TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 features D D D D D D D D D D D D D D D D Fast Throughput Rate: 1.25 MSPS at 5 V, 625 KSPS at 3 V Wide Analog Input: 0 V to AVDD Differential Nonlinearity Error: < ± 1 LSB Integral Nonlinearity Error: < ± 1 LSB 8-to-1 Analog MUX – TLV1578 Internal OSC Single 2.7-V to 5.5-V Supply Operation Low Power: 12 mW at 3 V and 35 mW at 5 V Auto Power Down of 1 mA Max Software Power Down: 10 µA Max Hardware Configurable DSP and Microcontroller Compatible Parallel Interface Binary/Twos Complement Output Hardware Controlled Extended Sampling Channel Sweep Mode Operation and Channel Select Hardware or Software Start of Conversion applications D D D D D D Mass Storage and HDD Automotive Digital Servos Process Control General-Purpose DSP Image Sensor Processing TLV1578 DA PACKAGE (TOP VIEW) CH0 CH1 CH2 CH3 CS WR RD CLK DGND DVDD INT/EOC D0 D1 D2 D3 D4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 CH7 CH6 CH5 CH4 MO AIN AVDD AGND REFM REFP CSTART D9/A1 D8/A0 D7 D6 D5 TLV1571 DW OR PW PACKAGE (TOP VIEW) CS WR RD CLK DGND DVDD INT/EOC D0 D1 D2 D3 D4 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 NC AIN AVDD AGND REFM REFP CSTART D9/A1 D8/A0 D7 D6 D5 NC – No internal connection description The TLV1571/1578 is a 10-bit data acquisition system that combines an 8-channel input multiplexer (MUX), a high-speed 10-bit ADC, and a parallel interface. The device contains two on-chip control registers allowing control of channel selection, software conversion start, and power down via the bidirectional parallel port. The control registers can be set to a default mode by applying a dummy RD signal when WR is tied low. This allows the TLV1571/1578 to be configured by hardware. The MUX is independently accessible. This allows the user to insert a signal conditioning circuit such as an antialiasing filter or an amplifier, if required, between the MUX and the ADC. Therefore, one signal conditioning circuit can be used for all eight channels. The TLV1571 is a single channel analog input device with all the same functions as the TLV1578. The TLV1571/TLV1578 operates from a single 2.7-V to 5.5-V power supply. It accepts an analog input range from 0 V to AVDD and digitizes the input at a maximum 1.25 MSPS throughput rate at 5 V. The power dissipations are only 12 mW with a 3-V supply or 35 mW with a 5-V supply. The device features an auto power-down mode that automatically powers down to 1 mA 50 ns after conversion is performed. In software power-down mode, the ADC is further powered down to only 10 µA. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 description (continued) Very high throughput rate, simple parallel interface, and low power consumption make the TLV1571/TLV1578 an ideal choice for high-speed digital signal processing requiring multiple analog inputs. AVAILABLE OPTIONS PACKAGE TA 32 TSSOP (DA) 0°C to 70°C TLV1578CDA TLV1571CDW TLV1571CPW – 40°C to 85°C TLV1578IDA TLV1571IDW TLV1571IPW 24 SOP (DW) 24 TSSOP (PW) functional block diagram – TLV1571/78 MO CH0 – CH7 REFP AVDD AIN REFM DVDD MUX 10-BIT SAR ADC TLV1578 Only Internal Clock Three State Latch D0 – D7 D8/A0 D9/A1 MUX CLK CS RD WR CSTART Input Registers and Control Logic AGND 2 POST OFFICE BOX 655303 INT/EOC DGND • DALLAS, TEXAS 75265 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 Terminal Functions NAME TERMINAL NO. I/O DESCRIPTION TLV1571 TLV1578 AGND 21 25 AIN 23 27 AVDD 22 26 CH0 – CH7 – 1– 4, 29–32 I Analog input channels CLK 4 8 I External clock input Analog ground I ADC analog input (used as single analog input channel for TLV1571) Analog supply voltage, 2.7 V to 5.5 V CS 1 5 I Chip select. A logic low on CS enables the TLV1571/ TLV1578. CSTART 18 22 I Hardware sample and conversion start input. The falling edge of CSTART starts sampling and the rising edge of CSTART starts conversion. DGND 5 9 DVDD Digital ground 6 10 8 –12, 13 –15 12 –16, 17–19 I/O Bidirectional 3-state data bus D8/A0 16 20 I/O Bidirectional 3-state data bus. D8/A0 along with D9/A1 is used as address lines to access CR0 and CR1 for initialization. D9/A1 17 21 I/O Bidirectional 3-state data bus. D9/A1 along with D8/A0 is used as address lines to access CR0 and CR1 for initialization. INT/EOC 7 11 O End-of-conversion/interrupt 28 O On-chip MUX analog output D0 – D7 MO NC Digital supply voltage, 2.7 V to 5.5 V 24 Not connected RD 3 7 I Read data. A falling edge on RD enables a read operation on the data bus when CS is low. REFM 20 24 I Lower reference voltage (nominally ground). REFM must be supplied or REFM pin must be grounded. REFP 19 23 I Upper reference voltage (nominally AVDD). The maximum input voltage range is determined by the difference between the voltage applied to REFP and REFM. WR 2 6 I Write data. A rising edge on the WR latches in configuration data when CS is low. When using software conversion start, a rising edge on WR also initiates an internal sampling start pulse. When WR is tied to ground, the ADC in nonprogrammable (hardware configuration mode). POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 detailed description Ain Charge Redistribution DAC _ + REFM SAR Register ADC Code Control Logic Figure 1. Analog-to-Digital SAR Converter The TLV1571/78 is a successive-approximation ADC utilizing a charge redistribution DAC. Figure 1 shows a simplified version of the ADC. The sampling capacitor acquires the signal on AIN during the sampling period. When the conversion process starts, the SAR control logic and charge redistribution DAC are used to add and subtract fixed amounts of charge from the sampling capacitor to bring the comparator into a balanced condition. When the comparator is balanced, the conversion is complete and the ADC output code is generated. sampling frequency, fs The TLV1571/TLV1578 requires 16 CLKs for each conversion, (assuming the read cycle takes 1 CLK). The equivalent maximum sampling frequency achievable with a given CLK frequency is: fs(max) = (1/17) fCLK The TLV1571 and TLV1578 are software configurable. The first two MSB bits, D(9,8) are used to address which register to set. The rest of the eight bits are used as control data bits. There are two control registers, CR0 and CR1, that are user configurable. All of the register bits are written to the control register during write cycles. A description of the control registers is shown in Figure 2. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 detailed description (continued) control registers A1 A0 A(1:0)=00 D7 D6 Control Register Zero (CR0) D7 D6 D5 STARTSEL PROGEOC CLKSEL 0: 0: HARDWARE INT START (CSTART) 1: EOC 1: SOFTWARE START A(1:0)=01 D5 D4 D3 D2 D4 SWPWDN D3 MODESEL D2 0: NORMAL 0: Internal Clock 1: External Clock 1: Power Down 0: Single Channel 1: Sweep Mode Control Register One (CR1) D7‡ D6 D3 D5‡ D4‡ RESERVED OSCSPD 0 Reserved 0 Reserved OUTCODE 0: Reserved Bit Always Write 0 0: INT. OSC. SLOW 1: INT. OSC. FAST 0: Reserved Bit Always Write 0 0: Reserved Bit, Always Write 0 D1 D0 D1 CHSEL(2–0)† D0 D(2– 0) Single Input Channels Swept 0h 0 0,1 1h 1 0,1,2,3 2h 2 0,1,2,3,4,5, 3h 3 0,1,2,3,4,5,6,7 4h 4 N/A 5h 5 N/A 6h 6 N/A 7h 7 N/A D2 READREG D1 STEST1 0: Binary 0: Enable Self Test 1: 1: Enable 2s Register Complement Read back CR1.(1–0) 0h 1h 2h 3h 0h D0 STEST0 IF READREG = 0 ACTION Output = CONVERSION result Output = SELF TEST 1 result Output = SELF TEST 2 result Output = SELF TEST 3 result IF READREG = 1 Output Contents of CR0 1h Output Contents of CR1 2h RESERVED 3h RESERVED † Don’t care for TLV1571 ‡ When in read back mode, the values read from the control register reserved bits are don’t care. Figure 2. Input Data Format POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 detailed description (continued) hardware configuration option The TLV1571/TLV1578 can configure itself. This option is enabled when the WR pin is tied to ground and a dummy RD signal is applied. The ADC is now fully configured. Zeros or default values are applied to both control registers. The ADC is configured ideally for 3-V operation, which means the internal OSC is set at 10 MHz, single channel input mode, and hardware start of conversion using CSTART. ADC conversion modes The TLV1571/TLV1578 provides two conversion modes and two start of conversion modes. In single channel input mode, a single channel is continuously sampled and converted. In sweep mode (only available for the TLV1578), a predetermined set of channels is continuously sampled and converted. Table 1 explains these modes in more detail. Table 1. Conversion Modes MODES Single Channel Input† CR0.D3 = 0 CR1.D7 = 0 Channel Sweep CR0.D3 = 1 CR1.D7 = 0 START OF CONVERSION OPERATION Hardware Start (CSTART) CR0.D7 = 0 • • • • • Software Start CR0.D7 = 1 • Repeated conversions from a selected channel • WR rising edge to start sampling initially. Thereafter, sampling occurs at the rising edge of RD. • Conversion begins after 6 clocks after sampling has begun. Thereafter, if in INT mode, one INT pulse is generated after each conversion • If in EOC mode, EOC will go high to low at start of conversion and return high at end of conversion. With external clock, WR and RD rising edge must be a minimum 5 ns before or after CLK rising edge. Hardware Start (CSTART) CR0.D7 = 0 • • • • • CSTART rising edge must be applied a minimum of 5 ns before or after CLK rising edge. Software Start CR0.D7 = 1 • One conversion per channel from a sequence of channels • WR rising edge to start sampling • ADC proceeds to sample next channel at rising edge of RD. Conversion begins after 6 clocks and lasts 10 clocks • If in INT mode, one INT pulse generated after each conversion • If in EOC mode, EOC will go high to low at start of conversion and return high at end of conversion. Repeated conversions from a selected channel CSTART falling edge to start sampling CSTART rising edge to start conversion If in INT mode, one INT pulse generated after each conversion If in EOC mode, EOC will go high to low at start of conversion, and return high at end of conversion. One conversion per channel from a predetermined sequence of channels CSTART falling edge to start sampling CSTART rising edge to start conversion If in INT mode, one INT pulse generated after each conversion If in EOC mode, EOC will go high to low at start of conversion, and return high at end of conversion. † Single channel input mode repeatedly samples and converts from the channel until WR is applied. 6 COMMENT–SET BITS CR0.D(2–0) FOR INPUT POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CSTART rising edge must be applied a minimum of 5 ns before or after CLK rising edge. With external clock, WR and RD rising edge must be a minimum 5 ns before or after CLK rising edge. TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 detailed description (continued) configure the device The device can be configured by writing to control registers CR0 and CR1. Table 2. TLV1571/TLV1578 Programming Examples INDEX REGISTER D7 D6 D5 D4 D3 D2 D1 D0 COMMENT 0 0 0 0 0 0 0 0 0 Single channel 0 1 0 0 0 0 0 1 0 0 Single Input CR0 0 0 0 1 1 0 1 0 1 1 Sweep mode CR1 0 1 0 0 0 0 1 1 0 0 2s complement output D9 D8 CR0 0 CR1 EXAMPLE1 EXAMPLE2 register read back Control data written to the TLV1571/78 can be read back from the control registers CR0 and CR1. See Figure 2. NOTE: Data read out of CR1 reserved bits is don’t care. power down The TLV1571/TLV1578 offers two power down modes, auto power down and software power down. This device will automatically proceed to auto power-down mode if RD is not present one clock after conversion. Software power down is controlled directly by the user by pulling CS to DVDD. Table 3. Power Down Modes PARAMETERS/MODES AUTO POWER DOWN SOFTWARE POWER DOWN (CS = DVDD) 1 mA 10 µA Comparator Power down Power down Clock buffer Maximum power down dissipation current Power down Power down Reference Active Power down Control registers Saved Saved Minimum power down time 1 CLK 2 CLK Minimum resume time 1 CLK 2 CLK self-test modes The TLV1571/TLV1578 provides three self test modes. These modes can be used to check whether the ADC itself is working properly without having to supply an external signal. There are three tests that are controlled by writing to CR1(D1,D0) (see Table 4). Table 4. Self Tests CR1(D1,D0) SELF TEST VOLTAGE APPLIED DIGITAL OUTPUT 0h Normal, no self test applied N/A 1h VREFM applied to ADC input internally 000h 2h (VREFP–VREFM)/2 applied to ADC input internally 200h 3h VIN = VREFP applied to ADC input internally 3FFh POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 detailed description (continued) reference voltage input The TLV1571/TLV1578 has two reference input pins: REFP and REFM. The voltage levels applied to these pins establish the upper and lower limits of the analog inputs to produce a full-scale and zero-scale reading respectively. The values of REFP, REFM, and the analog input should not exceed the positive supply or be less than GND consistent with the specified absolute maximum ratings. The digital output is at full scale when the input signal is equal to or higher than REFP and is at zero when the input signal is equal to or lower than REFM. sampling/conversion All sampling, conversion, and data output in the device are started by a trigger. This could be the RD, WR, or CSTART signal depending on the mode of conversion and configuration. The rising edge of RD, WR, and CSTART signal are extremely important, since they are used to start the conversion. These edges need to stay close to the rising edge of the external clock (if external clock is used as source of conversion clock). The minimum setup and hold time with respect to the rising edge of the external clock should be 5 ns minimum. When the internal clock is used, this is not an issue since these two edges will start the internal clock automatically. Therefore, the setup time is always met. Software controlled sampling lasts 6 clock cycles. This is done via the CLK input or the internal oscillator if enabled. The input clock frequency can be 1 MHz to 20 MHz, translating into a sampling time from 0.6 µs to 0.3 µs. The internal oscillator frequency is 9 MHz minimum (oscillator frequency is between 9 MHz to 22 MHz), translating into a sampling time from 0.6 µs to 0.3 µs. Conversion begins immediately after sampling and lasts 10 clock cycles. This is again done using the external clock input (1 MHz–20 MHz) or the internal oscillator (9 MHz minimum) if enabled. Hardware controlled sampling, via CSTART, begins on falling CSTART lasts the length of the active CSTART signal. This allows more control over the sampling time, which is useful when sampling sources with large output impedances. On rising CSTART, conversion begins. Conversion in hardware controlled mode also lasts 10 clock cycles. This is done using the external clock input (1 MHz–20 MHz) or the internal oscillator (9 MHz minimum) as is the case in software controlled mode. ExtClk th(WRL_EXTCLKH) ≥5 ns tsu(WRH_EXTCLKH) ≥5 ns WR OR th(RDL_EXTCLKH) ≥5 ns tsu(RDH_EXTCLKH) ≥5 ns RD OR th(CSTARTL_EXTCLKH) ≥5 ns td(EXTCLK_CSTARTL) ≥5 ns tsu(CSTARTH_EXTCLKH) ≥5 ns CSTART NOTE: tsu = setup time, th = hold time Figure 3. Trigger Timing – Software Start Mode Using External Clock 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 start of conversion mechanism There are two ways to convert data: hardware and software. In the hardware conversion mode the ADC begins sampling at the falling edge of CSTART and begins conversion at the rising edge of CSTART. Software start mode ADC samples for 6 clocks, then conversion occurs for ten clocks. The total sampling and conversion process lasts only 16 clocks in this case. If RD is not detected during the next clock cycle, the ADC automatically proceeds to a power-down state. Data is valid on the rising edge of INT in both conversion modes. hardware CSTART conversion external clock With CS low and WR low, data is written into the ADC. The sampling begins at the falling edge of CSTART and conversion begins at the rising edge of CSTART. At the end of conversion, EOC goes from low to high, telling the host that conversion is ready to be read out. The external clock is active and is used as the reference at all times. With this mode, it is required that CSTART is not applied at the rising edge of the clock (see Figure 4). POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 15 16 t su(CSL_WRL) t h(WRH_CSH) t su(CSL_RDL) t su(CSL_RDL) CS WR t h(RDH_CSH) t d(CSH_CSTARTL) t(sample) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 (Channel 0) (see Note A) tc tc (10 I/O CLKs) t(sample) (Channel 0) (see Note A) CSTART RD t su(DAV_WRH) t D[0:9] t d(EOC_RDL) t dis(RDH_DAV) h(WRH_DAV) Config Data ADC ADC t en(RDL_DAV) t en(RDL_DAV) INT OR EOC Auto Power Down NOTE A: AIN for TLV1571; channels sweep according to register settings. Figure 4. Multichannel Input Mode Conversion – Hardware CSTART, External Clock TLV1571, TLV1578 2.7 V to 5.5 V, 1-/8-CHANNEL, 10-BIT, RARALLEL ANALOG-TO-DIGITAL CONVERTERS 6 CLK SLAS170D – MARCH 1999 – REVISED JULY 2000 10 start of conversion mechanism (continued) internal clock In single channel input mode, with CS low and WR low, data is written into the ADC. The sampling begins at the falling edge of CSTART, and conversion begins at the rising edge of CSTART. The internal clock turns on at the rising edge of CSTART. The internal clock is disabled after each conversion. t su(CSL_WRL) t h(WRH_CSH) t su(CSL_RDL) t su(CSL_RDL) CS t d(CSH_CSTARTL) WR t (STARTOSC) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 t(sample) (Channel 0) (see Note A) t h(RDH_CSH) tc CSTART 0 1 9 tc (Channel 1) (see Note A) 10 t (STARTOSC) RD t su(DAV_WRH) t d(EOC_RDL) t h(WRH_DAV) D[0:9] t dis(RDH_DAV) Config Data ADC Data ADC Data t en(RDL_DAV) INT tc OR EOC Auto Power Down Auto Power Down NOTE A: AIN for TLV1571; channels sweep according to register settings. 11 Figure 5. Multichannel Input Mode Conversion – Hardware CSTART, Internal Clock SLAS170D – MARCH 1999 – REVISED JULY 2000 t en(RDL_DAV) TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS INTCLK With CS low and WR low, data is written into the ADC. Sampling begins at the rising edge of WR. The conversion process begins 6 clocks after sampling begins. At the end of conversion, INT goes low telling the host that conversion is ready to be read out. EOC is low during the conversion and makes a high-to-low transition at the end of the conversion. The external clock is active and is used as the reference at all times. With this mode, WR and RD should not be applied at the rising edge of the clock (see Figure 3). 0 1 5 6 7 15 16 0 4 5 15 CLK t su(CSL_WRL) t su(CSL_RDL) t h(WRH_CSH) t h(RDH_CSH) t su(CSL_RDL) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CS WR RD t(sample) (Channel 0) (see Note A) t su(DAV_WRH) t(sample) (Channel 1) (see Note A) tc t d(EOC_RDL) t dis(RDH_DAV) t h(WRH_DAV) D[0:9] Config Data tc ADC Data ADC Data t en(RDL_DAV) t en(RDL_DAV) INT OR EOC Auto Powerdown NOTE A: AIN for TLV1571; channels sweep according to register settings. Figure 6. Multichannel Input Mode Conversion – Software Start, External Clock TLV1571, TLV1578 2.7 V to 5.5 V, 1-/8-CHANNEL, 10-BIT, RARALLEL ANALOG-TO-DIGITAL CONVERTERS external clock SLAS170D – MARCH 1999 – REVISED JULY 2000 12 software START conversion software START conversion (continued) internal clock With CS low and WR low, data is written into the ADC. Sampling begins at the rising edge of WR. Conversion begins 6 clocks after sampling begins. The internal clock begins at the rising edge of WR. The internal clock is disabled after each conversion. Subsequent sampling begins at the rising edge of RD. t su(CSL_RDL) t su(CSL_WRL) t h(RDH_CSH) CS t h(WRH_CSH) WR POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 RD t (STARTOSC) 4 5 6 15 16 0 4 5 15 INTCLK t(sample) (Channel 0) (see Note A) t d(EOC_RDL) t su(DAV_WRH) t h(WRH_DAV) D[0:9] t(sample) (Channel 1) (see Note A) t dis(RDH_DAV) tc ADC Data ADC t en(RDL_DAV) INT OR EOC Auto Powerdown NOTE A: AIN for TLV1571; channels sweep according to register settings. Figure 7. Multichannel Input Mode Conversion – Software Start, Internal Clock Auto Powerdown 13 SLAS170D – MARCH 1999 – REVISED JULY 2000 Config Data tc TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS 0 t (STARTOSC) TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 software START conversion (continued) system clock source The TLV1571/TLV1578 internally derives multiple clocks from the SYSCLK for different tasks. SYSCLK is used for most conversion subtasks. The source of SYSCLK is programmable via control register zero bit 5. The source of SYSCLK is changed at the rising edge of WR of the cycle when CR0.D5 is programmed. internal clock (CR0.D5 = 0, SYSCLK = internal OSC) The TLV1571/TLV1578 has a built-in 10 MHz OSC. When the internal OSC is selected as the source of SYSCLK, the internal clock starts with a delay (one half of the OSC period max) after the falling edge of the conversion trigger (either WR, RD, or CSTART). The OSC speed can be set to 10 ± 1 MHz or 20 ± 2 MHz by setting register bit CR1.6. external clock (CR0.D5 = 1, SYSCLK = external clock) The TLV1571/TLV1578 is designed to accept an external clock input (CMOS/TTL logic) with frequencies from 1 MHz to 20 MHz. host processor interface The TLV1571/TLV1578 provides a generic high-speed parallel interface that is compatible with high-performance DSPs and general-purpose microprocessors. The interface includes D(0–9), INT/EOC, RD, and WR. output format The data output format is unipolar (code 0 to 1023) when the device is operated in single-ended input mode. The output code format can be either binary or twos complement by setting register bit CR1.D3. power up and initialization After power up, CS must be low to begin an I/O cycle. INT/EOC is initially high. The TLV1571/TLV1578 requires two write cycles to configure the two control registers. The first conversion after the device has returned from the power-down state may be invalid and should be disregarded. definitions of specifications and terminology integral nonlinearity Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full scale. The point used as zero occurs 1/2 LSB before the first code transition. The full-scale point is defined as level 1/2 LSB beyond the last code transition. The deviation is measured from the center of each particular code to the true straight line between these two points. differential nonlinearity An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. A differential nonlinearity error of less than ±1 LSB ensures no missing codes. zero offset The major carry transition should occur when the analog input is at zero volts. Zero error is defined as the deviation of the actual transition from that point. gain error The first code transition should occur at an analog value 1/2 LSB above negative full scale. The last transition should occur at an analog value 1 1/2 LSB below the nominal full scale. Gain error is the deviation of the actual difference between first and last code transitions and the ideal difference between first and last code transitions. 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 software START conversion (continued) signal-to-noise ratio + distortion (SINAD) Signal-to-noise ratio + distortion is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in decibels. effective number of bits (ENOB) For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula, N = (SINAD – 1.76)/6.02 it is possible to get a measure of performance expressed as N, the effective number of bits. Thus, the effective number of bits for a device for sine wave inputs at a given input frequency can be calculated directly from its measured SINAD. total harmonic distortion (THD) Total harmonic distortion is the ratio of the rms sum of the first six harmonic components to the rms value of the measured input signal and is expressed as a percentage or in decibels. spurious free dynamic range (SFDR) Spurious free dynamic range is the difference in dB between the rms amplitude of the input signal and the peak spurious signal. DSP interface The TLV1571/TLV1578 is a 10-bit 1-/8-analog input channel analog-to-digital converter with throughput up to 1.25 MSPS at 5 V and up to 625 KSPS at 3 V. To achieve 1.25 MSPS throughput, the ADC must be clocked at 20 MHz. Likewise to achieve 625 KSPS throughout, the ADC must be clocked at 10 MHz. The TLV1571/TLV1578 can be easily interfaced to microcontrollers, ASICs, and DSPs. Figure 8 shows the pin connections to interface the TLV1571/TLV1578 to the TMS320C6x DSP. TMS320C6X A0–A15 TLV1571/78 EN Address Decoder CS CH(1– 8)† REF HW WR HR RD EOC INTx REFP REFM D0– D9 D0– D15 † The TLV1571 has only one analog input (AIN). Figure 8. TMS320C6x DSP Interface POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 15 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 grounding and decoupling considerations General practices should apply to the PCB design to limit high frequency transients and noise that are fed back into the supply and reference lines. This requires that the supply and reference pins be sufficiently bypassed. In most cases 0.1-µF ceramic chip capacitors are adequate to keep the impedance low over a wide frequency range. Since their effectiveness depends largely on the proximity to the individual supply pin, they should be placed as close to the supply pins as possible. To reduce high frequency and noise coupling, it is highly recommended that digital and analog grounds be shorted immediately outside the package. This can be accomplished by running a low impedance line between DGND and AGND under the package. DVDD AVDD TLV1571/78 AVDD 100 nF DVDD 100 nF DGND AGND VREFP REFP VREFM 100 nF REFM Figure 9. Placement for Decoupling Capacitors power supply ground layout Printed-circuit boards that use separate analog and digital ground planes offer the best system performance. Wire-wrap boards do not perform well and should not be used. The two ground planes should be connected together at the low-impedance power-supply source. The best ground connection may be achieved by connecting the ADC AGND terminal to the system analog ground plane making sure that analog ground currents are well managed. Driving Source† TLV1571/78 MO Rs VS VI Ri(MUX) AIN Ri(ADC) VC Ci 15 pF VI = Input Voltage at AIN VS = External Driving Source Voltage Rs = Source Resistance Ri(ADC)= Input Resistance of ADC Ri(MUX)= Input Resistance (MUX on resistance) Ci = Input Capacitance VC = Capacitance Charging Voltage † Driving source requirements: • Noise and distortion for the source must be equivalent to the resolution of the converter. • Rs must be real at the input frequency. Figure 10. Equivalent Input Circuit Including the Driving Source 16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 simplified analog input analysis Using the equivalent circuit in Figure 9, the time required to charge the analog input capacitance from 0 to VS within 1/2 LSB, tch(1/2 LSB), can be derived as follows. ǒ Ǔ The capacitance charging voltage is given by: V C(t) + VS 1–e–tchńRtCi Where: (1) Rt = Rs + Ri Ri = Ri(ADC) + Ri(MUX) tch = Charge time The input impedance Ri is 718 Ω at 5 V, and is higher (~ 1.25 kΩ) at 2.7 V. The final voltage to 1/2 LSB is given by: (2) VC (1/2 LSB) = VS – (VS /2048) ǒ Ǔ Equating equation 1 to equation 2 and solving for cycle time tc gives: V S ǒ Ǔ * VSń2048 + VS 1–e–tchńRtCi and time to change to 1/2 LSB (minimum sampling time) is: (3) tch (1/2 LSB) = Rt × Ci × ln(2048) Where: ln(2048) = 7.625 Therefore, with the values given, the time for the analog input signal to settle is: tch (1/2 LSB) = (Rs + 718 Ω) × 15 pF × ln(2048) (4) This time must be less than the converter sample time shown in the timing diagrams, which is 6x SCLK. tch (1/2 LSB) ≤ 6x 1/f(SCLK) (5) Therefore the maximum SCLK frequency is: Max(f(SCLK) ) = 6 / tch (1/2 LSB) = 6/(ln(2048) × Rt × Ci ) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 (6) 17 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, GND to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 6.5 V Analog input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to AVDD + 0.3 V Reference input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AVDD + 0.3 V Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to DVDD + 0.3 V Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 150°C Operating free-air temperature range, TA: TLV1571C, TLV1578C . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C TLV1571I, TLV1578I . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. recommended operating conditions power supplies MIN MAX UNIT Analog supply voltage, AVDD 2.7 5.5 V Digital supply voltage, DVDD 2.7 5.5 V NOTE 1: Abs (AVDD – DVDD) < 0.5 V analog inputs Analog input voltage, AIN MIN MAX UNIT AGND VREFP V digital inputs MIN NOM 2.1 2.4 MAX UNIT High-level input voltage, VIH DVDD = 2.7 V to 5.5 V Low level input voltage, VIL DVDD = 2.7 V to 5.5 V 0.8 V DVDD = 4.5 V to 5.5 V 20 MHz DVDD = 2.7 V to 3.3 V 10 MHz Input CLK frequency Pulse duration duration, CLK high high, tw(CLKH) (CLKH) Pulse duration duration, CLK low low, tw(CLKL) V DVDD = 4.5 V to 5.5 V, fCLK = 20 MHz 23 ns DVDD = 2.7 V to 3.3 V, fCLK = 10 MHz 46 ns DVDD = 4.5 V to 5.5 V, fCLK = 20 MHz 23 ns DVDD = 2.7 V to 3.3 V, fCLK = 10 MHz 46 ns Rise time, I/O and control, CLK, CS 50 pF output load 4 Fall time, I/O and control, CLK, CS 50 pF output load 4 ns reference specifications MIN External reference voltage VREFP AVDD = 3 V AVDD = 5 V VREFM AVDD = 3 V AVDD = 5 V VREFP – VREFM 18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MAX UNIT AVDD AVDD V 2.5 AGND 1 V AGND 2 V 2 AVDD–AGND V 2 NOM V TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 electrical characteristics over recommended operating free-air temperature range, supply voltages, and reference voltages (unless otherwise noted) digital specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Logic inputs IIH IIL High-level input current DVDD = 5 V, DVDD = 3 V, Input = DVDD –1 1 µA Low-level input current DVDD = 5 V, DVDD = 3 V, Input = 0 V –1 1 µA Ci Input capacitance 15 pF 10 Logic outputs VOH VOL High-level output voltage Low-level output voltage IOH = 50 µA to 0.5 mA IOL = 50 µA to 0.5 mA IOZ IOL High-impedance-state output current DVDD = 5 V, DVDD = 3 V, Input = DVDD Low-impedance-state output current DVDD = 5 V, DVDD = 3 V, Input = 0 V Co Output capacitance Internal clock DVDD– 0.4 V 0.4 V 1 µA –1 µA 5 pF 3 V, AVDD = DVDD 9 10 11 5 V, AVDD = DVDD 18 20 22 MHz dc specifications PARAMETER TEST CONDITIONS MIN Resolution TYP MAX 10 UNIT Bits Accuracy Integral nonlinearity, INL Best fit Differential nonlinearity, DNL ± 0.5 ±1 LSB ± 0.5 ±1 LSB Missing codes EO EG 0 Offset error ± 0.1% ± 0.15% FSR Gain error ± 0.1% ± 0.2% FSR Analog input Ci Input capacitance Ilkg Input leakage current ri Input MUX ON resistance AIN, AVDD = 3 V, AVDD = 5 V 15 pF MUX input, AVDD = 3 V, AVDD = 5 V 25 pF ±1 VAIN = 0 to AVDD AVDD = DVDD = 3 V 240 680 AVDD = DVDD = 5 V 215 340 µA Ω Voltage reference input ri Input resistance Ci Input capacitance 2 kΩ 300 pF Power supply PD IPD Operating supply current, current IDD + IREF AVDD = DVDD = 3 V, fCLK = 10 MHz AVDD = DVDD = 5 V, fCLK = 20 MHz Power dissipation AVDD+DVDD = 3 V AVDD+DVDD = 5 V 4 5.5 mA 7 8.5 mA 12 17 mW 35 43 mW Software IDD + IREF AVDD = 3 V AVDD = 5 V 1 8 µA 2 10 µA Auto IDD + IREF AVDD = 3 V AVDD = 5 V 0.5 1 mA 0.5 1 mA Supply current in power-down power down mode POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 19 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 electrical characteristics over recommended operating free-air temperature range, supply voltages, and reference voltages (unless otherwise noted) (continued) ac specifications, AVDD = DVDD = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS fI = 100 kHz,, 80% of FS Signal to noise ratio, Signal-to-noise ratio SNR Signal to noise ratio + distortion, Signal-to-noise distortion SINAD fI = 100 kHz,, 80% of FS distortion THD Total harmonic distortion, fI = 100 kHz,, 80% of FS Effective number of bits, bits ENOB fI = 100 kHz,, 80% of FS range SFDR Spurious free dynamic range, fI = 100 kHz,, 80% of FS MIN TYP fs = 1.25 MSPS, AVDD = 5 V fs = 625 KSPS, AVDD = 3 V fs = 1.25 MSPS, AVDD = 5 V 56 60 dB 58 60 dB 55 60 dB fs = 625 KSPS, AVDD = 3 V fs = 1.25 MSPS, AVDD = 5 V fs = 625 KSPS, AVDD = 3 V 55 fs = 1.25 MSPS, AVDD = 5 V fs = 625 KSPS, AVDD = 3 V fs = 1.25 MSPS, AVDD = 5 V 9 9.3 Bits 9 9.3 Bits fs = 625 KSPS, AVDD = 3 V MAX 60 UNIT dB –60 –56 dB –60 –56 dB –63 –56 dB –63 –56 dB Analog input Channel-to-channel cross talk Full power bandwidth Full-power Small-signal bandwidth Sampling Sam ling rate, rate fs 20 – 75 –1 dB Full-scale 0 dB input sine wave –3 dB Full-scale 0 dB input sine wave –1 dB –20 dB input sine wave –3 dB –20 dB input sine wave 12 15 dB 18 MHz 30 MHz 20 MHz 35 MHz AVDD = 4.5 V to 5.5 V 0.0625 1.25 MSPS AVDD = 2.7 V to 3.3 V 0.0625 0.625 MSPS POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 timing requirements, AVDD = DVDD = 5 V (unless otherwise noted) PARAMETER tc(CLK) Cycle time time, CLK t(sample) Reset and sampling time tc TEST CONDITIONS MIN DVDD = 4.5 V to 5.5 V 50 TYP MAX UNIT ns DVDD = 2.7 V to 3.3 V 100 ns 6 SYSCLK Cycles Total conversion time 10 SYSCLK Cycles twL(EOC) Pulse width, end of conversion, EOC 10 SYSCLK Cycles twL(INT) Pulse width, interrupt 1 SYSCLK Cycles t(STARTOSC) Start-up time, internal oscillator td(CSH_ CSTARTL) Delay time, CS high to CSTART low 100 ns 10 ns DVDD = 5 V at 50 pF 20 ns DVDD = 3 V at 50 pF 40 ns DVDD = 5 V at 50 pF 5 ns DVDD = 3 V at 50 pF 10 ns ten(RDL_DAV) en(RDL DAV) Enable time, time data out tdis(RDH_DAV) dis(RDH DAV) Disable time time, data out tsu(CSL_WRL) Setup time, CS to WR 5 th(WRH_CSH) Hold time, CS to WR 5 ns ns tw(WR) Pulse width, write 1 Clock Period tw(RD) Pulse width, read 1 Clock Period tsu(DAV_WRH) Setup time, data valid to WR 10 ns th(WRH_DAV) Hold time, data valid to WR 5 tsu(CSL_RDL) Setup time, CS to RD 5 ns th(RDH_CSH) Hold time, CS to RD 5 ns th(WRL_EXTXLKH) Hold time WR to clock high 5 ns th(RDL_EXTCLKH) Hold time RD to clock high 5 ns th(CSTARTL_EXTCLKH) Hold time CSTART to clock high 5 ns tsu(WRH_EXTCLKH) Setup time WR high to clock high 5 ns tsu(RDH_EXTCLKH) Setup time RD high to clock high 5 ns tsu(CSTARTH_EXTCLKH) Setup time CSTART high to clock high 5 ns td(EXTCLK_CSTARTL) Delay time clock low to CSTART low 5 ns 5 ns td(EOC_RDL) Delay time, conversion end to RD ↓ NOTE: Specifications subject to change without notice. Data valid is denoted as DAV. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ns 21 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 TYPICAL CHARACTERISTICS ANALOG MUX INPUT RESISTANCE vs INPUT CHANNEL NUMBER SUPPLY CURRENT vs FREE AIR TEMPERATURE 600 I CC – Supply Current – mA Analog MUX Input Resistance – Ω 700 500 400 300 200 AVDD = DVDD = 2.7 V 100 AVDD = DVDD = 5 V 0 0 1 2 3 4 5 6 7 8.0 7.5 AV DD = DVDD = 5 V 7.0 6.5 6.0 5.5 5.0 4.5 4.0 AVDD = DVDD = 3 V 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 TA – Free Air Temperature – °C Input Channel Number Figure 11 Figure 12 ANALOG INPUT BANDWIDTH vs FREQUENCY SUPPLY CURRENT vs CLOCK FREQUENCY 1 7 0 AVDD = DVDD = 5 V Analog Input Bandwidth – dB I CC – Supply Current – mA 6 5 4 3 AVDD = DVDD = 3 V 2 –1 –2 –3 –4 AVDD = DVDD = 5 V, AIN = 90% of FS, REF = 5 V, 1 –5 0 0 2 4 6 8 10 12 14 16 18 20 TA = 25°C –6 0.1 Figure 13 Figure 14 POST OFFICE BOX 655303 10 f – Frequency – MHz fclock – Clock Frequency – MHz 22 1 • DALLAS, TEXAS 75265 100 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 TYPICAL CHARACTERISTICS DNL – Differential Nonlinearity – LSB DIFFERENTIAL NONLINEARITY vs DIGITAL OUTPUT CODE 1.0 0.5 0.0 AVDD = DVDD = 3 V, External Ref = 3 V, CLK = 10 MHz, TA = 25°C –0.5 –1.0 0 256 512 768 1023 Digital Output Code Figure 15 INL – Integral Nonlinearity – LSB INTEGRAL NONLINEARITY vs DIGITAL OUTPUT CODE 1.0 AVDD = DVDD = 3 V, External Ref = 3 V, CLK = 10 MHz, TA = 25°C 0.5 0.0 –0.5 –1.0 0 256 512 768 1023 Digital Output Code Figure 16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 23 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 TYPICAL CHARACTERISTICS DNL – Differential Nonlinearity – LSB DIFFERENTIAL NONLINEARITY vs DIGITAL OUTPUT CODE 1.0 0.5 0.0 AVDD = DVDD = 5 V, External Ref = 5 V, CLK = 20 MHz, TA = 25°C –0.5 –1.0 0 256 512 768 1023 Digital Output Code Figure 17 INL – Integral Nonlinearity – LSB INTEGRAL NONLINEARITY vs DIGITAL OUTPUT CODE 1.0 0.5 0.0 AVDD = DVDD = 5 V, External Ref = 5 V, CLK = 20 MHz, TA = 25°C –0.5 –1.0 0 256 512 Digital Output Code Figure 18 24 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 768 1023 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 TYPICAL CHARACTERISTICS EFFECTIVE NUMBER OF BITS vs FREQUENCY ENOB – Effective Number of Bits – BITS 10 9 AVDD = DVDD = 3 V, External Ref = 3 V 8 7 6 5 4 3 2 1 0 50 100 150 200 f – Frequency – kHz 250 Figure 19 EFFECTIVE NUMBER OF BITS vs FREQUENCY ENOB – Effective Number of Bits – BITS 10 9 AVDD = DVDD = 5 V, External Ref = 5 V 8 7 6 5 4 3 2 1 0 50 100 150 200 250 300 350 400 450 500 f – Frequency – kHz Figure 20 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 25 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 TYPICAL CHARACTERISTICS FAST FOURIER TRANSFORM MAGNITUDE vs FREQUENCY Magnitude – dB 0 AIN = 200 KHz –20 CLK = 10 MHz –40 AVDD = DVDD = 3 V External Ref = 3 V –60 –80 –100 –120 0 25 50 75 100 125 150 175 200 225 250 275 450 500 550 f – Frequency – kHz Figure 21 FAST FOURIER TRANSFORM MAGNITUDE vs FREQUENCY Magnitude – dB 0 AIN = 200 KHz –20 CLK = 20 MHz –40 AVDD = DVDD = 5 V External Ref = 5 V –60 –80 –100 –120 0 50 100 150 200 250 300 350 400 f – Frequency – kHz Figure 22 26 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 MECHANICAL DATA DA (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 38 PINS SHOWN 0,30 0,19 0,65 38 0,13 M 20 6,20 NOM 8,40 7,80 0,15 NOM Gage Plane 1 19 0,25 A 0°– 8° 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 28 30 32 38 A MAX 9,80 11,10 11,10 12,60 A MIN 9,60 10,90 10,90 12,40 DIM 4040066 / D 11/98 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 27 TLV1571, TLV1578 2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTERS SLAS170D –MARCH 1999 – REVISED JULY 2000 MECHANICAL DATA DW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 16 PINS SHOWN 0.050 (1,27) 0.020 (0,51) 0.014 (0,35) 16 0.010 (0,25) M 9 0.419 (10,65) 0.400 (10,15) 0.010 (0,25) NOM 0.299 (7,59) 0.293 (7,45) Gage Plane 0.010 (0,25) 1 8 0°– 8° A 0.050 (1,27) 0.016 (0,40) Seating Plane 0.104 (2,65) MAX 0.012 (0,30) 0.004 (0,10) PINS ** 0.004 (0,10) 16 20 24 28 A MAX 0.410 (10,41) 0.510 (12,95) 0.610 (15,49) 0.710 (18,03) A MIN 0.400 (10,16) 0.500 (12,70) 0.600 (15,24) 0.700 (17,78) DIM 4040000 / C 07/96 NOTES: A. B. C. D. 28 All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MS-013 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TLV1571CDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1571CDWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1571IDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1571IDWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1571IPW ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV1571IPWG4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV1578CDA ACTIVE TSSOP DA 32 46 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV1578CDAG4 ACTIVE TSSOP DA 32 46 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV1578CDAR ACTIVE TSSOP DA 32 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV1578CDARG4 ACTIVE TSSOP DA 32 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV1578IDA ACTIVE TSSOP DA 32 46 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV1578IDAG4 ACTIVE TSSOP DA 32 46 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device TLV1578CDAR Package Package Pins Type Drawing TSSOP DA 32 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.6 11.5 1.6 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV1578CDAR TSSOP DA 32 2000 346.0 346.0 41.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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