TI TLK3114SCZPV

Data Manual
November 2006
Serial Gigibit Products
SLLS582D
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and is
an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303, Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated
Contents
Section
1
2
3
Title
Page
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−1
1.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−5
1.2
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−6
Terminal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−1
Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1
3.1
Serdes Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1
3.2
10-Gbps Ethernet Transceiver Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1
3.3
Parallel Interface Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1
3.4
Parallel Interface Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1
3.5
Transmit Data Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−2
3.6
Transmission Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−2
3.7
Channel Clock to Serial Transmit Clock Synchronization . . . . . . . . . . . 3−3
3.8
Receive Data Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−4
3.9
Data Reception Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−4
3.10 Auto Detectable HSTL/SSTL_2 Class 1 I/O . . . . . . . . . . . . . . . . . . . . . . 3−5
3.11 8-b/10-b Encoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−5
3.12 Comma Detect and 8-b/10-b Decoding . . . . . . . . . . . . . . . . . . . . . . . . . . 3−6
3.13 Channel Initialization and Synchronization . . . . . . . . . . . . . . . . . . . . . . . 3−7
3.13.1
Channel State Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−8
3.14 End-of-Packet Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−8
3.15 Fault Detection and Reporting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−9
3.16 Receive Synchronization and Skew Compensation . . . . . . . . . . . . . . 3−10
3.16.1
Column State Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−11
3.17 Independent Channel Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−12
3.18 Inter-Packet Gap Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−13
3.19 Clock Tolerance Compensation (CTC) . . . . . . . . . . . . . . . . . . . . . . . . . 3−15
3.20 Parallel-to-Serial Shift Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−17
3.21 Serial-to-Parallel Shift Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−17
3.22 High-Speed VML Output Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−18
3.23 Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−18
3.24 PRBS Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−19
3.25 MDIO Management Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−20
3.26 Operating Frequency Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−36
3.27 Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−36
3.28 Loopback Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−37
3.29 Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−37
3.30 Differences From the TLK3104SA Device . . . . . . . . . . . . . . . . . . . . . . . 3−37
iii
4
5
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1
Absolute Maximum Ratings Over Operating Free-Air
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3
Reference Clock Timing Requirements (RFCP/N) . . . . . . . . . . . . . . . . .
4.4
Reference Clock Electrical Characteristics (RFCP/N) . . . . . . . . . . . . . .
4.5
LVTTL Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6
SSTL_2 Class 1 Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.7
HSTL Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.8
Serial Transmitter/Receiver Characteristics . . . . . . . . . . . . . . . . . . . . . .
4.9
SSTL_2 Class 1/HSTL Output Switching Characteristics . . . . . . . . . . .
4.10 SSTL_2 Class 1/HSTL Input Timing Requirements . . . . . . . . . . . . . . . .
4.11 MDIO Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.12 Package Dissipation Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4−1
4−1
4−1
4−1
4−2
4−2
4−2
4−3
4−3
4−5
4−5
4−6
4−7
5−1
List of Illustrations
Figure
Title
Page
1−1 System Block Diagram (Chip-to-Chip Implementation) . . . . . . . . . . . . . . . . . . 1−1
1−2 System Block Diagram (PCS Implementation) . . . . . . . . . . . . . . . . . . . . . . . . . 1−2
1−3 System Block Diagram (Backplane Interconnect Implementation) . . . . . . . . 1−2
1−4 TLK3114SC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−4
1−5 Block Diagram of Individual Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−5
2−1 TLK3114SC GNT/GPV-Package Terminal Diagram . . . . . . . . . . . . . . . . . . . . . 2−1
3−1 Transmit Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−2
3−2 Transmitter Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−3
3−3 Transmit and Reference Clock Relationship (Channel Sync Mode) . . . . . . . 3−3
3−4 Transmit and Reference Clock Relationship
(Independent Channel Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−4
3−5 Receive Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−4
3−6 Receiver Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−5
3−7 Channel Synchronization State Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−7
3−8 End-of-Packet Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−9
3−9 Receive and Reference Clock Relationship
(Synchronized Channel Modes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−10
3−10 Column De-skew State Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−11
3−11 Receive and Reference Clock Relationship
(Independent Channel Modes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−12
3−12 Inter-Packet Gap Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−13
3−13 IPG Management State Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−14
iv
3−14 Channel Synchronization Using Alignment Code . . . . . . . . . . . . . . . . . . . . . 3−15
3−15 Clock Tolerance Compensation: Add . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−16
3−16 Clock Tolerance Compensation: Drop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−17
3−17 Output Differential Voltage Under Preemphasis . . . . . . . . . . . . . . . . . . . . . . 3−18
3−18 Repeater-Mode Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−19
3−19 Management Interface Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−20
3−20 Management Interface Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−20
3−21 Management Interface Extended Space Address Timing . . . . . . . . . . . . . . 3−21
3−22 Management Interface Extended Space Write Timing . . . . . . . . . . . . . . . . . 3−21
3−23 Management Interface Extended Space Read Timing . . . . . . . . . . . . . . . . 3−21
3−24 Management Interface Extended Space Read and Increment Timing . . . 3−21
4−1 Differential and Common-Mode Output Voltage Definitions . . . . . . . . . . . . . . 4−4
4−2 Transmit Template . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4−4
4−3 Receive Template . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4−4
4−4 Input Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4−4
4−5 SSTL_2 Class 1/HSTL Output Timing Requirements . . . . . . . . . . . . . . . . . . . 4−5
4−6 SSTL_2 Class 1/HSTL Data Input Timing Requirements . . . . . . . . . . . . . . . . 4−5
4−7 MDIO Read/Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4−6
4−8 High-Speed I/O Direct-Coupled Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4−6
4−9 Example High-Speed I/O AC-Coupled Mode . . . . . . . . . . . . . . . . . . . . . . . . . . 4−6
4−10 SSTL_2 Class 1 I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4−7
4−11 HSTL I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4−7
List of Tables
Table
Title
Page
2−1 Clock Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−2
2−2 Serial Side Data Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−2
2−3 Parallel Data Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−3
2−4 JTAG Test Port Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−4
2−5 Management Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−5
2−6 Miscellaneous Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−5
2−7 Voltage Supply and Reference Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−6
3−1 Operational Interface Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1
3−2 Parallel Interface Clocking Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1
3−3 Parallel Data Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−2
3−4 Valid K-Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−6
3−5 Valid XGMII Channel Encodings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−6
3−6 Receive Data Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−7
3−7 Local and Remote Fault Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−9
v
3−8 IPG Management State Machine Notation . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−9 Programmable Preemphasis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−10 Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−11 MDIO Device Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−12 MDIO Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−13 Control Register Bit Definitions (Register 0) . . . . . . . . . . . . . . . . . . . . . . . . .
3−14 Status Register Bit Definitions (Register 1) . . . . . . . . . . . . . . . . . . . . . . . . . .
3−15 PHY Identifier Bit Definitions (Register 2) . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−16 PHY Identifier Bit Definitions (Register 3) . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−17 Extended Status Register Bit Definitions (Register 15) . . . . . . . . . . . . . . . .
3−18 Global Configuration Register Bit Definitions (Register 16) . . . . . . . . . . . .
3−19 Channel A Configuration Registers Bit Definitions (Register 17) . . . . . . . .
3−20 Channel B Configuration Registers Bit Definitions (Register 18) . . . . . . . .
3−21 Channel C Configuration Registers Bit Definitions (Register 19) . . . . . . . .
3−22 Channel D Configuration Registers Bit Definitions (Register 20) . . . . . . . .
3−23 Channel Status Register (Register 22) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−24 Channel Synchronization Status Register (Register 23) . . . . . . . . . . . . . . .
3−25 Clock Tolerance Compensation Status (Register 24) . . . . . . . . . . . . . . . . .
3−26 Error Counter Control Register (Register 25) . . . . . . . . . . . . . . . . . . . . . . . .
3−27 Channel A Error Count (Register 26) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−28 Channel B Error Count (Register 27) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−29 Channel C Error Count (Register 28) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−30 Channel D Error Count (Register 29) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−31 PHY XS Control 1 Register (Register 40) . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−32 PHY XS Status 1 Register (Register 41) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−33 PHY XS Speed Ability Register (Register 44) . . . . . . . . . . . . . . . . . . . . . . . .
3−34 Devices in Package Register (Register 45) . . . . . . . . . . . . . . . . . . . . . . . . . .
3−35 10G PHY XS Status 2 Register (Register 48) . . . . . . . . . . . . . . . . . . . . . . . .
3−36 10G PHY XGXS Lane Status Register (Register 424) . . . . . . . . . . . . . . . .
3−37 PHY XS Register Cross Reference (Registers 432768−432776) . . . . . . .
3−38 DTE XS Control 1 Register (Register 50) . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−39 DTE XS Status 1 Register (Register 51) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−40 DTE XS Speed Ability Register (Register 54) . . . . . . . . . . . . . . . . . . . . . . . .
3−41 Devices in Package Register (Register 55) . . . . . . . . . . . . . . . . . . . . . . . . . .
3−42 10G DTE XS Status 2 Register (Register 58) . . . . . . . . . . . . . . . . . . . . . . . .
3−43 10G DTE XGXS Lane Status Register (Register 524) . . . . . . . . . . . . . . . . .
3−44 DTE XS Register Cross Reference (Registers 532768−532776) . . . . . . .
3−45 Comparison of TLK3104SA and TLK3114SC Devices . . . . . . . . . . . . . . . .
vi
3−14
3−18
3−19
3−20
3−22
3−23
3−23
3−24
3−24
3−24
3−25
3−26
3−27
3−28
3−29
3−30
3−31
3−32
3−33
3−33
3−33
3−33
3−33
3−33
3−34
3−34
3−34
3−34
3−34
3−35
3−35
3−35
3−35
3−35
3−36
3−36
3−36
3−37
1 Description
The TLK3114SC device is a flexible quad serial transceiver, delivering high-speed, bidirectional, point-to-point data
transmissions to provide up to 10 Gbps of data transmission capacity. The TLK3114SC device is terminal compatible
with the TLK3104SA quad serial transceiver and supports an operating range of serial data rates from 2.5 Gbps to
3.125 Gbps. The primary application of this device is to provide building blocks for developing point-to-point
baseband data transmission over controlled-impedance media of approximately 50 Ω. The transmission media can
be printed-circuit board (PCB) traces, copper cables, or fiber-optical media. The ultimate rate and distance of data
transfer is dependent upon the attenuation characteristics of the media and the noise coupling into the lines.
The TLK3114SC device performs the parallel-to-serial, serial-to-parallel conversion, and clock extraction functions
for a physical layer interface. The TLK3114SC device also provides a selectable 8-b/10-b encode/decode function.
The serial transmitter is implemented using differential pseudoemitter controlled logic (PECL) compatible signaling
called voltage mode logic (VML) that eliminates the need for external components. The serial receiver employs an
equalization circuit to maximize receive capabilities.
The four transceivers in the TLK3114SC device can be configured as either four separate links or synchronized
together as a single data path. The TLK3114SC device supports both the 32-bit data path, 4-bit control, 10-gigabit
media independent interface (XGMII), and the extended auxiliary unit interface (XAUI) specified in the IEEE 802.3ae
10-Gigabit Ethernet standard. Figure 1−1 shows an example system block diagram for the TLK3114SC device used
as an XGMII extended sublayer (XGXS) device to provide an additional trace distance on PCB for data being
transferred between the switching fabric and optical transceiver modules.
RCA..D
TCA..D
Clk
TDA..D[9:0] TX+
TX−
MAC/
Switch
Fabric
XGMII
TLK3114SC
XGXS
4
RX+ RDA..D[9:0]
RX−
4
XAUI
TLK3114SC
XGXS
RDA..D[9:0] RX+
4
XGMII
PCS
Clk
TX+ TDA..D[9:0]
TX−
RX−
16
4
MDIO
6”
MDC
MDIO
20”
E/O
16
TCA..D
RCA..D
16:1
TX MUX
MDC
1:16
CDR/
De-MUX
O/E
MDIO MDC
6”
3”
Management
Figure 1−1. System Block Diagram (Chip-to-Chip Implementation)
Figure 1−2 shows an example system block diagram for TLK3114SC device used to provide the 10-Gbps Ethernet
physical coding sublayer (as defined in IEEE802.3ae Clause 48) to coarse wavelength division multiplexed optical
transceiver.
1−1
Line Card
TCA..D
4
TDA..D[9:0] TX+
TX−
4
TLK3114SC
or
TLK3104SA
MAC/
Packet
XGMII
Processor
TLK3114SC
PCS
4
4
XAUI
CWDM
Optics
RCA..D
4
RDA..D[9:0] RX+
RX−
4
4
4
Figure 1−2. System Block Diagram (PCS Implementation)
Figure 1−3 shows an example system block diagram for the TLK3114SC device used to provide the system
backplane interconnect.
Line Card
RCA..D
4
RX+ RDA..D[9:0]
RX−
4
TLK3114SC
XGMII
XAUI
MAC/
Packet
Processor
Framer/
PCS
PHY/
Optics
TCA..D
4
4
System
Backplane
TX+ TDA..D[9:0]
TX−
RCA..D
4
Switch Fabric
RX+ RDA..D[9:0]
RX−
4
TLK3114SC
XGMII
XAUI
TCA..D
4
4
TX+ TDA..D[9:0]
TX−
Figure 1−3. System Block Diagram (Backplane Interconnect Implementation)
The TLK3114SC device supports the IEEE 802.3 defined management data input/output (MDIO) interface to allow
ease in configuration and status monitoring of the link.
The TLK3114SC device supports the IEEE 1149.1 defined JTAG test port for ease in board manufacturing test. It also
supports a comprehensive series of built-in tests for self-test purposes including internal serial loopback and
pseudorandom bit stream (PRBS) generation and verification.
1−2
The TLK3114SC device operates with a single 2.5-V supply and dissipates less than 3 W. The device is packaged
in a 19-mm ×19−mm, 289-terminal plastic ball grid array (PBGA) package and is characterized for operation from
0°C to 70°C.
The TLK3114SC device is a member of a family of CMOS multi-gigabit transceivers, intended for use in high-speed
bidirectional point-to-point data transmission systems.
Figure 1−4 provides a high−level description of the TLK3114SC device. For a detailed diagram of the individual
channels, see Figure 1−5.
1−3
RD[9:0]
TX+
RCLK
MODE/CODE
TX−
MFA
Channel A
RX+
TD[9:0]
RX−
CHCLK
REFCLK
RDA[9:0]
RCA
MFA
TDA[9:0]
TCA
RCB
MFB
TDB[9:0]
TCB
TXBP
TXBN
RXBP
RXBN
RD[9:0]
TX+
RCLK
MODE/CODE
TX−
MFC
Channel C
RX+
TD[9:0]
RX−
CHCLK
REFCLK
RDC[9:0]
RCC
MFC
TDC[9:0]
TCC
TXCP
TXCN
RXCP
RXCN
RD[9:0]
TX+
RCLK
MODE/CODE
TX−
MFD
Channel D
RX+
TD[9:0]
RX−
CHCLK
REFCLK
RDD[9:0]
RCD
MFD
TDD[9:0]
TCD
PSYNC
TXDP
TXDN
RXDP
RXDN
CODE/MODE
Mode Select
RFCP/RFCN
JTAG
Figure 1−4. TLK3114SC Block Diagram
Figure 1−5 is a more detailed block diagram description of each channel core.
1−4
RXAP
RXAN
RD[9:0]
TX+
RCLK
MODE/CODE
TX−
MFB
Channel B
RX+
TD[9:0]
RX−
CHCLK
REFCLK
RDB[9:0]
TDI
TDO
TCLK
TMS
TXAP
TXAN
MDI
MDIO/MDC
LPENx
PRBSEN
PRBS
Generator
10
CODE
MUX 10
TCx
TDx[7:0]
Tx FIFO
TDx[9:0]
8-B/10-B
Encoder
10
KGENx
TXxP
Parallel to
Serial
D
10
Q
TXxN
Mode
Selector
MUX
Baud Clock
TDx[9:0]
CONFIG0
RFCN
CONFIG1
Multiplying Clock
Synthesizer
RFCP
Baud Clock
RCx
Interpolator and
Clock Recovery
CTC
MUX
RCA
Recovered
Clock
RDx[7:0]
RDx[9:0] MUX
KFLAGx
8-B/10-B
DecoderPRBS
Verification
10
Rx FIFO
PSYNC
10
Serial to
Parallel and
Comma Detect
MUX
RXxP
RXxN
10
CODE
SYNCEN
Figure 1−5. Block Diagram of Individual Channel
1.1 Features
•
Quad 3.125 Gbps per channel transceiver providing 10-Gbps data throughput
•
IEEE 802.3 10-Gbps Ethernet XGXS compliant including:
−
XGMII parallel interface to MAC and XAUI serial interfaces
−
Clock tolerance compensation with column add/drop
−
XAUI interpacket gap /A/, /K/, and /R/ code generation and stripping
−
Remote and local fault reporting on the XGMII as defined
•
MDIO interface
•
Selectable synchronized or independent channel operation
•
Selectable transmit-only, receiver-only, transceiver, and repeater functions
•
Selectable on-chip 8-b/10-b ENDEC
•
On-chip receive equalization
•
Receiver differential input thresholds 200 mVP-P
•
On-chip 100-Ω differential receiver termination
1−5
•
No external filter capacitors required
•
VML serial driver providing PECL-compatible differential signaling with no external components
•
Auto-selects between HSTL or SSTL_2 Class 1 I/O with on-chip 50-Ω series termination on outputs
•
Able to operate with a single 2.5-V power supply
•
On-chip PRBS generation and verification controlled from external terminal
•
IEEE 1149.1 JTAG test interface
•
Hot-plug protection
•
Mainstream 250-nm CMOS technology
•
Small-footprint, 19-mm × 19-mm, 289-ball PBGA package
1.2 Ordering Information
PACKAGE
TA
PLASTIC BALL GRID ARRAY
(PBGA)
SYMBOL
TLK3114SCGNT
0°C
0
C to 70
70°C
C
TLK3114SCGPV
TLK3114SCZPV
ECAT
NOTE: For the most current package and ordering information, see the Package Option
Addendum at the end of this document, or see the TI website at www.ti.com.
1−6
2 Terminal Descriptions
The TLK3114SC device is available in a 289-terminal MicroStar BGA package (GNT/GPV). The terminal layout for
the GNT and GPV packages is shown in Figure 2−1. The TLK3114SC pinout is compatible with TLK3104SA board
designs.
Pin Out
(Top View)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
17
VDDQ
GND
RDB3
VDDQ
GND
RCB
VDDQ
GND
VREF
GND
VDDQ
RCC
GND
VDDQ
RDC3
GND
VDDQ
17
16
MFA
MFB
RDB2
RDB6
RDB9
TCB
TDB5
TDB8
VDDQ
TDC8
TDC5
TCC
RDC9
RDC6
RDC2
MFC
MFD
16
15
VDDQ
GND
RDB1
RDB5
RDB8
TDB2
TDB4
TDB7
TDC9
TDC7
TDC4
TDC2
RDC8
RDC5
RDC1
GND
VDDQ
15
14
RDA9
RDA8
RDB0
VDDQ
GND
TDB1
VDDQ
GND
VDDQ
GND
VDDQ
TDC1
GND
VDDQ
RDC0
RDD8
RDD9
14
13
RDA7
RDA6
RDA5
RDB4
RDB7
TDB0
TDB3
TDB6
TDB9
TDC6
TDC3
TDC0
RDC7
RDC4
RDD5
RDD6
RDD7
13
12
VDDQ
GND
RDA4
RDA3
RDA2
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
RDD2
RDD3
RDD4
GND
VDDQ
12
11
RCA
RDA1
RDA0
VDDQ
GND
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
GND
VDDQ
RDD0
RDD1
RCD
11
10
TCA
TDA9
TDA8
TDA7
TDA6
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
TDD6
TDD7
TDD8
TDD9
TCD
10
9
VDDQ
GND
TDA5
TDA4
TDA3
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
TDD3
TDD4
TDD5
GND
VDDQ
9
8
TDA2
TDA1
TDA0
VDDQ
GND
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
GND
VDDQ
TDD0
TDD1
TDD2
8
7
VDDA
GNDA
GNDA
VDD
GND
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
GND
VDD
GNDA
GNDA
VDDA
7
6
VDDA
RXAN
VDDA
TXAN
GND
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
T−GND
GND
TXDN
VDDA
RXDN
VDDA
6
5
VDDA
RXAP
VDDA
TXAP
GND
GNDA
GNDA
GND
GND
GND
GNDA
GNDA
GND
TXDP
VDDA
RXDP
VDDA
5
4
GNDA
GNDA
GNDA
VDD
VDD
TXBP
TXBN
VDD
VDD
VDD
TXCN
TXCP
VDD
VDD
GNDA
GNDA
GNDA
4
3
TCLK
TDI
LPENA
LPENB
GNDA
VDDA
VDDA
GND
RFCP
GND
VDDA
VDDA
GNDA
LPENC
LPEND
PADR2
MDIO
3
2
TDO
TMS
CONFIG0
CONFIG1
GNDA
RXBP
RXBN
GND
RFCN
GND
RXCN
RXCP
GNDA
TESTEN
PADR4
PADR3
MDC
2
1
ENABLE
RSTN
PSYNC SYNCEN
GNDA
VDDA
VDDA
VDD
PRBSEN
VDD
VDDA
VDDA
GNDA
CODE
PADR0
PADR1
DADR0
1
A
B
E
F
G
H
J
K
L
M
N
P
R
T
U
C
D
Figure 2−1. TLK3114SC GNT/GPV-Package Terminal Diagram
2−1
The terminals are grouped in tables by functionality, such as clocks, serial side data, parallel data, etc. The terminal
numbers are also listed for convenient reference.
Table 2−1. Clock Terminals
TERMINAL
NAME
XGMII
NAME
NUMBER
RCA
A11
RCB
RCC
RCD
F17
M17
U11
RFCP
RFCN
J3
J2
TCA
TCB
TCC
TCD
RX_CLK
N/A
TYPE
DESCRIPTION
HSTL/SSTL_2
output
HSTL/SSTL_2
output
Receive data clock, channel A. The data on RDA(0–9) is output on the rising and
falling edges of RCA. When PSYNC is high, RCA acts as the receive clock for all
channels.
This terminal has internal series termination to provide direct connection to a 50-Ω
transmission line.
Receive data clock, channels B–D. When PSYNC is low, the data on RDx(0–9) is
output on the rising and falling edges of the receive clocks. When PSYNC is high,
these terminals are duplicates of RCA.
These terminals have internal series termination to provide direct connection to a
50-Ω transmission line.
N/A
PECL
compatible or
LVDS input
Differential reference input clock. This differential pair accepts LVDS- or
PECL-compatible signals. When interfacing with 3.3-V PECL, ac-coupling is
required. An on-chip 100-Ω termination resistor is placed differentially between the
terminals. Internal biasing is provided.
A10
TX_CLK
HSTL/SSTL_2
input
Transmit data clock, channel A. The data on TDA(0–9) is latched on the rising and
falling edges of TCA. When PSYNC is high, TCA acts as the transmit clock for all
channels.
F16
M16
U10
N/A
HSTL/SSTL_2
input
Transmit data clock, channels B–D. When PSYNC is low, the data on TDx(0–9) is
latched on the rising and falling edges of the transmit clocks. When PSYNC is high,
these terminals are undefined.
Table 2−2. Serial Side Data Terminals
TERMINAL
TYPE
DESCRIPTION
B5, B6
F2, G2
M2, L2
T5, T6
PECL-compatible
input
Receive differential pairs, channels A–D. High-speed serial inputs with on-chip 100-Ω
differential termination. Each input pair is terminated differentially across an on-chip
100-Ω resistor (see Figure 4−9 and Figure 4−10). These terminals have internal biasing.
D5, D6
F4, G4
M4, L4
P5, P6
PECL-compatible
output
Transmit differential pairs, channels A–D. High-speed serial outputs.
NAME
NUMBER
RXAP, RXAN
RXBP, RXBN
RXCP, RXCN
RXDP, RXDN
TXAP, TXAN
TXBP, TXBN
TXCP, TXCN
TXDP, TXDN
2−2
Table 2−3. Parallel Data Terminals
TERMINAL
NAME
NUMBER
RDA[0:7]
C11, B11,
E12, D12,
C12, C13,
B13, A13
RDA8
B14
XGMII
NAME
TYPE
RXD[0:7]
HSTL/SST
L_2 output
RXC0
HSTL/SST
L_2 output
DESCRIPTION
Receive data terminals, channel A. Parallel data on this bus is valid on the rising and
falling edges of RCA.
These terminals have internal series termination to provide direct connection to a
50-Ω transmission line.
Receive data/K-flag, channel A. When CODE is low, this terminal is the ninth bit of
a received 8-b/10-b encoded byte. When CODE is high, this terminal acts as the
K-character flag. When this terminal is high, it indicates the data on RDA(0–7) is a
valid K-character. Data on this terminal is valid on the rising and falling edges of RCA.
This terminals has internal series termination to provide direct connection to a 50-Ω
transmission line.
RDA9
A14
N/A
HSTL/SST
L_2 output
Receive data terminal/error detect, channel A. When CODE is low, this terminal is
the tenth bit of a 8-b/10-b encoded byte. When CODE is high, this terminal goes high
to signify the occurrence of either a disparity error or an invalid code word during the
decoding of the received data. Data on this terminal is valid on the rising and falling
edges of RCA.
This terminal has internal series termination to provide direct connection to a 50-Ω
transmission line.
RDB[0:7]
C14, C15,
C16, C17,
D13, D15,
D16, E13
RXD[8:15]
RDC[0:7]
R14, R15,
R16, R17,
P13, P15,
P16, N13
RXD[16:23]
RDD[0:7]
R11, T11,
N12, P12,
R12, R13,
T13, U13
RXD[24:31]
RDB8
RDC8
RDD8
E15
N15
T14
HSTL/SST
L_2 output
Receive data terminals, channels B–D. When PSYNC is low, parallel data on these
buses is valid on the rising and falling edges of the recovered data clock (RCB, RCC,
or RCD). When PSYNC is high, data on each bus is valid on the rising and falling
edges of RCA.
These terminals are series terminated to provide direct connection to a 50-Ω
transmission line.
RXC1
RXC2
RXC3
Receive data/K-flag, channels B–D. When PSYNC is low, data on these terminals
is valid on the rising and falling edges of the recovered clock (RCB, RCC, or RCD).
When PSYNC is high, data on these terminals is valid on the rising and falling edges
of RCA.
HSTL/SST
L_2 output
When CODE is low, these terminals are the ninth bit of a received 8-b/10-b encoded
byte. When CODE is high, these terminals act as the K-character flag. When
asserted high, this indicates the data on RDx[0:7] is a valid K-character.
These terminals are series terminated to provide direct connection to a 50-Ω
transmission line.
Receive data terminal/error detect, channels B–D. When PSYNC is low, data on
these terminals is valid on the rising and falling edges of recovered channel clock
(RCB, RCC, RCD). When PSYNC is high, data on these terminals is valid on the
rising and falling edges of RCA.
RDB9
RDC9
RDD9
E16
N16
U14
N/A
HSTL/SST
L_2 output
When CODE is low, these terminals are the tenth bit of a 8-b/10-b encoded byte.
When CODE is high, these terminals provide an error detection flag. The error detect
is asserted high to signify the occurrence of either a disparity error or an invalid code
word during the decoding of the received data.
These terminals have internal series termination to provide direct connection to a
50-Ω transmission line.
2−3
Table 2−3. Parallel Data Terminals (Continued)
TERMINAL
XGMII
NAME
TYPE
DESCRIPTION
C8, B8, A8,
E9, D9, C9,
E10, D10
TXD[0:7]
HSTL/SST
L_2 input
Transmit data terminals, channel A. Parallel data on this bus is clocked on the rising
and falling edges of TCA.
TDA8
C10
TXC0
HSTL/SST
L_2 input
Transmit data/KGEN, channel A. When CODE is low, this terminal is the ninth bit of
an 8-b/10-b encoded byte to be transmitted. When CODE is high, this terminal acts
as the K-character generator indicator. When this terminal is high, it causes the data
on TDA(0−7) to be encoded into a K-character.
TDA9
B10
N/A
HSTL/SST
L_2 input
Transmit data terminal, channel A. When CODE is low, this terminal is the tenth bit
of an 8-b/10-b encoded byte. When CODE is high, this terminal is ignored.
TDB[0:7]
F13, F14,
F15, G13,
G15, G16,
H13, H15
TXD[8:15]
TDC[0:7]
M13, M14,
M15, L13,
L15, L16, K13,
K15
TXD[16:23]
HSTL/SST
L_2 input
Transmit data terminals, channels B–D. When PSYNC is low, parallel data on this
bus is clocked on the rising and falling edges of the transmit channel clock (TCB,
TCC, TCD). When PSYNC is high, data on these buses is clocked on the rising and
falling edges of TCA.
TDD[0:7]
R8, T8, U8,
N9, P9, R9,
N10, P10
TXD[24:31]
NAME
NUMBER
TDA[0:7]
TDB8
TDC8
TDD8
H16
K16
R10
TDB9
TDC9
TDD9
J13
J15
T10
TXC1
TXC2
TXC3
N/A
HSTL/SST
L_2 input
HSTL/SST
L_2 input
Transmit data/KGEN, channels B–D. When PSYNC is low, data on these terminals
is clocked on the rising and falling edges of the transmit channel clock (TCB, TCC,
or TCD). When PSYNC is high, data on these terminals is clocked on the rising and
falling edges of TCA.
When CODE is low, these terminals are the ninth bit of an 8-b/10-b encoded byte
to be transmitted. When CODE is high, these terminals act as the K-character
generator indicator. When driven high, these terminals cause the data on TDx(0−7)
to be encoded into a K-character.
Transmit data terminal, channels B–D. When PSYNC is low, data on these terminals
is clocked on the rising and falling edges of the transmit channel clock (TCB, TCC,
TCD). When PSYNC is high, data on these terminals is clocked on the rising and
falling edges of TCA.
When CODE is low, these terminals are the tenth bit of an 8-b/10-b encoded byte.
When CODE is high, these terminals are ignored.
Table 2−4. JTAG Test Port Interface
TERMINAL
TYPE
DESCRIPTION
A3
LVTTL input
JTAG clock. TCLK clocks state information and test data into and out of the device during the
operation of the test port.
TDI
B3
LVTTL input†
JTAG input data. TDI serially shifts test data and test instructions into the device during the
operation of the test port.
TDO
A2
LVTTL output
JTAG output data. TDO serially shifts test data and test instructions out of the device during
operation of the test port. When the JTAG port is not in use, TDO is in a high-impedance state.
NAME
NUMBER
TCLK
TMS
B2
LVTTL input†
† With an internal pullup resistor
2−4
JTAG mode select. TMS controls the state of the internal test-port controller.
Table 2−5. Management Data Interface
TERMINAL
TYPE
DESCRIPTION
U1
LVTTL input
Management MMD address. DADR0 is the externally set device address, which configures PHY
XS or DTE XS according to Table 3−11.
MDC
U2
LVTTL input
Management data clock. MDC is the clock reference for the transfer of management data to and
from the protocol device.
MDIO
U3
LVTTL I/O
Management data I/O. MDIO is the bidirectional serial data path for the transfer of management
data to and from the protocol device.
PADR(0−4)
R1, T1,
T3, T2, R2
LVTTL input
Management PHY address. Device address PADR(0−4) is the externally set physical address
given to this device used to distinguish one device from another.
NAME
NUMBER
DADR0
Table 2−6. Miscellaneous Terminals
TERMINAL
NAME
NUMBER
CODE
P1
TYPE
LVTTL input†
DESCRIPTION
Encode enable. When CODE is high, the 8-b/10-b encoder and decoder is enabled.
Configuration terminals. These terminals put the device under one of the three operation modes:
00 = Transceiver mode
01 = Transmit-only mode
10 = Receive-only mode
11 = Repeater mode
CONFIG0
CONFIG1
C2, D2
LVTTL input‡
ENABLE
A1
LVTTL input†
Standby enable. When this terminal is held low, the device is in a low-power state. When high, the
device operates normally.
LPEN(A−D)
C3, D3,
P3, R3
LVTTL input‡
Internal loop enable, channels A−D. When high, the serial output for each channel is internally
looped back to its serial input.
Multifunction outputs, channels A−D. The functions of these terminals are enabled via the MDIO.
Currently defined functions are:
MF(A−D)
A16, B16,
T16, U16
Terminal indicates 1 for HSTL, 0 for SSTL_2 signaling (default),
LVTTL output
LOS (loss of signal) for each channel,
COMMA_DET (K28.5 character detected) for each channel, and
PRBS_STATUS (pseudorandom bit stream test status) for each channel.
PRBSEN
J1
LVTTL input‡
PRBS enable. When this terminal is asserted high, the PRBS generator and comparator circuits
are inserted into the transmit and receive data paths on all channels. PRBS_PASS is indicated on
the MFx terminals once they are enabled using MDIO.
PSYNC
C1
LVTTL input‡
Channel synchronization enable. When PSYNC is high, all transmit data is latched on the rising
and falling edges of TCA and all receive data is valid on the rising and falling edges of RCA.
RSTN
B1
LVTTL input†
Chip reset (FIFO clear). Pulling this terminal low recenters the transmit skew buffers, receive
channel synchronization FIFOs, and resets MDIO flags.
SYNCEN
D1
LVTTL input†
Comma detect enable. When this terminal is high, comma detection and byte alignment for all
channels are enabled.
TESTEN
P2
LVTTL input‡
Test mode enable. This terminal is used for manufacturing test. This terminal must be left
unconnected or tied low.
† With an internal pullup resistor
‡ With an internal pulldown resistor
2−5
Table 2−7. Voltage Supply and Reference Terminals
TERMINAL
2−6
TYPE
DESCRIPTION
NAME
NUMBER
GND
B9, B12, B15, B17, E5, E6,
E7, E8, E11, E14, E17, H2,
H3, H5, H14, H17, J5, K2,
K3, K5, K14, K17, N5, N6,
N7, N8, N11, N14, N17, T9,
T12, T15, T17
Ground
Digital logic ground. Supply reference for core logic and SSTL_2 Class 1 buffers.
GNDA
A4, B4, B7, C4, C7, E1, E2,
E3, F5, G5, L5, M5, N1, N2,
N3, R4, R7, T4, T7, U4
Ground
Analog ground. Supply reference for analog circuitry.
T-GND
F6−F12, G6−G12, H6−H12,
J6−J12, K6−K12, L6−L12,
M6−M12
Ground
Thermal grounds. Electrically connected to GND, these terminals provide a thermal
path for heat dissipation.
VDD
D4, D7, E4, H1, H4, J4, K1,
K4, N4, P4, P7
Supply
Core supply (2.5 V). Digital logic power. Provides power for all digital circuitry.
VDDA
A5, A6, A7, C5, C6, F1, F3,
G1, G3, L1, L3, M1, M3,
R5, R6, U5, U6, U7
Supply
Analog voltage supply (2.5 V). Provides power for all analog circuitry.
VDDQ
A9, A12, A15, A17, D8,
D11, D14, D17, G14, G17,
J14, J16, L14, L17, P8,
P11, P14, P17, U9, U12,
U15, U17
Supply
HSTL/SSTL_2 Class 1 supply voltage. Nominally 1.5 V for HSTL or 2.5 V for SSTL_2
Class 1.
VREF
J17
Input
Input voltage reference for HSTL/SSTL_2 Class 1 I/O
3 Detailed Description
The TLK3114SC device has four operational interface modes controlled by the states of terminals CODE and
PSYNC. These operational interface modes are listed in Table 3−1.
Table 3−1. Operational Interface Modes
CODE
PSYNC
Low
Low
Four independent serializer/deserializers (serdes)
DESCRIPTION
Low
High
Four synchronized serdes
High
Low
Four independent transceivers with on-chip 8-b/10-b encode/decode
High
High
10-gigabit ethernet XGMII extended sublayer (XGXS) transceiver
3.1 Serdes Modes
When CODE is deasserted, the TLK3114SC device performs serialization and deserialization of encoded data across
four ten-bit interfaces (TBI) similar to that done in fibre channel and 802.3z gigabit ethernet serdes devices. The
channels can be synchronized to allow use of one transmit data clock and one receive data clock.
3.2 10-Gbps Ethernet Transceiver Modes
When CODE and PSYNC are asserted, the TLK3114SC device supports the 32-bit data path, 4-bit control, 10-gigabit
media independent interface (XGMII), and full encoding scheme specified in the IEEE 802.3ae 10-Gigabit Ethernet
standard. In these modes, the TLK3114SC device performs the serialization/deserialization and channel
synchronization function of an extended auxiliary unit interface (XAUI), also specified in the IEEE 802.3ae 10-Gigabit
Ethernet standard.
3.3 Parallel Interface Clocking
Two clocking choices are selectable via the PSYNC terminal detailed in Table 3−2. Under channel sync mode
(PSYNC is high), TCA is used as the transmit data clock for all four channels. Under independent channel mode
(PSYNC is low), each channel uses its own transmit data clock (TCA−TCD) to latch data into the TLK3114SC device.
A data FIFO is placed in the transmit data path to resolve any phase difference between the transmit data clocks and
differential reference clock, RFCP/N.
Table 3−2. Parallel Interface Clocking Modes
PSYNC
PARALLEL INTERFACE CLOCKING OPERATION
Low
Independent channel mode. TC[A−D]/RC[A−D] clock in/out each individual channel
High
Channel sync mode. TCA/RCA clock in/out all channels of data
On the receive data path, in independent channel mode, the data for each channel is output referenced to each
channel’s extracted receive clock. In channel sync mode, the data on all channels are synchronized and output
referenced to the extracted receive clock for channel A, RCA. A FIFO is enabled in the parallel receive data path on
each channel to compensate for channel skew and clock phase tolerance differences between the recovered clocks
for each channel and the receive output clock, RCA. This FIFO has a total depth of 11 bytes.
3.4 Parallel Interface Data
Two data mode choices are selectable via the CODE terminal detailed in Table 3−3. In serdes mode, the transmit
data bus for each channel accepts 10-bit wide 8-b/10-b encoded data at the TDx[0:9] terminals. Data is latched on
the rising and falling edge of the transmit data clock. The 8-b/10-b encoded data is then phase aligned to the reference
clock (RFCP/RFCN), serialized, then transmitted sequentially beginning with bit 0 (TDx0) over the differential
high-speed serial transmit terminals.
3−1
In serdes mode, the receive data bus for each channel outputs 10-bit wide 8-b/10-b encoded data on RDx[0:9]. The
8-b/10-b encoded data input to the differential high-speed serial receive terminals is deserialized with the first bit (bit
0) output on RDx0 and the last bit (bit 9) output on RDx9. Data is output relative to both the rising and falling edges
of the receive clock.
Table 3−3. Parallel Data Modes
CODE
PARALLEL INTERFACE DATA OPERATION
Low
Serdes mode. On-chip 8-b/10-b encoder/decoder is disabled. Data on TDx[0:9] and RDx[0:9] is treated as 8-b/10-b encoded
data.
High
Transceiver mode. Enables 8-b/10-b encode/decode for each channel. Data TDx[0:7] and RDx[0:7] are treated as uncoded
data. TDx8 is used as the K-character generator control. RDx8 is the K-character indicator to the host device. Data on TDx9 is
ignored. RDx9 goes high on either a disparity or code error.
In transceiver mode, the transmit data bus for each channel accepts 8-bit wide parallel data at the TDx[0:7] terminals.
Data is sampled on the rising and falling edges of the transmit clock as shown in Figure 3−1. The data is first aligned
to the reference clock (RFCP/RFCN), then 8-b/10-b encoded and passed to the serializer. The generation of
K-characters on each channel is controlled by TDx8 (KGEN). When KGEN is asserted along with the 8 bits of data
TDx[0:7], the appropriate 8-b/10-b K-character is transmitted.
In transceiver mode, the receive data bus for each channel outputs an 8-bit wide parallel data on RDx[0:7]. Reception
of K-characters is reported on RDx8 (KFLAG). When KFLAG is asserted, the 8 bits of data on RDx[0:7] must be
interpreted as a K-character. If an error is uncovered in decoding the data, KFLAG and RDx9 (RX_ER) are asserted
and 0xFE is placed on the receive data bus for that channel.
3.5 Transmit Data Bus Timing
For each channel, the transmitter portion of the TLK3114SC device latches the data on transmit data bus TDx[0:9]
on both the rising and falling edges of the transmit data clock, as shown in Figure 3−1. Depending on the state of the
PSYNC terminal, the transmit data clock is either TCA (channel sync mode) or the individual transmit channel clocks,
TCA−TCD (independent channel mode). When in the channel sync mode, signals on TCB, TCC, and TCD are
ignored.
TCA, TCB,
TCC, TCD
th
tsu
th
tsu
TDx[9:0]
Data
Data
Figure 3−1. Transmit Interface Timing
3.6 Transmission Latency
For each channel, the data transmission latency of the TLK3114SC device is defined as the delay from the rising or
falling edge of the selected transmit clock when valid data is on the transmit data terminals to the serial transmission
of bit 0, as shown in Figure 3−2. The minimum latency (TLATENCY) is 71 bit times; the maximum is 120 bit times. There
are approximately 20 bit times required for the 8-b/10-b encoder.
3−2
10-Bit Code Transmitted
TXxP
TXxN
td(T_Latency)
TDx[7:0]
Byte to be Transmitted
TCx
Figure 3−2. Transmitter Latency
3.7 Channel Clock to Serial Transmit Clock Synchronization
The TLK3114SC device requires an external differential reference clock, RFCP/N, for the on-chip phase-locked loop
(PLL) and the clock/data recovery loop. To compensate for arbitrary clock phase tolerance differences between the
reference clock and the data aligned to the transmit clock, a small FIFO in the parallel transmit data path on each
channel is employed. This FIFO has a depth of four bytes.
The reference clock and the transmit data clock(s) are assumed to be from a common source and only phase
misaligned due to different path delays as shown in Figure 3−3 and Figure 3−4. The reference clock is multiplied in
frequency 10x to produce the internal serialization clock. The internal serialization clock is used to clock out the serial
transmit data.
Protocol Device
TLK3114SC
Channel A
Channel
Logic
TCA
Data A
TX
FIFO
Channel B
Data B
TX
FIFO
Channel
Logic
Serdes
Core
Data C
Channel C
TX
FIFO
Channel
Logic
Channel D
Channel
Logic
Serdes
Core
Serdes
Core
Data D
TX
FIFO
Serdes
Core
RFCP/RFCN
Xtal OSC
Figure 3−3. Transmit and Reference Clock Relationship (Channel Sync Mode)
3−3
Protocol Device
TLK3114SC
Channel A
Channel
Logic
Data A
TX
FIFO
TCA
Serdes
Core
Channel B
Channel
Logic
Data B
TX
FIFO
TCB
Serdes
Core
Data C
Channel C
Channel
Logic
TX
FIFO
TCC
Serdes
Core
Channel D
Channel
Logic
Data D
TX
FIFO
TCD
Serdes
Core
RFCP/RFCN
Xtal OSC
Figure 3−4. Transmit and Reference Clock Relationship (Independent Channel Mode)
3.8 Receive Data Bus Timing
For each channel, the receiver portion of the TLK3114SC device outputs the recovered deserialized data on the
receive data bus TDx[0:9] on both the rising and falling edges of the receive data clock, as shown in Figure 3−5.
Depending on the state of PSYNC terminal the receive data clock is either RCA (channel sync mode) or the individual
receive channel clocks, RCA−RCD (independent channel mode). Terminals RCB, RCC, and RCD are also strobed
to match RCA in channel sync mode.
RCA, RCB,
RCC, RCD
th
tsu
th
tsu
RDx[9:0]
Data
Data
Figure 3−5. Receive Interface Timing
3.9 Data Reception Latency
For each channel, the serial-to-parallel data latency is the time from when the first bit arrives at the receiver input until
it is output in the aligned parallel word with RDx0 received as first bit, as shown in Figure 3−6. The minimum latency
(RLATENCY) is 84 bit times; the maximum is 225 bit times. The 8-b/10-b encoder, channel de-skew, and CTC all
contribute to the maximum latency.
3−4
10-Bit Code Received
RXxP
RXxN
RLatency
RDx[7:0]
Byte Received
RCLKx
Figure 3−6. Receiver Latency
3.10 Auto Detectable HSTL/SSTL_2 Class 1 I/O
The transmit and receive data buses of the TLK3114SC device are compatible with both high-speed transfer logic
(HSTL) supply and stub series terminated logic 2 (SSTL_2) Class 1 buffers. The TLK3114SC device determines
which buffer technology to use by sensing the voltage level on the VDDQ supply terminals at power up. If the voltage
on the VDDQ supply is between 2.3 V and 2.7 V, the TLK3114SC device provides the necessary drive current to meet
SSTL_2 Class 1 requirements. If the voltage on the VDDQ supply is between 1.4 V and 2 V, the TLK3114SC device
provides HSTL compatible signaling. During normal operation, the voltage level on the VDDQ terminals must not
change.
All HSTL/SSTL_2 Class 1 outputs are series terminated to provide direct connection to a 50-Ω transmission line
signaling environment (see Figure 4−10 and Figure 4−11).
3.11 8-b/10-b Encoder
All true serial interfaces require a method of encoding to ensure sufficient transition density for the receiving PLL to
acquire and maintain lock. The encoding scheme also maintains the signal dc balance by keeping the number of 1s
and 0s the same, which allows for ac-coupled data transmission. The TLK3114SC device uses the 8-b/10-b encoding
algorithm that is used by fibre channel and gigabit ethernet. This provides good transition density for clock recovery
and improves error checking. The 8-b/10-b encoder/decoder function is enabled for all four channels by the assertion
of the CODE terminal. When enabled, the TLK3114SC device internally encodes and decodes the data such that the
user reads and writes actual 8-bit data on each channel.
When enabled, the 8-b/10-b encoder converts 8-bit wide data to a 10-bit wide encoded data character to improve
its transition density. This transmission code includes D-characters, used for transmitting data, and K-characters,
used for transmitting protocol information. Each K- or D-character code word can also have both a positive and a
negative disparity version. The disparity of a code word is selected by the encoder to balance the running disparity
of the serialized data stream.
The generation of K-characters to be transmitted on each channel is controlled by TDx8 (KGEN). When KGEN is
asserted along with the 8 bits of data TDx[0:7], an 8-b/10-b K-character is transmitted. Similarly, reception of
K-characters is reported by RDx8 (KFLAG). When KFLAG is asserted, the 8 bits of data on RDx[0:7] must be
interpreted as a K-character. The TLK3114SC device transmits and receives all 12 valid K-characters defined in
Table 3−4. Table 3−5 provides additional transmit data control coding and descriptions that have been proposed for
10 gigabits per second ethernet. Data patterns put on TDx[0:7], other than those defined in Table 3−4 when TDx8
is asserted, result in an invalid K-character being transmitted, which results in a code error at the receiver.
3−5
Table 3−4. Valid K-Codes
ENCODED K-CODE
K-CODE
TDX8 OR RDX8
DATA BUS
(RDX[7:0] OR
TDX[7:0])
00 through FF
0
K28.0
K28.1†
NEGATIVE
RUNNING
DISPARITY
POSITIVE
RUNNING
DISPARITY
dddddddd
dddddddddd
dddddddddd
Normal data
1
000 11100
001111 0100
110000 1011
IdleO/busy
1
001 11100
001111 1001
110000 0110
IdleE/busy
K28.2
1
010 11100
001111 0101
110000 1010
K28.3
1
011 11100
001111 0011
110000 1100
K28.4
K28.5†
1
100 11100
001111 0010
110000 1101
1
101 11100
001111 1010
110000 0101
K28.6
K28.7†
1
110 11100
001111 0110
110000 1001
1
111 11100
001111 1000
110000 0111
Code violation or parity error
K23.7
1
111 10111
111010 1000
000101 0111
IdleO/not busy
K27.7
1
111 11011
110110 1000
001001 0111
SOP(S)
K29.7
1
111 11101
101110 1000
010001 0111
EOP(T)
K30.7
1
111 11110
† A comma is contained within this K-code.
011110 1000
100001 0111
K-CODE DESCRIPTION
Channel alignment precursor
IdleE/not busy
Table 3−5. Valid XGMII Channel Encodings
DATA BUS
(TDX[7:0]† OR RDX[7:0]‡)
TDX8§ OR
RDX8¶
00 through FF
0
Normal data transmission
00 through 06
1
Reserved
DESCRIPTION
07
1
Idle
08 through 9B
1
Reserved
9C
1
Sequence (only valid in channel A)
9D through FA
1
Reserved
FB
1
Start (only valid in channel A)
FC
1
Reserved
FD
1
Terminate
FE
1
Transmit error propagation
FF
1
Reserved
† XGMII names: TDA[7:0] = TXD[7:0], TDB[7:0] = TXD[15:8], TDC[7:0] = TXD[23:16], and TDD[7:0] = TXD[31:24]
‡ XGMII names: RDA[7:0] = RXD[7:0], RDB[7:0] = RXD[15:8], RDC[7:0] = RXD[23:16], and RDD[7:0] = RXD[31:24]
§ XGMII names: TDA8 = TXC0, TDB8 = TXC1, TDC8 = TXC2, and TDD8 = TXC3
¶ XGMII names: RDA8 = RXC0, RDB8 = RXC1, RDC8 = RXC2, and RDD8 = RXC3
3.12 Comma Detect and 8-b/10-b Decoding
When parallel data is clocked into a parallel-to-serial converter, the byte boundary that was associated with the
parallel data is lost in the serialization of the data. When the serial data is received and converted to parallel format
again, a method is needed to be able to recognize the byte boundary. Generally, this is accomplished through the
use of a synchronization pattern. This is a unique pattern of 1s and 0s that either cannot occur as part of valid data
or is a pattern that repeats at defined intervals. 8-b/10-b encoding contains a character called the comma (b’0011111’
or b’1100000’), which is used by the comma detect circuit to align the received serial data back to its original byte
boundary. The decoder detects the K28.5 comma, generating a synchronization signal aligning the data to their 10-bit
boundaries for decoding. It then converts the data back into 8-bit data. It is important to note that the comma can be
either (b’0011111’) or the inverse (b’1100000’) depending on the running disparity. The TLK3114SC decoder detects
both patterns. Comma detect is not active in PRBS mode.
3−6
The reception of K-characters is reported by the assertion of RDx8 (KFLAG) on each channel. When a code word
error or running disparity error is detected in the decoded data on a channel, RDx9 (ERROR DETECT) and KFLAG
are asserted and an 0xFE is placed on the receive data bus for that channel, as shown in Table 3−6. When a loss
of signal (LOS) is detected on the differential receive inputs, a local fault is reported on the receive data bus (see
Section 3.15, Fault Detection and Reporting). The LOS signal can be disabled using MDIO (see Table 3−13).
Table 3−6. Receive Data Controls
EVENT
RECEIVE DATA BUS (RDX[7:0])
KFLAG (RDX8)
ERROR DETECT (RDX9)
XX
0
0
Valid K-code (see Table 3−4)
1
0
1
1
Normal data
Normal K-character
Loss of signal
See Table 3−7
Code word error or running disparity error
FE
3.13 Channel Initialization and Synchronization
The TLK3114SC device has a synchronization state machine, which is responsible for handling link initialization and
synchronization for each channel. The initialization and synchronization state diagram is provided in Figure 3−7. The
status of any channel can be monitored by reading MDIO registers 4.24 and 5.24, bits 3:0.
RESET
or LOS
Valid Data
or Error
UNSYNC
Comma
Valid
Data
Error
ACQ1
MISS3
3 Consecutive
Valid Data
Words
Error
Valid
Data
Comma
Error
Error
ACQ2
MISS2
Error
Comma
Error
ACQ3
Valid
Data
3 Consecutive
Valid Data
Words
MISS1
Comma
Error
3 Consecutive
Valid Data
Words
SYNC
Valid Data
or Comma
Figure 3−7. Channel Synchronization State Machine
3−7
3.13.1 Channel State Descriptions
UNSYNC—This is the initial state for each channel upon device power up or reset. If a LOS condition is detected,
the channel state is set to UNSYNC. In this state, the TLK3114SC device has the comma detect circuit active and
makes code word alignment adjustments based on the position of a comma in the incoming data stream. While in
this state, the TLK3114SC device sets the lane sync bit to 0 for the particular channel in MDIO registers 4.24 and 5.24,
bits 3:0, indicating the lane is not synchronized. The channel state transitions to the ACQ1 state upon the detection
of a comma.
NOTE: When the lane sync bit equals 0, it causes a local fault to be output on the receive data bus.
ACQ1—During this state the comma detect circuit is active but code word realignment is disabled. The TLK3114SC
device remains in this state until either a comma is detected in the same code word alignment position as found in
state UNSYNC or a decode error is encountered. While in this state, the lane sync bit for the particular channel
remains deasserted indicating the lane is not synchronized. A decode or running disparity error returns the channel
state to UNSYNC. A detected comma causes the channel state to transition to ACQ2.
NOTE: When the lane sync bit equals 0, it causes a local fault to be output on the receive data bus.
ACQ2—During this state, the comma detect circuit is active but code word re-alignment is disabled. The TLK3114SC
device remains in this state until either a comma is detected in the same code word alignment position as found in
state UNSYNC or a decode error is encountered. While in this state, the lane sync bit for the particular channel
remains deasserted indicating the lane is not synchronized. A decode or running disparity error returns the channel
state to UNSYNC. A detected comma causes the channel state to transition to ACQ3.
NOTE: When the lane sync bit equals 0, it causes a local fault to be output on the receive data bus.
ACQ3—During this state the comma detect circuit is active but code word re-alignment is disabled. The TLK3114SC
device remains in this state until either a comma is detected or a decode error encountered. While in this state, the
lane sync bit for the particular channel remains deasserted indicating the lane is not synchronized. A decode or
running disparity error returns the channel state to UNSYNC. A detected comma causes the channel state to
transition to SYNC.
NOTE: When the lane sync bit equals 0, it causes a local fault to be output on the receive data bus.
SYNC—This is the normal state for receiving data. When in this state, the TLK3114SC device sets the lane sync bit
to 1 for the particular channel in MDIO registers 4.24 and 5.24, bits 3:0, indicating the lane has been synchronized.
During this state the comma detect circuit is active but code word re-alignment is disabled. A decode or running
disparity error causes the channel state to transition to MISS1.
MISS1—When entering this state an internal error counter is cleared. If the next three consecutive codes are decoded
without error, the channel state reverts back to SYNC. If a decode or running disparity error is detected, the channel
state transitions to MISS2.
MISS2—When entering this state an internal error counter is cleared. If the next three consecutive codes are decoded
without error, the channel state reverts back to MISS1. If a decode or running disparity error is detected, the channel
state transitions to MISS3.
MISS3—When entering this state an internal error counter is cleared. If the next three consecutive codes are decoded
without error, the channel state reverts back to MISS1. If a decode or running disparity error is detected, the channel
state transitions to UNSYNC.
3.14 End-of-Packet Error Detection
Because of their unique data patterns, /A/ (K28.3), /K/ (K28.5), and /T/ (K29.7) catch running disparity errors that may
have propagated undetected from previous codes in a packet. Running disparity errors detected by these control
codes at the end of the packets cause the previous data codes to be reported as errors (0xFE) to allow the protocol
device to reject the packet (see Figure 3−8).
3−8
XAUI
XGMII
RXA
...
D
D
D
D
A
Running Disparity Error
Detected by /A/ Yields
RXB
...
D
D
D
T
A
Running Disparity Error
Detected by /T/ Yields
...
D
D
E
T
I
RXC
...
D
D
D
K
A
Running Disparity Error
Detected by /K/ Yields
...
D
D
E
I
I
RXD
...
D
D
D
K
A
Running Disparity Error
Detected by /K/ Yields
...
D
D
E
I
I
...
D
D
D
E
I
D = Data
T = K29.7
A = K28.3
K = K28.5
E = Error (0xFE)
I = Idle
Figure 3−8. End-of-Packet Error Detection
3.15 Fault Detection and Reporting
The TLK3114SC device detects and reports local faults as well as forwards both local and remote faults as defined
in the IEEE P802.3ae to aid in fault diagnosis. All faults detected by the TLK3114SC device, such as LOS detect, are
reported as local faults to the upper layer protocols, as shown in Table 3−7. Once a local fault is detected in the
TLK3114SC device, bit 7 in MDIO registers 4.1 and 5.1 is set. Fault sequences received by the TLK3114SC device,
either on the transmit data bus or on the high-speed receiver terminals, are forwarded without change to the MDIO
registers in the TLK3114SC device.
The TLK3114SC device reports a fault by outputting a K28.4 (0x9C) on channel A, 0x00 on channels B and C, and
either 0x01 for local faults or 0x02 for remote faults on the receive data terminals for channel D. Forwarding of remote
faults is handled as a normal transmission.
Table 3−7. Local and Remote Fault Sequences
CHANNEL DESCRIPTION
Channel A†
Channel B
Channel C
Channel D
RDA[7:0]
LOCAL FAULT
Sequence‡
REMOTE FAULT
Sequence‡
RDA8
1
1
RDA9
1
1
RDB[7:0]
00
00
RDB8
0
0
RDB9
0
0
RDC[7:0]
00
00
RDC8
0
0
RDC9
0
0
RDD[7:0]
01
02
RDD8
0
0
RDD9
0
0
† Channels A, B, C, and D are equal to the XGMII lanes 0, 1, 2, and 3, respectively.
‡ The sequence character is equal to 0x9C.
3−9
3.16 Receive Synchronization and Skew Compensation
When the TLK3114SC device is configured in channel sync mode, a FIFO is enabled in the parallel receive data path
on each channel to compensate for channel skew and clock phase tolerance differences between the recovered
clocks for each channel and the receive output clock, RCA, as is shown in Figure 3−9. This FIFO has a depth of
11 bytes.
Protocol Device
TLK3114SC
Channel A
Channel
Logic
RX
FIFO
Data A
Serdes
Core
RCA
RCLKA
Channel B
Channel
Logic
Channel C
Channel
Logic
Channel D
Channel
Logic
RX
FIFO
Data B
RX
FIFO
Data C
RX
FIFO
Data D
RCLKB
RCLKC
RCLKD
Serdes
Core
Serdes
Core
Serdes
Core
RFCP/RFCN
Xtal OSC
Figure 3−9. Receive and Reference Clock Relationship (Synchronized Channel Modes)
The de-skew of the four channels into a single column of data is accomplished by alignment of the receive FIFOs
on each channel to a K28.3 K-character sent during the inter-packet gap (IPG) between data packets or during initial
link synchronization. The K28.3 code (referred to as the A or alignment code) is transmitted on the first column
following the end of the data packet as shown in Figure 3−12.
The column deskew state machine is provided in Figure 3−10. The status of column alignment can be monitored by
reading bit 12 of MDIO registers 4.24 or 5.24 for global alignment, or bits 3:0 of MDIO registers 4.24 or 5.24 for
particular channels. Bit 4 of MDIO registers 23, 4.32775, and 5.32775 indicates when a realignment has occurred.
3−10
RESET
or LOS
UNALIGN
De-skew
Error
Valid
Data
FAIL3
De-skew
Error
Valid
Data
FAIL2
||A||
||A||
De-skew
De-skew
Error
Error
DET1
||A||
Valid
Data
De-skew
Error
Valid
Data
||A||
FAIL1
||A||
De-skew
Error
DET2
Valid
Data
De-skew
Error
DET3
||A||
Valid
Data
||A||
ALIGN
Valid
Data
Figure 3−10. Column De-skew State Machine
3.16.1 Column State Descriptions
UNALIGN—This is the initial state for the column state machine upon device power up or reset. If any of the channel
state machines are set to UNSYNC, the column state is set to UNALIGN. In this state, the column state machine
searches for alignment character codes (K28.3 or /A/) on each channel and aligns the FIFO pointers on each channel
to the /A/ character code. While in this state, the column alignment sync bit is set to 0 in MDIO registers 4.24 and 5.24,
bit 12, indicating the column is not aligned. The column state transitions to the DET1 state upon the detection and
alignment of /A/ character codes in all four channels.
NOTE: When the XGXS lane alignment bit equals 0, it causes a local fault to be output on the receive
data bus.
DET1—During this state, the alignment character code detect circuit is active on each channel but the column
re-alignment is disabled. The column state machine remains in this state looking for a column of alignment character
codes. If an incomplete alignment column is detected (alignment character codes not found on all channels), the
column state machine transitions to state UNALIGN. While in this state, the column alignment sync bit is set to 0 in
MDIO registers 4.24 and 5.24, bit 12, indicating the column is not aligned. Detection of a complete alignment column
causes the column state machine to transition to state DET2.
NOTE: When the XGXS lane alignment bit equals 0, it causes a local fault to be output on the receive
data bus.
DET2—During this state, the alignment character code detect circuit is active on each channel but the column
re-alignment is disabled. The column state machine remains in this state looking for a column of alignment character
codes. If an incomplete alignment column is detected (alignment character codes not found on all channels), the
column state machine transitions to state UNALIGN. While in this state, the column alignment sync bit is set to 0 in
MDIO registers 4.24 and 5.24, bit 12, indicating the column is not aligned. Detection of a complete alignment column
causes the column state machine to transition to state DET3.
NOTE: When the XGXS lane alignment bit equals 0, it causes a local fault to be output on the receive
data bus.
DET3—During this state, the alignment character code detect circuit is active on each channel but the column
re-alignment is disabled. The column state machine remains in this state looking for a column of alignment character
codes. If an incomplete alignment column is detected (alignment character codes not found on all channels), the
column state machine transitions to state UNALIGN. While in this state, the column alignment sync bit is set to 0 in
MDIO registers 4.24 and 5.24, bit 12, indicating the column is not aligned. Detection of a complete alignment column
causes the column state machine to transition to state ALIGN.
NOTE: When the XGXS lane alignment bit equals 0, it causes a local fault to be output on the receive
data bus.
3−11
ALIGN—This is the normal state for receiving data. When in this state, the column state machine sets the column
alignment sync bit to 1 in MDIO registers 4.24 and 5.24, bit 12, indicating all channels are aligned. During this state,
the alignment character code detect circuit is active on each channel but the column re-alignment is disabled. If a
complete alignment column is not detected in the correct position within the IPG, the column state machine transitions
to state FAIL1.
FAIL1—When in this state, the column alignment sync bit is 1 in MDIO registers 4.24 and 5.24, bit 12. During this
state, the alignment character code detect circuit is active on each channel but the column re-alignment is disabled.
If a complete alignment column is not detected in the correct position within the IPG, the column state machine
transitions to state FAIL2.
FAIL2—When in this state, the column alignment sync bit is 1 in MDIO registers 4.24 and 5.24, bit 12. During this
state, the alignment character code detect circuit is active on each channel but the column re-alignment is disabled.
If a complete alignment column is not detected in the correct position within the IPG, the column state machine
transitions to state FAIL3.
FAIL3—When in this state, the column alignment sync bit is 1 in MDIO registers 4.24 and 5.24, bit 12. During this
state, the alignment character code detect circuit is active on each channel but the column re-alignment is disabled.
If complete alignment column is not detected in the correct position within the IPG, the column state machine
transitions to state UNALIGN.
3.17 Independent Channel Mode
When the TLK3114SC device is configured in independent channel mode, the recovered clocks for each channel are
used to output the received data on the parallel interface. Thus, as is shown in Figure 3−11, in the independent
channel modes, no FIFO is enabled.
Protocol Device
TLK3114SC
Channel A
Channel
Logic
RCLKA
RCA
Channel B
Channel
Logic
RCB
Channel
Logic
Serdes
Core
Data C
RCLKC
RCC
Channel D
Serdes
Core
Data B
RCLKB
Channel C
Channel
Logic
Data A
Serdes
Core
Data D
RCLKD
RCD
Serdes
Core
RFCP/RFCN
Xtal OSC
Figure 3−11. Receive and Reference Clock Relationship (Independent Channel Modes)
3−12
3.18 Inter-Packet Gap Management
When in the 10-Gbps ethernet XGXS operational mode, the TLK3114SC device replaces the idle codes (see
Table 3−5) during the IPG with the necessary codes to perform all channel alignment, byte alignment, and clock
tolerance compensation as defined in IEEE 802.3ae, subclause 48.2.4.2. According to clause 46, a valid packet must
begin on channel A. However, due to variable packet sizes, the IPG can begin on any channel. The TLK3114SC
device replaces idle codes latched on the same TCA (TX_CLK) clock edge as the end of packet code with /K/ codes
(as shown in Figure 3−12).
Packet
IPG
TDA[7:0]
I
I
S
D
D
D
D
...
D
D
D
D
I
I
I
I
I
I
TDB[7:0]
I
I
D
D
D
D
D
...
D
D
D
T
I
I
I
I
I
I
TDC[7:0]
I
I
D
D
D
D
D
...
D
D
D
I
I
I
I
I
I
I
TDD[7:0]
I
I
D
D
D
D
D
...
D
D
D
I
I
I
I
I
I
I
TXA
K
R
S
D
D
D
D
...
D
D
D
D
A
R
R
K
K
R
TXB
K
R
D
D
D
D
D
...
D
D
D
T
A
R
R
K
K
R
TXC
K
R
D
D
D
D
D
...
D
D
D
K
A
R
R
K
K
R
TXD
K
R
D
D
D
D
D
...
D
D
D
K
A
R
R
K
K
R
Input
Output
S = Start of Packet
D = Data
T = End of Packet
A = K28.3
K = K28.5
R = K28.0
I = Idle
Figure 3−12. Inter-Packet Gap Management
The subsequent idles in the IPG are replaced by columns of channel alignment codes (K28.3), byte alignment codes
(K28.5), or clock tolerance compensation codes (K28.0). The state machine, which governs the IPG replacement
procedure, is illustrated in Figure 3−13, with notation defined in Table 3−8. Note that any IPG management state
transitions to send data if the IPG is terminated.
The repetition of the A pattern on each serial channel allows the FIFOs to remove or add the required phase delay
to align the data from all four channels for output on a single edge of the receive clock for channel A, RCA, as shown
in Figure 3−14.
3−13
Any State
!(||idle|| + ||Q||)
nextAK = K
+ Acnt ! = 0
Send Data
nextAK = A*
Acnt = 0
RESET
Send K
Send A
||Q||
!||Q||
Send Q
Acnt ! = 0
nextKR = R
Send R
Acnt ! = 0*
nextKR = K
Acnt ! = 0*
nextKR = K
Send K
!||Q||*
nextKR = R
Acnt ! = 0*
nextKR = R
nextKR = R
Acnt = 0
Send A
Acnt = 0
||Q||
!||Q||*
nextKR = K
Send Q
nextKR = K
Figure 3−13. IPG Management State Machine
Table 3−8. IPG Management State Machine Notation
SYMBOL
||idle||
||Q||
Link status message:
K28.4, Dx.y, Dx.y, Dx.y
nextAK
A Boolean variable. It takes the value K when an A is sent at the beginning of the IPG and the value A when a K is sent at the
beginning of the IPG. Its initial value is K.
Acnt
When an A character is sent, variable Acnt is loaded with a random number such that 16 ≤ Acnt ≤ 31. Acnt is decremented each
time a column of non-A characters is generated.
nextKR
3−14
DEFINITION
XGMII idle. 0x07 on TD[A:D].
A randomly-generated Boolean that can assume the value K or R.
Any Valid
Code
RXAP/RXAN
RXBP/RXBN
K28.3
K28.5
K28.0
R R X X X X X X X X X X A A A A A A A A A A K K K K K K K K K K R R R R R R R R R R K K K K
R R X X X X X X X X X X A A A A A A A A A A K K K K K K K K K K R R R R R R R R R R K K K K
RXCP/RXCN R R X X X X X X X X X X A A A A A A A A A A K K K K K K K K K K R R R R R R R R R R K K K K
RXDP/RXDN
R R X X X X X X X X X X A A A A A A A A A A K K K K K K K K K K R R R R R R R R R R K K K K
RCA
RDA[9:0]
Undefined
Undefined
A
K
R
RDB[9:0]
Undefined
Undefined
A
K
R
RDC[9:0]
Undefined
Undefined
A
K
R
RDD[9:0]
Undefined
Undefined
A
K
R
Figure 3−14. Channel Synchronization Using Alignment Code
3.19 Clock Tolerance Compensation (CTC)
The XAUI interface is defined to allow for separate clock domains on each side of the link. Though the reference clocks
for two devices on a XAUI link have the same specified frequencies, there are slight differences within those limits
that, if not compensated for, lead to over- or underruns of the FIFOs on the receive data path. The TLK3114SC device
provides compensation for these differences in reference clock frequencies via the insertion or the removal of R
characters on all channels, as shown in Figure 3−15 and Figure 3−16. Bit 11 of MDIO register 16 allows enabling of
the CTC, as noted in Table 3−18.
3−15
Packet
IPG
RXA
K
R
S
D
D
D
D
...
D
D
D
D
A
R
R
K
S
D
RXB
K
R
D
D
D
D
D
...
D
D
D
T
A
R
R
K
D
D
RXC
K
R
D
D
D
D
D
...
D
D
D
K
A
R
R
K
D
D
RXD
K
R
D
D
D
D
D
...
D
D
D
K
A
R
R
K
D
D
RDA[7:0]
I
I
S
D
D
D
D
...
D
D
D
D
I
I
I
I
I
S
RDB[7:0]
I
I
D
D
D
D
D
...
D
D
D
T
I
I
I
I
I
D
RDC[7:0]
I
I
D
D
D
D
D
...
D
D
D
I
I
I
I
I
I
D
RDD[7:0]
I
I
D
D
D
D
D
...
D
D
D
I
I
I
I
I
I
D
Input
Output
S = Start of Packet
D = Data
T = End of Packet
A = K28.3
K = K28.5
R = K28.0
I = Idle
Added Column
Figure 3−15. Clock Tolerance Compensation: Add
3−16
Packet
IPG
RXA
K
R
S
D
D
D
D
...
D
D
D
D
A
R
R
K
S
D
RXB
K
R
D
D
D
D
D
...
D
D
D
T
A
R
R
K
D
D
RXC
K
R
D
D
D
D
D
...
D
D
D
K
A
R
R
K
D
D
RXD
K
R
D
D
D
D
D
...
D
D
D
K
A
R
R
K
D
D
Input
Dropped Column
RDA[7:0]
I
I
S
D
D
D
D
...
D
D
D
D
I
I
I
S
D
D
RDB[7:0]
I
I
D
D
D
D
D
...
D
D
D
T
I
I
I
D
D
D
RDC[7:0]
I
I
D
D
D
D
D
...
D
D
D
I
I
I
I
D
D
D
RDD[7:0]
I
I
D
D
D
D
D
...
D
D
D
I
I
I
I
D
D
D
Output
S = Start of Packet
D = Data
T = End of Packet
A = K28.3
K = K28.5
R = K28.0
I = Idle
Figure 3−16. Clock Tolerance Compensation: Drop
The R code is disparity neutral, allowing its removal or insertion without affecting the current running disparity of each
channel’s serial stream.
The clock tolerance compensation circuit also converts XAUI A, K, and R characters to XGMII idles, as illustrated in
Figure 3−16.
3.20 Parallel-to-Serial Shift Register
The parallel-to-serial shift register on each channel takes in 10-bit wide data from either the 8-b/10-b encoders, if
enabled, or directly from the transmit data bus and converts it to a serial stream. The shift register is clocked by the
internally generated bit clock, which is 10 times the reference clock (RFCP/RFCN) frequency. The least significant
bit (LSB) for each channel is transmitted first.
3.21 Serial-to-Parallel Shift Register
For each channel, serial data is received on the RXxP/RXxN terminals. The interpolator and clock recovery circuit
locks to the data stream if the clock to be recovered is within ±100 PPM of the internally generated bit rate clock. The
recovered clock retimes the input data stream. The serial data is then clocked into the serial-to-parallel shift registers.
If enabled, the 10-bit wide parallel data is then fed into 8-b/10-b decoders. If the TLK3114SC device is configured
in one of the synchronized channel modes, the parallel data for each channel is fed into a FIFO buffer where the output
is synchronized to RCA. If the TLK3114SC device is configured in one of the independent channel modes, the parallel
data for each channel is output synchronized to each channel’s recovered clock.
Transmitting data across PCB or cables attenuates the high frequency content of the signal. This reduces the timing
margin for the receiver and clock recovery circuits. The TLK3114SC device applies a filter at the receiver to invert
the effects of the interconnect, or equalize and recover some of the lost margin. This maximizes the receiver’s ability
to recover transmitted data.
3−17
3.22 High-Speed VML Output Driver
The high-speed data output driver is implemented using voltage mode logic that offers PECL-compatible differential
pair for a 100-Ω differential impedance environment with no external components. The line can be directly coupled
or ac coupled. See Figure 4−8 and Figure 4−9 for termination details.
Both current mode logic (CML) and PECL drivers require external components to provide a rising edge (CML) or a
falling edge (PECL). The disadvantage of the external edge control is a limited edge rate due to package and line
parasitics. In contrast, a VML driver drives and controls both the rising and falling edges inside the package and
therefore provides optimum performance for increased speed requirements. Furthermore, the VML driver controls
the output voltage swing and adjusts automatically for varying load conditions. The PECL-compatible output provides
a nominal 850-mV (singled-ended) swing centered at VDDA/2. The receiver input contains internal biasing for
ac-coupling. The receiver internal circuitry sets the common mode voltage to 2 × VDDA/3.
When transmitting data across long lengths of PCB trace or cable, the high frequency content of the signal is
attenuated due to the skin effect of the media. This causes a smearing of the data eye when viewed on an
oscilloscope. The net result is reduced timing margins for the receiver and clock recovery circuits. In order to provide
equalization for the high frequency loss, the differential swing is increased or preemphasized for the bit immediately
following a transition and subsequently reduced or deemphasized for run lengths greater than one, as shown in
Figure 3−17. This provides additional high frequency energy to compensate for PCB or cable loss. The level of the
preemphasis is programmable via bits 4 and 5 of MDIO registers 16−20. Users can control the strength of the
preemphasis to optimize for a specific system requirement. There are two control bits in the user-defined registers
of MDIO to set the preemphasis level, as shown in Table 3−9. See also Table 3−18 for MDIO settings.
Table 3−9. Programmable Preemphasis
PRE1 (Bit 4)
REGISTERS 16−20
PRE2 (Bit 5)
REGISTERS 16−20
PREEMPHASIS LEVEL
(VOD(p) / VOD(d)−1)†
0
0
30%
1
0
20%
0
1
10%
1
1
Preemphasis disabled
† VOD(p): Magnitude of the voltage swing when there is a transition in the data stream.
VOD(d): Magnitude of the voltage swing when there is no transition in the data stream.
Vod(p)
Vod(d)
Vod(pd)
VCMT
Vod(pp)
Vod(d)
Vod(p)
Bit
Time
Bit
Time
Figure 3−17. Output Differential Voltage Under Preemphasis
3.23 Device Configuration
The TLK3114SC device has four operational configurations controlled by two configuration terminals, CONFIG0 and
CONFIG1. These configurations are listed in Table 3−10 and controlled by the MDIO interface (see Table 3−18).
When the device is put in a certain mode, unused circuit blocks are powered down to conserve the system power.
3−18
Table 3−10. Device Configuration
CONFIG0
CONFIG1
CONFIGURATION
Low
Low
Full-duplex transceiver mode—normal operation (default after reset).
Low
High
Transmit-only mode—data on high-speed data inputs is ignored. Receive data bus is in a high-impedance state.
High
Low
Receive-only mode—high-speed data outputs are in a high-impedance state. Data on the transmit data bus is
ignored.
High
High
Repeater mode—recovered serial data and clock are sent back out the transmit serial output.
While transceiver, transmit-only, and receive-only modes are straightforward, the repeater mode of operation is
shown in Figure 3−18. The received serial data is recovered by the extracted clock and is then sent back out on the
transmit serial output. The data eye opens both vertically and horizontally.
RXxP
D
RXxN
Q
Deserializer
Recovered Clock
TXxP
TXxN
D
Q
Serializer
TX PLL
CONFIG0
CONFIG1
Mode
Selection
Repeater
Mode
Figure 3−18. Repeater-Mode Block Diagram
3.24 PRBS Generator
The TLK3114SC device has a built-in 27−1 PRBS self-test function available on each channel. The PRBS data pattern
represents a worst case data recovery task compared to any 8-b/10-b data pattern combination and is, therefore, a
sufficient test for the link and jitter tolerance. The self-test function is enabled by asserting the PRBSEN terminal or
setting bit 2 (PRBS enable) of MDIO channel configuration registers 16−20, 4.32768−4.32772, or 5.32768−5.32772.
When the self-test function is enabled, PRBS is generated and fed into the 10-bit parallel-to-serial converter input
register. Data on the transmit data bus is ignored during the PRBS test mode. The PRBS pattern is then fed through
the transmit circuitry as if it were normal data and sent out to the transmitter. The output can be sent to a BERT (bit
error rate tester), the receiver of another TLK3114SC channel, or can be looped back to the receive input of the same
channel. Since the PRBS is not really random but a predetermined sequence of 1s and 0s, the data can be captured
and checked for errors by a BERT.
Result reporting of the PRBS test (PRBS_PASS) is available on each receive channel multifunction (MF[A−D])
terminal. To enable the report of the PRBS tests, see bits 10 and 9 of MDIO register 16, 4.32768, or 5.32768. If
SYNCEN is high, then PRBS_PASS latches low on the first occurrence of a bit error. SYNCEN low releases the latch
function on PRBS_PASS. MDIO comma detect settings do not affect the latching function.
3−19
3.25 MDIO Management Interface
The TLK3114SC device supports the MDIO interface as defined in clauses 22 and 45 of the IEEE 802.3ae Ethernet
specification. The MDIO allows register-based management and control of the serial links. Normal operation of the
TLK3114SC device is possible without use of this interface since all of the essential signals necessary for operations
are accessible via the device terminals. However, some additional features are accessible only through the MDIO.
The MDIO management interface consists of a bidirectional data path (MDIO) and a clock reference (MDC). The
timing required to read from the internal registers 0−31 is shown in Figure 3−19. The timing required to write to the
internal registers 0−31 is shown in Figure 3−20. The port address is defined by the external inputs PADR(0−4).
MDC
MDIO
32 “1”s
0
1
1
0
A4
A0
R4
R0
Hi-Z
0
D15
PHY Address
Preamble
SFD
D0
Data
Idle
Register Address
Read Code
Turn Around
Figure 3−19. Management Interface Read Timing
MDC
MDIO
32 “1”s
0
1
0
1
A4
A0
Preamble
R4
R0
1
0
D15
PHY Address
SFD
D0
Data
Idle
Register Address
Write Code
Turn Around
Figure 3−20. Management Interface Write Timing
The extended register address space transactions are orthogonal to register 0−31 transactions, distinguished by the
ST bytes. Extended address space registers are denoted X.Y, where X designates the device address and Y
designates the register number. The permitted device addresses are shown in Table 3−11. The DADR0 bit is defined
by an external input, while the DADR[4:1] bits are predetermined. Write transactions that address an invalid register
or device or a read-only register are ignored. Read transactions that address an invalid register return a 0. Read
transactions that address an invalid device are ignored.
Timing for an address transaction is shown in Figure 3−21. The timing required to write to the internal registers is
shown in Figure 3−22. The timing required to read from the internal registers is shown in Figure 3−23. The timing
required to read from the internal registers and then increment the active address for the next transaction is shown
in Figure 3−24.
Table 3−11. MDIO Device Address
3−20
DADR(4:1)
DADR0
DEVICE MODE
0010
0
PHY XS
0010
1
DTE XS
MDC
MDIO
32 “1”s
0
0
0
0
A4
A0
Preamble
DA4
DA0
1
0
A15
Reg
Address
PHY Address
Start
A0
1
Idle
Dev Address
Address Code
Turn Around
Figure 3−21. Management Interface Extended Space Address Timing
MDC
MDIO
32 “1”s
0
0
0
1
A4
A0
Preamble
DA4
DA0
1
0
D15
PHY Address
Start
D0
Data
1
Idle
Dev Address
Write Code
Turn Around
Figure 3−22. Management Interface Extended Space Write Timing
MDC
MDIO
32 “1”s
0
0
1
1
A4
A0
Preamble
DA4
DA0
Hi-Z
0
D15
PHY Address
Start
D0
Data
1
Idle
Dev Address
Read Code
Turn Around
Figure 3−23. Management Interface Extended Space Read Timing
MDC
MDIO
32 “1”s
0
0
Preamble
1
0
A4
A0
DA4
DA0
Hi-Z
0
D15
PHY Address
Start
D0
Data
1
Idle
Dev Address
Read and Inc Code
Turn Around
Figure 3−24. Management Interface Extended Space Read and Increment Timing
The IEEE 802.3 Clause 22 and Clause 45 specifications define many of the registers, and additional registers have
been implemented for expanded functionality. The IEEE-defined registers and the expanded functionality registers
are outlined in Table 3−12.
3−21
Table 3−12. MDIO Registers
REGISTER ADDRESS
DEFINITION
Control
IEEE 802.3 defined. See Table 3−13
1
Status
IEEE 802.3 defined. See Table 3−14
2, 3
PHY identifier
IEEE 802.3 defined. See Table 3−15 and Table 3−16
4−14
Not applicable
−
15
Extended status
IEEE 802.3 defined. See Table 3−17
16
Global configuration
See Table 3−18
17−20
Channel A−D configuration
See Table 3−19, Table 3−20, Table 3−21, and Table 3−22
21
Reserved
Reserved
22
Channel status
See Table 3−23
23
Channel sync status
See Table 3−24
24
CTC status
See Table 3−25
25
Error counter control
See Table 3−26
Channel A−D error count
See Table 3−27, Table 3−28, Table 3−29, and Table 3−30
4.0
PHY XS control 1
IEEE 802.3 defined. See Table 3−31
4.1
PHY XS status 1
IEEE 802.3 defined. See Table 3−32
4.2, 4.3
26−29
PHY XS identifier
IEEE 802.3 defined. Same as registers 2, 3
4.4
PHY XS speed ability
IEEE 802.3 defined. See Table 3−33
4.5
Devices in package
IEEE 802.3 defined. See Table 3−34
Not applicable
−
PHY XS status 2
IEEE 802.3 defined. See Table 3−35
Not applicable
−
10G PHY XGXS lane status
See Table 3−36
Not applicable
−
PHY XS global configuration
See Table 3−37
4.6, 4.7
4.8
4.9−4.23
4.24
4.25−4.32767
4.32768
4.32769−4.32772
PHY XS channel A−D configuration
See Table 3−37
4.32773
Reserved
Reserved
4.32774
PHY XS channel status
See Table 3−37
4.32775
PHY XS channel sync status
See Table 3−37
4.32776
PHY XS CTC status
See Table 3−37
4.32777
Error counter control
See Table 3−37
4.32778−4.32781
Channel A−D error count
See Table 3−37
4.32782−4.65535
Not applicable
−
5.0
DTE XS control 1
IEEE 802.3 defined. See Table 3−38
5.1
DTE XS status 1
IEEE 802.3 defined. See Table 3−39
5.2, 5.3
DTE XS identifier
IEEE 802.3 defined. Same as registers 2, 3
5.4
DTE XS speed ability
IEEE 802.3 defined. See Table 3−40
5.5
Devices in package
IEEE 802.3 defined. See Table 3−41
Not applicable
−
DTE XS status 2
IEEE 802.3 defined. See Table 3−42
Not applicable
−
10G DTE XGXS lane status
See Table 3−43
Not applicable
−
DTE XS global configuration
See Table 3−44
DTE XS channel A−D configuration
See Table 3−44
5.6, 5.7
5.8
5.9−5.23
5.24
5.25−5.32767
5.32768
5.32769−5.32772
3−22
REGISTER NAME
0
Table 3−12. MDIO Registers (Continued)
REGISTER ADDRESS
REGISTER NAME
DEFINITION
5.32773
Reserved
Reserved
5.32774
DTE XS channel status
See Table 3−44
5.32775
DTE XS channel sync status
See Table 3−44
5.32776
DTE XS CTC status
See Table 3−44
5.32777
Error counter control
See Table 3−44
5.32778−5.32781
Channel A−D error count
See Table 3−44
5.32782−5.65535
Not applicable
−
Several MDIO register bits may be affected by Boolean functions. When a bit value is overridden through a Boolean
function, writes to that bit are ignored. The bit returns to its prior value once the override is removed.
Table 3−13. Control Register Bit Definitions (Register 0)
BIT(S)
NAME
DESCRIPTION
Logically ORed with the inverse of the RSTN terminal.
READ/WRITE
Read/Write
Self Clearing†
15
Reset
14
Loopback
1 = Enable loopback mode on all channels.
0 = Disable loopback mode on all channels (default).
Read/Write
13
Speed selection (LSB)
Not applicable. Read returns a 1.
Read-only
12
Auto-negotiation enable
Not applicable. Read returns a 0.
Read-only
1 = Global resets including FIFO clear
0 = Normal operation
Logically ORed with the inversion of the ENABLE terminal.
11
Power down
1 = Power-down mode is enabled.
0 = Normal operation (default).
Read/Write
10
Isolate
Not applicable. Read returns a 0.
Read-only
9
Restart auto-negotiation
Not applicable. Read returns a 0.
Read-only
8
Duplex mode
Only full duplex is supported. Writes are ignored. Read returns a 1.
Read-only
7
Collision test
Not applicable. Read returns a 0.
Read-only
6
Speed selection (MSB)
Not applicable. Read returns a 1.
Read-only
Reserved
Write as 0. Ignore on read.
5:0
−
† After reset, this bit is set to 1; it automatically sets itself back to 0 on the next MDC clock cycle.
Table 3−14. Status Register Bit Definitions (Register 1)
BIT(S)
NAME
15:9
DESCRIPTION
READ/WRITE
Read returns all 0s.
Read-only
8
Extended status
Read returns a 1, indicating extended status information is held in register 15.
Read-only
7
Reserved
Read is ignored.
Read-only
Various configurations
Read returns all 0s.
Read-only
Link status
1 = Link is up
0 = Link is down
Read-only
6:3
2
Latches low until read.
1
Jabber detect
Read returns a 0.
Read-only
0
Extended capability
Read returns a 1, indicating extended register capability.
Read-only
Registers 2 and 3 contain the identifier for the 10-Gbps ethernet XGXS device.
The identifier code is composed of bits 3−24 of the 25-bit organizationally unique identifier (OUI) assigned to Texas
Instruments by the IEEE. The 6-bit manufacturer model number is unique to the TLK3114SC device. The
manufacturer revision number denotes the current revision of the TLK3114SC device.
3−23
Table 3−15. PHY Identifier Bit Definitions (Register 2)
OUI ADDRESS BITS 3−18
2.15
2.14
2.13
2.12
2.11
2.10
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Table 3−16. PHY Identifier Bit Definitions (Register 3)
OUI ADDRESS BITS 19−24
MANUFACTURER REVISION
NUMBER
MANUFACTURER MODEL NUMBER
3.15
3.14
3.13
3.12
3.11
3.10
3.9
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.1
3.0
0
1
0
1
0
0
0
0
0
1
0
1
0
0
0
0
Table 3−17. Extended Status Register Bit Definitions (Register 15)
BIT(S)
15:12
11:0
NAME
DESCRIPTION
Read returns all 0s.
Read-only
Reserved
Read returns all 0s.
Read-only
See also registers 17−20 for individual channel configurations.
Writing to register 16 overwrites any previous settings to registers 17−20.
3−24
READ/WRITE
Various configurations
Table 3−18. Global Configuration Register Bit Definitions (Register 16)
BIT(S)
15
NAME
DESCRIPTION
READ/WRITE
Reserved
Read returns 0, writes are ignored.
Read-only
14
De-skew state machine
1 = Enable deskew state machine described in Figure 3−10.
0 = Disable deskew state machine (default).
Read/Write
13
Channel synchronization
state machine
1 = Enable channel synchronization state machine described in Figure 3−7.
0 = Disable channel synchronization state machine (default).
Read/Write
12
IPG management state
machine
1 = Enable IPG management state machine described in Figure 3−13.
0 = Disable IPG management state machine (default).
Read/Write
11
Clock tolerance
compensation
1 = Enable clock tolerance compensation.
0 = Disable clock tolerance compensation (default).
Read/Write
Multifunction (MF[A−D]) terminal configuration.
10:9
Multifunction pin output
8
Loss of signal detection
Bit 10
0
0
1
1
Bit 9
0
1
0
1
Output
HSTL = 1, SSTL_2 = 0 (default)
1 = Comma detected, 0 = data
Register 22, bits 3−0 (LOS)
Register 22, bits 7−4 (PRBS pass)
1 = Enable LOS condition described in Table 3−6 for all channels (default).
0 = Disable this function.
Read/Write
Read/Write
Configuration bits (see Table 3−10), default value = 0.
7
Configuration: Config1
When CONFIG1 = low, this bit can be set to 1.
When CONFIG1 = high, this bit is read-only.
Read/Write
Logically ORed with external input CONFIG1.
Configuration bits (see Table 3−10), default value = 0
6
Configuration: Config0
When CONFIG0 = low, this bit can be set to 1.
When CONFIG0 = high, this bit is read-only.
Read/Write
Logically ORed with external input CONFIG0.
5
Preemphasis: Pre2
Programmable preemphasis control (see Table 3−9), default value = 0.
Read/Write
4
Preemphasis: Pre1
Programmable preemphasis control (see Table 3−9), default value = 0.
Read/Write
3
Reserved
Read returns a 0, writes are ignored.
Read-only
1 = Enable PRBS internal generation and verification on all channels
0 = Normal operation (default).
2
PRBS enable
When PRBSEN = low, this bit can be set to 1.
When PRBSEN = high, this bit is read-only.
Read/Write
Logically ORed with PRBSEN.
1
Comma detect enable
1 = Enable K28.5 code detection and bit alignment on all channels (default).
0 = Disable K28.5 code detection on all channels.
Read/Write
Logically AND’ed with SYNCEN.
0
Reserved
Read returns a 0, writes are ignored.
Read/Write
3−25
Table 3−19. Channel A Configuration Registers Bit Definitions (Register 17)
BIT(S)
15:12
11
NAME
DESCRIPTION
READ/WRITE
Reserved
Read returns all 0s, writes are ignored.
Read-only
Clock tolerance compensation
1 = Enable clock tolerance compensation.
0 = Disable clock tolerance compensation (default).
Read/Write
Logically ORed with register 16, bit 11.
Multifunction (MFA) pin configuration for channel A.
10:9
Multifunction pin output
Bit 10
0
0
1
1
Bit 9
0
1
0
1
MFA Output
HSTL = 1, SSTL_2 = 0 (default)
1 = Comma detected, 0 = data
Register 22, bit 0 (LOS)
Register 22, bit 4 (PRBS pass)
Read/Write
Logically ORed with register 16, bits 10 and 9.
8
Loss of Signal Detection
1 = Enable LOS condition described in Table 3−7 for channel A (default).
0 = Disable this function.
Read/Write
Logically AND’ed with register 16, bit 8.
Configuration bits (see Table 3−10), default value = 0
7
Configuration: Config1
When CONFIG1 = low, this bit can be set to 1.
When CONFIG1 = high, this bit is read-only.
Read/Write
Logically ORed with register 16, bit 7.
Configuration bits (see Table 3−10), default value = 0
6
Configuration: Config0
When CONFIG0 = low, this bit can be set to 1.
When CONFIG0 = high, this bit is read-only.
Read/Write
Logically ORed with register 16, bit 6.
5
Preemphasis: Pre2
Programmable preemphasis control (see Table 3−9), default value = 0.
Logically ORed with register 16, bit 5.
Read/Write
4
Preemphasis: Pre1
Programmable preemphasis control (see Table 3−9), default value = 0.
Logically ORed with register 16, bit 4.
Read/Write
1 = Enable loopback mode on channel A.
0 = Disable loopback mode on channel A (default).
3
Loopback
Logically ORed with register 0, bit 14.
Read/Write
When LPENA = low, this bit can be set to 1.
When LPENA = high, this bit is read-only.
1 = Enable PRBS internal generation and verification on channel A
0 = Normal operation (default).
2
PRBS enable
Logically ORed with register 16, bit 2.
Read/Write
When PRBSEN = low, this bit can be set to 1.
When PRBSEN = high, this bit is read-only.
1
Comma detect enable
1 = Enable K28.5 code detection and bit alignment on channel A (default).
0 = Disable K28.5 code detection on channel A.
Read/Write
Logically AND’ed with SYNCEN and register 16, bit 1.
0
Power down
1 = Power-down mode is enabled for channel A.
0 = Normal operation (default).
Logically ORed with register 0, bit 11.
3−26
Read/Write
Table 3−20. Channel B Configuration Registers Bit Definitions (Register 18)
BIT(S)
15:12
11
NAME
DESCRIPTION
READ/WRITE
Reserved
Read returns all 0s, writes are ignored.
Read-only
Clock tolerance compensation
1 = Enable clock tolerance compensation.
0 = Disable clock tolerance compensation (default).
Read/Write
Logically ORed with register 16, bit 11.
Multifunction (MFB) pin configuration for channel B.
10:9
Multifunction pin output
Bit 10
0
0
1
1
Bit 9
0
1
0
1
MFB Output
HSTL = 1, SSTL_2 = 0 (default)
1 = Comma detected, 0 = data
Register 22, bit 1 (LOS)
Register 22, bit 5 (PRBS Pass)
Read/Write
Logically ORed with register 16, bits 10 and 9.
8
Loss of signal detection
1 = Enable LOS condition described in Table 3−7 for channel B (default).
0 = Disable this function.
Read/Write
Logically AND’ed with register 16, bit 8.
Configuration bits (see Table 3−10), default value = 0.
7
Configuration: Config1
When CONFIG1 = low, this bit can be set to 1.
When CONFIG1 = high, this bit is read-only.
Read/Write
Logically ORed with register 16, bit 7.
Configuration bits (see Table 3−10), default value = 0
6
Configuration: Config0
When CONFIG0 = low, this bit can be set to 1.
When CONFIG0 = high, this bit is read-only.
Read/Write
Logically ORed with register 16, bit 6.
5
Preemphasis: Pre2
Programmable preemphasis control (see Table 3−9), default value = 0.
Logically ORed with register 16, bit 5.
Read/Write
4
Preemphasis: Pre1
Programmable preemphasis control (see Table 3−9), default value = 0.
Logically ORed with register 16, bit 4.
Read/Write
3
Loopback
1 = Enable loopback mode on channel B.
0 = Disable loopback mode on channel B (default).
Read/Write
Logically ORed with register 0, bit 14.
1 = Enable PRBS internal generation and verification on channel B.
0 = Normal operation (default).
2
PRBS enable
Logically ORed with register 16, bit 2.
Read/Write
When PRBSEN = low, this bit can be set to 1.
When PRBSEN = high, this bit is read-only.
1
Comma detect enable
1 = Enable K28.5 code detection and bit alignment on channel B (default).
0 = Disable K28.5 code detection on channel B.
Read/Write
Logically AND’ed with SYNCEN and register 16, bit 1.
0
Power down
1 = Power-down mode is enabled for channel B.
0 = Normal operation (default).
Read/Write
Logically ORed with register 0, bit 11.
3−27
Table 3−21. Channel C Configuration Registers Bit Definitions (Register 19)
BIT(S)
15:12
11
NAME
DESCRIPTION
READ/WRITE
Reserved
Read returns all 0s, writes are ignored.
Read-only
Clock tolerance compensation
1 = Enable clock tolerance compensation.
0 = Disable clock tolerance compensation (default).
Read/Write
Logically ORed with register 16, bit 11.
Multifunction (MFC) pin configuration for channel C.
10:9
Multifunction pin output
Bit 10
0
0
1
1
Bit 9
0
1
0
1
MFC Output
HSTL = 1, SSTL_2 = 0 (default)
1 = Comma detected, 0 = data
Register 22, bit 2 (LOS)
Register 22, bit 6 (PRBS Pass)
Read/Write
Logically ORed with register 16, bits 10 and 9.
8
Loss of signal detection
1 = Enable LOS condition described in Table 3−7 for channel C (default).
0 = Disable this function.
Read/Write
Logically AND’ed with register 16, bit 8.
Configuration bits (see Table 3−10), default value = 0
7
Configuration: Config1
When CONFIG1 = low, this bit can be set to 1.
When CONFIG1 = high, this bit is read-only.
Read/Write
Logically ORed with register 16, bit 7.
Configuration bits (see Table 3−10), default value = 0
6
Configuration: Config0
When CONFIG0 = low, this bit can be set to 1.
When CONFIG0 = high, this bit is read-only.
Read/Write
Logically ORed with register 16, bit 6.
5
Preemphasis: Pre2
Programmable preemphasis control (see Table 3−9), default value = 0.
Logically ORed with register 16, bit 5.
Read/Write
4
Preemphasis: Pre1
Programmable preemphasis control (see Table 3−9), default value = 0.
Logically ORed with register 16, bit 4.
Read/Write
3
Loopback
1 = Enable loopback mode on channel C.
0 = Disable loopback mode on channel C (default).
Read/Write
Logically ORed with register 0, bit 14.
1 = Enable PRBS internal generation and verification on channel C.
0 = Normal operation (default).
2
PRBS enable
Logically ORed with register 16, bit 2
Read/Write
When PRBSEN = low, this bit can be set to 1.
When PRBSEN = high, this bit is read-only.
1
Comma detect enable
1 = Enable K28.5 code detection and bit alignment on channel C (default).
0 = Disable K28.5 code detection on channel C.
Read/Write
Logically AND’ed with SYNCEN and register 16, bit 1.
0
Power down
1 = Power-down mode is enabled for channel C.
0 = Normal operation (default).
Logically ORed with register 0, bit 11.
3−28
Read/Write
Table 3−22. Channel D Configuration Registers Bit Definitions (Register 20)
BIT(S)
15:12
11
NAME
DESCRIPTION
READ/WRITE
Reserved
Read returns all 0s, writes are ignored.
Read-only
Clock tolerance compensation
1 = Enable clock tolerance compensation.
0 = Disable clock tolerance compensation (default).
Read/Write
Logically ORed with register 16, bit 11
Multifunction (MFD) pin configuration for channel D.
10:9
Multifunction pin output
Bit 10
0
0
1
1
Bit 9
0
1
0
1
MFD Output
HSTL = 1, SSTL_2 = 0 (default)
1 = Comma detected, 0 = data
Register 22, bit 3 (LOS)
Register 22, bit 7 (PRBS Pass)
Read/Write
Logically ORed with register 16, bits 10 and 9.
8
Loss of signal detection
1 = Enable LOS condition described in Table 3−7 for channel D (default).
0 = Disable this function.
Read/Write
Logically AND’ed with register 16, bit 8.
Configuration bits (see Table 3−10), default value = 0
7
Configuration: Config1
When CONFIG1 = low, this bit can be set to 1.
When CONFIG1 = high, this bit is read-only.
Read/Write
Logically ORed with register 16, bit 7.
Configuration bits (see Table 3−10), default value = 0
6
Configuration: Config0
When CONFIG0 = low, this bit can be set to 1.
When CONFIG0 = high, this bit is read-only.
Read/Write
Logically ORed with register 16, bit 6.
5
Preemphasis: Pre2
Programmable preemphasis control (see Table 3−9), default value = 0.
Logically ORed with register 16, bit 5.
Read/Write
4
Preemphasis: Pre1
Programmable preemphasis control (see Table 3−9), default value = 0.
Logically ORed with register 16, bit 4.
Read/Write
3
Loopback
1 = Enable loopback mode on channel D.
0 = Disable loopback mode on channel D (default).
Read/Write
Logically ORed with register 0, bit 14
1 = Enable PRBS internal generation and verification on channel D
0 = Normal operation (default)
2
PRBS enable
Logically ORed with register 16, bit 2
Read/Write
When PRBSEN = low, this bit can be set to 1.
When PRBSEN = high, this bit is read-only.
1
Comma detect enable
1 = Enable K28.5 code detection and bit alignment on channel D (default).
0 = Disable K28.5 code detection on channel D.
Read/Write
Logically AND’ed with SYNCEN and register 16, bit 1
0
Power down
1 = Power-down mode is enabled for channel D.
0 = Normal operation (default)
Read/Write
Logically ORed with register 0, bit 11
3−29
Table 3−23. Channel Status Register (Register 22)
BIT(S)
15
NAME
Channel D transmit FIFO collision error
DESCRIPTION
1 = Collision error is detected to cause the transmit FIFO self reset.
0 = No error (default)
READ/WRITE
Read-only
After being read, this bit is reset to 0.
14
Channel C transmit FIFO collision error
1 = Collision error is detected to cause the transmit FIFO self reset.
0 = No error (default)
Read-only
After being read, this bit is reset to 0.
13
Channel B transmit FIFO collision error
1 = Collision error is detected to cause the transmit FIFO self reset.
0 = No error (default)
Read-only
After being read, this bit is reset to 0.
12
Channel A transmit FIFO collision error
1 = Collision error is detected to cause the transmit FIFO self reset.
0 = No error (default)
Read-only
After being read, this bit is reset to 0.
11
Channel D decode error
1 = Code word or running disparity error detected.
0 = No error (default)
Read-only
After being read, this bit is reset to 0.
10
Channel C decode error
1 = Code word or running disparity error detected.
0 = No error (default)
Read-only
After being read, this bit is reset to 0.
9
Channel B decode error
1 = Code word or running disparity error detected.
0 = No error (default)
Read-only
After being read, this bit is reset to 0.
8
Channel A decode error
1 = Code word or running disparity error detected.
0 = No error (default)
Read-only
After being read, this bit is reset to 0.
7
Channel D PRBS pass
1 = PRBS testing passes without error (default).
0 = Error is detected during PRBS test.
Read-only
After PRBS_PASS has been cleared, reading this bit sets it to 1.
6
Channel C PRBS pass
1 = PRBS testing passes without error (default).
0 = Error is detected during PRBS test.
Read-only
After PRBS_PASS has been cleared, reading this bit sets it to 1.
5
Channel B PRBS pass
1 = PRBS testing passes without error (default).
0 = Error is detected during PRBS test.
Read-only
After PRBS_PASS has been cleared, reading this bit sets it to 1.
4
Channel A PRBS pass
1 = PRBS testing passes without error (default).
0 = Error is detected during PRBS test
Read-only
After PRBS_PASS has been cleared, reading this bit sets it to 1.
3
Channel D LOS output
1 = LOS condition is reported.
0 = No LOS (default)
Read-only
After being read, this bit is reset to 0.
2
Channel C LOS output
1 = LOS condition is reported.
0 = No LOS (default)
Read-only
After being read, this bit is reset to 0.
1
Channel B LOS output
1 = LOS condition is reported.
0 = No LOS (default)
Read-only
After being read, this bit is reset to 0.
0
Channel A LOS output
1 = LOS condition is reported.
0 = No LOS (default)
After being read, this bit is reset to 0.
3−30
Read-only
Table 3−24. Channel Synchronization Status Register (Register 23)
BIT(S)
15:5
4
NAME
DESCRIPTION
READ/WRITE
Reserved
Read returns all 0s.
Read-only
Channel align flag
1 = Channel deskew circuit has realigned to a K28.3 /A/ code word on all channels.
0 = No /A/ has been detected.
Read-only
After being read, this bit is reset to 0.
3
2
1
0
Channel D receive FIFO
collision error
Channel C receive FIFO
collision error
Channel B receive FIFO
collision error
Channel A receive FIFO
collision error
1 = Collision error is detected to cause the receive FIFO self reset.
0 = No error.
Read-only
After being read, this bit is reset to 0.
1 = Collision error is detected to cause the receive FIFO self reset.
0 = No error.
Read-only
After being read, this bit is reset to 0.
1 = Collision error is detected to cause the receive FIFO self reset.
0 = No error.
Read-only
After being read, this bit is reset to 0.
1 = Collision error is detected to cause the receive FIFO self reset.
0 = No error.
Read-only
After being read, this bit is reset to 0.
3−31
Table 3−25. Clock Tolerance Compensation Status (Register 24)
BIT(S)
15
NAME
Channel D drop idle column
DESCRIPTION
1 = IDLE column has been dropped.
0 = No IDLE column dropped.
READ/WRITE
Read-only
After being read, this bit is reset to 0.
14
Channel C drop idle column
1 = IDLE column has been dropped.
0 = No IDLE column dropped.
Read-only
After being read, this bit is reset to 0.
13
Channel B drop idle column
1 = IDLE column has been dropped.
0 = No IDLE column dropped.
Read-only
After being read, this bit is reset to 0.
12
Channel A drop idle column
1 = IDLE column has been dropped.
0 = No IDLE column dropped.
Read-only
After being read, this bit is reset to 0.
11
10
9
8
7
Channel D insert idle
column
Channel C insert idle
column
Channel B insert idle
column
Channel A insert idle
column
Channel D FIFO overflow
1 = IDLE column has been inserted.
0 = No IDLE column inserted.
Read-only
After being read, this bit is reset to 0.
1 = IDLE column has been inserted.
0 = No IDLE column inserted.
Read-only
After being read, this bit is reset to 0.
1 = IDLE column has been inserted.
0 = No IDLE column inserted.
Read-only
After being read, this bit is reset to 0.
1 = IDLE column has been inserted.
0 = No IDLE column inserted.
Read-only
After being read, this bit is reset to 0.
1 = FIFO overflow condition
0 = No error
Read-only
After being read, this bit is reset to 0.
6
Channel C FIFO overflow
1 = FIFO overflow condition
0 = No error
Read-only
After being read, this bit is reset to 0.
5
Channel B FIFO overflow
1 = FIFO overflow condition
0 = No error
Read-only
After being read, this bit is reset to 0.
4
Channel A FIFO overflow
1 = FIFO overflow condition
0 = No error
Read-only
After being read, this bit is reset to 0.
3
Channel D FIFO underflow
1 = FIFO underflow condition
0 = No error
Read-only
After being read, this bit is reset to 0.
2
Channel C FIFO underflow
1 = FIFO underflow condition
0 = No error
Read-only
After being read, this bit is reset to 0.
1
Channel B FIFO underflow
1 = FIFO underflow condition
0 = No error
Read-only
After being read, this bit is reset to 0.
0
Channel A FIFO underflow
1 = FIFO underflow condition
0 = No error
After being read, this bit is reset to 0.
3−32
Read-only
Table 3−26. Error Counter Control Register (Register 25)
BIT(S)
15:5
NAME
DESCRIPTION
READ/WRITE
Reserved
Read returns all 0s.
Read-only
4
Rx PSYNC
0 = RC(A−D) clocks out individual channel. Transmit clocking is unaffected.
1 = All receive data is valid on the rising and falling edges of RCA (default).
Logically AND’ed with PSYNC terminal.
Read/Write
3
Channel D counter select
0 = Running disparity error counter (default).
1 = Decode error counter
Read/Write
2
Channel C counter select
0 = Running disparity error counter (default).
1 = Decode error counter
Read/Write
1
Channel B counter select
0 = Running disparity error counter (default).
1 = Decode error counter
Read/Write
0
Channel A counter select
0 = Running disparity error counter (default).
1 = Decode error counter
Read/Write
Table 3−27. Channel A Error Count (Register 26)
BIT(S)
15:0
NAME
DESCRIPTION
Channel A running disparity or decode error count value selected by
register 25, bit 0.
Error count
READ/WRITE
Read-only
After being read, this counter is reset to 0.
Table 3−28. Channel B Error Count (Register 27)
BIT(S)
15:0
NAME
DESCRIPTION
Channel B running disparity or decode error count value selected by
register 25, bit 1.
Error count
READ/WRITE
Read-only
After being read, this counter is reset to 0.
Table 3−29. Channel C Error Count (Register 28)
BIT(S)
15:0
NAME
DESCRIPTION
Channel C running disparity or decode error count value selected by
register 25, bit 2.
Error count
READ/WRITE
Read-only
After being read, this counter is reset to 0.
Table 3−30. Channel D Error Count (Register 29)
BIT(S)
15:0
NAME
DESCRIPTION
Channel D running disparity or decode error count value selected by
register 25, bit 3.
Error count
READ/WRITE
Read-only
After being read, this counter is reset to 0.
Table 3−31. PHY XS Control 1 Register (Register 4.0)
BIT(S)
NAME
DESCRIPTION
Logically ORed with the inverse of RSTN terminal.
READ/WRITE
Read/Write
Self Clearing†
15
Reset
14
Loopback
1 = Enable loopback mode on all channels.
0 = Disable loopback mode on all channels (default).
Read/Write
13
Speed selection (LSB)
Not applicable. Read returns 1.
Read-only
Reserved
Not applicable. Read returns all 0s.
Read-only
Speed selection (MSB)
Not applicable. Read returns 1.
Read-only
5:2
Speed selection
Not applicable. Read returns all 0s.
Read-only
1:0
Reserved
Not applicable. Read returns all 0s.
Read-only
12:7
6
1 = Global resets including FIFO clear.
0 = Normal operation (default)
† After reset, this bit is set to 1; it automatically sets itself back to 0 on the next MDC clock cycle.
3−33
Table 3−32. PHY XS Status 1 Register (Register 4.1)
BIT(S)
NAME
DESCRIPTION
READ/WRITE
15:8
Reserved
Read is ignored.
Read-only
7
Local fault
Logical OR of register 4.8, bits 10 and 11.
Read-only
6:3
Reserved
Read is ignored.
Read-only
TX link status
1 = Link is up
0 = Link is down
Read-only
2
Latches low until read.
1:0
Reserved
Read is ignored.
Read-only
Table 3−33. PHY XS Speed Ability Register (Register 4.4)
BIT(S)
15:1
0
NAME
DESCRIPTION
READ/WRITE
Reserved
Read returns all 0s.
Read-only
10G capable
Read returns 1.
Read-only
Table 3−34. Devices in Package Register (Register 4.5)
BIT(S)
15:6
NAME
DESCRIPTION
READ/WRITE
Reserved
Read is ignored.
Read-only
5
DTE XS present
1 = Device is configured as a DTE XS.
0 = Device is configured as a PHY XS.
Read-only
4
PHY XS present
1 = Device is configured as a PHY XS.
0 = Device is configured as a DTE XS.
Read-only
Not applicable
Read returns all 0s.
Read-only
Clause 22 registers present
Read returns 1.
Read-only
3:1
0
Table 3−35. 10G PHY XS Status 2 Register (Register 4.8)
BIT(S)
NAME
DESCRIPTION
READ/WRITE
15
Device present
Read returns 1.
Read-only
14
Device present
Read returns 0.
Read-only
Reserved
Read is ignored.
Read-only
Transmit local fault
1 = Transmit fault detected
0 = No transmit fault detected
Read-only
13:12
11
Latches high until read.
10
Receive local fault
1 = Receive fault detected
0 = No receive fault detected
Read-only
Latches high until read.
9:0
Reserved
Read is ignored.
Read-only
Table 3−36. 10G PHY XGXS Lane Status Register (Register 4.24)
BIT(S)
15:13
12
11:4
NAME
DESCRIPTION
READ/WRITE
Reserved
Read is ignored.
Read-only
Lane alignment
1 = PHY XGXS transmit lanes aligned
0 = PHY XGXS transmit lanes not aligned
Read-only
Reserved
Read is ignored.
Read-only
3
Lane D sync
Lane D is synchronized.
Read-only
2
Lane C sync
Lane C is synchronized.
Read-only
1
Lane B sync
Lane B is synchronized.
Read-only
0
Lane A sync
Lane A is synchronized.
Read-only
MDIO registers 4.32768−4.32781 are analogous to registers 16−29. The following table cross references the
appropriate register definition.
3−34
Table 3−37. PHY XS Register Cross Reference (Registers 4.32768−4.32776)
REGISTER
ADDRESS
4.32768
EQUIVALENT
REGISTER
ADDRESS
NAME
PHY XS global configuration
16
DEFINITION
Global Configuration
See Table 3−18
Channels A−D Configuration
See Table 3−19, Table 3−20,
Table 3−21, and Table 3−22
22
Channel Status
See Table 3−23
PHY XS channel sync status
23
Channel Sync Status
See Table 3−24
PHY XS CTC status
24
CTC Status
See Table 3−25
Error counter control
25
Error Counter Control
See Table 3−26
Channels A−D Error Count
See Table 3−27, Table 3−28,
Table 3−29, and Table 3−30
4.32769−4.32772
PHY XS channels A−D
configuration
17−20
4.32774
PHY XS channel status
4.32775
4.32776
4.32777
4.32778−4.32781
EQUIVALENT REGISTER
NAME
Channels A−D error count
26−29
Table 3−38. DTE XS Control 1 Register (Register 5.0)
BIT(S)
NAME
DESCRIPTION
Logically ORed with the inverse of RSTN terminal.
READ/WRITE
Read/Write
Self Clearing†
15
Reset
14
Loopback
1 = Enable loopback mode on all channels.
0 = Disable loopback mode on all channels (default).
Read/Write
13
Speed selection (LSB)
Not applicable. Read returns 1.
Read-only
Reserved
Not applicable. Read returns all 0s.
Read-only
Speed selection (MSB)
Not applicable. Read returns 1.
Read-only
Speed selection
Not applicable. Read returns all 0s.
Read-only
12:7
6
5:2
1 = Global resets including FIFO clear.
0 = Normal operation (default).
1:0
Reserved
Not applicable. Read returns all 0s.
† After reset, this bit is set to 1; it automatically sets itself back to 0 on the next MDC clock cycle.
Read-only
Table 3−39. DTE XS Status 1 Register (Register 5.1)
BIT(S)
NAME
DESCRIPTION
READ/WRITE
15:8
Reserved
Read is ignored.
Read-only
7
Local fault
Logical OR of register 5.8, bits 10 and 11.
Read-only
6:3
Reserved
Read is ignored.
Read-only
RX link status
1 = Link is up
0 = Link is down
Read-only
2
Latches low until read.
1:0
Reserved
Read is ignored.
Read-only
Table 3−40. DTE XS Speed Ability Register (Register 5.4)
BIT(S)
15:1
0
NAME
DESCRIPTION
READ/WRITE
Reserved
Read returns all 0s.
Read-only
10G capable
Read returns a 1.
Read-only
Table 3−41. Devices in Package Register (Register 5.5)
BIT(S)
15:6
NAME
DESCRIPTION
READ/WRITE
Reserved
Read is ignored.
Read-only
5
DTE XS present
1 = Device is configured as a DTE XS.
0 = Device is configured as a PHY XS.
Read-only
4
PHY XS present
1 = Device is configured as a PHY XS.
0 = Device is configured as a DTE XS.
Read-only
Not applicable
Read returns all 0s.
Read-only
Clause 22 registers present
Read returns 1.
Read-only
3:1
0
3−35
Table 3−42. 10G DTE XS Status 2 Register (Register 5.8)
BIT(S)
NAME
DESCRIPTION
READ/WRITE
15
Device present
Read returns 1.
Read-only
14
Device present
Read returns 0.
Read-only
Reserved
Read is ignored.
Read-only
Transmit local fault
1 = Transmit fault detected
0 = No transmit fault detected
Read-only
13:12
11
Latches high until read.
10
1 = Receive fault detected
0 = No receive fault detected
Receive local fault
Read-only
Latches high until read.
9:0
Reserved
Read is ignored.
Read-only
Table 3−43. 10G DTE XGXS Lane Status Register (Register 5.24)
BIT(S)
15:13
NAME
DESCRIPTION
READ/WRITE
Reserved
Read is ignored.
Read-only
Lane alignment
1 = DTE XGXS transmit lanes aligned
0 = DTE XGXS transmit lanes not aligned
Read-only
Reserved
Read is ignored.
Read-only
3
Lane D sync
Lane D is synchronized
Read-only
2
Lane C sync
Lane C is synchronized
Read-only
1
Lane B sync
Lane B is synchronized
Read-only
0
Lane A sync
Lane A is synchronized
Read-only
12
11:4
MDIO registers 5.32768−5.32781 are analogous to registers 16−29. The following table cross references the
appropriate register definition.
Table 3−44. DTE XS Register Cross Reference (Registers 5.32768−5.32776)
REGISTER
ADDRESS
5.32768
5.32769−5.32772
NAME
DTE XS global configuration
DTE XS channel A−D
configuration
EQUIVALENT
REGISTER
ADDRESS
16
17−20
EQUIVALENT REGISTER
NAME
DEFINITION
Global configuration
See Table 3−18
Channel A−D configuration
See Table 3−19, Table 3−20,
Table 3−21, and Table 3−22
5.32774
DTE XS channel status
22
Channel status
See Table 3−23
5.32775
DTE XS channel sync status
23
Channel sync status
See Table 3−24
5.32776
DTE XS CTC status
24
CTC status
See Table 3−25
5.32777
Error counter control
25
Error counter control
See Table 3−26
Channel A−D error count
See Table 3−27, Table 3−28,
Table 3−29, and Table 3−30
5.32778−5.32781
Channel A−D error count
26−29
3.26 Operating Frequency Range
The TLK3114SC device is optimized for operation at a serial data rate of 3.125 Gbps. The TLK3114SC device may
operate at a serial data rate between 2.5 Gbps to 3.125 Gbps. The external differential reference clock has an
operating frequency from 125 MHz to 156.25 MHz. The reference clock frequency must be within ±100 PPM and have
less than 40 ps of jitter.
3.27 Power-Down Mode
When the ENABLE terminal is held low, the TLK3114SC device enters a low power quiescent state. In this state, all
analog and digital circuitry is disabled. In the power-down mode, the serial transmit and the receive data bus terminals
for all channels are in a high-impedance state.
3−36
3.28 Loopback Testing
The TLK3114SC device can provide a self-test function by enabling the internal loop-back path with the assertion of
LPENx for each channel, setting bit 14 (Loopback) of register 4.0 or 5.0, or by setting bit 3 (Loopback) of MDIO
channel configuration registers 17−20, 4.32769−4.32772, or 5.32769−5.32772. Enabling this terminal or bit causes
serial transmitted data to be routed internally to the receiver for that channel (see Figure 1−5). The parallel data output
can be compared to the parallel input data for that channel to provide functional verification. The external differential
output is held in a high-impedance state during the loop-back testing.
3.29 Power-On Reset
Upon application of minimum valid power, the TLK3114SC device generates an internal power-on reset. During the
power-on reset the receive data terminals RDx[0:9] are tri-stated and the recovered receive clock terminals RC[A−D]
are held low. The length of the power-on reset cycle is dependent upon the frequency of the reference clock,
RFCP/RFCN, but is less than 1 ms in duration.
3.30 Differences Between the TLK31x4Sx Devices
The TLK31x4Sx class of devices contain several differences. The TLK3114 series represents improvements in robust
performance across operating conditions. The TLK3114 device class, however, contains distinct several functional
improvements and extensions beyond those included in the TLK3104SA device. These differences are outlined in
Table 3−45.
Table 3−45. Comparison of TLK3104SA and TLK3114SC Devices
PARAMETER/FUNCTION
TLK3104SA
TLK3114SC
HSTL
Supports HSTL scaled to 1.8 V
Buffers optimized for 1.5-V HSTL, although they
still support 1.8-V scaled HSTL. See Section 3.10.
Comma detect
Comma detect on positive comma only
Comma detect on both positive and negative
commas. See Section 3.12.
Improved error reporting
LOS and decode errors reported as 0xFF
Enhanced reporting. See Table 3−6.
End-of-packet error detection and reporting
Not supported
Supported. See Section 3.14.
Local fault and remote fault detection and
reporting
Not supported
IPG code generation and stripping
Not supported
Supported. See Section 3.18.
Clock tolerance compensation
Not supported
Supported. See Section 3.19.
Repeater mode
Not supported
Supported. See Section 3.23.
Power
Low power
Further reduced power
Serial receive
XAUI compliant
Improved signal tolerance
Terminal A1
TRSTN
ENABLE
Terminal U1
ENABLE
DADR0
Clause 45 MDIO
Not supported
Supported. See Section 3.25.
MDIO PHY/PRT address name
DVAD[0:4]
PADR[0:4]
MDIO DEV address specifier
Not supported
DADR0. See Section 3.25.
Supported. See Section 3.15.
The ENABLE terminal on the TLK3104SA device is U1. On the TLK3114SC device the ENABLE terminal is terminal
A1. The TLK3114 devices are compatible with a design intended for the TLK3104SA device. The TLK3104SA design
would be required to pull U1 high and A1 high. If a TLK3114SC device was substituted then U1 would be ignored,
since only clause 22 MDIO transactions would be executed, and A1 would still be required to be high. Also, the JTAG
standard, IEEE 1149.1, specifies that TRSTN is optional as long as there is an ENABLE or reset terminal which
accomplishes the same task. The TLK3114 devices place ENABLE where the TLK3104SA device had TRSTN so
that JTAG function is unaffected.
MDIO register addresses have been renamed to better reflect terminology in IEEE 802.3ae clause 45. The name
changes do not reflect a functional change.
3−37
3−38
4 Electrical Specifications
4.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range
(unless otherwise noted){
Supply voltage, VDD, VDDQ , VDDA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to 3 V
Input voltage, VI, (LVTTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 to 4 V
Input voltage, VI, (HSTL/SSTL_2 Class 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 to 4 V
DC input voltage (I/O) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to 3 V
Storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HBM: 2 kV, CDM: 750 V
Characterized free-air operating temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE: All voltage values, except differential I/O bus voltages, are stated with respect to the network ground terminal.
4.2 Recommended Operating Conditions
MAX
UNIT
2.3
2.5
2.7
V
2.3
2.5
2.7
V
HSTL Class 1
1.4
1.5
1.9
V
2.3
2.5
2.7
V
500
650
mA
Analog supply voltage, VDDA
Core supply current, IDD
NOM
SSTL_2 Class 1
Core supply voltage, VDD
I/O supply voltage, VDDQ
MIN
Rω = 156.25 MHz
SSTL_2 Class 1,
Rω = 156.25 MHz
150
325
mA
I/O supply current, IDDQ
HSTL Class 1
Rω = 156.25 MHz
120
200
mA
Analog supply current, IDDA
Rω = 156.25 MHz
280
320
mA
Total power consumption, PD
Transceiver mode,
Rω = 156.25 MHz
2.25
3.25
W
Transmit mode,
Rω = 156.25 MHz
0.9
1.5
W
Receive mode,
Rω = 156.25 MHz
2
2.8
W
Repeater mode,
Rω = 156.25 MHz
1.8
2.2
W
SSTL_2 Class 1
1.15
1.25
1.35
V
Input reference voltage, VREF†
HSTL Class 1
0.68
0.75
0.9
V
Analog shutdown current, ISDA
ENABLE = Low
µA
300
ENABLE = Low
500
µA
Core shutdown current, ISDD
† The value of VREF may be selected to provide optimum noise margin in the system. Typically, the value of VREF is expected to be 0.5VDDQ of
the transmitting device and VREF is expected to track variations in VDDQ. Peak-to-peak ac noise on VREF may not exceed 2% of VREF (dc).
4.3 Reference Clock Timing Requirements (RFCP/N)
These characteristics are over recommended operating conditions unless otherwise noted.
PARAMETER
Rω
Frequency
MIN
TYP
MAX
Minimum data rate
TEST CONDITION
TYP−0.01%
125
TYP+0.01%
Maximum data rate
TYP−0.01%
156.25
TYP+0.01%
Accuracy
−100
Duty cycle
40%
Jitter
Random and deterministic
100
50%
UNIT
MHz
ppm
60%
40
ps
4−1
This clock must be crystal referenced to meet the requirements of the above table. Contact TI for specific clocking
recommendations.
4.4 Reference Clock Electrical Characteristics (RFCP/N)
These characteristics are over recommended operating conditions unless otherwise noted.
PARAMETER
MIN
VI
Input voltage
825
Vidth
Differential input voltage
200
CIN
Input capacitance
RIN
Input differential impedance
80
TYP
MAX
UNIT
1675
mV
mVP-P
3
pF
100
120
Ω
TYP
MAX
UNIT
VDD
V
0.6
V
3.5
V
0.8
V
4.5 LVTTL Electrical Characteristics
These characteristics are over recommended operating conditions unless otherwise noted.
See Chapter 2, Terminal Descriptions, for a list of LVTTL signals.
PARAMETER
TEST CONDITION
MIN
VDD−0.2
VOH
High-level output voltage
IOH = −400 µA, VDD = MIN
VOL
Low-level output voltage
IOL = 4 mA,
VIH
High-level input voltage
VIL
Low-level input voltage
IH
VDD = MIN
0
2
High input current
VDD = MAX,
VIN = 2 V
IL
Low input current
VDD = MAX,
VIN = 0.4 V
CIN
Input capacitance
0.25
40
µA
−600
µA
4
pF
4.6 SSTL_2 Class 1 Signals
See Chapter 2, Terminal Descriptions, for a list of SSTL_2 Class 1 signals.
NOTE:
For more information on SSTL_2 Class 1 specifications and test conditions, see EIA/JEDEC,
Stub Series Terminated Logic For 2.5 V (SSTL_2), EIA/JESD8-9A, Dec 2000.
PARAMETER
TEST CONDITION
VOH(dc)
High-level output voltage
VOL(dc)
Low-level output voltage
VIH(dc)
High-level dc input voltage
DC input, logic high
VIL(dc)
Low-level dc input voltage
DC input, logic low
VIH(ac)
High-level ac input voltage
AC input, logic high
VIL(ac)
Low-level ac input voltage
AC input, logic low
IOH(dc)
High output current
VDDQ = 2.3 V,
VOUT = VDDQ–0.62 V
IOL(dc)
Low output current
VDDQ = 2.3 V, VOUT = 0.54 V
CIN
Input capacitance
4−2
MIN
TYP
MAX
1.76
UNIT
V
0.74
V
Vref+0.18
VDDQ+0.3
V
−0.3
Vref–0.18
V
Vref+0.35
V
Vref–0.35
V
−7.6
mA
7.6
mA
4
pF
4.7 HSTL Signals
See Chapter 2, Terminal Descriptions, for a list of HSTL signals.
NOTE:
For more information on HSTL specifications and test conditions, see EIA/JEDEC, High-Speed
Transceiver Logic (HSTL): A 1.5-V Output Buffer Supply Voltage Based Interface Standard for
Digital Integrated Circuits, EIA/JESD8-6, Aug 1995.
PARAMETER
CONDITION
VOH(dc)
High-level output voltage
VOL(dc)
Low-level output voltage
VIH(dc)
High-level dc input voltage
DC input, logic high
VIL(dc)
Low-level dc input voltage
DC input, logic low
VIH(ac)
High-level ac input voltage
AC input, logic high
VIL(ac)
Low-level ac input voltage
AC input, logic low
IOH(dc)
MIN
TYP
MAX
VDDQ−0.4
UNIT
VDDQ
V
0.4
V
Vref+0.1
VDDQ+0.3
V
−0.3
Vref–0.1
V
Vref+0.2
V
Vref–0.2
V
High output current
VDDQ = 1.5 V
−8
mA
IOL(dc)
Low output current
VDDQ = 1.5 V
8
mA
CIN
Input capacitance
4
pF
4.8 Serial Transmitter/Receiver Characteristics
PARAMETER
VOD(p)
VOD(d)
TX output voltage magnitude away from common
mode
VOD(pp)
TX output differential peak-to-peak voltage swing
VOD(pd)
TEST CONDITION
MIN
TYP
MAX
UNIT
Maximum preemphasis
enabled, See Figure 4−1
650
850
1000
mV
Preemphasis disabled,
See Figure 4−1
600
800
mV
Maximum preemphasis
enabled, See Figure 4−1
1300
1700
2000
mVP-P
Preemphasis disabled,
See Figure 4−1
1200
1450
1600
mVP-P
1250
1400
mV
VCMT
TX output common mode voltage range
See Figure 4−1
1000
VID
RX input voltage magnitude away from common
mode
See Figure 4−3
100
1150
mV
VID(p)
RX input differential peak-to-peak voltage swing
See Figure 4−3
200
2300
mVP-P
VCMR
RX input common mode voltage range
See Figure 4−3
1000
2000
mV
ILKG
RX input leakage current
−10
10
µA
CI
RX input capacitance
2
pF
130
ps
tr, tf
Differential output signal rise, fall time (20% to 80%)
RL = 50 Ω, CL = 5 pF,
See Figure 4−1
JTOL
Jitter tolerance, total jitter at serial input
Zero crossing, See Figure 4−4
0.65
UI†
JDR
Serial input deterministic jitter
Zero crossing, See Figure 4−4
0.37
UI
JS
Serial input sinusoidal jitter <20 MHz
0.1
UI
JT
Serial output total jitter
PRBS at 3.125 GHz,
See Figure 4−2
0.35
UI
JD
Serial output deterministic jitter
PRBS at 3.125 GHz
0.17
UI
R(LATENCY)
Total delay from RX input to RD output
See Figure 3−6
89
225
Bits
See Figure 3−2
71
120
Bits
T(LATENCY) Total delay from TD input to TX output
† Unit interval (UI) is one serial bit time (320 ps minimum).
80
90
0.2
4−3
VOD(p)
VOD(d)
VOD(pd) VOD(pp)
VO(CMT)
VOD(d)
VOD(p)
Bit
Time
tr , tf
Differential Amplitude − mV
Differential Amplitude − mV
Figure 4−1. Differential and Common-Mode Output Voltage Definitions
600
0
−600
0.175
0.825
100
0
−100
0.325
0.675
Unit Interval
1
Unit Interval
Figure 4−3. Receive Template
Figure 4−2. Transmit Template
t(J_DR)
t(J_R)
t(J_R)
t(J_TOL)
NOTE: t(J_TOL)= t(J_R) + t(J_DR), where t(J_TOL) is the receive jitter tolerance,
t(J_DR) is the received deterministic jitter, and t(J_R) is the Gaussian random
edge jitter distribution at a maximum BER = 10-12.
Figure 4−4. Input Jitter
4−4
1
4.9 SSTL_2 Class 1/HSTL Output Switching Characteristics
These characteristics are over recommended operating conditions unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
tsu
RDx[0:9] setup prior to RCx transition high or low
See Figure 4−5, timing relative to 0.5xVDDQ
960
ps
th
RDx[0:9] hold after RCx transition high or low
See Figure 4−5, timing relative to 0.5xVDDQ
960
ps
slew
RDx[0:9] slew rate
CL = 10 pF
1
RCA, RCB,
RCC, RCD
mV/ps
VDDQ/2
th
tsu
th
tsu
RDx[9:0]
Figure 4−5. SSTL_2 Class 1/HSTL Output Timing Requirements
4.10 SSTL_2 Class 1/HSTL Input Timing Requirements
These characteristics are over recommended operating conditions unless otherwise noted.
PARAMETER
tsu
TDx[0:9] setup prior to TCx transition high or low
th
TDx[0:9] hold after TCx transition high or low
† All values are at 25_C with a nominal supply.
MIN†
TEST CONDITION
TYP
MAX
UNIT
See Figure 4−6, timing relative to VREF
480
ps
See Figure 4−6, timing relative to VREF
480
ps
TCA, TCB,
TCC, TCD
VREF
th
tsu
th
tsu
TDx[9:0]
Figure 4−6. SSTL_2 Class 1/HSTL Data Input Timing Requirements
4−5
4.11 MDIO Timing Requirements
These characteristics are over recommended operating conditions unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
400
MAX
UNIT
tperiod
MDC period
See Figure 4−7
50
tsu
MDIO setup to ↑ MDC
See Figure 4−7
10
ns
th
MDIO hold to ↑ MDC
See Figure 4−7
10
ns
MDC
tp
tsu
th
MDIO
Figure 4−7. MDIO Read/Write Timing
TXP
50 Ω
RXP
VDDA
Transmission Line
50 Ω
4.2 kΩ
+
_
50 Ω
50 Ω
TXN
Transmitter
Transmission Line
6.3 kΩ
GND
RXN
Media
Receiver
Figure 4−8. High-Speed I/O Direct-Coupled Mode
TXP
50 Ω
RXP
VDDA
Transmission Line
50 Ω
4.2 kΩ
+
_
50 Ω
50 Ω
TXN
Transmitter
Transmission Line
Media
6.3 kΩ
GND
RXN
Receiver
Figure 4−9. Example High-Speed I/O AC-Coupled Mode
4−6
ns
VREF
50 Ω
(optional)
50 Ω
50 Ω
Transmission Line
+
_
VDDQ
RΩ
RΩ
VREF
GND
Output
PCB
Input
NOTE: The output buffer of the TLK3114SC has on-chip termination of 50 Ω. The
output signal is compliant with the JEDEC SSTL_2 Class 1 specification.
Line termination on the receive end is optional and not recommended for
low-power applications.
Figure 4−10. SSTL_2 Class 1 I/O
50 Ω
50 Ω
Transmission Line
+
_
VDDQ
RΩ
RΩ
VREF
GND
Output
PCB
Input
NOTE: The TLK3114SC provides a push-pull effect on the output buffer for
externally sourced series terminated loads. In HSTL mode, the signal swing
is small, allowing for minimal power consumption and low electromagnetic
emission (EME). To assure sufficient signal levels on the receive side, no
termination resistor is used.
Figure 4−11. HSTL I/O
4.12 Package Dissipation Rating
PARAMETER
θJA
Junction to free air thermal resistance
TEST CONDITION
MIN
TYP
MAX
UNIT
Airflow = 0 M/S
21.6
°C/W
Airflow = 1 M/S
17.8
°C/W
Airflow = 2 M/S
16.7
°C/W
4−7
4−8
5 Mechanical Data
GNT (S-PBGA-N289)
PLASTIC BALL GRID ARRAY
19,20
SQ
18,80
16,00 TYP
1,00
U
T
R
P
1,00
N
M
L
K
J
A1 Corner
H
G
F
E
D
C
B
A
3
1
2
5
4
7
6
9
8
11
10
13
12
15
14
17
16
Bottom View
2,00 MAX
Seating Plane
0,60
0,40
∅ 0,10 M
0,50
0,30
0,15
4201082/B 11/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
5−1
GPV (S–PBGA–N289)
PLASTIC BALL GRID ARRAY
19,20
SQ
18,80
16,00 TYP
1,00
U
T
R
P
1,00
N
M
L
K
J
H
G
F
E
D
A1 Corner
C
B
A
3
1
2
5
4
7
6
9
8
11
10
13
12
15
14
17
16
Bottom View
2,00 MAX
Seating Plane
0,60
0,40
0,10
0,50
0,30
0,15
4204203/A 02/2002
NOTES:
5−2
A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
PACKAGE OPTION ADDENDUM
www.ti.com
27-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
TLK3114SCGNT
ACTIVE
BGA
GNT
289
84
TBD
Call TI
Call TI
TLK3114SCGPV
ACTIVE
BGA
GPV
289
84
TBD
Call TI
Level-3-260C-168 HR
TLK3114SCZPV
ACTIVE
BGA
ZPV
289
84
Pb-Free
(RoHS)
SNAGCU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Jul-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
TLK3114SCGNT
OBSOLETE
BGA
GPV
289
TBD
Call TI
Level-3-220C-168 HR
TLK3114SCGPV
ACTIVE
BGA
GPV
289
84
TBD
Call TI
Level-3-220C-168 HR
TLK3114SCZPV
ACTIVE
BGA
ZPV
289
84
Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1