*R oH S CO M PL IA NT TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL, TISP7250H3SL THRU TISP7400H3SL TRIPLE ELEMENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS TISP7xxxH3SL Overvoltage Protector Series TISP7xxxH3SL Overview This TISP® device series protects central office, access and customer premise equipment against overvoltages on the telecom line. The TISP7xxxH3SL has the same symmetrical bidirectional protection on any terminal pair; R-T, R-G and T-G. In addition, the device is rated for simultaneous R-G and T-G impulse conditions. The TISP7xxxH3SL is available in a wide range of voltages and has a high current capability, allowing minimal series resistance to be used. These protectors have been specified mindful of the following standards and recommendations: GR-1089-CORE, FCC Part 68, UL1950, EN 60950, IEC 60950, ITU-T K.20, K.21 and K.45. The TISP7350H3SL meets the FCC Part 68 “B” ringer voltage requirement and survives both Type A and B impulse tests. These devices are housed in a through-hole 3-pin single-in-line (SL) plastic package. Summary Electrical Characteristics VDRM V(BO) VT @ IT V V V TISP7070H3 58 70 3 TISP7080H3 65 80 3 TISP7095H3 75 95 3 TISP7125H3 100 125 3 TISP7135H3 110 135 3 TISP7145H3 120 145 3 TISP7165H3 130 165 3 TISP7180H3 145 180 3 TISP7200H3 150 200 3 TISP7210H3 160 210 3 TISP7220H3 170 220 3 TISP7250H3 200 250 3 TISP7290H3 230 290 3 TISP7300H3 230 300 3 TISP7350H3 275 350 3 TISP7400H3 300 400 3 † Bourns' part has an improved protection voltage Part # IDRM µA 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 I(BO) mA 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 IT A 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 IH mA 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 Co @ -2 V pF 140 140 140 74 74 74 74 74 74 74 74 62 62 62 62 62 Functionally Replaces ITSM A 1 cycle 60 Hz 60 di/dt A/µs 2/10 Wavefront 400 P1553AC† P1803AC† P2103AC† P2353AC† P2703AC† P3203AC P3403AC Summary Current Ratings ITSP A Parameter Waveshape Value 2/10 500 1.2/50, 8/20 350 10/160 250 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 5/320 200 10/560 130 10/1000 100 TISP7xxxH3SL Overvoltage Protector Series ITU-T K.20/21 Rating . . . . . . . . 8 kV 10/700, 200 A 5/310 SL Package (Top View) Ion-Implanted Breakdown Region Precise and Stable Voltage Low Voltage Overshoot under Surge Device ‘7070 ‘7080 ‘7095 ‘7125 ‘7135 ‘7145 ‘7165 ‘7180 ‘7200 ‘7210 ‘7220 ‘7250 ‘7290 ‘7350 ‘7400 V(BO) G 2 V 58 65 75 100 110 120 130 145 150 160 170 200 230 275 300 V 70 80 95 125 135 145 165 180 200 210 220 250 290 350 400 R 3 Waveshape Standard 2/10 µs 8/20 µs 10/160 µs GR-1089-CORE IEC 61000-4-5 FCC Part 68 FCC Part 68 ITU-T K.20/21 FCC Part 68 GR-1089-CORE 10/560 µs 10/1000 µs 1 VDRM MDXXAGA Device Symbol T R SD7XAB G Terminals T, R and G correspond to the alternative line designators of A, B and C Rated for International Surge Wave Shapes - Single and Simultaneous Impulses 10/700 µs T ITSP 3-Pin Through-Hole Packaging - Compatible with TO-220AB pin-out A 500 350 250 -Low Height .................................................................... 8.3 mm Low Differential Capacitance ....................................... < 72 pF 200 .............................................. UL Recognized Component 130 100 Description The TISP7xxxH3SL limits overvoltages between the telephone line Ring and Tip conductors and Ground. Overvoltages are normally caused by a.c. power system or lightning flash disturbances which are induced or conducted on to the telephone line. Each terminal pair, T-G, R-G and T-R, has a symmetrical voltage-triggered bidirectional thyristor protection characteristic. Overvoltages are initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current prevents d.c. latchup as the diverted current subsides. How To Order Device Package Carrier TISP7xxxH3 SL (Single-in-Line) Tube Order As TISP7xxxH3SL-S Insert xxx value corresponding to protection voltages of 070, 080, 095, 125 etc. MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP7xxxH3SL Overvoltage Protector Series Description (continued) This TISP7xxxH3SL range consists of fifteen voltage variants to meet various maximum system voltage levels (58 V to 300 V). They are guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. These high current protection devices are in a 3-pin single-in-line (SL) plastic package and are supplied in tube pack. For alternative impulse rating, voltage and holding current values in SL packaged protectors, consult the factory. For lower rated impulse currents in the SL package, the 45 A 10/1000 TISP7xxxF3SL series is available. These monolithic protection devices are fabricated in ion-implanted planar structures to ensure precise and matched breakover control and are virtually transparent to the system in normal operation. Absolute Maximum Ratings, TA = 25 °C (Unless Otherwise Noted) Rating Repetitive peak off-state voltage, (see Note 1) Symbol ‘7070 ‘7080 ‘7095 ‘7125 ‘7135 ‘7145 ‘7165 ‘7180 ‘7200 ‘7210 ‘7220 ‘7250 ‘7290 ‘7350 ‘7400 Non-repetitive peak on-state pulse current (see Notes 2, and 3) 2/10 (Telcordia GR-1089-CORE, 2/10 voltage wave shape) 8/20 µs (IEC 61000-4-5, 1.2/50 µs voltage, 8/20 current combination wave generator) 10/160 µs (FCC Part 68, 10/160 µs voltage wave shape) 4/250 (ITU-T K.20/21, 10/700 voltage wave shape, dual) 0.2/310 (CNET I 31-24, 0.5/700 voltage wave shape) 5/310 (ITU-T K.20/21, 10/700 voltage wave shape, single) 5/320 µs (FCC Part 68, 9/720 µs voltage wave shape) 10/560 µs (FCC Part 68, 10/560 µs voltage wave shape) 10/1000 (Telcordia GR-1089-CORE, 10/1000 voltage wave shape) Non-repetitive peak on-state current (see Notes 2, 3 and 4) 20 ms (50 Hz) full sine wave 16.7 ms (60 Hz) full sine wave 1000 s 50 Hz/60 Hz a.c. Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 200 A Junction temperature Storage temperature range VDRM ITSP Value ± 58 ± 65 ± 75 ±100 ±110 ±120 ±130 ±145 ±150 ±160 ±170 ±200 ±230 ±275 ±300 500 350 250 225 200 200 200 130 100 Unit V A ITSM 55 60 0.9 A diT/dt TJ Tstg 400 -40 to +150 -65 to +150 A/µs °C °C NOTES: 1. Derate value at -0.13%/°C for temperatures below 25 °C. 2. Initially the TISP7xxxH3 must be in thermal equilibrium. 3. These non-repetitive rated currents are peak values of either polarity. The rated current values may be applied to any terminal pair. Additionally, both R and T terminals may have their rated current values applied simultaneously (in this case the G terminal return current will be the sum of the currents applied to the R and T terminals). The surge may be repeated after the TISP7xxxH3 returns to its initial conditions. 4. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring track widths. Derate current values at -0.61 %/°C for ambient temperatures above 25 °C. MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP7xxxH3SL Overvoltage Protector Series Electrical Characteristics for any Terminal Pair, TA = 25 °C (Unless Otherwise Noted) IDRM Parameter Repetitive peak offstate current VD = VDRM V(BO) Breakover voltage dv/dt = ±750 V/ms, V(BO) Impulse breakover voltage dv/dt ≤ ±1000 V/µs, Linear voltage ramp, Maximum ramp value = ±500 V di/dt = ±20 A/µs, Linear current ramp, Maximum ramp value = ±10 A I(BO) VT IH dv/dt ID Breakover current On-state voltage Holding current Critical rate of rise of off-state voltage Off-state current Test Conditions Min TA = 25 °C TA = 85 °C ‘7070 ‘7080 ‘7095 ‘7125 ‘7135 ‘7145 ‘7165 ‘7180 ‘7200 ‘7210 ‘7220 ‘7250 ‘7290 ‘7350 ‘7400 ‘7070 ‘7080 ‘7095 ‘7125 ‘7135 ‘7145 ‘7165 ‘7180 ‘7200 ‘7210 ‘7220 ‘7250 ‘7290 ‘7350 ‘7400 RSOURCE = 300 Ω dv/dt = ±750 V/ms, RSOURCE = 300 Ω IT = ±5 A, tW = 100 µs IT = ±5 A, di/dt = - /+30 mA/ms ±0.1 ±0.15 Linear voltage ramp, Maximum ramp value < 0.85VDRM VD = ±50 V Typ Max ±5 ±10 ±70 ±80 ±95 ±125 ±135 ±145 ±165 ±180 ±200 ±210 ±220 ±250 ±290 ±350 ±400 ±78 ±88 ±103 ±134 ±144 ±154 ±174 ±189 ±210 ±220 ±231 ±261 ±302 ±362 ±414 ±0.8 ±5 ±0.6 µA V V A V A kV/µs ±5 TA = 85 °C Unit ±10 µA MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP7xxxH3SL Overvoltage Protector Series Electrical Characteristics for any Terminal Pair, TA = 25 °C (Unless Otherwise Noted) A Parameter Coff Off-state capacitance f = 1 MHz, Test Conditions Vd = 1 V rms, VD = 0, f = 1 MHz, Vd = 1 V rms, VD = -1 V f = 1 MHz, Vd = 1 V rms, VD = -2 V f = 1 MHz, Vd = 1 V rms, VD = -50 V f = 1 MHz, Vd = 1 V rms, VD = -100 V (see Note 5) NOTE Min Typ ‘7070 thru ‘7095 ‘7125 thru ‘7220 ‘7250 thru ‘7400 ‘7070 thru ‘7095 ‘7125 thru ‘7220 ‘7250 thru ‘7400 ‘7070 thru ‘7095 ‘7125 thru ‘7220 ‘7250 thru ‘7400 ‘7070 thru ‘7095 ‘7125 thru ‘7220 ‘7250 thru ‘7400 ‘7125 thru ‘7220 ‘7250 thru ‘7400 Max 170 90 84 150 79 67 140 74 62 73 35 28 33 26 Unit Max Unit 50 °C/W pF 5: To avoid possible voltage clipping, the ‘7125 is tested with VD = -98 V. Thermal Characteristics Parameter R θJA NOTE Junction to free air thermal resistance Test Conditions EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note 6) Min Typ 6: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths. MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP7xxxH3SL Overvoltage Protector Series Parameter Measurement Information +i Quadrant I ITSP Switching Characteristic ITSM IT V(BO) VT I(BO) IH VDRM -v IDRM ID VD ID IDRM VD VDRM +v IH I(BO) V(BO) VT IT ITSM Quadrant III Switching Characteristic ITSP -i VD = ±50 V and ID = ±10 µA used for reliability release PM4XAAC Figure 1. Voltage-current Characteristic for Terminal Pairs MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP7xxxH3SL Overvoltage Protector Series Typical Characteristics OFF-STATE CURRENT vs JUNCTION TEMPERATURE 10 TC7AAA NORMALIZED BREAKOVER VOLTAGE vs JUNCTION TEMPERATURE TC7AABA 1.10 '7125 THRU '7220 VD = +50 V Normalized Breakover Voltage |ID| - Off-State Current - µA 1 1.05 VD = -50 V 0·1 '7250 THRU '7400 0·01 '7070 THRU '7095 '7250 THRU '7400 1.00 0·001 0.95 0·0001 0 25 50 75 100 125 TJ - Junction Temperature - °C -25 150 0 25 50 75 100 125 TJ - Junction Temperature - °C Figure 2. 150 Figure 3. 4.0 200 150 TA = 25 °C 3.0 tW = 100 µs 100 TC7AAC + I(BO), - I(BO) '7070 THRU '7220 1.5 70 50 2.0 40 30 1.5 20 15 10 1.0 7 0.9 5 0.8 4 0.7 3 0.6 2 0.5 1.5 NORMALIZED HOLDING CURRENT vs JUNCTION TEMPERATURE 2.0 Normalized Holding Current Breakover Current Normalized to 25 °C Holding Current ON-STATE CURRENT NORMALIZED BREAKOVER CURRENT vs vs ON-STATE VOLTAGE TC7AADA JUNCTION TEMPERATURE '3125 THRU '3210 + I(BO), - I(BO) '7250 THRU '7400 '3250 THRU '3350 1 0.4 0.7 -251 '3070 THRU '3095 1.0 0.9 0.8 0.7 0.6 0.5 0.4 5 7125 0 1.5 252 50 3 1 754 100 TJV-TJunction Temperature - On-State Voltage - V- °C 0 150 Figure 4. MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. -25 0 25 50 75 100 TJ - Junction Temperature - °C Figure 5. 125 150 TISP7xxxH3SL Overvoltage Protector Series Typical Characteristics Capacitance Normalized to VD = -1V 0.7 0.6 0.5 '7070 THRU '7095 0.4 '7125 THRU '7220 0.3 '7250 THRU '7400 0.2 1 2 3 5 10 20 30 50 VD - Off-state Voltage - V Figure 6. 100 150 TC7AAHA '7350 '7400 75 '7290 TJ = 25°C Vd = 1 Vrms 0.8 80 '7250 0.9 '7125 '7135 '7145 '7165 '7180 '7200 '7210 '7220 TC7AAIA DIFFERENTIAL OFF-STATE CAPACITANCE vs RATED REPETIVE PEAK OFF-STATE VOLTAGE '7070 '7080 '7095 1 ∆C - Differential Off-State Capacitance - pF NORMALIZED CAPACITANCE vs OFF-STATE VOLTAGE 70 65 60 ∆C = Coff(-2 V) - Coff(-50 V) 55 50 45 40 35 30 50 60 70 80 100 150 200 250 300 VDRM - Repetitive Peak Off-State Voltage - V 400 Figure 7. MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP7xxxH3SL Overvoltage Protector Series Rating and Thermal Information ITSM(t) - Non-Repetitive Peak On-State Current - A 30 NON-REPETITIVE PEAK ON-STATE CURRENT vs CURRENT DURATION TI7AB VGEN = 600 V rms, 50/60 Hz RGEN = 1.4*VGEN/ITSM(t) EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB, TA = 25 °C SIMULTANEOUS OPERATION OF R AND T TERMINALS. G TERMINAL CURRENT = 2xITSM(t) 20 15 10 9 8 7 6 5 4 3 2 1.5 1 0.9 0.8 0·1 1 10 100 1000 t - Current Duration - s Figure 8. VDRM DERATING FACTOR vs MINIMUM AMBIENT TEMPERATURE 1.00 IMPULSE RATING vs AMBIENT TEMPERATURE TI7AACA 700 600 0.99 TC7HAA TELCORDIA 2/10 500 IEC 1.2/50, 8/20 400 0.97 Impulse Current - A Derating Factor 0.98 '7070 THRU '7095 0.96 300 FCC 10/160 250 200 150 ITU-T 10/700 FCC 10/560 0.95 120 '7125 THRU '7220 0.94 '7250 THRU '7400 0.93 -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 TAMIN - Minimum Ambient Temperature - °C Figure 9. MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TELCORDIA 10/1000 100 90 80 70 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 TA - Ambient Temperature - °C Figure 10. TISP7xxxH3SL Overvoltage Protector Series APPLICATIONS INFORMATION Deployment These devices are three terminal overvoltage protectors. They limit the voltage between three points in the circuit. Typically, this would be the two line conductors and protective ground (Figure 11). Th3 Th1 Th2 Figure 11. MULTI-POINT PROTECTION In Figure 11, protectors Th2 and Th3 limit the maximum voltage between each conductor and ground to the ±V(BO) of the individual protector. Protector Th1 limits the maximum voltage between the two conductors to its ±V(BO) value. Manufacturers are being increasingly required to design in protection coordination. This means that each protector is operated at its design level and currents are diverted through the appropriate protector, e.g. the primary level current through the primary protector and lower levels of current may be diverted through the secondary or inherent equipment protection. Without coordination, primary level currents could pass through the equipment only designed to pass secondary level currents. To ensure coordination happens with fixed voltage protectors, some resistance is normally used between the primary and secondary protection. The values given in this data sheet apply to a 400 V (d.c. sparkover) gas discharge tube primary protector and the appropriate test voltage when the equipment is tested with a primary protector. Impulse Testing To verify the withstand capability and safety of the equipment, standards require that the equipment is tested with various impulse wave forms. The table below shows some common values. Voltage Peak Current Current TISP7xxxH3 Series Value Waveform 25 °C Rating Resistance Waveform A µs A Ω µs 2500 2/10 500 2/10 500 GR-1089-CORE 0 1000 10/1000 100 10/1000 100 1500 10/160 200 10/160 250 800 10/560 100 10/560 130 FCC Part 68 0 1000 9/720 † 25 5/320 † 200 (March 1998) 1500 (SINGLE) 37.5 5/320 † 200 1500 (DUAL) 2 x 27 4/250 2 x 225 I 31-24 1500 0.5/700 37.5 0.2/310 200 0 200 5/310 25 10/700 1000 200 5/310 37.5 (SINGLE) 1500 0 ITU-T K.20/K.21 200 5/310 100 (SINGLE) 4000 2 x 225 4/250 2 x 72 (DUAL) 4000 † FCC Part 68 terminology for the waveforms produced by the ITU-T recommendation K.21 10/700 impulse generator NA = Not Applicable, primary protection removed or not specified. Standard Peak Voltage Setting V Coordination Resistance (Min.) NA NA NA NA NA 4.5 6.0 If the impulse generator current exceeds the protector’s current rating, then a series resistance can be used to reduce the current to the protector’s rated value to prevent possible failure. The required value of series resistance for a given waveform is given by the following calculations. First, the minimum total circuit impedance is found by dividing the impulse generator’s peak voltage by the protector’s rated current. The impulse generator’s fictive impedance (generator’s peak voltage divided by peak short circuit current) is then subtracted from the minimum total circuit impedance to give the required value of series resistance. In some cases, the equipment will require verification over a temperature range. By using the rated waveform values from Figure 10, the appropriate series resistor value can be calculated for ambient temperatures in the range of -40 °C to 85 °C. MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP7xxxH3SL Overvoltage Protector Series APPLICATIONS INFORMATION AC Power Testing The protector can withstand the G return currents applied for times not exceeding those shown in Figure 8. Currents that exceed these times must be terminated or reduced to avoid protector failure. Fuses, PTC (Positive Temperature Coefficient) resistors and fusible resistors are overcurrent protection devices which can be used to reduce the current flow. Protective fuses may range from a few hundred milliamperes to one ampere. In some cases, it may be necessary to add some extra series resistance to prevent the fuse opening during impulse testing. The current versus time characteristic of the overcurrent protector must be below the line shown in Figure 8. In some cases there may be a further time limit imposed by the test standard (e.g. UL 1459 wiring simulator failure). Capacitance The protector characteristic off-state capacitance values are given for d.c. bias voltage, VD , values of 0, -1 V, -2 V and -50 V. Where possible, values are also given for -100 V. Values for other voltages may be calculated by multiplying the VD = 0 capacitance value by the factor given in Figure 6. Up to 10 MHz, the capacitance is essentially independent of frequency. Above 10 MHz, the effective capacitance is strongly dependent on connection inductance. For example, a printed wiring (PW) trace of 10 cm could create a circuit resonance with the device capacitance in the region of 50 MHz. In many applications, the typical conductor bias voltages will be about -2 V and -50 V. Figure 7 shows the differential (line unbalance) capacitance caused by biasing one protector at -2 V and the other at -50 V. Normal System Voltage Levels The protector should not clip or limit the voltages that occur in normal system operation. For unusual conditions, such as ringing without the line connected, some degree of clipping is permissible. Under this condition, about 10 V of clipping is normally possible without activating the ring trip circuit. Figure 9 allows the calculation of the protector VDRM value at temperatures below 25 °C. The calculated value should not be less than the maximum normal system voltages. The TISP7290H3, with a VDRM of 230 V, can be used for the protection of ring generators producing 105 V rms of ring on a battery voltage of -58 V. The peak ring voltage will be 58 + 1.414*105 = 206.5 V. However, this is the open circuit voltage and the connection of the line and its equipment will reduce the peak voltage. For the extreme case of an unconnected line, the temperature at which clipping begins can be calculated using the data from Figure 9. To possibly clip, the VDRM value has to be 206.5 V. This is a reduction of the 230 V 25 °C VDRM value by a factor of 206.5/230 = 0.90. Figure 9 shows that a 0.90 reduction will occur below an ambient temperature of -40 °C. For this example, the TISP7290H3 will allow normal equipment operation, even on an open-circuit line, down to below -40 °C. JESD51 Thermal Measurement Method To standardize thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51 standard. Part 2 of the standard (JESD51-2, 1995) describes the test environment. This is a 0.0283 m 3 (1 ft 3) cube which contains the test PCB (Printed Circuit Board) horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for packages smaller than 27 mm (1.06 ’’) on a side and the other for packages up to 48 mm (189 ’’). The thermal measurements used the smaller 76.2 mm x 114.3 mm (3.0 ’’ x 4.5 ’’) PCB. The JESD51-3 PCBs are designed to have low effective thermal conductivity (high thermal resistance) and represent a worse case condition. The PCBs used in the majority of applications will achieve lower values of thermal resistance and so can dissipate higher power levels than indicated by the JESD51 values. MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP7xxxH3SL Overvoltage Protector Series Typical Circuits TIP WIRE R1a F1a Th3 PROTECTED EQUIPMENT Th1 E.G. LINE CARD Th2 R1b F1b RING WIRE AI7XBK TISP7xxxH3 Figure 12. Protection Module R1a Th3 SIGNAL Th1 Th2 R1b AI7XBL TISP7150H3 D.C. Figure 13. ISDN Protection OVERCURRENT PROTECTION TIP WIRE RING/TEST PROTECTION TEST RELAY RING RELAY S3a R1a COORDINATION RESISTANCE SLIC RELAY Th3 S1a SLIC PROTECTION Th4 S2a Th1 SLIC Th2 RING WIRE Th5 R1b S3b TISP7xxxH3 S1b S2b TISP6xxxx, TISPPBLx, 1/2TISP6NTP2 C1 220 nF TEST EQUIPMENT RING GENERATOR VBAT AI7XBJ Figure 14. Line Card Ring/Test Protection “TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office. “Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries. MARCH 1999 - REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.