SLOS195G − FEBRUARY 1997 − REVISED NOVEMBER 2003
D Low Supply-Voltage
D
D
D
D
TLV2361 . . . DBV PACKAGE
(TOP VIEW)
Operation . . . VCC = ±1 V Min
Wide Bandwidth . . . 7 MHz Typ at
VCC± = ±2.5 V
High Slew Rate . . . 3 V/µs Typ at
VCC± = ±2.5 V
Wide Output Voltage Swing . . . ±2.4 V Typ
at VCC± = ±2.5 V, RL = 10 kΩ
Low Noise . . . 8 nV/√Hz Typ at f = 1 kHz
IN+
VCC−
IN−
1
5
VCC+
4
OUT
2
3
TLV2362 . . . D, DGK, P, PS, OR PW PACKAGE
(TOP VIEW)
1OUT
1IN−
1IN+
VCC−
description/ordering information
1
8
2
7
3
6
VCC+
2OUT
2IN−
2IN+
The TLV236x devices are high-performance dual
4
5
operational amplifiers built using an original
Texas Instruments bipolar process. These
devices can be operated at a very low supply
voltage (±1 V), while maintaining a wide output swing. The TLV236x devices offer a dramatically improved
dynamic range of signal conditioning in low-voltage systems. The TLV236x devices also provide higher
performance than other general-purpose operational amplifiers by combining higher unity-gain bandwidth and
faster slew rate. With their low distortion and low-noise performance, these devices are well suited for audio
applications.
ORDERING INFORMATION
−0°C to 70°C
TOP-SIDE
MARKING
Reel of 3000
TLV2361CDBVR
Reel of 250
TLV2361CDBVT
Reel of 3000
TLV2361IDBVR
Reel of 250
TLV2361IDBVT
MSOP/VSSOP (DGK)
Reel of 2500
TLV2362IDGKR
YBS
PDIP (P)
Tube of 50
TLV2362IP
TLV2362IP
Tube of 75
TLV2362ID
Reel of 2500
TLV2362IDR
Reel of 2000
TLV2362IPSR
Tube of 150
TLV2362IPW
Reel of 2000
TLV2362IPWR
SOT-23-5 (DBV)
SOT-23-5 (DBV)
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC (D)
SOP (PS)
TSSOP (PW)
VAAC
VAAI
2362I
TY2362
TY2362
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#',
+&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$
$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'
#'$#1 "** (""!'#'$,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLOS195G − FEBRUARY 1997 − REVISED NOVEMBER 2003
equivalent schematic (each amplifier)
VCC+
IN+
IN−
OUT
VCC−
ACTUAL DEVICE COMPONENT COUNT
COMPONENT
TLV2361
TLV2362
30
46
Resistors
6
11
Diodes
1
1
Capacitors
2
4
JFET
1
1
Transistors
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLOS195G − FEBRUARY 1997 − REVISED NOVEMBER 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 V
Supply voltage, VCC− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −3.5 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.5 V
Input voltage, VI (any input) (see Notes 1 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC±
Output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.5 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Duration of short-circuit current at (or below) 25°C (output shorted to GND) . . . . . . . . . . . . . . . . . . . Unlimited
Package thermal impedance, θJA (see Notes 4 and 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
DBV package . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W
DGK package . . . . . . . . . . . . . . . . . . . . . . . . 172°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC−.
2. Differential voltages are at IN+ with respect to IN−.
3. All input voltage values must not exceed VCC.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Selecting the maximum of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
VCC
TA
Supply voltage
TLV2361C
Operating free-air temperature
TLV2361I, TLV2362I
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
MAX
UNIT
±1
±2.5
V
0
70
−40
85
°C
3
SLOS195G − FEBRUARY 1997 − REVISED NOVEMBER 2003
TLV2361 and TLV2362 electrical characteristics, VCC± = ±1.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
25°C
VIO
Input offset voltage
VO = 0,
VIC = 0
Full range
IIO
Input offset current
VO = 0,
VIC = 0
Full range
IIB
Input bias current
VO = 0,
VIC = 0
VIC
Common-mode input
voltage
|VIO| ≤ 7.5 mV
VOM+
Maximum positive-peak
output voltage
VOM−
Maximum negative-peak
output voltage
ICC
Supply current
(per amplifier)
1
5
20
Full range
±0.5
Full range
±0.5
RL = 10 kΩ
25°C
1.2
RL ≥ 10 kΩ
Full range
1.2
RL = 10 kΩ
25°C
−1.2
RL ≥ 10 kΩ
Full range
−1.2
25°C
150
nA
1.4
V
−1.4
V
Full range
60
nA
V
1.4
TLV2361
mV
100
250
25°C
UNIT
6
150
25°C
No load
MAX
7.5
25°C
VO = 0,
TYP
2.25
mA
2.75
mA
80
AVD
Large-signal differential
voltage amplification
VO = ±1 V,
CMRR
Common-mode rejection
ratio
VIC = ±0.5 V
25°C
75
dB
kSVR
Supply-voltage rejection
ratio
VCC± = ±1.5 V to ±2.5 V
25°C
80
dB
RL = 10 kΩ
TLV2362
25°C
dB
55
TLV2361 and TLV2362 operating characteristics, VCC± = ±1.5 V, TA = 25°C
PARAMETER
4
TEST CONDITIONS
TYP
VI = ±0.5 V
RL = 10 kΩ,
2.5
V/µs
Unity-gain bandwidth
AV = 1,
AV = 40,
CL = 100 pF
6
MHz
Equivalent input noise voltage
RS = 100 Ω,
RF = 10 kΩ,
f = 1 kHz
9
nV/√Hz
SR
Slew rate
B1
Vn
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
SLOS195G − FEBRUARY 1997 − REVISED NOVEMBER 2003
TLV2361 and TLV2362 electrical characteristics, VCC± = ±2.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
25°C
1
MAX
UNIT
6
VIO
Input offset voltage
VO = 0,
VIC = 0
Full range
IIO
Input offset current
VO = 0,
VIC = 0
Full range
IIB
Input bias current
VO = 0,
VIC = 0
VIC
Common-mode input
voltage
|VIO| ≤ 7.5 mV
Maximum positive-peak
output voltage
RL = 10 kΩ
25°C
2
VOM+
RL ≥ 10 kΩ
Full range
2
Maximum negative-peak
output voltage
RL = 10 kΩ
25°C
−2
VOM−
RL ≥ 10 kΩ
Full range
−2
ICC
Supply current
(per amplifier)
VO = 0,
No load
AVD
Large-signal differential
voltage amplification
VO = ±1 V,
RL = 10 kΩ
CMRR
Common-mode rejection
ratio
VIC = ±0.5 V
25°C
85
dB
kSVR
Supply-voltage rejection
ratio
VCC± = ±1.5 V to ±2.5 V
25°C
80
dB
7.5
25°C
5
20
Full range
±1.5
Full range
±1.4
25°C
2.4
V
−2.4
V
1.75
2.5
3
60
25°C
nA
V
Full range
TLV2361
nA
150
250
25°C
TLV2362
100
150
25°C
mV
mA
80
dB
60
TLV2361 and TLV2362 operating characteristics, VCC± = ±2.5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
Unity-gain bandwidth
AV = 1,
AV = 40,
VI = ±0.5 V
RL = 10 kΩ,
Vn
Equivalent input noise voltage
RS = 100 Ω,
THD + N
Total harmonic distortion, plus noise
AV = 1,
SR
Slew rate
B1
POST OFFICE BOX 655303
TYP
UNIT
3
V/µs
CL = 100 pF
7
MHz
RF = 10 kΩ,
f = 1 kHz
8
nV/√Hz
VO = ±1.2 V,
RL = 10 kΩ, f = 3 kHz
• DALLAS, TEXAS 75265
0.004
%
5
SLOS195G − FEBRUARY 1997 − REVISED NOVEMBER 2003
TYPICAL CHARACTERISTICS
Table of Graphs
GRAPH TITLE
6
FIGURE
Supply current vs Free-air temperature
1
Supply current vs Supply voltage
2
Maximum positive output voltage vs Output current
3
Maximum negative output voltage vs Output current
4
Maximum peak-to-peak output voltage vs Frequency
5
Equivalent input noise voltage vs Frequency
6
Total harmonic distortion vs Frequency
7
Total harmonic distortion vs Output voltage
8
POST OFFICE BOX 655303
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SLOS195G − FEBRUARY 1997 − REVISED NOVEMBER 2003
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
2.5
2.5
VO = 0
No Load
Per Channel
I CC − Supply Current − mA
I CC − Supply Current − mA
2
VCC = ±2.5 V
1.5
VCC = ±1.5 V
1
0.5
TA = 25°C
TA = 0°C
2
TA = −40°C
1.5
1
0.5
0
−50
0
−25
0
25
50
75
±1
0
100
Figure 1
VOM− − Maximum Positive Output Voltage − V
1.5
VCC± = ±1.5 V
1
0.5
0
−0.8
−1.2
±5
0
TA = 25°C
2
−0.4
±4
MAXIMUM NEGATIVE OUTPUT VOLTAGE
vs
OUTPUT CURRENT
2.5
0
±3
Figure 2
MAXIMUM POSITIVE OUTPUT VOLTAGE
vs
OUTPUT CURRENT
VCC± = ±2.5 V
±2
VCC± − Supply Voltage − V
TA − Free-Air Temperature − °C
VOM+ − Maximum Positive Output Voltage − V
TA = 85°C
TA = 75°C
VO = 0
No Load
Per Channel
−1.8
−2
−0.5
−1
VCC± = ±1.5 V
−1.5
−2
VCC± = ±2.5 V
−2.5
0
IO − Output Current − mA
4
8
12
16
20
IO − Output Current − mA
Figure 3
Figure 4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SLOS195G − FEBRUARY 1997 − REVISED NOVEMBER 2003
TYPICAL CHARACTERISTICS
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY
50
5
V n − Equivalent Input Noise Voltage − nV/ Hz
VO(PP) − Maximum Peak-to-Peak Output Voltage − V
MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE
vs
FREQUENCY
VCC± = ±2.5 V
4
3
VCC± = ±1.5 V
2
1
TA = 25°C
RL = 10 kΩ
0
1k
10 k
1M
100 k
VCC± = ±2.5 V
TA = 25°C
RS = 100 Ω
40
30
20
10
0
10
10 M
100
f − Frequency − Hz
Figure 5
Figure 6
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
1
VCC± = ±2.5 V
RS = 10 kΩ
RL = 10 kΩ
VO = ±1.2 V
1
THD − Total Harmonic Distortion − %
THD − Total Harmonic Distortion − %
10 k
TOTAL HARMONIC DISTORTION
vs
OUTPUT VOLTAGE
10
AV = 100
0.1
AV = 10
0.01
AV = 1
VCC± = ±3 V
RS = 10 kΩ
RL = 4 kΩ
AV = 10 V
0.1
0.01
20 kHz
20 Hz
0.001
1 kHz
0.0001
0.001
0
20
40
60
80
100
0
0.5
1
Figure 7
Figure 8
POST OFFICE BOX 655303
1.5
VO(rms) − Output Voltage − V
f − Frequency − kHz
8
1k
f − Frequency − Hz
• DALLAS, TEXAS 75265
2
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TBD
Lead/Ball Finish
TLV2361CDBV
OBSOLETE
SOT-23
DBV
5
TLV2361CDBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2361CDBVRE4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2361CDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2361CDBVTE4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TBD
Call TI
MSL Peak Temp (3)
TLV2361IDBV
OBSOLETE
SOT-23
DBV
5
TLV2361IDBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2361IDBVRE4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2361IDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2361IDBVTE4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362ID
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IDE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IDGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IDGKRG4
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IDRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLV2362IPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLV2362IPSR
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IPSRE4
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IPWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
TLV2362IPWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IPWRE4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2362IPWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Call TI
Call TI
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2007
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.430 (10,92)
MAX
0.010 (0,25) M
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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