PACKAGE OPTION ADDENDUM www.ti.com 23-Jul-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 5962-86806012A ACTIVE LCCC FK 20 1 TBD 5962-8680601EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type Purchase Samples UC1846J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type Contact TI Distributor or Sales Office UC1846J/80257 OBSOLETE CDIP J 16 TBD Call TI Call TI Samples Not Available UC1846J/80364 OBSOLETE CDIP J 16 TBD Call TI Call TI Samples Not Available UC1846J/80619 OBSOLETE CDIP J 16 TBD Call TI Call TI Samples Not Available UC1846J883B ACTIVE CDIP J 16 1 TBD A42 UC1846L883B ACTIVE LCCC FK 20 1 TBD UC1847J OBSOLETE CDIP J 16 TBD Call TI Call TI Replaced by UC1846J UC1847J883B OBSOLETE CDIP J 16 TBD Call TI Call TI Replaced by UC1846J883B UC1847L OBSOLETE LCCC FK 20 TBD Call TI Call TI Samples Not Available UC1847L883B OBSOLETE LCCC FK 20 Call TI Call TI Replaced by UC1846L883B UC2846DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples UC2846DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples UC2846DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples TBD POST-PLATE N / A for Pkg Type Purchase Samples N / A for Pkg Type Contact TI Distributor or Sales Office POST-PLATE N / A for Pkg Type Contact TI Distributor or Sales Office UC2846DWTR/81265 OBSOLETE SOIC DW 16 TBD Call TI Call TI Samples Not Available UC2846DWTR/81265G4 OBSOLETE SOIC DW 16 TBD Call TI Call TI Samples Not Available UC2846DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) UC2846J ACTIVE CDIP J 16 1 TBD UC2846N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Request Free Samples UC2846NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Request Free Samples Addendum-Page 1 CU NIPDAU Level-2-260C-1 YEAR A42 N / A for Pkg Type Purchase Samples Contact TI Distributor or Sales Office PACKAGE OPTION ADDENDUM www.ti.com 23-Jul-2010 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) UC2846QTR ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR Purchase Samples UC2846QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR Purchase Samples UC2847DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples UC2847DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples UC2847N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Purchase Samples UC2847NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Purchase Samples UC3846DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples UC3846DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples UC3846DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples UC3846DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples UC3846J ACTIVE CDIP J 16 1 TBD UC3846N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Request Free Samples UC3846NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Request Free Samples UC3846Q ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR Purchase Samples UC3846QG3 ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR Purchase Samples UC3846QTR ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR Purchase Samples UC3846QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR Purchase Samples UC3847DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) Addendum-Page 2 A42 N / A for Pkg Type CU NIPDAU Level-2-260C-1 YEAR Contact TI Distributor or Sales Office Request Free Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Jul-2010 Orderable Device Status (1) Package Type Package Drawing Pins UC3847DWG4 ACTIVE SOIC DW 16 UC3847DWTR ACTIVE SOIC DW UC3847DWTRG4 ACTIVE SOIC Package Qty 40 Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples DW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples UC3847J OBSOLETE CDIP J 16 UC3847N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) TBD CU NIPDAU N / A for Pkg Type Call TI Call TI Request Free Samples Samples Not Available UC3847NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Request Free Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 23-Jul-2010 OTHER QUALIFIED VERSIONS OF UC1846, UC1847, UC2846, UC2846M, UC3846, UC3846M, UC3847 : • Catalog: UC3846, UC3847, UC2846, UC3846M, UC3846 • Enhanced Product: UC1846-EP, UC1846-EP • Military: UC2846M, UC1846, UC1847 • Space: UC1846-SP, UC1846-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Enhanced Product - Supports Defense, Aerospace and Medical Applications • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing UC2846DWTR SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DW 16 2000 330.0 16.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.85 10.8 2.7 12.0 16.0 Q1 UC2846QTR PLCC FN 20 1000 330.0 16.4 10.3 10.3 4.9 12.0 16.0 Q1 UC3846DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1 UC3846QTR PLCC FN 20 1000 330.0 16.4 10.3 10.3 4.9 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UC2846DWTR SOIC DW 16 2000 346.0 346.0 33.0 UC2846QTR PLCC FN 20 1000 346.0 346.0 33.0 UC3846DWTR SOIC DW 16 2000 346.0 346.0 33.0 UC3846QTR PLCC FN 20 1000 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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