TI TPS61097

TPS61097
www.ti.com .............................................................................................................................................................. SLVS872A – JUNE 2009 – REVISED JULY 2009
LOW INPUT VOLTAGE SYNCHRONOUS BOOST CONVERTER
WITH LOW QUIESCENT CURRENT
FEATURES
1
•
•
•
•
•
•
•
Up to 95% Efficiency at Typical Operating
Conditions
Connection from Battery to Load via Bypass
Switch in Shutdown Mode
Typical Shutdown Current Less Than 5 nA
Typical Quiescent Current Less Than 5 µA
Operating Input Voltage Range
From 0.9 V to 5.5 V
Fixed Output Voltage Options
From 1.8 V to 5.0 V
Power-Save Mode for Improved Efficiency at
Low Output Power
•
•
Overtemperature Protection
Small 2.8-mm x 2.9-mm 5-Pin SOT-23 Package
APPLICATIONS
•
•
•
•
•
•
•
MSP430 Applications
All Single-Cell, Two-Cell, and Three-Cell
Alkaline, NiCd, NiMH, or Single-Cell Li-Battery
Powered Products
Personal Medical Products
Fuel Cell and Solar Cell Powered Products
PDAs
Mobile Applications
White LEDs
DESCRIPTION
The TPS61097 provide a power supply solution for products powered by either a single-cell, two-cell, or
three-cell alkaline, NiCd, or NiMH, or one-cell Li-Ion or Li-polymer battery. They can also be used in fuel cell or
solar cell powered devices where the capability of handling low input voltages is essential. Possible output
currents depend on the input-to-output voltage ratio. The devices provides output currents up to 100 mA at a
3.3-V output while using a single-cell Li-Ion or Li-Polymer battery. The boost converter is based on a
current-mode controller using synchronous rectification to obtain maximum efficiency. The maximum average
input current is limited to a value of 350 mA. The output voltage can be programmed by an external resistor
divider, or it is fixed internally on the chip. The converter can be disabled to minimize battery drain. During
shutdown, the battery is connected to the load to enable battery backup of critical functions on the load. The
device is packaged in a 5-pin SOT-23 package (DBV) measuring 2.8 mm × 2.9 mm.
TPS61097-33
L
VOUT
3.3 V
VOUT
L1
C2
VIN
0.9 V to 3.3 V
VIN
C1
EN
GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TPS61097
SLVS872A – JUNE 2009 – REVISED JULY 2009 .............................................................................................................................................................. www.ti.com
AVAILABLE DEVICE OPTIONS (1) (2)
TA
OUTPUT
VOLTAGE
DC/DC
Adjustable
1.8 V
–40°C to 85°C
Reel of 1000
TPS61097-ADJDRSR
PREVIEW
6-pin SON – DRS
Reel of 1000
TPS61097-18DRSR
PREVIEW
Reel of 3000
TPS61097-18DBVR
Reel of 250
TPS61097-18DBVT
Reel of 1000
TPS61097-27DRSR
Reel of 3000
TPS61097-27DBVR
Reel of 250
TPS61097-27DBVT
Reel of 1000
TPS61097-30DRSR
Reel of 3000
TPS61097-30DBVR
Reel of 250
TPS61097-30DBVT
Reel of 1000
TPS61097-33DRSR
Reel of 3000
TPS61097-33DBVR
Reel of 250
TPS61097-33DBVT
Reel of 1000
TPS61097-50DRSR
Reel of 3000
TPS61097-50DBVR
Reel of 250
TPS61097-50DBVT
5-pin SOT-23 – DBV
5-pin SOT-23 – DBV
6-pin SON – DRS
3.0 V
5-pin SOT-23 – DBV
6-pin SON – DRS
3.3 V
5-pin SOT-23 – DBV
6-pin SON – DRS
5.0 V
(1)
(2)
(3)
2
TOP-SIDE MARKING
6-pin SON – DRS
6-pin SON – DRS
2.7 V
ORDERABLE
PART NUMBER
PACKAGE (3)
5-pin SOT-23 – DBV
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
YC4L
PREVIEW
PREVIEW
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Contact the factory for availability of other fixed output voltage versions.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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TPS61097
www.ti.com .............................................................................................................................................................. SLVS872A – JUNE 2009 – REVISED JULY 2009
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VI
Input voltage range
Isc
Short-circuit current
TJ
Junction temperature range
Tstg
Storage temperature range
ESD
Electrostatic discharge rating
(1)
(2)
VIN, L, VOUT, EN, FB
–0.3 V to 7 V
400 mA
–40°C to 150°C
–65°C to 150°C
Human-Body Model (HBM)
(2)
2000 V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
ESD testing is performed according to the respective JESD22 JEDEC standard.
DISSIPATION RATINGS TABLE
PACKAGE
THERMAL RESISTANCE
θJA
POWER RATING
TA ≤ 25°C
DERATING FACTOR ABOVE
TA = 25°C
DRS
TBD°C/W
TBD mW
TBD mW/°C
DBV
255°C/W
390 mW
-3.92 mW/°C
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
0.9
5.5
Adjustable output voltage
1.8
5.5
V
Operating free air temperature range
–40
85
°C
Operating junction temperature range
–40
125
°C
VIN
Supply voltage at VIN
VOUT
TA
TJ
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UNIT
V
3
TPS61097
SLVS872A – JUNE 2009 – REVISED JULY 2009 .............................................................................................................................................................. www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature
range of 25°C) (unless otherwise noted)
DC/DC STAGE
PARAMETER
TEST CONDITIONS
MIN
VIN
Input voltage
VOUT
TPS61097-ADJ output voltage
range
VFB
TPS61097-ADJ feedback voltage VIN = 1.2 V , IOUT = 10 mA
1.16
TPS61097-18
VIN = 1.2 V , IOUT = 10 mA
1.75
TPS61097-27
VIN = 1.2 V , IOUT = 10 mA
TPS61097-30
VIN = 1.2 V , IOUT = 10 mA
TPS61097-33
VOUT
ISW
TYP
MAX
UNIT
0.9
5.5
V
1.8
5.0
V
1.20
1.24
V
1.80
1.85
2.62
2.70
2.78
2.91
3.00
3.09
VIN = 1.2 V , IOUT = 10 mA
3.20
3.30
3.40
TPS61097-50
VIN = 2.4 V , IOUT = 10 mA
4.85
5.00
5.15
Switch current limit
VOUT = 3.3 V
200
350
475
Rectifying switch on resistance
VOUT = 3.3 V
1.0
Ω
Main switch on resistance
VOUT = 3.3 V
1.0
Ω
Bypass switch on resistance
VIN = 1.2 IOUT = 100 mA
3.4
Ω
Line regulation
VIN < VOUT, VIN = 1.2 V to 1.8 V, IOUT = 10 mA
0.5%
Load regulation
VIN < VOUT, IOUT = 10 mA to 50 mA, VIN = 1.8 V
0.5%
IQ
Quiescent current
ISD
Shutdown current
VIN
VOUT
VIN
Leakage current into L
VIN < VOUT
IO = 0 mA, VEN = VIN = 1.2 V, VOUT = 3.4V
VEN = 0 V, VIN = 1.2 V, IOUT = 0 mA
VEN = 0 V, VIN = 1.2 V, VL = 1.2 V
V
mA
1
2.5
µA
4
6.5
µA
0.005
0.15
µA
0.01
1
µA
TYP
MAX
0.01
0.1
µA
0.65
V
CONTROL STAGE
PARAMETER
EN input current
VIL
Logic low level, EN falling edge
VIH
Logic high level, EN rising edge
Overvoltage protection threshold
VUVLO
4
TEST CONDITIONS
MIN
EN = 0 V or EN = VIN
0.78
TPS61097-ADJ
5.5
UNIT
V
6.5
7
V
Overtemperature protection
150
°C
Overtemperature hysteresis
20
°C
Undervoltage lock-out threshold for turn off
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VIN decreasing
0.5
0.7
Copyright © 2009, Texas Instruments Incorporated
TPS61097
www.ti.com .............................................................................................................................................................. SLVS872A – JUNE 2009 – REVISED JULY 2009
PIN ASSIGNMENTS
4
VOUT
6
GND
2
EN
3
L
5
NC
4
VOUT
VIN
1
GND
2
EN
6
W
3
1
IE
EN
VIN
EV
2
L
ADJUSTABLE OUTPUT VOLAGE
DRS PACKAGE
(TOP VIEW)
PR
GND
5
IE
W
1
EV
VIN
FIXED OUTPUT VOLTAGE
DRS PACKAGE
(TOP VIEW)
PR
FIXED OUTPUT VOLTAGE
DBV PACKAGE
(TOP VIEW)
3
L
5
FB
4
VOUT
NC – No internal connection
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
DBV
DRS
VIN
1
1
GND
2
2
EN
3
3
I
Enable input (1 = enabled, 0 = disabled). EN must be actively terminated high or low.
VOUT
4
4
O
Boost converter output
L
5
6
I
Connection for inductor
FB
–
5
I
(Adjustable versions) Voltage feedback of adjustable versions.
Exposed
Thermal Pad
I
Boost converter input voltage
Control / logic ground
–
Copyright © 2009, Texas Instruments Incorporated
Must be soldered to PCB to achieve appropriate power dissipation. Should be connected to
GND.
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TPS61097
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FUNCTIONAL BLOCK DIAGRAM (FIXED OUTPUT VERSION)
Bypass
Switch
P
N
L
VOUT
Rectifying
Switch
Thermal Shutdown
Startup Circuit
N
Driver
VIN
Undervoltage
Lockout
Bypass Switch
Control
Main
Switch
Control Logic
Current
Sense
EN
Overvoltage
Protection
GND
1.20 V
6
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TPS61097
www.ti.com .............................................................................................................................................................. SLVS872A – JUNE 2009 – REVISED JULY 2009
FUNCTIONAL BLOCK DIAGRAM (ADJUSTABLE OUTPUT VERSION)
Bypass
Switch
P
N
L
VOUT
Rectifying
Switch
Thermal Shutdown
Startup Circuit
N
Driver
VIN
Undervoltage
Lockout
Bypass Switch
Control
Main
Switch
Control Logic
Current
Sense
EN
Overvoltage
Protection
FB
GND
1.20 V
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TPS61097
SLVS872A – JUNE 2009 – REVISED JULY 2009 .............................................................................................................................................................. www.ti.com
PARAMETER MEASUREMENT INFORMATION
TPS61097-33
L
VOUT
3.3 V
VOUT
L1
C2
VIN
0.9 V to 3 V
VIN
C1
EN
GND
C1
10 µF
C2
10 µF
L
10 µH
Table 1. List of Components
8
REFERENCE
MANUFACTURER
PART NO.
C1
Murata
GRM319R61A106KE19 10µF 10V X5R 1206 20%
C2
Murata
GRM319R61A106KE19 10µF 10V X5R 1206 20%
L1
Coilcraft
DO3314-103MLC
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TPS61097
www.ti.com .............................................................................................................................................................. SLVS872A – JUNE 2009 – REVISED JULY 2009
TYPICAL CHARACTERISTICS
Table 2. Table of Graphs
FIGURE
Maximum Output Current
Efficiency
Input Current
Startup Voltage
Output Voltage
Waveforms
vs Input Voltage
1
vs Output Current
2
vs Input Voltage
3
vs Input Voltage (Device Enabled, No Output Load, VOUT = 3.3 V)
4
vs Input Voltage (Device Disabled, No Output Load)
5
vs Temperature
6
vs Output Current
7
vs Output Current
8
vs Input Voltage
9
Output Voltage Ripple
10
Load Transient Response
11
Line Transient Response
12
Switching Waveform, Continuous Mode
13
Switching Waveform, Discontinuous Mode
14
Startup After Enable (VIN = 1.2 V, IOUT = 10 mA)
15
Startup After Enable (VIN = 1.8 V, IOUT = 10 mA)
16
MAXIMUM OUTPUT CURRENT
vs
INPUT VOLTAGE
EFFICIENCY
vs
OUTPUT CURRENT
0.25
100
90
0.20
80
70
Efficiency – %
IO(max) – Maximum Output Current – A
COUT = 10 µF, ceramic
L = 10 µH
0.15
0.10
VIN = 3 V
60
VIN = 2.5 V
50
VIN = 1.8 V
40
VIN = 1.5 V
30
0.05
VIN = 1.2 V
20
COUT = 10 µF, ceramic
L = 10 µH
10
0.00
VIN = 0.9 V
0
0.9
1.2
1.5
1.8
2.1
2.4
VI – Input Voltage – V
Figure 1.
Copyright © 2009, Texas Instruments Incorporated
2.7
3
0.1
1
10
100
IO – Output Current – mA
Figure 2.
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TPS61097
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EFFICIENCY
vs
INPUT VOLTAGE
INPUT CURRENT
vs
INPUT VOLTAGE
100
20
IOUT = 10 mA
90
18
80
16
IIN – Input Current – µA
Efficiency – %
70
IOUT = 100 µA
60
IOUT = 5 mA
IOUT = 100 mA
50
IOUT = 50 mA
40
30
20
12
10
8
6
2
0
0
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
0.9 1.2 1.5 1.8 2.1 2.4
2.7
3
VIN – Input Voltage – V
VIN – Input Voltage – V
Figure 3.
Figure 4.
INPUT CURRENT
vs
INPUT VOLTAGE
STARTUP VOLTAGE
vs
TEMPERATURE
120
3.3 3.6 3.9 4.2
0.720
VIN = 1.8 V
No Load
Device Disabled
No Output Load
0.718
100
0.716
80
Startup Voltage – V
IIN – Input Current – nA
14
4
COUT = 10 µF, ceramic
L = 10 µH
10
60
40
0.714
0.712
0.710
20
0.708
0
0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
3.3 3.6 3.9 4.2
VIN – Input Voltage – V
Figure 5.
10
Device Enabled
No Output Load
VOUT = 3.3 V
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0.706
-40
-25
-10
5
20
35
50
65
80
TA – Temperature – °C
Figure 6.
Copyright © 2009, Texas Instruments Incorporated
TPS61097
www.ti.com .............................................................................................................................................................. SLVS872A – JUNE 2009 – REVISED JULY 2009
STARTUP VOLTAGE
vs
OUTPUT CURRENT
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
0.725
3.32
COUT = 10 µF, ceramic
L = 10 µH
VIN = 1.8 V
3.30
VOUT – Output Voltage – V
Startup Voltage – V
0.720
0.715
0.710
0.705
VIN = 2.1 V
VIN = 2.5 V
VIN = 2.7 V
VIN = 3.0 V
3.28
VIN = 0.9 V
VIN = 1.2 V
3.26
VIN = 1.5 V
VIN = 1.8 V
3.24
3.22
3.20
0.700
0
1
10
1
100
10
100
IOUT – Output Current – mA
1000
IOUT – Output Current – mA
Figure 7.
Figure 8.
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
6
Device disabled
VOUT – Ouput Voltage – V
5
4
RLOAD = 1k
3
RLOAD = 122
2
1
0
0
1
2
3
4
5
6
VIN – Input Voltage – V
Figure 9.
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TPS61097
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OUTPUT VOLTAGE RIPPLE
Inductor Current
VIN = 1.8 V
IOUT = 50 mA
COUT = 10 µF, ceramic
L = 10 µH
VOUT
Figure 10.
LOAD TRANSIENT RESPONSE
IOUT
VIN = 1.2 V
IOUT = 6 mA to 50 mA
VOUT
Figure 11.
12
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TPS61097
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LINE TRANSIENT RESPONSE
VIN
Offset 1.8 V
VIN = 1.8 V to 2.4 V
RLOAD = 100 W
VOUT
Figure 12.
SWITCHING WAVEFORM, CONTINUOUS MODE
VIN = 1.8 V
IOUT = 50 mA
Inductor Current
Inductor Voltage
VOUT
Figure 13.
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TPS61097
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SWITCHING WAVEFORM, DISCONTINUOUS MODE
VIN = 1.8 V
IOUT = 10 mA
Inductor Current
Inductor Voltage
VOUT
Figure 14.
STARTUP AFTER ENABLE
VIN = 1.2 V
IOUT = 10 mA
VOUT
VEN
Figure 15.
14
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STARTUP AFTER ENABLE
VIN = 1.8 V
IOUT = 10 mA
VOUT
VEN
Figure 16.
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TPS61097
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DETAILED DESCRIPTION
Operation
The TPS61097 is a high performance, high efficient family of switching boost converters. To achieve high
efficiency the power stage is realized as a synchronous boost topology. For the power switching two actively
controlled low RDSon power MOSFETs are implemented.
Controller Circuit
The device is controlled by a hysteretic current mode controller. This controller regulates the output voltage by
keeping the inductor ripple current constant in the range of 200 mA and adjusting the offset of this inductor
current depending on the output load. If the required average input current is lower than the average inductor
current defined by this constant ripple the inductor current goes discontinuous to keep the efficiency high at low
load conditions.
IL
Continuous Current Operation
Discontinuous Current Operation
200 mA
(typ.)
200 mA
(typ.)
t
Figure 17. Hysteretic Current Operation
The output voltage VOUT is monitored via the feedback network which is connected to the voltage error amplifier.
To regulate the output voltage, the voltage error amplifier compares this feedback voltage to the internal voltage
reference and adjusts the required offset of the inductor current accordingly. For fixed output voltage versions,
the feedback function is connected internally. A resistive divider network is required to set the output voltage with
the adjustable option.
The self oscillating hysteretic current mode architecture is inherently stable and allows fast response to load
variations. It also allows using inductors and capacitors over a wide value range.
Device Enable and Shutdown Mode
The device is enabled when EN is set high and shut down when EN is low. During shutdown, the converter stops
switching and all internal control circuitry is turned off.
Bypass Switch
The TPS61097 contains a P-channel MOSFET (Bypass Switch) in parallel with the synchronous rectifying
MOSFET. When the IC is enabled (EN = VIH), the Bypass Switch is turned off to allow the IC to work as a
standard boost converter. When the IC is disabled (EN = VIL) the Bypass Switch is turned on to provide a direct,
low impedance connection from the input voltage (at the L pin) to the load (VOUT). The Bypass Switch is not
impacted by Undervoltage lockout, Overvoltage or Thermal shutdown.
Startup
After the EN pin is tied high, the device starts to operate. If the input voltage is not high enough to supply the
control circuit properly a startup oscillator starts to operate the switches. During this phase the switching
frequency is controlled by the oscillator and the maximum switch current is limited. As soon as the device has
built up the output voltage to about 1.8 V, high enough for supplying the control circuit, the device switches to its
normal hysteretic current mode operation. The startup time depends on input voltage and load current.
Operation at Output Overload
If in normal boost operation the inductor current reaches the internal switch current limit threshold the main
switch is turned off to stop further increase of the input current.
In this case the output voltage will decrease since the device can not provide sufficient power to maintain the set
output voltage.
16
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If the output voltage drops below the input voltage the backgate diode of the rectifying switch gets forward biased
and current starts flow through it. Because this diode cannot be turned off, the load current is only limited by the
remaining DC resistances. As soon as the overload condition is removed, the converter automatically resumes
normal operation and enters the appropriate soft start mode depending on the operating conditions.
Undervoltage Lockout
An undervoltage lockout function stops the operation of the converter if the input voltage drops below the typical
undervoltage lockout threshold. This function is implemented in order to prevent malfunctioning of the converter.
The undervoltage lockout function has no control of the Bypass Switch. If the Bypass Switch is enabled (EN =
VIL) there is no impact during an undervoltage condition, the Bypass Switch remains on.
Overvoltage Protection
If, for any reason, TPS61097-ADJ output voltage is not properly connected to the input of the voltage amplifier,
the IC cannot control the output voltage. Therefore an overvoltage protection is implemented to keep the output
voltage from exceeding the absolute maximum voltage ratings of the IC and to protect the load. For this
protection the TPS61097-ADJ output voltage is also monitored internally. In case it reaches the internally
programmed threshold of 6.5 V typically the voltage amplifier regulates the output voltage to this value.
If the TPS61097-ADJ is used to drive LEDs, this feature protects the circuit if the LED fails.
Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature
exceeds the programmed threshold (150 °C typical), the device stops operating. As soon as the IC temperature
has decreased below the programmed threshold, it starts operating again. There is a built-in hysteresis to avoid
unstable operation at IC temperatures at the overtemperature threshold.
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APPLICATION INFORMATION
Design Procedure
The TPS61097 DC/DC converters are intended for systems powered by a single up to triple cell Alkaline, NiCd,
NiMH battery with a typical terminal voltage between 0.9 V and 5.5 V. They can also be used in systems
powered by one-cell Li-Ion or Li-Polymer with a typical voltage between 2.5 V and 4.2 V. Additionally, any other
voltage source like solar cells or fuel cells with a typical output voltage between 0.9 V and 5.5 V can power
systems where the TPS61097 is used. The TPS61097 does not down-regulate VIN; therefore, if VIN is greater
than VOUT, VOUT tracks VIN.
Programming the Output Voltage
Within the TPS61097 family, there are fixed and adjustable output voltage versions available. For the adjustable
output voltage versions, an external resistor divider is used to adjust the output voltage. The resistor divider must
be connected between VOUT, FB, and GND. When the output voltage is regulated properly, the typical value of
the voltage at the FB pin is 1.2 V. The maximum recommended value for the output voltage is 5.5 V. The current
through the resistive divider should be about 100 times greater than the current into the FB pin. The typical
current into the FB pin is 0.01 µA, and the voltage across the resistor between FB and GND, R2, is typically 1.2
V. Based on those two values, the recommended value for R2 should be lower than 500 kΩ, in order to set the
divider current at 1 µA or higher. It is recommended to keep the value for this resistor in the range of 100 kΩ.
Equation 1 calculates the value of R1 to set the desired output voltage:
R3 = R4 ×
VOUT
–1
VFB
(1)
As an example, if an output voltage of 2.5 V is needed, a 162-kΩ resistor should be chosen for R1 when a
150-kΩ has been selected for R2.
TPS61097-ADJ
L
VOUT
1.8 V to 5.5 V
VOUT
L1
R1
VIN
0.9 V to VOUT
VIN
C2
FB
R2
C1
EN
GND
Figure 18. Typical Application Circuit for Adjustable Output Voltage Option
Adjustable Bypass Switching
The EN pin can be set up as a low voltage control for the bypass switch. By setting the desired ratio of R1 and
R2, the TPS61097 can be set to switch on the bypass at a defined voltage level on VIN. For example, setting R1
and R2 to 200K Ω would set VEN to half of VIN. The voltage level of VIN engaging the bypass switch is based on
the VIL level of EN (0.65 V). If VIN is less than 1.30 V then the bypass switch will be enabled. For VIN values
above 1.50 V (50% of VIH) the bypass switch is disabled.
18
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TPS61097
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TPS61097-33
L
VOUT
3.3 V
VOUT
L1
C2
VIN
0.9 V to V
VIN
R1
C1
EN
R2
GND
Figure 19. Adjustable Bypass Switching
Inductor Selection
To make sure that the TPS61097 devices can operate, a suitable inductor must be connected between pin VIN
and pin L. Inductor values of 4.7 µH show good performance over the whole input and output voltage range .
Choosing other inductance values affects the switching frequency f proportional to 1/L as shown in Equation 2.
L=
V ´ (VOUT - VIN )
1
´ IN
f ´ 200 mA
VOUT
(2)
Choosing inductor values higher than 4.7 µH can improve efficiency due to reduced switching frequency and
therefore with reduced switching losses. Using inductor values below 2.2 µH is not recommended.
Having selected an inductance value, the peak current for the inductor in steady state operation can be
calculated. Equation 3 gives the peak current estimate.
IL,MAX
ì VOUT ´ IOUT
+ 100 mA; continous current operation
ï
= í 0.8 ´ VIN
ï200 mA;
discontinuous current operation
î
(3)
IL,MAX is the inductor's required minimum current rating. Note that load transient or over current conditions may
require an even higher current rating.
Equation 4 provides an easy way to estimate whether the device is operating in continuous or discontinuous
operation. As long as the equation is true, continuous operation is typically established. If the equation becomes
false, discontinuous operation is typically established.
VOUT ´ IOUT
> 0.8 ´ 100 mA
VIN
(4)
Due to the use of current hysteretic control in the TPS61097, the series resistance of the inductor can impact the
operation of the main switch. There is a simple calculation that can ensure proper operation of the TPS61097
boost converter. The relationship between the series resistance (RIN), the input voltage (VIN) and the switch
current limit (ISW) is shown in Equation 5.
RIN < VIN / ISW
(5)
Examples:
ISW = 400 mA, VIN = 2.5 V
(6)
In Equation 6, RIN < 2.5 V / 400 mA; therefore, RIN must be less than 6.25 Ω.
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TPS61097
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ISW = 400 mA, VIN = 1.8 V
(7)
In Equation 7, RIN < 1.8 V / 400 mA; therefore, RIN must be less than 4.5 Ω.
The following inductor series from different suppliers have been used with TPS61097 converters:
Table 3. List of Inductors
VENDOR
INDUCTOR SERIES
Coilcraft
DO3314
TDK
NLC565050T
Taiyo Yuden
CBC2012T
Capacitor Selection
Input Capacitor
The input capacitor should be at least 10-µF to improve transient behavior of the regulator and EMI behavior of
the total power supply circuit. The input capacitor should be a ceramic capacitor and be placed as close as
possible to the VIN and GND pins of the IC.
Output Capacitor
For the output capacitor C2, it is recommended to use small ceramic capacitors placed as close as possible to
the VOUT and GND pins of the IC. If, for any reason, the application requires the use of large capacitors which
can not be placed close to the IC, the use of a small ceramic capacitor with an capacitance value of around
2.2µF in parallel to the large one is recommended. This small capacitor should be placed as close as possible to
the VOUT and GND pins of the IC.
A minimum capacitance value of 4.7 µF should be used, 10 µF are recommended. If the inductor value exceeds
4.7 µH, the value of the output capacitance value needs to be half the inductance value or higher for stability
reasons, see Equation 8.
C2 ³
L
´
2
(8)
The TPS61097 is not sensitive to the ESR in terms of stability. Using low ESR capacitors, such as ceramic
capacitors, is recommended to minimize output voltage ripple. If heavy load changes are expected, the output
capacitor value should be increased to avoid output voltage drops during fast load transients.
Table 4. Recommended Output Capacitors
20
VENDOR
CAPACITOR SERIES
Murata
GRM188R60J106M47D 10µF 6.3V X5R 0603
Murata
GRM319R61A106KE19 10µF 10V X5R 1206
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TPS61097
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Layout Considerations
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of
ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
control ground, it is recommended to use short traces as well, separated from the power ground traces. This
avoids ground shift problems, which can occur due to superimposition of power ground current and control
ground current.
Figure 20. Layout Schematic
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TPS61097
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Figure 21. PCB Top View
Thermal Information
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS61097 devices is 125°C. The thermal
resistance of the 6-pin SON 3 × 3 package (DRS) is RθJA = TBD °C/W, if the thermal pad is soldered. Specified
regulator operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the maximum power
dissipation is about TBD mW. More power can be dissipated if the maximum ambient temperature of the
application is lower.
22
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PACKAGE OPTION ADDENDUM
www.ti.com
2-Jul-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS61097-33DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS61097-33DBVT
ACTIVE
SOT-23
DBV
5
250
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Jul-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
TPS61097-33DBVR
SOT-23
DBV
5
3000
180.0
TPS61097-33DBVT
SOT-23
DBV
5
250
180.0
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
9.2
3.23
3.17
1.37
4.0
8.0
Q3
9.2
3.23
3.17
1.37
4.0
8.0
Q3
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Jul-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS61097-33DBVR
SOT-23
DBV
5
3000
205.0
200.0
33.0
TPS61097-33DBVT
SOT-23
DBV
5
250
205.0
200.0
33.0
Pack Materials-Page 2
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