TS321 www.ti.com...................................................................................................................................... SLOS489B – DECEMBER 2005 – REVISED SEPTEMBER 2008 LOW-POWER SINGLE OPERATIONAL AMPLIFIER FEATURES 1 • • • • • D (SOIC) PACKAGE (TOP VIEW) Wide Power-Supply Range – Single Supply…3 V to 30 V – Dual Supply…±1.5 V to ±15 V Large Output Voltage Swing… 0 V to 3.5 V (Min) (VCC = 5 V) Low Supply Current…500 µA (Typ) Low Input Bias Current…20 nA (Typ) Stable With High Capacitive Loads NC 1 8 NC IN– 2 7 VCC+ IN+ 3 6 OUT VCC– 4 5 NC NC – No internal connection DBV (SOT-23-5) PACKAGE (TOP VIEW) OUT 1 5 VCC+ VCC– 2 IN+ 3 4 IN– DESCRIPTION/ORDERING INFORMATION The TS321 is a bipolar operational amplifier for cost-sensitive applications in which space savings are important. ORDERING INFORMATION TA PACKAGE SOIC – D –40°C to 125°C SOT-23-5 – DBV (1) (2) (1) ORDERABLE PART NUMBER Tube of 75 TS321ID Reel of 2500 TS321IDR Reel of 3000 TS321IDBVR Reel of 250 TS321IDBVT TOP-SIDE MARKING (2) SR321I 9C1_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV: The actual top-side marking has one additional character that designates the assembly/test site. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2008, Texas Instruments Incorporated TS321 SLOS489B – DECEMBER 2005 – REVISED SEPTEMBER 2008...................................................................................................................................... www.ti.com SCHEMATIC DIAGRAM VCC IN– IN+ OUT 2 Submit Documentation Feedback Copyright © 2005–2008, Texas Instruments Incorporated Product Folder Link(s): TS321 TS321 www.ti.com...................................................................................................................................... SLOS489B – DECEMBER 2005 – REVISED SEPTEMBER 2008 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN VCC Supply voltage (2) VID Differential input voltage (3) VI Input voltage range (2) (4) II Input current (4) tshort Duration of output short circuit to ground Single 32 UNIT V V 32 V 50 mA Unlimited TJ Operating virtual junction temperature Tstg Storage temperature range (6) ±16 –0.3 Package thermal impedance, junction to free air (5) (6) (2) (3) (4) (5) 32 Dual θJA (1) MAX D package 97 DBV package 206 –65 °C/W 150 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. These voltage values are with respect to the midpoint between VCC+ and VCC–. Differential voltages are at IN+ with respect to IN–. Neither input must ever be more positive than VCC+ or more negative than VCC–. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions VCC Supply voltage TA Operating free-air temperature Single supply Dual supply MIN MAX 3 30 ±1.5 ±15 –40 125 Submit Documentation Feedback Copyright © 2005–2008, Texas Instruments Incorporated Product Folder Link(s): TS321 UNIT V °C 3 TS321 SLOS489B – DECEMBER 2005 – REVISED SEPTEMBER 2008...................................................................................................................................... www.ti.com Electrical Characteristics VCC+ = 5 V, VCC– = GND, VO = 1.4 V (unless otherwise noted) PARAMETER TEST CONDITIONS RS = 0, 5 V < VCC+ < 30 V, 0 < VIC < (VCC+ – 1.5 V) VIO Input offset voltage IIO Input offset current IIB Input bias current (1) AVD Large-signal differential voltage amplification VCC = 15 V, RL = 2 kΩ, VO = 1.4 V to 11.4 V VICR Common-mode input voltage (2) VCC = 30 V MIN TYP MAX 0.5 4 Full range 5 25°C 2 Full range 20 Full range VCC = 30 V High-level output voltage RL = 10 kΩ VCC = 5 V RL = 2 kΩ 30 50 25°C RL = 2 kΩ VOH TA 25°C 150 200 25°C 50 Full range 25 25°C 0 VCC+ – 1.5 Full range 0 VCC+ – 2 25°C Full range 25°C 26 mV nA nA V/mV V 27 25.5 27 Full range 26.5 25°C 3.5 Full range 100 UNIT 28 V 3 25°C 5 15 VOL Low-level output voltage RL = 10 kΩ GBP Gain bandwidth product VCC = 30 V, VI = 10 mV, RL = 2 kΩ, f = 100 kHz, CL = 100 pF 25°C 0.8 MHz SR Slew rate VCC = 15 V, VI = 0.5 V to 3 V, RL = 2 kΩ, CL = 100 pF, unity gain 25°C 0.4 V/µs φm Phase margin CMRR Common-mode rejection ratio Full range 20 25°C V 60 ° RS ≤ 10 kΩ 25°C 65 85 dB ISOURCE Output source current VCC = 15 V, VO = 2 V, VID = 1 V 25°C 20 40 mA ISINK Output sink current VCC = 15 V, VID = 1 V VO = 2 V 25°C 10 20 mA VO = 0.2 V 25°C 12 50 IO Short-circuit to GND VCC = 15 V 25°C SVR Supply-voltage rejection ratio VCC = 5 V to 30 V 25°C VCC = 5 V ICC Total supply current No load VCC = 5 V VCC = 30 V THD Total harmonic distortion VCC = 30 V, VO = 2 Vpp, AV = 20 dB, RL = 2 kΩ, f = 1 kHz, CL = 100 pF eN Equivalent input noise voltage VCC = 30 V, f = 1 kHz, RS = 100 Ω (1) (2) 4 25°C VCC = 30 V Full range 40 65 µA 60 110 mA dB 500 800 600 900 600 900 µA 1000 25°C 0.015 25°C 50 % nV/√Hz The direction of the input current is out of the device. This current essentially is constant, independent of the state of the output, so no loading change exists on the input lines. The input common-mode voltage of either input signal should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 32 V without damage. Submit Documentation Feedback Copyright © 2005–2008, Texas Instruments Incorporated Product Folder Link(s): TS321 PACKAGE OPTION ADDENDUM www.ti.com 18-May-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TS321ID ACTIVE SOIC D 8 TS321IDBVR ACTIVE SOT-23 DBV TS321IDBVRE4 ACTIVE SOT-23 TS321IDBVRG4 ACTIVE TS321IDBVT 75 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-May-2009 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) TS321IDBVR SOT-23 DBV 5 3000 180.0 9.2 3.23 3.17 1.37 4.0 TS321IDBVT SOT-23 DBV 5 250 TS321IDR SOIC D 8 2500 180.0 9.2 3.23 3.17 1.37 330.0 12.4 6.4 5.2 2.1 Pack Materials-Page 1 W Pin1 (mm) Quadrant 8.0 Q3 4.0 8.0 Q3 8.0 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS321IDBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 TS321IDBVT SOT-23 DBV 5 250 202.0 201.0 28.0 TS321IDR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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