TI TLV61224DCKT

TLV61224
SLVSAM7 – MARCH 2011
www.ti.com
Single Cell High Efficient Step-Up Converter in 6 Pin SC-70 Package
FEATURES
APPLICATIONS
•
•
1
•
•
•
•
•
•
•
•
•
Up to 94% Efficiency at Typical Operating
Conditions
5 μA Quiescent Current
Operating Input Voltage from 0.7 V to 3.0 V
Pass-Through Function during Shutdown
More than 40mA Output Current from a 1.2V
Input
Typical Switch Current Rating 400 mA
Output Overvoltage Protection
Overtemperature Protection
Fixed 3.0 V Output Voltage
Small 6-pin SC-70 Package
•
•
Battery Powered Applications
– 1 to 2 Cell NiMH or Alkaline
– 1 cell Li-Primary
Consumer and Portable Medical Products
Personal Care Products
DESCRIPTION
The TLV61224 provides a power-supply solution for products powered by either a single-cell or two-cell alkaline
or NiMH, or one-cell Li-primary battery. Possible output currents depend on the input-to-output voltage ratio. The
boost converter is based on a hysteretic controller topology using synchronous rectification to obtain maximum
efficiency at minimal quiescent currents. The output voltage of this device is set internally to a fixed output
voltage of 3.0 V. The converter can be switched off by a featured enable pin. While being switched off, battery
drain is minimized. The device is offered in a 6-pin SC-70 package (DCK) measuring 2 mm x 2 mm to enable
small circuit layout size.
L1
4.7 µH
VIN
0.8 V to VOUT
VOUT
L
VIN
C1
10 µF
FB
C2
10µF
VOUT
3.0 V
EN
GND
TLV61224
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TLV61224
SLVSAM7 – MARCH 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE DEVICE OPTIONS (1)
TA
OUTPUT VOLTAGE
DC/DC
PACKAGE
MARKING
PACKAGE
–40°C to 85°C
3.0 V
QXC
6-Pin SC-70
(1)
(2)
(2)
PART NUMBER
TLV61224DCK
Contact the factory to check availability of other fixed output voltage versions.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
Voltage range (2)
VIN, L, VOUT, EN, FB
–0.3
7.5
V
Temperature range
Operating junction temperature, TJ
–40
150
°C
Storage, Tstg
–65
150
°C
2
kV
ESD rating (3)
(1)
(2)
(3)
Human Body Model - (HBM)
Machine Model (MM)
200
V
Charge Device Model - (CDM)
1.5
kV
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network ground terminal.
ESD testing is performed according to the respective JESD22 JEDEC standard.
THERMAL INFORMATION
THERMAL METRIC (1)
TLV61224
θJA
Junction-to-ambient thermal resistance
231.9
θJCtop
Junction-to-case (top) thermal resistance
55.8
θJB
Junction-to-board thermal resistance
77.3
ψJT
Junction-to-top characterization parameter
0.7
ψJB
Junction-to-board characterization parameter
76.4
(1)
UNITS
DCK (6) PINS
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN
VIN
Supply voltage at VIN
0.7
TA
Operating free air temperature range
TJ
Operating virtual junction temperature range
2
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NOM
MAX
UNIT
3.0
V
–40
85
°C
–40
125
°C
Copyright © 2011, Texas Instruments Incorporated
TLV61224
SLVSAM7 – MARCH 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature
range of 25°C) (unless otherwise noted)
DC/DC STAGE
PARAMETER
TEST CONDITIONS
VIN
Input voltage range
VIN
Maximum minimum input voltage
RLoad ≥ 150 Ω, TA = 25°C
for startup
VOUT
TLV61224 output voltage
ILH
Inductor current ripple
ISW
MIN
TYP
0.7
3.0
0.7
VIN < VOUT
2.85
switch current limit
VOUT = 3.0 V, VIN = 1.2 V
160
RDSon_HSD
Rectifying switch on resistance
VOUT = 3.0 V
RDSon_LSD
Main switch on resistance
VOUT = 3.0 V
Line regulation
VIN < VOUT
0.5 %
Load regulation
VIN < VOUT
0.5 %
VIN
Quiescent
current
ISD
Shutdown
current
ILKG_VOUT
Leakage current into VOUT
VEN = 0 V, VIN = 1.2 V, VOUT = 3.0 V
ILKG_L
Leakage current into L
VEN = 0 V, VIN = 1.2 V, VL = 1.2 V, VOUT ≥ VIN
IEN
EN input current
Clamped on GND or VIN (VIN < 1.5 V)
VIN
3.0
IO = 0 mA, VEN = VIN = 1.2 V, VOUT = 3.0 V
VEN = 0 V, VIN = 1.2 V, VOUT ≥ VIN
UNIT
V
V
3.15
200
IQ
VOUT
MAX
V
mA
400
mA
1000
mΩ
600
mΩ
0.5
1
μA
5
10
μA
0.2
1
μA
μA
1
0.01
0.7
μA
0.005
0.1
μA
CONTROL STAGE
VIL
maximum EN input low voltage
VIN ≤ 1.5 V
0.2 ×
VIN
VIH
minimum EN input high voltage
VIN ≤ 1.5 V
VIL
maximum EN input low voltage
VIN > 1.5 V
0.4
V
VIH
minimum EN input high voltage
VIN > 1.5 V
1.2
V
VUVLO
Undervoltage lockout threshold
for turn off
VIN decreasing
500
mV
0.8 ×
VIN
Undervoltage lockout hysteresis
Overvoltage protection threshold
V
50
5.5
V
mV
7.5
V
Overtemperature protection
140
°C
Overtemperature hysteresis
20
°C
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TLV61224
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PIN ASSIGNMENTS
DCK PACKAGE
(TOP VIEW)
VIN
FB
GND
EN
L
VOUT
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
EN
6
I
Enable input (1: enabled, 0: disabled). Must be actively tied high or low.
FB
2
I
Output voltage sense input. Must be connected to VOUT.
GND
3
L
5
I
Connection for Inductor
VIN
1
I
Boost converter input voltage
VOUT
4
O
Boost converter output voltage
4
Control / logic and power ground
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Copyright © 2011, Texas Instruments Incorporated
TLV61224
SLVSAM7 – MARCH 2011
www.ti.com
FUNCTIONAL BLOCK DIAGRAM (TLV61224)
L
VOUT
VOUT
VIN
Gate
Driver
VIN
Start Up
Current
Sensor
FB
Device
Control
EN
GND
VREF
PARAMETER MEASUREMENT INFORMATION
L1
L
VIN
VOUT
VOUT
VIN
C2
FB
EN
C1
GND
TLV61224
Table 1. List of Components:
COMPONENT
REFERENCE
PART NUMBER
MANUFACTURER
VALUE
C1
GRM188R60J106ME84D
Murata
10 μF, 6.3V
C2
GRM188R60J106ME84D
Murata
10 μF, 6.3V
L1
EPL3015-472MLB
Coilcraft
4.7 μH
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TLV61224
SLVSAM7 – MARCH 2011
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TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
Minimum of Maximum Output
Current
Efficiency
Input Current
Output Voltage
Waveforms
vs Input Voltage
1
vs Output Current, VIN = [1.2 V; 2.4 V]
2
vs Input Voltage, IOUT = [100 uA; 1 mA; 10 mA; 50 mA]
3
vs Input Voltage at No Output Load, Device Enabled
4
vs Output Current, VIN = [1.2 V; 2.4 V]
5
vs Input Voltage, Device Disabled, RLOAD = [1 kΩ; 10 kΩ]
6
Load Transient Response, VIN = 1.2 V, IOUT = 10 mA to 30 mA
7
Line Transient Response, VIN = 0.9 V to 1.2 V, IOUT = 30 mA
8
Startup after Enable, VIN = 0.7 V, RLOAD = 150 Ω
9
EFFICIENCY
vs
OUTPUT CURRENT
180
100
160
90
140
80
70
120
Efficiency (%)
Output Current (mA)
MINIMUM OF MAXIMUM OUTPUT CURRENT
vs
INPUT VOLTAGE
100
80
60
60
50
40
30
40
20
20
10
0
0.8
1.0
1.2
1.4
1.6 1.8 2.0 2.2
Input Voltage (V)
2.4
2.6
2.8
VIN = 1.2 V
VIN = 2.4 V
0
0.01
3.0
0.1
1
Output Current (mA)
10
100
Figure 1.
Figure 2.
EFFICIENCY
vs
INPUT VOLTAGE
NO LOAD APPLICATION INPUT CURRENT
vs
INPUT VOLTAGE
100
40
90
35
80
30
Input Current (µA)
Efficiency (%)
70
60
50
40
30
IOUT = 0.1 mA
IOUT = 1 mA
IOUT = 10 mA
IOUT = 50 mA
20
10
0
0.8
1.0
1.2
1.4
1.6 1.8 2.0 2.2
Input Voltage (V)
Figure 3.
6
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2.4
2.6
2.8
3.0
25
20
15
10
5
0
0.8
1.0
1.2
1.4
1.6 1.8 2.0 2.2
Input Voltage (V)
2.4
2.6
2.8
3.0
Figure 4.
Copyright © 2011, Texas Instruments Incorporated
TLV61224
SLVSAM7 – MARCH 2011
www.ti.com
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
OUTPUT VOLTAGE
vs
INPUT VOLTAGE, DEVICE DISABLED
3.15
2.4
2.2
2.0
Output Voltage (V)
Output Voltage (V)
3.10
3.05
3.00
2.95
1.8
1.6
1.4
1.2
1.0
0.8
0.6
2.90
0.4
VIN = 1.2 V
VIN = 2.4 V
2.85
0.01
0.1
RLoad = 1 kΩ
RLoad = 10 kΩ
0.2
1
Output Current (mA)
10
0.0
0.8
100
1.0
1.2
1.4
1.6 1.8 2.0 2.2
Input Voltage (V)
2.4
Figure 5.
Figure 6.
LOAD TRANSIENT RESPONSE
LINE TRANSIENT RESPONSE
2.6
2.8
3.0
Input Voltage
500 mV/div, DC
Output Current
20 mA/div, DC
Output Voltage
10 mV/div, AC
Output Voltage
10 mV/div, AC
VIN = 1.2 V, IOUT = 10 mA to 30 mA
VIN = 0.9 V to 1.2 V, IOUT = 30 mA
TLV61224
TLV61224
Time 2 ms/div
Figure 7.
Time 2 ms/div
Figure 8.
STARTUP AFTER ENABLE
Enable Voltage
2 V/div, DC
Output Voltage
500 mV/div, DC
Inductor Current
100 mA/div, DC
TLV61224
VIN = 1.2 V, RLOAD = 150 W
Time 40 ms/div
Figure 9.
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TLV61224
SLVSAM7 – MARCH 2011
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DETAILED DESCRIPTION
OPERATION
The TLV61224 is a high performance, high efficient boost converter. To achieve high efficiency the power stage
is implemented as a synchronous boost topology. For the power switching two actively controlled low RDSon
power MOSFETs are used.
CONTROLLER CIRCUIT
The device is controlled by a hysteretic current mode controller. This controller regulates the output voltage by
keeping the inductor ripple current constant in the range of 200 mA and adjusting the offset of this inductor
current depending on the output load. In case the required average input current is lower than the average
inductor current defined by this constant ripple the inductor current gets discontinuous to keep the efficiency high
at low load conditions.
IL
Continuous Current Operation
Discontinuous Current Operation
200 mA
(typ.)
200 mA
(typ.)
t
Figure 10. Hysteretic Current Operation
The output voltage VOUT is monitored via the internal feedback network which is connected to the voltage error
amplifier. To regulate the output voltage, the voltage error amplifier compares this feedback voltage to the
internal voltage reference and adjusts the required offset of the inductor current accordingly.
Device Enable and Shutdown Mode
The device is enabled when EN is set high and shut down when EN is low. During shutdown, the converter stops
switching and all internal control circuitry is turned off. In this case the input voltage is connected to the output
through the back-gate diode of the rectifying MOSFET. This means that there always will be voltage at the output
which can be as high as the input voltage or lower depending on the load.
Startup
After the EN pin is tied high, the device starts to operate. In case the input voltage is not high enough to supply
the control circuit properly a startup oscillator starts to operate the switches. During this phase the switching
frequency is controlled by the oscillator and the maximum switch current is limited. As soon as the device has
built up the output voltage to about 1.8V, high enough for supplying the control circuit, the device switches to its
normal hysteretic current mode operation. The startup time depends on input voltage, load current and output
capacitance.
Operation at Output Overload
If in normal boost operation the inductor current reaches the internal switch current limit threshold the main
switch is turned off to stop further increase of the input current.
In this case the output voltage will decrease since with limited input current it is not possible anymore to provide
sufficient power to the output to maintain the programmed output voltage.
If the output voltage drops below the input voltage the backgate diode of the rectifying switch gets forward biased
and current starts flowing through it. This diode cannot be turned off, so the current finally is only limited by the
remaining DC resistances. As soon as the output load has decreased to a value the converter can supply, the
converter resumes normal operation providing the set output voltage.
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TLV61224
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Undervoltage Lockout
An implemented undervoltage lockout function (UVLO) stops the operation of the converter if the input voltage
drops below the typical undervoltage lockout threshold. This function is implemented in order to prevent
malfunctioning of the converter and protect batteries against deep discharge.
Overvoltage Protection
If, for any reason, the output voltage is not fed back properly to the input of the voltage amplifier, control of the
output voltage will not work anymore. Therefore overvoltage protection is implemented to avoid the output
voltage exceeding critical values for the device and possibly for the system it is supplying. For this protection the
TLV61224 output voltage is also monitored internally. In case it reaches the internally programmed threshold the
voltage amplifier regulates the output voltage to this value.
Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC junction temperature. If the
temperature exceeds the programmed threshold (see electrical characteristics table), the device stops operating.
As soon as the IC temperature has decreased below the programmed threshold, it starts operating again. To
prevent unstable operation close to the region of overtemperature threshold, a built-in hysteresis is implemented.
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APPLICATION INFORMATION
DESIGN PROCEDURE
The TLV61224 DC/DC converter is intended for systems powered by a single or dual cell Alkaline or NiMH
battery with a typical terminal voltage between 0.7 V and 3.0 V. Additionally, any other voltage source with a
typical output voltage between 0.7 V and 3.0 V can be used with the TLV61224.
Programming the Output Voltage
At fixed voltage versions, the output voltage is programmed by an internal resistor divider. The FB pin is used to
sense the output voltage. To configure the devices properly, the FB pin needs to be connected directly to VOUT.
Inductor Selection
To make sure that the TLV61224 devices can operate, a suitable inductor must be connected between pin VIN
and pin L. Inductor values of 4.7 μH show good performance over the whole input and output voltage range.
Due to the fixed inductor current ripple control the switching frequency is defined by the inductor value. For a
given switching frequency, input and output voltage the required inductance can be estimated using Equation 1.
L=
V ´ (VOUT - VIN )
1
´ IN
f ´ 200 mA
VOUT
(1)
Using inductor values higher than 4.7 μH can improve efficiency since higher values cause lower switching
frequency and less switching losses. Using inductor values below 2.2 μH is not recommended.
To ensure reliable operation of the TLV61224 under all load conditions it is recommended to use inductors with a
current rating of 400mA or higher. This will cover normal operation including current peaks during line and load
transients.
The following inductor series from different suppliers have been used with the TLV61224 converter:
Table 2. List of Inductors
VENDOR
Coilcraft
INDUCTOR SERIES
EPL3015
EPL2010
Murata
LQH3NP
Tajo Yuden
NR3015
Wurth Elektronik
WE-TPC Typ S
Capacitor Selection
Input Capacitor
At least a 10-μF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior
of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and GND pins of the
IC is recommended.
Output Capacitor
For the output capacitor C2, it is recommended to use small ceramic capacitors placed as close as possible to
the VOUT and GND pins of the IC. There are no minimum output capacitor ESR requirements for maintaining
control loop stability. If, for any reason, the application requires the use of large capacitors which can not be
placed close to the IC, the use of a small ceramic capacitor with a capacitance value in the range of 2.2μF in
parallel to the large capacitor is recommended. This small capacitor should be placed as close as possible to the
VOUT and GND pins of the IC.
A minimum capacitance value of 4.7 μF should be used, 10 μF are recommended. To calculate the required
output capacitance, in case an inductor with a value higher than 4.7 μH has been selected, Equation 2 can be
used.
10
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SLVSAM7 – MARCH 2011
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C2 ³
L
´
2
(2)
Layout Considerations
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.
To lay out the ground, it is recommended to use short traces as well, separated from the power ground traces.
This avoids ground shift problems, which can occur due to superimposition of power ground current and control
ground current. Assure that the ground traces are connected close to the device GND pin.
L1
VOUT
Enable
VIN
C2
VIN
GND
VOUT
C1
GND
Figure 11. PCB Layout Suggestion
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power-dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal
Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Mar-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
TLV61224DCKR
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV61224DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(3)
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Mar-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TLV61224DCKR
SC70
DCK
6
3000
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
TLV61224DCKT
SC70
DCK
6
250
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Mar-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV61224DCKR
SC70
DCK
6
3000
203.0
203.0
35.0
TLV61224DCKT
SC70
DCK
6
250
203.0
203.0
35.0
Pack Materials-Page 2
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