TLC556, TLC556Y DUAL LinCMOS TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 D D D D D D D Very Low Power Consumption . . . 2 mW Typ at VDD = 5 V Capable of Operation in Astable Mode CMOS Output Capable of Swinging Rail to Rail High Output-Current Capability Sink 100 mA Typ Source 10 mA Typ Output Fully Compatible With CMOS, TTL, and MOS Low Supply Current Reduces Spikes During Output Transitions Single-Supply Operation From 2 V to 15 V Functionally interchangeable With the NE556; Has Same Pinout D, J, OR N PACKAGE (TOP VIEW) 1 DISCH 1 THRES 1 CONT 1 RESET 1 OUT 1 TRIG GND 14 2 13 3 12 4 11 5 10 6 9 7 8 VDD 2 DISCH 2 THRES 2 CONT 2 RESET 2 OUT 2 TRIG FK PACKAGE (TOP VIEW) description 1 CONT NC 1 RESET NC 1 OUT 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 2 THRES NC 2 CONT NC 2 RESET 1 TRIG GND NC 2 TRIG 2 OUT The TLC556 series are monolithic timing circuits fabricated using the TI LinCMOS process, which provides full compatibility with CMOS, TTL, and MOS logic and operates at frequencies up to 2 MHz. Accurate time delays and oscillations are possible with smaller, less-expensive timing capacitors than the NE556 because of the high input impedance. Power consumption is low across the full range of power supply voltages. 1 1 THRES 1 DISCH NC V DD 2 DISCH D NC–No internal connection Like the NE556, the TLC556 has a trigger level approximately one-third of the supply voltage and a threshold level approximately two-thirds of the supply voltage. These levels can be altered by use of the control voltage terminal. When the trigger input falls below the trigger level, the flip-flop is set and the output goes high. If the trigger input is above the trigger level and the threshold input is above the threshold level, the flip-flop is reset and the output is low. The reset input can override all other inputs and can be used to initiate a new timing cycle. If the reset input is low, the flip-flop is reset and the output is low. Whenever the output is low, a low-impedance path is provided between the discharge terminal and ground. While the CMOS output is capable of sinking over 100 mA and sourcing over 10 mA, the TLC556 exhibits greatly reduced supply-current spikes during output transitions. This minimizes the need for the large decoupling capacitors required by the NE556. These devices have internal electrostatic-discharge (ESD) protection circuits that prevent catastrophic failures at voltages up to 2000 V as tested under MIL-STD-883C, Method 3015. However, care should be exercised in handling these devices, as exposure to ESD may result in degradation of the device parametric performance. All unused inputs should be tied to an appropriate logic level to prevent false triggering. The TLC556C is characterized for operation from 0°C to 70°C. The TLC556I is characterized for operation from – 40°C to 85°C. The TLC556M is characterized for operation over the full military temperature range of – 55°C to 125°C. LinCMOS is a trademark of Texas Instruments Incorporated. Copyright 1997, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TLC556, TLC556Y DUAL LinCMOS TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 AVAILABLE OPTIONS PACKAGE TA RANGE VDD RANGE O°C to 70°C 2V to 18 V TLC556CD TLC556CN – 4O°C to 85°C 3V to 18 V TLC556lD TLC556IN – 55°C to 125°C 5V to 18 V TLC556MD SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) TLC556MFK PLASTIC DIP (N) TLC556MJ CHIP FORM (Y) TLC556Y TLC556MN The D package is available taped and reeled. Add the suffix R to the device type (e.g., TLC556CDR). FUNCTION TABLE RESET VOLTAGE† TRIGGER VOLTAGE† THRESHOLD VOLTAGE† OUTPUT DISCHARGE SWITCH On < MIN Irrelevant Irrelevant L > MAX < MIN Irrelevant H Off >MAX >MAX >MAX L On > MAX > MAX < MIN As previously established † For conditions shown as MIN or MAX, use the appropriate value specified under electrical characteristics. functional block diagram (each timer) VDD 14 CONT 3 RESET 4 R THRES R1 2 R 1 5 OUT S R 6 TRIG R 1 DISCH 7 GND RESET can override TRIG and THRES. TRIG can override THRES. Pin numbers shown are for the D, J, or N packages. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC556, TLC556Y DUAL LinCMOS TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 TLC556Y chip information These chips, properly assembled, display characteristics similar to the TLC556 (see electrical table). Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJ max = 150°C TOLERANCES ARE ± 10% 61 ALL DIMENSIONS ARE IN MILS NO BACKSIDE METALLIZATION PIN (7) INTERNALLY CONNECTED TO BACKSIDE OF CHIP 97 FUNCTIONAL BLOCK DIAGRAM (EACH TIMER) VDD (14) CONT (3) RESET (4) R THRESH R1 (2) R 1 (5) OUT S R (6) TRIG R (1) DISCH (7) GND POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TLC556, TLC556Y DUAL LinCMOS TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 absolute maximum ratings over operating free-air temperature (unless otherwise noted) TLC556C TLC556I TLC556M UNIT 18 18 18 V – 0.3 to VDD – 0.3 to VDD – 0.3 to VDD V Sink current, discharge or output 150 150 150 mA Source current, output 15 15 15 mA Supply voltage, VDD (see Note 1) Input voltage range, VI Continuous total power dissipation See Dissipation Rating Table Operating free-air temperature range Storage temperature range Case temperature for 60 seconds Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds FK package J package Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds D or N package 0 to 70 – 40 to 85 – 55 to 125 °C – 65 to 150 – 65 to 150 – 65 to 150 °C 260 300 °C 260 260 NOTE 1: All voltage values are with respect to network ground terminal. DISSIPATION RATING TABLE PACKAGE D FK J N TA ≤ 25°C POWER RATING 950 mW 1375 mW 1375 mW 1150 mW DERATING FACTOR ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING TA = 125°C POWER RATING 7.6 mW/°C 11.0 mW/°C 11.0 mW/°C 9.2 mW/°C 608 mW 880 mW 880 mW 736 mW 494 mW 715 mW 715 mW 598 mW N/A 275 mW 275 mW N/A recommended operating conditions Supply voltage, VDD TLC556C Operating free-air temperature range, TA 4 MIN MAX 2 15 0 70 TLC556I – 40 85 TLC556M – 55 125 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT V °C TLC556, TLC556Y DUAL LinCMOS TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 electrical characteristics at specified free-air temperature, VDD = 2 V for TLC556C, VDD = 3 V for TLC556I PARAMETER VIT TEST CONDITIONS Input threshold voltage Trigger voltage I(trigger) (t i ) Trigger current V((reset) t) Reset voltage I(reset) ( t) Reset current TYP MAX MIN TYP MAX 25°C 0.95 1.33 1.65 1.6 2 2.4 Full range 0.85 1.75 1.5 IOL = 1 mA VOH High level output voltage High-level IOH = –300 300 µA VOL Low level output voltage Low-level IOL = 1 mA IDD Supply current See Note 2 10 10 MAX 75 150 0.4 Full range 0.3 0.67 0.95 0.71 1.05 0.61 1 10 10 MAX 75 150 25°C 0.4 0.3 1.1 1.5 0.4 1.8 0.3 1.1 10 10 MAX 75 150 MAX 66.7% 66.7% 25°C 0.04 Full range 0.2 0.03 0.25 0.1 0.1 MAX 0.5 120 25°C 1.5 1.5 25°C 1.9 Full range 1.5 0.07 0.2 0.3 0.07 130 500 800 V V 0.3 0.4 130 V nA 1.9 0.35 V pA 2.5 Full range 25°C 1.5 V pA 0.375 25°C Full range 1.29 1.8 25°C UNIT pA 1.39 25°C Full range Discharge g switch off-state current 2.5 25°C 25°C Control voltage (open circuit) as a percentage of supply voltage Discharge g switch on-state voltage TLC556I MIN Threshold current V(t i ) (trigger) TLC556C TA† 500 1000 V µA † Full range is 0°C to 70°C for TLC556C and – 40°C to 85°C for TLC556I. NOTE 2: These values apply for the expected operating configurations in which THRES is connected directly to DISCH or TRIG. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 TLC556, TLC556Y DUAL LinCMOS TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 electrical characteristics at specified free-air temperature, VDD = 5 V PARAMETER VIT TEST CONDITIONS Input threshold voltage Threshold current V((trigger)) Trigger voltage I((trigger) i ) Trigger current V((reset)) Reset voltage I((reset)) Reset current Control voltage (open circuit) as a percentage of supply voltage Discharge g switch on-state voltage IOL O = 10 mA Discharge g switch off-state current VO OH High-level g output voltage IOH 1 mA O = –1 IOL O = 8 mA VO OL Low-level output voltage IOL O = 5 mA IOL 3 2 mA O = 3.2 IDD Supply current See Note 2 TLC556C TLC556I TLC556M TA† MIN TYP MAX MIN TYP MAX MIN TYP MAX 25°C 2.8 3.3 3.8 2.8 3.3 3.8 2.8 3.3 3.8 Full range 2.7 3.9 2.7 3.9 2.7 25°C 10 10 10 MAX 75 150 5000 25°C 1.36 Full range 1.26 1.66 1.96 1.36 2.06 1.26 1.66 1.96 1.36 2.06 1.26 1.66 10 10 10 MAX 75 150 5000 25°C 0.4 Full range 0.3 1.1 1.5 0.4 1.8 0.3 1.1 1.5 0.4 1.8 0.3 1.1 10 10 10 MAX 75 150 5000 MAX 66.7% 66.7% 66.7% 25°C 0.15 Full range 0.5 0.15 0.6 0.5 0.15 0.6 0.6 25°C 0.1 0.1 0.1 MAX 0.5 2 120 25°C 4.1 Full range 4.1 25°C 4.8 0.21 0.13 Full range 0.4 0.21 0.3 0.08 0.3 0.13 700 1000 0.4 0.3 0.08 0.3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 0.21 pA 0.5 V nA 700 1200 0.4 0.6 0.13 0.3 0.45 0.08 0.3 340 700 0.35 340 V V 0.4 0.35 340 1.5 4.8 0.5 0.4 Full range 25°C 4.1 V pA 4.1 0.5 Full range 25°C 4.8 4.1 Full range 25°C 4.1 1.96 1.8 25°C V pA 2.06 25°C † Full range is 0°C to 70°C for TLC556C, – 40°C to 85°C for TLC556I, and – 55°C to 125°C for TLC556M. NOTE 2: These values apply for the expected operating configurations in which THRES is connected directly to DISCH or to TRIG. 6 3.9 UNIT V 0.4 1400 µA TLC556, TLC556Y DUAL LinCMOS TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 electrical characteristics at specified free-air temperature, VDD = 15 V PARAMETER VIT TEST CONDITIONS Input threshold voltage Threshold current V(t (trigger) i ) Trigger voltage I(trigger) (t i ) Trigger current V((reset) t) Reset voltage I(reset) ( t) Reset current Control voltage (open circuit) as a percentage of supply voltage Discharge g switch onstate voltage IOL = 100 mA Discharge g switch offstate current IOH = –10 10 mA VOH High-level g output voltage IOH = –5 5 mA IOH = –1 1 mA IOL = 100 mA VOL Low-level output voltage IOL = 50 mA IOL = 10 mA IDD Supply current See Note 2 TA† TLC556C TLC556I TLC556M MIN TYP MAX MIN TYP MAX MIN TYP MAX 25°C 9.45 10 10.55 9.45 10 10.55 9.45 10 10.55 Full range 9.35 10.65 9.35 10.65 9.35 10 10 10 MAX 75 150 5000 25°C 4.65 4.55 5 5.35 4.65 5.45 4.55 5 5.35 4.65 5.45 4.55 5 10 10 10 MAX 75 150 5000 25°C 0.4 0.3 1.1 1.5 0.4 1.8 0.3 1.1 1.5 0.4 1.8 0.3 1.1 10 10 10 MAX 75 150 5000 MAX 66.7% 66.7% 66.7% 25°C 0.8 1.7 0.8 1.8 1.7 0.8 1.8 0.1 0.1 0.1 MAX 0.5 2 120 25°C 12.5 12.5 25°C 13.5 Full range 13.5 25°C 14.2 Full range 14.2 25°C 14.2 14.6 25°C 13.5 14.9 14.2 1.28 3.2 14.6 1 13.5 14.9 0.3 1.28 1.2 1.6 pA 1.7 V nA 14.2 14.6 14.2 V 14.9 3.2 1.28 3.7 0.63 1 0.12 0.3 0.63 1.2 1.8 1 V 1.5 0.12 0.4 0.72 3.2 3.8 1.4 0.4 0.72 V 14.2 1.3 0.12 1.5 13.5 3.6 0.63 pA 12.5 14.2 Full range Full range 12.5 13.5 Full range 25°C 14.2 12.5 Full range 25°C 12.5 V 1.8 25°C Full range 5.35 1.8 25°C Full range pA 5.45 25°C Full range V 10.65 25°C Full range UNIT 0.3 0.45 0.72 1.2 mA 2 † Full range is 0°C to 70°C for TLC556C, – 40°C to 85°C for TLC556I, and – 55°C to 125°C for TLC556M. NOTE 2: These values apply for the expected operating configurations in which THRES is connected directly to DISCH or TRIG. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 TLC556, TLC556Y DUAL LinCMOS TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 electrical characteristics, VDD = 5 V, TA = 25°C PARAMETER VIT TEST CONDITIONS Input threshold voltage MIN TYP MAX 2.8 3.3 3.8 1.36 1.66 0.4 1.1 Threshold current V(trigger) Trigger voltage I(trigger) Trigger current V(reset) I(reset) Reset voltage 10 IOL = 10 mA 0.15 Discharge switch off-state current VOH VOL IOH = – 1 mA IOL = 8 mA Low-level output voltage 4.1 IOL = 5 mA IOL = 2.1 mA V pA 0.5 0.1 High-level output voltage V pA 1.5 10 Discharge switch on-state voltage V pA 1.96 10 Reset current UNIT V nA 4.8 V 0.21 0.4 0.13 0.3 0.08 0.3 IDD Supply current See Note 2 3.40 700 NOTE 2: These values apply for the expected operating configurations in which THRES is connected directly to DISCH or TRIG. V µA operating characteristics, VDD = 5 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS Initial error of timing interval † VDD = 5 V to 15 V, Supply voltage sensitivity of timing interval CT = 0.1 µF, tr tf Output pulse rise time fmax Maximum frequency in astable mode Output pulse fall time TYP MAX RA = RB = 1 kΩ to 100 kΩ 1% 3% See Note 3 0.1 0.5 20 75 15 60 RL = 10 MΩ, MΩ CL = 10 pF RA = 470 Ω, CT = 200 pF, RB = 200 Ω, See Note 3 MIN 1.2 2.1 UNIT %/V ns MHz † Timing interval error is defined as the difference between the measured value and the average value of a random sample from each process run. NOTE 3: RA, RB, and CT are as defined in Figure 3. 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC556, TLC556Y DUAL LinCMOS TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 TYPICAL CHARACTERISTICS PROPAGATION DELAY TIMES (TO DISCHARGE OUTPUT FROM TRIGGER AND THRESHOLD SHORTED TOGETHER) vs SUPPLY VOLTAGE DISCHARGE SWITCH ON-STATE RESISTANCE vs FREE-AIR TEMPERATURE 600 Discharge Switch On-State Resistance – Ω 70 VDD = 2 V, IO = 1 mA 40 VDD = 5 V, IO = 10 mA 20 VDD = 15 V, IO = 100 mA 10 7 4 2 1 –75 t PHL , t PLH – Propagation Delay Times – ns 100 IO(on) ≥ 1 mA CL ≈ 0 TA = 25°C 500 400 300 tPHL 200 tPLH‡ 100 0 –50 –25 0 25 50 75 100 125 0 2 TA – Free-Air Temperature – °C 4 6 8 10 12 14 16 18 20 VDD – Supply Voltage – V ‡ The effects of the load resistance on these values must be taken into account separately. Figure 1 Figure 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 TLC556, TLC556Y DUAL LinCMOS TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 APPLICATION INFORMATION 0.1 µF RA tL tH VDD 0.1 µF tPHL CONT VDD RESET TLC556 DISCH RL 2/3 VDD Output OUT RB THRES CL 1/3 VDD TRIG GND GND CT tPLH CIRCUIT TRIGGER AND THRESHOLD VOLTAGE WAVEFORM Figure 3. Astable Operation Connecting the trigger input to the threshold input, as shown in Figure 3, causes the timer to run as a multivibrator. The capacitor CT charges through RA and RB to the threshold voltage level (approximately 0.67 VDD) and then discharges through RB only to the value of the trigger voltage level (approximately 0.33 VDD). The output is high during the charging cycle (tH) and low during the discharge cycle (tL). The duty cycle is controlled by the values of RA, and RB, and CT, as shown in the equations below. [ CT (RA ) RB) In 2 (In 2 + 0.693) t L [ C T R B In 2 Period + t H ) t L [ C T (R A ) 2R B) In 2 tL RB Output driver duty cycle + [ 1 * tH ) tL R A ) 2R B tH Output waveform duty cycle + tH t)H tL [ R )RB2R B A The 0.1-µF capacitor at CONT in Figure 3 decreases the period by about 10%. The formulas shown above do not allow for any propagation delay from the trigger and threshold inputs to the discharge output. These delay times add directly to the period and create differences between calculated and actual values that increase with frequency. In addition, the discharge output resistance ron adds to RB to provide another source of error in the calculation when RB is very low or ron is very high. ƪ ǒ ƪ ǒ Ǔƫ Ǔƫ The equations below provide better agreement with measured values. 10 tH + CT (RA ) RB) In tL + CT (RB ) ron) In 3 * exp * tPLH C T (R B ) r on) 3 * exp * tPHL C T (R A ) R B) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ) tPHL ) tPLH TLC556, TLC556Y DUAL LinCMOS TIMERS SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997 APPLICATION INFORMATION The preceding equations and those given earlier are similar in that a time constant is multiplied by the logarithm of a number or function. The limit values of the logarithmic terms must be between In 2 at low frequencies and In 3 at extremely high frequencies. For a duty cycle close to 50%, an appropriate constant for the logarithmic t t H terms can be substituted with good results. Duty cycles less than 50% will require that H < 1 and t t t H L L possibly RA ≤ ron. These conditions can be difficult to obtain. ) In monostable applications, the trip point of the trigger input can be set by a voltage applied to CONT. An input voltage between 10% and 80% of the supply voltage from a resistor divider with at least 500-µA bias provides good results. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-89503022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596289503022A TLC556MFKB 5962-8950302CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8950302CA TLC556MJB TLC556CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLC556C TLC556CDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLC556C TLC556CDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC556C TLC556CDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC556C TLC556CN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC556CN TLC556CNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC556CN TLC556ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC556I TLC556IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC556I TLC556IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLC556I TLC556IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLC556I TLC556IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC556IN TLC556INE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC556IN TLC556MD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC556MDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 -55 to 125 TLC556M TLC556M Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) TLC556MDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 TLC556M TLC556MDRG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC556MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596289503022A TLC556MFKB TLC556MJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 TLC556MJ TLC556MJB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8950302CA TLC556MJB TLC556MN OBSOLETE PDIP N 14 TBD Call TI Call TI -55 to 125 TLC556M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLC556, TLC556M : • Catalog: TLC556 • Military: TLC556M NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 21-Jun-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLC556CDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLC556CDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLC556IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Jun-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLC556CDR SOIC D 14 2500 367.0 367.0 38.0 TLC556CDR SOIC D 14 2500 333.2 345.9 28.6 TLC556IDR SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated