TL750L, TL751L SERIES LOW-DROPOUT VOLTAGE REGULATORS www.ti.com SLVS017S – SEPTEMBER 1987 – REVISED AUGUST 2005 FEATURES • • • Very Low Dropout Voltage, Less Than 0.6 V at 150 mA Very Low Quiescent Current TTL- and CMOS-Compatible Enable on TL751L Series 60-V Load-Dump Protection OUTPUT COMMON COMMON NC 1 8 2 7 3 6 4 5 INPUT COMMON COMMON NC Reverse Transient Protection Down to –50 V Internal Thermal-Overload Protection Overvoltage Protection Internal Overcurrent-Limiting Circuitry Less Than 500-µA Disable (TL751L Series) TL750L . . . KTE PACKAGE (TOP VIEW) TL750L . . . KC PACKAGE (TOP VIEW) COMMON TL750L . . . D PACKAGE (TOP VIEW) • • • • • OUTPUT COMMON INPUT COMMON • OUTPUT COMMON INPUT NC − No internal connection TL751L . . . D PACKAGE (TOP VIEW) OUTPUT COMMON COMMON NC 1 8 2 7 3 6 4 5 INPUT COMMON COMMON ENABLE NC − No internal connection TL751L . . . P PACKAGE (TOP VIEW) OUTPUT NC NC NC 1 8 2 7 3 6 4 5 INPUT NC COMMON ENABLE TL750L . . . LP PACKAGE (TO-92, TO-226AA) (TOP VIEW) INPUT COMMON OUTPUT NC − No internal connection DESCRIPTION/ORDERING INFORMATION The TL750L and TL751L series of fixed-output voltage regulators offer 5-V, 8-V, 10-V, and 12-V options. The TL751L series also has an enable (ENABLE) input. When ENABLE is high, the regulator output is placed in the high-impedance state. This gives the designer complete control over power up, power down, or emergency shutdown. The TL750L and TL751L series are low-dropout positive-voltage regulators specifically designed for battery-powered systems. These devices incorporate overvoltage and current-limiting protection circuitry, along with internal reverse-battery protection circuitry to protect the devices and the regulated system. The series is fully protected against 60-V load-dump and reverse-battery conditions. Extremely low quiescent current during full-load conditions makes these devices ideal for standby power systems. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerFLEX is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1987–2005, Texas Instruments Incorporated TL750L, TL751L SERIES LOW-DROPOUT VOLTAGE REGULATORS www.ti.com SLVS017S – SEPTEMBER 1987 – REVISED AUGUST 2005 ORDERING INFORMATION TJ VO TYP AT 25°C PACKAGE (1) PowerFLEX™ – KTE TL750L05CKTER Tube of 75 TL750L05CD Reel of 2500 TL750L05CDR Tube of 75 TL751L05CD Reel of 2500 TL751L05CDR Bulk of 1000 TL750L05CLP Reel of 2000 TL750L05CLPR Tube of 50 TL750L05CKC Tube of 75 TL750L08CD Reel of 2500 TL750L08CDR TO-226/TO-92 – LP Bulk of 1000 TL750L08CLP 750L08C PDIP – P Tube of 50 TL751L10CP TL751L10C Tube of 75 TL750L10CD Reel of 2500 TL750L10CDR Tube of 75 TL751L10CD Reel of 2500 TL751L10CDR Bulk of 1000 TL750L10CLP Reel of 2000 TL750L10CLPR Tube of 75 TL750L12CD Reel of 2500 TL750L12CDR Tube of 75 TL751L12CD Reel of 2500 TL751L12CDR Bulk of 1000 TL750L12CLP 5V TO-226/TO-92 – LP TO-220 – KC 0°C to 125°C 10 V SOIC – D SOIC – D TO-226/TO-92 – LP 12 V SOIC – D TO-226/TO-92 – LP (1) (2) TL750L05C 50L05C 51L05C 750L05C TL750L05C 50L08C 50L10C 51L10C 750L10C 50L12C 51L12C 750L12C Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current ordering information, see the Package Option Addendum at the end of this data sheet. DEVICE COMPONENT COUNT 2 TOP-SIDE MARKING Reel of 2000 SOIC – D 8V ORDERABLE PART NUMBER (2) Transistors 20 JFETs 2 Diodes 5 Resistors 16 TL750L, TL751L SERIES LOW-DROPOUT VOLTAGE REGULATORS www.ti.com SLVS017S – SEPTEMBER 1987 – REVISED AUGUST 2005 Absolute Maximum Ratings (1) over operating junction temperature range (unless otherwise noted) MIN MAX Continuous input voltage Transient input voltage (2) t ≤ 100 ms Transient reverse input voltage TJ Operating virtual junction temperature Lead temperature Tstg (1) (2) V 60 V –15 V TA = 25°C Continuous reverse input voltage 1,6 mm (1/16 in) for 10 s Storage temperature range –65 UNIT 26 –50 V 150 °C 260 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The transient input voltage rating applies to the waveform shown in Figure 1. Package Thermal Data (1) (1) PACKAGE BOARD θJC θJA PDIP (P) High K, JESD 51-7 57°C/W 85°C/W PowerFLEX™ (KTE) High K, JESD 51-5 3°C/W 23°C/W SOIC (D) High K, JESD 51-7 39°C/W 97°C/W TO-226/TO-92 (LP) High K, JESD 51-7 55°C/W 140°C/W TO-220 (KC) High K, JESD 51-5 3°C/W 19°C/W Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. Recommended Operating Conditions over recommended operating junction temperature range (unless otherwise noted) VI Input voltage VIH High-level ENABLE input voltage MIN MAX TL75xL05 6 26 TL75xL08 9 26 TL75xL10 11 26 TL75xL12 13 26 TL75xLxx 2 15 TJ = 25°C TL75xLxx –0.3 0.8 TJ = 0°C to 125°C TL75xLxx –0.15 0.8 UNIT V V VIL (1) Low-level ENABLE input voltage IO Output current TL75xLxx 0 150 mA TJ Operating virtual junction temperature TL75xLxxC 0 125 °C (1) V The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for ENABLE voltage levels and temperature only. 3 TL750L, TL751L SERIES LOW-DROPOUT VOLTAGE REGULATORS www.ti.com SLVS017S – SEPTEMBER 1987 – REVISED AUGUST 2005 TL75xL05 Electrical Characteristics (1) VI = 14 V, IO = 10 mA, TJ = 25°C (unless otherwise noted) PARAMETER Output voltage Input regulation voltage VI = 6 V to 26 V, IO = 0 to 150 mA TJ = 0°C to 125°C TYP 4.8 5 4.75 VI = 6 V to 26 V 6 30 IO = 5 mA to 150 mA 60 65 20 0.2 IO = 150 mA 0.6 f = 10 Hz to 100 kHz VI = 6 V to 26 V, IO = 10 mA, TJ = 0°C to 125°C 1 ENABLE ≥ 2 V mV mV V µV 500 10 V dB 50 IO = 10 mA IO = 150 mA (1) 5.2 5.25 10 VI = 8 V to 18 V, f = 120 Hz Input bias current UNIT MAX 5 Output regulation voltage Output noise voltage TJ = 25°C MIN VI = 9 V to 16 V Ripple rejection Dropout voltage TL750L05 TL751L05 TEST CONDITIONS 12 2 mA 0.5 Pulse-testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 10-µF capacitor, with equivalent series resistance of less than 0.4 Ω, across the output. TL75xL08 Electrical Characteristics (1) VI = 14 V, IO = 10 mA, TJ = 25°C (unless otherwise noted) PARAMETER Output voltage Input regulation voltage VI = 9 V to 26 V, IO = 0 to 150 mA TJ = 0°C to 125°C 8 8.32 7.6 8.4 20 50 60 65 40 0.2 IO = 150 mA 0.6 f = 10 Hz to 100 kHz VI = 9 V to 26 V, IO = 10 mA, TJ = 0°C to 125°C ENABLE ≥ 2 V V mV dB 80 IO = 10 mA IO = 150 mA 4 7.68 25 IO = 5 mA to 150 mA (1) MAX 10 VI = 11 V to 21 V, f = 120 Hz Input bias current TYP VI = 9 V to 26 V Output regulation voltage Output noise voltage TJ = 25°C UNIT MIN VI = 10 V to 17 V Ripple rejection Dropout voltage TL750L08 TL751L08 TEST CONDITIONS mV V µV 500 10 12 1 2 mA 0.5 Pulse-testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 10-µF capacitor, with equivalent series resistance of less than 0.4 Ω, across the output. TL750L, TL751L SERIES LOW-DROPOUT VOLTAGE REGULATORS www.ti.com SLVS017S – SEPTEMBER 1987 – REVISED AUGUST 2005 TL75xL10 Electrical Characteristics (1) VI = 14 V, IO = 10 mA, TJ = 25°C (unless otherwise noted) PARAMETER Output voltage Input regulation voltage VI = 11 V to 26 V, IO = 0 to 150 mA TYP MAX TJ = 25°C 9.6 10 10.4 TJ = 0°C to 125°C 9.5 25 VI = 11 V to 26 V 30 60 VI = 12 V to 22 V, f = 120 Hz IO = 5 mA to 150 mA 60 65 50 0.2 IO = 150 mA 0.6 f = 10 Hz to 100 kHz VI = 11 V to 26 V, IO = 10 mA, TJ = 0°C to 125°C 1 ENABLE ≥ 2 V (1) mV mV V µV 700 10 V dB 100 IO = 10 mA IO = 150 mA Input bias current 10.5 10 Output regulation voltage Output noise voltage UNIT MIN VI = 12 V to 19 V Ripple rejection Dropout voltage TL750L10 TL751L10 TEST CONDITIONS 12 2 mA 0.5 Pulse-testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 10-µF capacitor, with equivalent series resistance of less than 0.4 Ω, across the output. TL75xL12 Electrical Characteristics (1) VI = 14 V, IO = 10 mA, TJ = 25°C (unless otherwise noted) PARAMETER Output voltage Input regulation voltage VI = 13 V to 26 V, IO = 0 to 150 mA TJ = 0°C to 125°C TYP MAX 11.52 12 12.48 11.4 15 30 20 40 VI = 13 V to 23 V, f = 120 Hz IO = 5 mA to 150 mA 55 50 IO = 150 mA 0.6 f = 10 Hz to 100 kHz VI = 13 V to 26 V, IO = 10 mA, TJ = 0°C to 125°C V mV dB 120 0.2 ENABLE ≥ 2 V (1) 50 IO = 10 mA IO = 150 mA Input bias current 12.6 VI = 13 V to 26 V Output regulation voltage Output noise voltage TJ = 25°C UNIT MIN VI = 14 V to 19 V Ripple rejection Dropout voltage TL750L12 TL751L12 TEST CONDITIONS mV V µV 700 10 12 1 2 mA 0.5 Pulse-testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 10-µF capacitor, with equivalent series resistance of less than 0.4 Ω, across the output. PARAMETER MEASUREMENT INFORMATION The TL750L, TL751L series are low-dropout regulators. This means that capacitance loading is important to the performance of the regulator because it is a vital part of the control loop. The capacitor value and its equivalent series resistance (ESR) both affect the control loop and must be defined for the load range and temperature range. Figure 1 shows the recommended range of ESR for a given load with a 10-µF capacitor on the output. 5 TL750L, TL751L SERIES LOW-DROPOUT VOLTAGE REGULATORS www.ti.com SLVS017S – SEPTEMBER 1987 – REVISED AUGUST 2005 TYPICAL CHARACTERISTICS TL750L05 EQUIVALENT SERIES RESISTANCE vs LOAD CURRENT TRANSIENT INPUT VOLTAGE vs TIME 60 0.9 0.8 Potential Instability Region 0.7 0.6 0.5 0.4 0.3 Region of Best Stability 0.2 0.1 0.024 0 TA = 25°C VI = 14 V + 46e(−t/0.230) for t ≥ 5 ms CL = 10-µF Tantalum Capacitor TA = − 40°C to 125°C V i − Transient Input Voltage − V ESR − Equivalent Series Resistance − Ω 1.0 50 40 30 tr = 1 ms 20 10 0 Potential Instability Region 10 80 120 0 0 150 100 200 300 400 500 600 t − Time − ms IL − Load Current − mA Figure 1. Figure 2. TL750L05 INPUT CURRENT vs INPUT VOLTAGE TL750L12 INPUT CURRENT vs INPUT VOLTAGE 60 40 35 50 II − Input Current − mA II − Input Current − mA 30 25 20 15 40 30 20 10 10 5 0 0 0 1 2 3 4 VI − Input Voltage − V Figure 3. 6 5 6 0 2 4 6 8 10 VI − Input Voltage − V Figure 4. 12 14 PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9166901Q2A OBSOLETE LCCC FK 20 TBD Call TI Call TI 5962-9166901QPA OBSOLETE CDIP JG 8 TBD Call TI Call TI TL750L05CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L05CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L05CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L05CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L05CKC NRND TO-220 KC 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L05CKCE3 NRND TO-220 KC 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L05CKCS ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L05CKTER NRND PFM KTE 3 2000 TBD CU SNPB TL750L05CLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN Level-1-220C-UNLIM N / A for Pkg Type TL750L05CLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L05CLPM OBSOLETE TO-92 LP 3 TBD Call TI Call TI TL750L05CLPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L05CLPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L05CP OBSOLETE PDIP P 8 TBD Call TI Call TI TL750L05QD OBSOLETE SOIC D 8 TBD Call TI Call TI TL750L05QDR OBSOLETE SOIC D 8 TBD Call TI Call TI TL750L05QKC OBSOLETE TO-220 KC 3 TBD Call TI Call TI TL750L05QLP OBSOLETE TO-92 LP 3 TBD Call TI Call TI TL750L05QP OBSOLETE PDIP P 8 TBD Call TI Call TI TL750L08CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TL750L08CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TL750L08CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TL750L08CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TL750L08CKC OBSOLETE TO-220 KC 3 TBD Call TI Call TI TL750L08CLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L08CLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L08CP OBSOLETE PDIP P 8 TBD Call TI Call TI TL750L08QD OBSOLETE SOIC D 8 TBD Call TI Call TI Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2007 Orderable Device Status (1) TL750L08QDR OBSOLETE SOIC D 8 TBD Call TI Call TI TL750L08QKC OBSOLETE TO-220 KC 3 TBD Call TI Call TI TL750L08QLP OBSOLETE TO-92 LP 3 TBD Call TI Call TI TL750L10CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L10CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L10CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L10CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L10CKC OBSOLETE TO-220 KC 3 TBD Call TI Call TI TL750L10CLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L10CLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L10CLPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L10CLPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) TL750L10CP OBSOLETE PDIP P 8 TBD Call TI Call TI TL750L10QD OBSOLETE SOIC D 8 TBD Call TI Call TI TL750L10QDR OBSOLETE SOIC D 8 TBD Call TI Call TI TL750L10QKC OBSOLETE TO-220 KC 3 TBD Call TI Call TI TL750L10QLP OBSOLETE TO-92 LP 3 TBD Call TI Call TI TL750L10QP OBSOLETE PDIP P 8 TBD Call TI Call TI TL750L12CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L12CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L12CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L12CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL750L12CKC OBSOLETE TO-220 KC 3 TBD Call TI Call TI TL750L12CLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L12CLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type TL750L12CP OBSOLETE PDIP P 8 TBD Call TI Call TI TL750L12QD OBSOLETE SOIC D 8 TBD Call TI Call TI TL750L12QDR OBSOLETE SOIC D 8 TBD Call TI Call TI TL750L12QKC OBSOLETE TO-220 KC 3 TBD Call TI Call TI TL750L12QLP OBSOLETE TO-92 LP 3 TBD Call TI Call TI TL750L12QP OBSOLETE SOIC D 8 TBD Call TI Call TI TL751L05CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL751L05CDE4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL751L05CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL751L05CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL751L05CP OBSOLETE PDIP P 8 TBD Call TI Call TI TL751L05MFKB OBSOLETE LCCC FK 20 TBD Call TI Call TI TL751L05MJGB OBSOLETE CDIP JG 8 TBD Call TI Call TI TL751L05QD OBSOLETE SOIC D 8 TBD Call TI Call TI TL751L05QDR OBSOLETE SOIC D 8 TBD Call TI Call TI TL751L05QP OBSOLETE PDIP P 8 TBD Call TI Call TI TL751L10CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL751L10CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL751L10CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL751L10CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL751L10CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL751L10CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL751L10QD OBSOLETE SOIC D 8 TBD Call TI Call TI TL751L10QP OBSOLETE PDIP P 8 TBD Call TI Call TI TL751L12CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL751L12CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL751L12CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL751L12CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TL751L12CP OBSOLETE PDIP P 8 TBD Call TI Call TI TL751L12MFKB OBSOLETE LCCC FK 20 TBD Call TI Call TI TL751L12MJGB OBSOLETE CDIP JG 8 TBD Call TI Call TI TL751L12QD OBSOLETE SOIC D 8 TBD Call TI Call TI TL751L12QDR OBSOLETE SOIC D 8 TBD Call TI Call TI TL751L12QP OBSOLETE PDIP P 8 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2007 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 MECHANICAL DATA MCER001A – JANUARY 1995 – REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0°–15° 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPFM001E – OCTOBER 1994 – REVISED JANUARY 2001 KTE (R-PSFM-G3) PowerFLEX PLASTIC FLANGE-MOUNT 0.375 (9,52) 0.080 (2,03) 0.070 (1,78) 0.365 (9,27) 0.360 (9,14) 0.050 (1,27) 0.040 (1,02) 0.350 (8,89) 0.220 (5,59) NOM 0.010 (0,25) NOM Thermal Tab (See Note C) 0.360 (9,14) 0.350 (8,89) 0.295 (7,49) NOM 0.320 (8,13) 0.310 (7,87) 0.420 (10,67) 0.410 (10,41) 1 3 0.025 (0,63) 0.031 (0,79) 0.100 (2,54) Seating Plane 0.004 (0,10) 0.010 (0,25) M 0.005 (0,13) 0.001 (0,03) 0.200 (5,08) 0.041 (1,04) 0.031 (0,79) 0.010 (0,25) NOM Gage Plane 3°– 6° 0.010 (0,25) 4073375/F 12/00 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. The center lead is in electrical contact with the thermal tab. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15). Falls within JEDEC MO-169 PowerFLEX is a trademark of Texas Instruments. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 MECHANICAL DATA MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001 LP (O-PBCY-W3) PLASTIC CYLINDRICAL PACKAGE 0.205 (5,21) 0.175 (4,44) 0.165 (4,19) 0.125 (3,17) DIA 0.210 (5,34) 0.170 (4,32) Seating Plane 0.157 (4,00) MAX 0.050 (1,27) C 0.500 (12,70) MIN 0.104 (2,65) FORMED LEAD OPTION 0.022 (0,56) 0.016 (0,41) 0.016 (0,41) 0.014 (0,35) STRAIGHT LEAD OPTION D 0.135 (3,43) MIN 0.105 (2,67) 0.095 (2,41) 0.055 (1,40) 0.045 (1,14) 1 2 3 0.105 (2,67) 0.080 (2,03) 0.105 (2,67) 0.080 (2,03) 4040001-2 /C 10/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Lead dimensions are not controlled within this area D. FAlls within JEDEC TO -226 Variation AA (TO-226 replaces TO-92) E. Shipping Method: Straight lead option available in bulk pack only. Formed lead option available in tape & reel or ammo pack. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 MECHANICAL DATA MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001 LP (O-PBCY-W3) PLASTIC CYLINDRICAL PACKAGE 0.539 (13,70) 0.460 (11,70) 1.260 (32,00) 0.905 (23,00) 0.650 (16,50) 0.610 (15,50) 0.020 (0,50) MIN 0.098 (2,50) 0.384 (9,75) 0.335 (8,50) 0.748 (19,00) 0.217 (5,50) 0.433 (11,00) 0.335 (8,50) 0.748 (19,00) 0.689 (17,50) 0.114 (2,90) 0.094 (2,40) 0.114 (2,90) 0.094 (2,40) 0.169 (4,30) 0.146 (3,70) DIA 0.266 (6,75) 0.234 (5,95) 0.512 (13,00) 0.488 (12,40) TAPE & REEL 4040001-3 /C 10/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Tape and Reel information for the Format Lead Option package. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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