook, halfpage
P
(W)
(1)
1.6
(2)
(3)
0.8
0
0.4
0.8
1.2
Po (W)
1.6
Sine wave of 1 kHz.
(1) VCC = 12 V; RL = 16 Ω.
(2) VCC = 7.5 V; RL = 4 Ω.
(3) VCC = 9 V; RL = 8 Ω.
Fig.23 Power dissipation as a function of Po (both
channels on).
1997 Oct 07
8
(1) RL = 4 Ω.
(2) RL = 8 Ω.
(3) RL = 16 Ω.
THD = 10%.
(1) RL = 4 Ω.
0
4
15
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
handbook, full pagewidth
a. Top view without components.
+VCC
GND
TDA
8547
CIC NIJMEGEN
D&A AUDIO POWER
100 µF
−OUT1
+OUT1
12 kΩ
12
kΩ
MODE
100 nF
16
1
P3
1 µF
11 kΩ
SELECT
11 kΩ
47 µF
1 µF
8
12 kΩ
IN1
56 kΩ
12 kΩ
9
TDA8547
56 kΩ
IN2
−OUT2
+OUT2
MGK703
b. Top view with components.
Fig.24 Printed-circuit board layout (BTL and SE).
1997 Oct 07
16
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
PACKAGE OUTLINES
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
HE
y
v M A
Z
9
16
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.41
0.40
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT162-1
075E03
MS-013AA
1997 Oct 07
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
17
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
w M
(e 1)
b
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
2.2
inches
0.19
0.020
0.15
0.055
0.045
0.021
0.015
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT38-1
050G09
MO-001AE
1997 Oct 07
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-10-02
95-01-19
18
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1997 Oct 07
TDA8547
19
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
TDA8547
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Oct 07
20
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
NOTES
1997 Oct 07
21
TDA8547
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
NOTES
1997 Oct 07
22
TDA8547
Philips Semiconductors
Preliminary specification
2 × 1 W BTL audio amplifier with output
channel switching
NOTES
1997 Oct 07
23
TDA8547
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Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/25/01/pp24
Date of release: 1997 Oct 07
Document order number:
9397 750 02338