*R oH V SC AV ER OM AI SIO PL LA N IA BL S NT E TISP4070M3LM THRU TISP4115M3LM, TISP4125M3LM THRU TISP4220M3LM, TISP4240M3LM THRU TISP4400M3LM BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS TISP4xxxM3LM Overvoltage Protector Series TISP4xxxM3LM Overview This TISP® device series protects central office, access and customer premise equipment against overvoltages on the telecom line. The TISP4xxxM3LM is available in a wide range of voltages and has a medium current capability. These protectors have been specified mindful of the following standards and recommendations: GR-1089-CORE, FCC Part 68, UL1950, EN 60950, IEC 60950, ITU-T K.20, K.21 and K.45. The TISP4350M3LM meets the FCC Part 68 “B” ringer voltage requirement and survives the Type B impulse tests. These devices are housed in a through-hole DO-92 package (TO-92 package with cropped center leg). Summary Electrical Characteristics V(BO) VT @ IT VDRM V V V TISP4070M3 58 70 3 TISP4080M3 65 80 3 TISP4095M3 75 95 3 TISP4115M3 90 115 3 TISP4125M3 100 125 3 TISP4145M3 120 145 3 TISP4165M3 135 165 3 TISP4180M3 145 180 3 TISP4220M3 160 220 3 TISP4240M3 180 240 3 TISP4250M3 190 250 3 TISP4260M3 200 260 3 TISP4290M3 220 290 3 TISP4300M3 230 300 3 TISP4350M3 275 350 3 TISP4395M3 320 395 3 TISP4400M3 300 400 3 B ourns’ part has an improved protection voltage Part # IDRM µA 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 I(BO) mA 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 IT A 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 IH mA 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 Co @ -2 V pF 120 120 120 120 65 65 65 65 65 55 55 55 55 55 55 55 55 Functionally Replaces P0640EA P0720EA P0900EA P1100EA ITSM A 1 cycle 60 Hz 32 di/dt A/µs 2/10 Wavefront 300 P1300EA P1500EA P1800EA P2300EA P2600EA P3100EA P3500EA Summary Current Ratings ITSP A Parameter Waveshape Value 2/10 300 1.2/50, 8/20 220 10/160 120 5/320 100 10/560 75 10/1000 50 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4xxxM3LM Overvoltage Protector Series ITU-T K.20/21 Rating ...........................4 kV 10/700,100 A 5/310 LM Package (Top View) Ion-Implanted Breakdown Region Precise and Stable Voltage Low Voltage Overshoot under Surge Device ‘4070 ‘4080 ‘4095 ‘4115 ‘4125 ‘4145 ‘4165 ‘4180 ‘4220 ‘4240 ‘4250 ‘4260 ‘4290 ‘4300 ‘4350 ‘4395 ‘4400 VDRM V(BO) V 58 65 75 90 100 120 135 145 160 180 190 200 220 230 275 320 300 V 70 80 95 115 125 145 165 180 220 240 250 260 290 300 350 395 400 T(A) NC R(B) 1 2 3 MD4XAT NC - No internal connection on pin 2 LMF Package (LM Package with Formed Leads) (Top View) T(A) 1 2 3 NC R(B) MD4XAKB NC - No internal connection on pin 2 Device Symbol T Rated for International Surge Wave Shapes R Waveshape Standard 2/10 µs 8/20 µs 10/160 µs GR-1089-CORE IEC 61000-4-5 FCC Part 68 ITU-T K.20/21 FCC Part 68 FCC Part 68 GR-1089-CORE 10/700 µs 10/560 µs 10/1000 µs ITSP SD4XAA Terminals T and R correspond to the alternative line designators of A and B A 300 220 120 Low Differential Capacitance .................................. 43 pF max. .............................................. UL Recognized Component 100 75 50 Description These devices are designed to limit overvoltages on the telephone line. Overvoltages are normally caused by a.c. power system or lightning flash disturbances which are induced or conducted on to the telephone line. A single device provides 2-point protection and is typically used for the protection of 2-wire telecommunication equipment (e.g. between the Ring and Tip wires for telephones and modems). Combinations of devices can be used for multi-point protection (e.g. 3-point protection between Ring, Tip and Ground). How To Order Device TISP4xxxM3LM Package Straight Lead DO-92 (LM) Carrier For Standard Termination Finish Order As Bulk Pack TISP4xxxM3LM Tape and Reeled TISP4xxxM3LMR Formed Lead DO-92 (LMF) Tape and Reeled TISP4xxxM3LMFR Insert xxx value corresponding to protection voltages of 070, 080, 095, 115 etc. NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. For Lead Free Termination Finish Order As TISP4xxxM3LM-S TISP4xxxM3LMR-S TISP4xxxM3LMFRS TISP4xxxM3LM Overvoltage Protector Series Description (continued) The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current prevents d.c. latchup as the diverted current subsides. This TISP4xxxM3LM range consists of seventeen voltage variants to meet various maximum system voltage levels (58 V to 320 V). They are guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. These protection devices are supplied in a DO-92 (LM) cylindrical plastic package. The TISP4xxxM3LM is a straight lead DO-92 supplied in bulk pack and on tape and reel. The TISP4xxxM3LMF is a formed lead DO-92 supplied only on tape and reel. For higher rated impulse currents in the DO-92 package, the 100 A 10/1000 TISP4xxxH3LM series is available. Absolute Maximum Ratings, TA = 25 °C (Unless Otherwise Noted) Rating Repetitive peak off-state voltage, (see Note 1) Symbol ‘4070 ‘4080 ‘4095 ‘4115 ‘4125 ‘4145 ‘4165 ‘4180 ‘4220 ‘4240 ‘4250 ‘4260 ‘4290 ‘4300 ‘4350 ‘4395 ‘4400 Non-repetitive peak on-state pulse current (see Notes 2, 3 and 4) 2/10 µs (GR-1089-CORE, 2/10 µs voltage wave shape) 8/20 µs (IEC 61000-4-5, combination wave generator, 1.2/50 voltage, 8/20 current) 10/160 µs (FCC Part 68, 10/160 µs voltage wave shape) 5/200 µs (VDE 0433, 10/700 µs voltage wave shape) 0.2/310 µs (I 31-24, 0.5/700 µs voltage wave shape) 5/310 µs (ITU-T K.20/21, 10/700 µs voltage wave shape) 5/310 µs (FTZ R12, 10/700 µs voltage wave shape) 5/320 µs (FCC Part 68, 9/720 µs voltage wave shape) 10/560 µs (FCC Part 68, 10/560 µs voltage wave shape) 10/1000 µs (GR-1089-CORE, 10/1000 µs voltage wave shape) Non-repetitive peak on-state current (see Notes 2, 3 and 5) 20 ms (50 Hz) full sine wave 16.7 ms (60 Hz) full sine wave 1000 s 50 Hz/60 Hz a.c. Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 100 A Junction temperature Storage temperature range NOTES: 1. 2. 3. 4. 5. VDRM ITSP Value ± 58 ± 65 ± 75 ± 90 ±100 ±120 ±135 ±145 ±160 ±180 ±190 ±200 ±220 ±230 ±275 ±320 ±300 300 220 120 110 100 100 100 100 75 50 Unit V A ITSM 30 32 2.1 A diT/dt TJ Tstg 300 -40 to +150 -65 to +150 A/µs °C °C See Applications Information and Figure 10 for voltage values at lower temperatures. Initially the TISP4xxxM3LM must be in thermal equilibrium with TJ = 25 °C. The surge may be repeated after the TISP4xxxM3LM returns to its initial conditions. See Applications Information and Figure 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring track widths. See Figure 8 for the current ratings at other durations. Derate current values at -0.61 %/°C for ambient temperatures above 25 °C NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4xxxM3LM Overvoltage Protector Series Electrical Characteristics, TA = 25 °C (Unless Otherwise Noted) IDRM Parameter Repetitive peak offstate current VD = ±V DRM V(BO) Breakover voltage dv/dt = ±750 V/ms, RSOURCE = 300 Ω V(BO) Impulse breakover voltage dv/dt ≤ ±1000 V/µs, Linear voltage ramp, Maximum ramp value = ±500 V di/dt = ±20 A/µs, Linear current ramp, Maximum ramp value = ±10 A I(BO) VT IH dv/dt ID Breakover current On-state voltage Holding current Critical rate of rise of off-state voltage Off-state current Test Conditions Min TA = 25 °C TA = 85 °C ‘4070 ‘4080 ‘4095 ‘4115 ‘4125 ‘4145 ‘4165 ‘4180 ‘4220 ‘4240 ‘4250 ‘4260 ‘4290 ‘4300 ‘4350 ‘4395 ‘4400 ‘4070 ‘4080 ‘4095 ‘4115 ‘4125 ‘4145 ‘4165 ‘4180 ‘4220 ‘4240 ‘4250 ‘4260 ‘4290 ‘4300 ‘4350 ‘4395 ‘4400 dv/dt = ±750 V/ms, RSOURCE = 300 Ω IT = ±5 A, tW = 100 µs IT = ±5 A, di/dt = - /+ 30 mA/ms ±0.15 ±0.15 Linear voltage ramp, Maximum ramp value < 0.85VDRM VD = ±50 V NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Typ Max ±5 ±10 ±70 ±80 ±95 ±115 ±125 ±145 ±165 ±180 ±220 ±240 ±250 ±260 ±290 ±300 ±350 ±395 ±400 ±78 ±88 ±102 ±122 ±132 ±151 ±171 ±186 ±227 ±247 ±257 ±267 ±298 ±308 ±359 ±405 ±410 ±0.6 ±3 ±0.6 µA V V A V A kV/µs ±5 TA = 85 °C Unit ±10 µA TISP4xxxM3LM Overvoltage Protector Series Electrical Characteristics, TA = 25 °C (Unless Otherwise Noted) (continued) Parameter Test Conditions f = 100 kHz, Vd = 1 V rms, VD = 0, Min 4070 thru ‘4115 ‘4125 thru ‘4220 ‘4240 thru ‘4400 ‘4070 thru ‘4115 ‘4125 thru ‘4220 ‘4240 thru ‘4400 ‘4070 thru ‘4115 ‘4125 thru ‘4220 ‘4240 thru ‘4400 ‘4070 thru ‘4115 ‘4125 thru ‘4220 ‘4240 thru ‘4400 ‘4125 thru ‘4220 ‘4240 thru ‘4400 f = 100 kHz, Vd = 1 V rms, VD = -1 V Coff Off-state capacitance f = 100 kHz, Vd = 1 V rms, VD = -2 V f = 100 kHz, Vd = 1 V rms, VD = -50 V f = 100 kHz, Vd = 1 V rms, VD = -100 V (see Note 6) NOTE Typ 86 60 54 80 56 50 74 52 46 36 26 20 20 16 Max 110 80 70 96 74 64 90 70 60 47 36 30 30 24 Unit Typ Max Unit pF 6: To avoid possible voltage clipping, the ‘4125 is tested with VD = -98 V. Thermal Characteristics Parameter R θJA NOTE Junction to free air thermal resistance Test Conditions Min EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note 7) 265 mm x 210 mm populated line card, 4-layer PCB, IT = ITSM(1000), TA = 25 °C 120 °C/W 57 7: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths. NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4xxxM3LM Overvoltage Protector Series Parameter Measurement Information +i Quadrant I ITSP Switching Characteristic ITSM IT V(BO) VT I(BO) IH VDRM -v IDRM ID VD ID IDRM VD VDRM +v IH I(BO) V(BO) VT IT ITSM Quadrant III ITSP Switching Characteristic -i Figure 1. Voltage-current Characteristic for T and R Terminals All Measurements are Referenced to the R Terminal NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. PMXXAAB TISP4xxxM3LM Overvoltage Protector Series Typical Characteristics OFF-STATE CURRENT vs JUNCTION TEMPERATURE 100 TCMAG NORMALIZED BREAKOVER VOLTAGE vs JUNCTION TEMPERATURE TC4MAF 1.10 Normalized Breakover Voltage VD = ±50 V |ID| - Off-State Current - µA 10 1 0·1 0·01 1.05 1.00 0.95 0·001 -25 0 25 50 75 100 TJ - Junction Temperature - °C 125 -25 150 Figure 2. ON-STATE CURRENT vs ON-STATE VOLTAGE 100 50 40 30 NORMALIZED HOLDING CURRENT vs JUNCTION TEMPERATURE TC4MAJA 2.0 TA = 25 °C tW = 100 µs 10 5 4 3 2 1.5 1 0.7 '4125 THRU '4220 '4240 THRU '4400 TC4MAD 1.5 20 15 7 150 Figure 3. Normalized Holding Current IT - On-State Current - A 70 0 25 50 75 100 125 TJ - Junction Temperature - °C '4070 THRU '4115 1.0 0.9 0.8 0.7 0.6 0.5 0.4 1 1.5 2 31 4 5 VT - On-State Voltage - V Figure 4. 7 0 -25 0 25 50 75 100 125 TJ - Junction Temperature - °C 150 Figure 5. NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4xxxM3LM Overvoltage Protector Series Typical Characteristics Capacitance Normalized to V D = 0 0.7 0.6 0.5 '4070 THRU '4115 0.4 '4125 THRU '4220 0.3 '4240 THRU '4400 0.2 0.5 '4145 '4165 '4180 '4125 '4115 TJ = 25 °C Vd = 1 Vrms 0.8 '4095 0.9 TC4MALB 50 '4220 '4240 '4250 '4260 '4290 '4300 '4350 '4395 '4400 TC4MAKA '4070 '4080 1 DIFFERENTIAL OFF-STATE CAPACITANCE vs RATED REPETITIVE PEAK OFF-STATE VOLTAGE ∆C - Differential Off-State Capacitance - pF NORMALIZED CAPACITANCE vs OFF-STATE VOLTAGE 45 40 ∆C = Coff(-2 V) - Coff(-50 V) 35 30 25 1 2 3 5 10 20 30 VD - Off-state Voltage - V 50 100150 Figure 6. NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 50 60 70 80 90100 150 200 250 300 VDRM - Repetitive Peak Off-State Voltage - V Figure 7. TISP4xxxM3LM Overvoltage Protector Series Rating and Thermal Information THERMAL IMPEDANCE vs POWER DURATION 30 150 VGEN = 600 Vrms, 50/60 Hz ZθJA(t) - Transient Thermal Impedance - °C/W ITSM(t) - Non-Repetitive Peak On-State Current - A NON-REPETITIVE PEAK ON-STATE CURRENT vs CURRENT DURATION RGEN = 1.4*VGEN/ITSM(t) 20 EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 15 10 9 8 7 6 5 4 3 2 1.5 0·1 1 10 100 1000 100 90 80 70 60 50 40 30 20 15 10 9 8 7 6 5 4 0·1 t - Current Duration - s ITSM(t) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 1 10 100 1000 t - Power Duration - s Figure 8. 1.00 TI4MAG Figure 9. VDRM DERATING FACTOR vs MINIMUM AMBIENT TEMPERATURE TI4MAHA 400 IMPULSE RATING vs AMBIENT TEMPERATURE TC4MAA BELLCORE 2/10 300 0.99 250 '4125 THRU '4220 Impulse Current - A Derating Factor 0.98 0.97 0.96 0.95 '4070 THRU '4115 IEC 1.2/50, 8/20 200 150 FCC 10/160 120 100 90 80 70 ITU-T 10/700 FCC 10/560 60 0.94 '4240 THRU '4400 50 BELLCORE 10/1000 0.93 -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 TAMIN - Minimum Ambient Temperature - °C Figure 10. 40 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 TA - Ambient Temperature - °C Figure 11. NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4xxxM3LM Overvoltage Protector Series APPLICATIONS INFORMATION Deployment These devices are two terminal overvoltage protectors. They may be used either singly to limit the voltage between two conductors (Figure 12) or in multiples to limit the voltage at several points in a circuit (Figure 13). Th3 Th1 Th1 Th2 Figure 12. Two Point Protection Figure 13. Multi-point Protection In Figure 12, protector Th1 limits the maximum voltage between the two conductors to ±V(BO) . This configuration is normally used to protect circuits without a ground reference, such as modems. In Figure 13, protectors Th2 and Th3 limit the maximum voltage between each conductor and ground to the ±V(BO) of the individual protector. Protector Th1 limits the maximum voltage between the two conductors to its ±V(BO) value. If the equipment being protected has all its vulnerable components connected between the conductors and ground, then protector Th1 is not required. Impulse Testing To verify the withstand capability and safety of the equipment, standards require that the equipment is tested with various impulse wave forms. The table below shows some common values. Standard Peak Voltage Setting V Voltage Waveform µs 2/10 10/1000 10/160 10/560 9/720 † 9/720 † 0.5/700 Peak Current Value A Current Waveform µs TISP4xxxM3 25 °C Rating A Series Resistance Ω 2500 500 2/10 300 11 1000 100 10/1000 50 1500 200 10/160 120 2x5.6 800 100 10/560 75 3 FCC Part 68 (March 1998) 1500 37.5 5/320 † 100 0 1000 25 5/320 † 100 0 I3124 1500 37.5 0.2/310 100 0 37.5 1500 5/310 100 0 10/700 ITU-T K.20/K.21 100 4000 † FCC Part 68 terminology for the waveforms produced by the ITU-T recommendation K.21 10/700 impulse generator GR-1089-CORE If the impulse generator current exceeds the protector’s current rating, then a series resistance can be used to reduce the current to the protector’s rated value to prevent possible failure. The required value of series resistance for a given waveform is given by the following calculations. First, the minimum total circuit impedance is found by dividing the impulse generator’s peak voltage by the protector’s rated current. The impulse generator’s fictive impedance (generator’s peak voltage divided by peak short circuit current) is then subtracted from the minimum total circuit impedance to give the required value of series resistance. For the FCC Part 68 10/560 waveform the following values result. The minimum total circuit impedance is 800/75 = 10.7 Ω and the generator’s fictive impedance is 800/100 = 8 Ω. This gives a minimum series resistance value of 10.7 - 8 = 2.7 Ω. After allowing for tolerance, a 3 Ω ±10% resistor would be suitable. The 10/160 waveform needs a standard resistor value of 5.6 Ω per conductor. These would be R1a and R1b in Figure 15 and Figure 16. FCC Part 68 allows the equipment to be non-operational after the 10/160 (conductor to ground) and 10/560 (interconductor) impulses. The series resistor value may be reduced to zero to pass FCC Part 68 in a non-operational mode, e.g. Figure 14. For this type of design, the series fuse must open before the TISP4xxxM3 fails. For Figure 14, the maximum fuse i2t is 2.3 A2s. In some cases, the equipment will require verification over a temperature range. By using the rated waveform values from Figure 11, the appropriate series resistor value can be calculated for ambient temperatures in the range of -40 °C to 85 °C. NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4xxxM3LM Overvoltage Protector Series APPLICATIONS INFORMATION AC Power Testing The protector can withstand currents applied for times not exceeding those shown in Figure 8. Currents that exceed these times must be terminated or reduced to avoid protector failure. Fuses, PTC (Positive Temperature Coefficient) resistors and fusible resistors are overcurrent protection devices which can be used to reduce the current flow. Protective fuses may range from a few hundred milliamperes to one ampere. In some cases, it may be necessary to add some extra series resistance to prevent the fuse from opening during impulse testing. The current versus time characteristic of the overcurrent protector must be below the line shown in Figure 8. In some cases there may be a further time limit imposed by the test standard (e.g. UL 1459 wiring simulator failure). Capacitance The protector characteristic off-state capacitance values are given for d.c. bias voltage, VD, values of 0, -1 V, -2 V and -50 V. Where possible, values are also given for -100 V. Values for other voltages may be calculated by multiplying the VD = 0 capacitance value by the factor given in Figure 6. Up to 10 MHz, the capacitance is essentially independent of frequency. Above 10 MHz, the effective capacitance is strongly dependent on connection inductance. In many applications, such as Figure 15 and Figure 17, the typical conductor bias voltages will be about -2 V and -50 V. Figure 7 shows the differential (line unbalance) capacitance caused by biasing one protector at -2 V and the other at -50 V. Normal System Voltage Levels The protector should not clip or limit the voltages that occur in normal system operation. For unusual conditions, such as ringing without the line connected, some degree of clipping is permissible. Under this condition, about 10 V of clipping is normally possible without activating the ring trip circuit. Figure 10 allows the calculation of the protector VDRM value at temperatures below 25 °C. The calculated value should not be less than the maximum normal system voltages. The TISP4260M3LM, with a VDRM of 200 V, can be used for the protection of ring generators producing 100 V rms of ring on a battery voltage of -58 V (Th2 and Th3 in Figure 17). The peak ring voltage will be 58 + 1.414*100 = 199.4 V. However, this is the open circuit voltage and the connection of the line and its equipment will reduce the peak voltage. In the extreme case of an unconnected line, clipping the peak voltage to 190 V should not activate the ring trip. This level of clipping would occur at the temperature when the VDRM has reduced to 190/200 = 0.95 of its 25 °C value. Figure 10 shows that this condition will occur at an ambient temperature of -28 °C. In this example, the TISP4260M3LM will allow normal equipment operation provided that the minimum expected ambient temperature does not fall below -28 °C. JESD51 Thermal Measurement Method To standardize thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51 standard. Part 2 of the standard (JESD51-2, 1995) describes the test environment. This is a 0.0283 m3 (1 ft3) cube which contains the test PCB (Printed Circuit Board) horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for packages smaller than 27 mm (1.06 ’’) on a side and the other for packages up to 48 mm (1.89 ’’). The LM package measurements used the smaller 76.2 mm x 114.3 mm (3.0 ’’ x 4.5 ’’) PCB. The JESD51-3 PCBs are designed to have low effective thermal conductivity (high thermal resistance) and represent a worse case condition. The PCBs used in the majority of applications will achieve lower values of thermal resistance and so can dissipate higher power levels than indicated by the JESD51 values. NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4xxxM3LM Overvoltage Protector Series Typical Circuits TIP WIRE MODEM FUSE TIP WIRE R1a RING DETECTOR Th3 HOOK SWITCH TISP4350 OR TISP4400 RING WIRE PROTECTED EQUIPMENT Th1 D.C. SINK Th2 SIGNAL AI6XBM E.G. L INE CARD R1b RING WIRE AI6XBK Figure 14. MODEM Inter-wire Protection Figure 15. Protection Module R1a Th3 SIGNAL Th1 Th2 R1b AI6XBL D.C. Figure 16. ISDN Protection OVERCURRENT PROTECTION TIP WIRE RING/TEST PROTECTION TEST RELAY RING RELAY SLIC RELAY S3a R1a Th3 S1a SLIC PROTECTION Th4 S2a SLIC Th1 Th2 RING WIRE Th5 R1b S3b S1b S2b TISP6xxxx, TISPPBLx, 1/2TISP6NTP2 C1 220 nF TEST EQUIPMENT RING GENERATOR Figure 17. Line Card Ring/Test Protection NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. VBAT AI6XBJ TISP4xxxM3LM Overvoltage Protector Series MECHANICAL DATA Device Symbolization Code Devices will be coded as below. Device TISP4070M3LM TISP4080M3LM TISP4095M3LM TISP4115M3LM TISP4125M3LM TISP4145M3LM TISP4165M3LM TISP4180M3LM TISP4220M3LM TISP4240M3LM TISP4250M3LM TISP4260M3LM TISP4290M3LM TISP4300M3LM TISP4350M3LM TISP4395M3LM TISP4400M3LM Symbolization Code 4070M3 4080M3 4095M3 4115M3 4125M3 4145M3 4165M3 4180M3 4220M3 4240M3 4250M3 4260M3 4290M3 4300M3 4350M3 4395M3 4400M3 Carrier Information Devices are shipped in one of the carriers below. A reel contains 2000 devices. Package Type Straight Lead DO-92 Straight Lead DO-92 Formed Lead DO-92 For Standard Termination Finish Carrier Order As Bulk Pack TISP4xxxM3LM Tape and Reeled TISP4xxxM3LMR Tape and Reeled TISP4xxxM3LMFR For Lead Free Termination Finish Order As TISP4xxxM3LM-S TISP4xxxM3LMR-S TISP4xxxM3LMFRS NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4xxxM3LM Overvoltage Protector Series MECHANICAL DATA LM002 (DO-92) 2-Pin Cylindrical Plastic Package 2-Pin Cylindrical Plastic Package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. LM002 Package (DO-92) 4.44 - 5.21 (.175 - .205) 3.17 - 4.19 (.125 - .165) 3.43 MIN. (.135) 2.03 - 2.67 (.080 - .105) 2.03 - 2.67 (.080 - .105) 4.32 - 5.34 (.170 - .210) MAX. 2.20 (.086) A 2 MIN. 2 12.7 (0.5) 0.40 - 0.56 (.016 - .022) 1 3 3 1 VIEW A 1.14 - 1.40 (.045 - .055) 0.35 - 0.41 (.014 - .016) 2.41 - 2.67 (.095 - .105) DIMENSIONS ARE: METRIC (INCHES) MD4XARA NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4xxxM3LM Overvoltage Protector Series MECHANICAL DATA LM002 (DO-92) - Formed Leads Version- 2-Pin Cylindrical Plastic Package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. LMF002 (DO-92) - Formed Leads Version of LM002 4.44 - 5.21 (.175 - .205) 3.17 - 4.19 (.125 - .165) 3.43 MIN. (.135) 2.03 - 2.67 (.080 - .105) 2.03 - 2.67 (.080 - .105) 4.32 - 5.34 (.170 - .210) MAX. 2.20 (.086) MAX. 4.00 (.157) A 2 2 0.40 - 0.56 (.016 - .022) 1 3 3 1 VIEW A 2.40 - 2.90 (.094 - .114) 0.35 - 0.41 (.014 - .016) 2.40 - 2.90 (.094 - .114) DIMRNSIONS ARE: METRIC (INCHES) MD4XASA NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4xxxM3LM Overvoltage Protector Series MECHANICAL DATA Tape Dimensions LMF002 Package (Formed Lead DO-92) Tape LMF002 Tape Dimensions Conform to the Requirements of EIA-468-B 11.70 - 13.70 (.461 - .539) Body Indent Visible 23.00 - 32.00 (.906 - 1.260) 17.66 - 27.68 (.695 -1.090) 15.50 - 16.53 (.610 - .650) 2.50 MIN. (.098) 0.00 - 0.50 (0.00 - .020) 8.50 - 11.00 (.335 - .433) 8.50 - 9.75 (.335 - .384) 4.88 - 5.28 (.192 - .208) 5.50 - 19.00 (.217 - .748) ø Adhesive Tape on Reverse Side - Shown Dashed VIEW A 17.50 - 19.00 (.689 - .748) 3.70 - 4.30 (.146 - .169) 3.41 - 4.21 (.134 - .166) 12.40 - 13.00 (.488 - .512) Tape Section Shown in View A Flat of DO-92 Body Towards Reel Axis Direction of Feed DIMENSIONS ARE: METRIC (INCHES) MD 4X A Q C “TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office. “Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries. NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.