NEC UPD17225

DATA SHEET
MOS INTEGRATED CIRCUIT
µPD17225, 17226, 17227, 17228
4-BIT SINGLE-CHIP MICROCONTROLLER
FOR SMALL GENERAL-PURPOSE INFRARED
REMOTE CONTROL TRANSMITTER
DESCRIPTION
µPD17225, 17226, 17227, 17228 (hereafter called µPD17225 subseries) are 4-bit single-chip microcontrollers for
small general-purpose infrared remote control transmitters.
It employs a 17K architecture of general-purpose register type devices for the CPU, and can directly execute
operations between memories instead of the conventional method of executing operations through the accumulator.
Moreover, all the instructions are 16-bit 1-word instructions which can be programmed efficiently.
In addition, a one-time PROM model, µPD17P218, to which data can be written only once, is also available. It is
convenient either for evaluating the µPD17225 subseries programs or small-scale production of application systems.
Detailed functions are described in the following manual. Be sure to read this manual when designing your
system.
µPD172×× Subseries User's Manual: U12795E
FEATURES
• Infrared remote controller carrier generator circuit (REM output)
• 17K architecture: General-purpose register system
• Program memory (ROM), Data memory (RAM)
Program memory (ROM)
µPD17225
µPD17226
µPD17227
µPD17228
4 K bytes
8 K bytes
12 K bytes
16 K bytes
(2048 × 16)
(4096 × 16)
(6144 × 16)
(8192 × 16)
111 × 4 bits
Data memory (RAM)
• 8-bit timer
223 × 4 bits
: 1 channel
• Basic internal timer/Watchdog timer : 1 channel (WDOUT output)
• Instruction execution time (can be changed in two steps)
at fX = 4 MHz
: 4 µs (high-speed mode)/8 µs (ordinary mode)
at fX = 8 MHz
: 2 µs (high-speed mode)/4 µs (ordinary mode)
• External interrupt pin (INT)
: 1
• I/O pins
: 20
• Supply voltage
: VDD = 2.2 to 3.6 V (at fX = 8 MHz (high-speed mode))
VDD = 2.0 to 3.6 V (at fX = 4 MHz (high-speed mode))
• Low-voltage detector circuit (mask option)
Unless otherwise specified, the µPD17225 is treated as the representative model throughout this document.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. U12643EJ2V0DS00 (2nd edition)
Date Published April 1999 N CP (K)
Printed in Japan
The mark
shows major revised points.
©
1997,1999
µPD17225, 17226, 17227, 17228
APPLICATION
Preset remote controllers, toys, portable systems, etc.
ORDERING INFORMATION
Part Number
Package
µPD17225CT-×××
28-pin plastic shrink DIP (400 mil)
µPD17225GT-×××
28-pin plastic SOP (375 mil)
µPD17225MC-×××-5A4
30-pin plastic shrink SOP (300 mil)
µPD17226CT-×××
28-pin plastic shrink DIP (400 mil)
µPD17226GT-×××
28-pin plastic SOP (375 mil)
µPD17226MC-×××-5A4
30-pin plastic shrink SOP (300 mil)
µPD17227CT-×××
28-pin plastic shrink DIP (400 mil)
µPD17227GT-×××
28-pin plastic SOP (375 mil)
µPD17227MC-×××-5A4
30-pin plastic shrink SOP (300 mil)
µPD17228CT-×××
28-pin plastic shrink DIP (400 mil)
µPD17228GT-×××
28-pin plastic SOP (375 mil)
µPD17228MC-×××-5A4
30-pin plastic shrink SOP (300 mil)
Remark ××× indicates ROM code suffix.
DIFFERENCE BETWEEN µPD17225 SUBSERIES AND µPD17215 SUBSERIES
Item
µPD17225 Subseries
µPD17215 Subseries
Supply Voltage
VDD = 2.0 to 3.6 V
VDD = 2.0 to 5.5 V
Instruction Execution
2 µs (VDD = 2.2 to 3.6 V)
4 µs (VDD = 2.0 to 3.6 V)
2 µs (VDD = 3.5 to 5.5 V)
4 µs (VDD = 2.2 to 5.5 V)
8 µs (VDD = 2.0 to 5.5 V)
Connected to RESET pin or VDD via
resistor (when not used)
Connected to RESET pin or GND (when not
used)
Time (tCY)
WDOUT Pin
Connection of WDOUT pin differs between µPD17P218 and µPD17225, 17226, 17227, and
17228 when OTP is evaluated on µPD17225 subseries board and when WDOUT pin is not
used. When µPD17P218 is used, malfunctioning does not occur even when WDOUT pin is
pulled up, though connection can be changed by using a jumper switch on the external board.
Others
2
Supply voltage, low-voltage detection voltage, oscillator characteristics, and noise characteristics differ.
Although µPD17P218 is used as one-time PROM for evaluation for both subseries,
µPD17P218 cannot be used to evaluate the low-voltage high-speed operation of the µPD17225
subseries.
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
PIN CONFIGURATION (TOP VIEW)
• 28-pin plastic SOP (375 mil)
µPD17225GT-×××, 17226GT-×××, 17227GT-×××, 17228GT-×××
• 28-pin plastic shrink DIP (400 mil)
µPD17225CT-×××, 17226CT-×××, 17227CT-×××, 17228CT-×××
P0D 2
1
28
P0D 1
P0D 3
2
27
P0D 0
INT
3
26
P0C 3
P0E 0
4
25
P0C 2
P0E 1
5
24
P0C 1
P0E 2
6
23
P0C 0
P0E 3
7
22
P0B 3
REM
8
21
P0B 2
V DD
9
20
P0B 1
X OUT
10
19
P0B 0
X IN
11
18
P0A 3
GND
12
17
P0A 2
RESET
13
16
P0A 1
WDOUT
14
15
P0A 0
Data Sheet U12643EJ2V0DS00
3
µPD17225, 17226, 17227, 17228
• 30-pin plastic shrink SOP (300 mil)
µPD17225MC-×××-5A4, µPD17226MC-×××-5A4, µPD17227MC-×××-5A4, µPD17228MC-×××-5A4
P0D2
1
30
IC2
P0D3
2
29
P0D1
INT
3
28
P0D0
P0E0
4
27
P0C3
P0E1
5
26
P0C2
P0E2
6
25
P0C1
P0E3
7
24
P0C0
REM
8
23
P0B3
VDD
9
22
P0B2
XOUT
10
21
P0B1
XIN
11
20
P0B0
GND
12
19
P0A3
RESET
13
18
P0A2
WDOUT
14
17
P0A1
IC1
15
16
P0A0
GND
: Ground
IC1, IC2
: Internally connected
INT
: External interrupt request signal input
P0A0-P0A3 : Input port (CMOS input)
P0B0-P0B3 : Input port (CMOS input)
P0C0-P0C3 : Output port (N-ch open-drain output)
P0D0-P0D3 : Output port (N-ch open-drain output)
P0E0-P0E3 : I/O port (CMOS push-pull output)
4
REM
: Remote controller output (CMOS push-pull output)
RESET
: Reset input
VDD
: Power supply
WDOUT
: Hang-up/low voltage detection output (N-ch open-drain output)
XIN, XOUT
: Resonator connection
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
BLOCK DIAGRAM
P0A0
P0A1
P0A2
P0A
Remote
Control
Divider
RF
REM
P0A3
RAM
µ PD17225, 17226 : 111 × 4 bits
µ PD17227, 17228 : 223 × 4 bits
P0B0
P0B1
P0B2
P0B3
8-bit Timer
SYSTEM REG.
P0B
Interrupt
Controller
INT
ALU
P0C0
P0C1
P0C2
P0C3
P0D0
P0D1
P0D2
P0D3
P0C
ROM
µ PD17225 : 2048
µ PD17226 : 4096
µ PD17227 : 6144
µ PD17228 : 8192
×
×
×
×
16 bits
16 bits
16 bits
16 bits
Instruction
Decoder
RESET
P0D
WDOUT
Program Counter
P0E0
P0E1
P0E2
P0E3
Power
Supply
Circuit
P0E
Stack (5 levels)
Basic Interval/
Watchdog Timer
VDD
GND
CPU Clock
XIN
OSC
XOUT
Data Sheet U12643EJ2V0DS00
5
µPD17225, 17226, 17227, 17228
CONTENTS
1.
2.
3.
4.
5.
6.
7.
6
PIN FUNCTIONS ...........................................................................................................................
8
1.1
Pin Function List ................................................................................................................................
8
1.2
Input/Output Circuits .........................................................................................................................
9
1.3
Processing of Unused Pins ..............................................................................................................
10
MEMORY SPACE .........................................................................................................................
11
2.1
Program Counter (PC) .......................................................................................................................
11
2.2
Program Memory (ROM) ...................................................................................................................
11
2.3
Stack ...................................................................................................................................................
13
2.4
Data Memory (RAM) ...........................................................................................................................
15
2.5
Register File (RF) ...............................................................................................................................
22
PORTS ...........................................................................................................................................
25
3.1
Port 0A (P0A0-P0A3) ...........................................................................................................................
25
3.2
Port 0B (P0B0-P0B3) ...........................................................................................................................
25
3.3
Port 0C (P0C0-P0C3) ...........................................................................................................................
25
3.4
Port 0D (P0D0-P0D3) ...........................................................................................................................
25
3.5
Port 0E (P0E0-P0E3) ...........................................................................................................................
25
3.6
INT Pin .................................................................................................................................................
26
3.7
Switching Bit I/O ................................................................................................................................
27
3.8
Specifying Pull-up Resistor Connection .........................................................................................
28
CLOCK GENERATOR CIRCUIT ..................................................................................................
29
4.1
Instruction Execution Time (CPU Clock) Selection ........................................................................
29
8-BIT TIMER AND REMOTE CONTROLLER CARRIER GENERATOR CIRCUIT .....................
30
5.1
Configuration of 8-bit Timer (with modulo function) .....................................................................
30
5.2
Function of 8-bit Timer (with modulo function) ..............................................................................
32
5.3
Carrier Generator Circuit for Remote Controller ............................................................................
33
BASIC INTERVAL TIMER/WATCHDOG TIMER ..........................................................................
37
6.1
Source Clock for Basic Interval Timer .............................................................................................
37
6.2
Controlling Basic Interval Timer ......................................................................................................
37
6.3
Operation Timing for Watchdog Timer ............................................................................................
39
INTERRUPT FUNCTIONS ............................................................................................................
40
7.1
Interrupt Sources ...............................................................................................................................
40
7.2
Hardware of Interrupt Control Circuit ..............................................................................................
41
7.3
Interrupt Sequence ............................................................................................................................
44
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
8.
STANDBY FUNCTIONS ................................................................................................................
46
8.1
HALT Mode .........................................................................................................................................
46
8.2
HALT Instruction Execution Conditions ..........................................................................................
47
8.3
STOP Mode .........................................................................................................................................
48
8.4
STOP Instruction Execution Conditions .........................................................................................
49
8.5
Releasing Standby Mode ..................................................................................................................
49
RESET ...........................................................................................................................................
50
9.1
Reset by Reset Signal Input .............................................................................................................
50
9.2
Reset by Watchdog Timer (Connect RESET and WDOUT pins) ...................................................
50
9.3
Reset by Stack Pointer (Connect RESET and WDOUT pins) ........................................................
51
10. LOW-VOLTAGE DETECTOR CIRCUIT (CONNECT RESET AND WDOUT PINS) ....................
52
11. ASSEMBLER RESERVED WORDS .............................................................................................
53
9.
11.1
Mask Option Directives .....................................................................................................................
53
11.2
Reserved Symbols .............................................................................................................................
54
12. INSTRUCTION SET ......................................................................................................................
60
12.1
Instruction Set Outline ......................................................................................................................
60
12.2
Legend ................................................................................................................................................
61
12.3
List of Instruction Sets ......................................................................................................................
62
12.4
Assembler (RA17K) Built-In Macro Instruction ..............................................................................
64
13. ELECTRICAL SPECIFICATIONS .................................................................................................
65
14. APPLICATION CIRCUIT EXAMPLE ............................................................................................
71
15. PACKAGE DRAWINGS ................................................................................................................
72
16. RECOMMENDED SOLDERING CONDITIONS ............................................................................
75
APPENDIX A. DIFFERENCES AMONG µPD17225, 17226, 17227, 17228 AND µPD17P218 .........
76
APPENDIX B. FUNCTIONAL COMPARISON OF µPD17225 SUBSERIES RELATED PRODUCTS ..
78
APPENDIX C. DEVELOPMENT TOOLS ............................................................................................
80
Data Sheet U12643EJ2V0DS00
7
µPD17225, 17226, 17227, 17228
1.
PIN FUNCTIONS
1.1
Pin Function List
Pin No.
Symbol
Function
Output Form
On Reset
15
16
17
18
(16)
(17)
(18)
(19)
P0A0
P0A1
P0A2
P0A3
4-bit CMOS input port with pull-up resistor.
Can be used for key return input of key matrix. When at least
one of these pins goes low, standby function is released.
–
Input
19
20
21
22
(20)
(21)
(22)
(23)
P0B0
P0B1
P0B2
P0B3
4-bit CMOS input port with pull-up resistor.
Can be used for key return input of key matrix. When at least
one of these pins goes low, standby function is released.
–
Input
23
24
25
26
(24)
(25)
(26)
(27)
P0C0
P0C1
P0C2
P0C3
4-bit N-ch open-drain output port.
Can be used for key source output of key matrix.
N-ch
open-drain
Low-level
output
27
28
1
2
(28)
(29)
(1)
(2)
P0D0
P0D1
P0D2
P0D3
4-bit N-ch open-drain output port.
Can be used for key source output of key matrix.
N-ch
open-drain
Low-level
output
4
5
6
7
(4)
(5)
(6)
(7)
P0E0
P0E1
P0E2
P0E3
4-bit input/output port.
Can be set in inputset in input or output mode in 1-bit units.
In output mode, this port functions as a high current CMOS output
port. In input mode, function as CMOS input and can be specified
to connect pull-up resistor by program.
CMOS
push-pull
Input
8 (8)
REM
Outputs transfer signal for infrared remote controller.
Active-high output.
CMOS
push-pull
Low-level
output
13 (13)
RESET
System reset input. CPU can be reset when low-level signal is
input to this pin. While low-level signal is input, oscillator is
stopped. Can be connected to pull-up resistor by mask option.
–
Input
9 (9)
VDD
Power supply
–
–
12 (12)
GND
Ground
–
–
3 (3)
INT
External interrupt request signal input
–
Input
N-ch
open-drain
Highimpedance
Low-level
output at low
voltage
detection
Output detecting hang-up and drop in supply voltage. This pin
outputs at low level either when an overflow occurs in the watchdog timer, when an overflow/underflow occurs in the stack, or
when the supply voltage drops below a specified level (mask
option). Connect this pin to the RESET pin.
14 (14)
WDOUT
11 (11)
10 (10)
XIN
XOUT
Connects ceramic resonator for system clock oscillation
–
(Oscillation
stops)
(15)
(30)
IC1
IC2
These pins cannot be used.
Leave open.
–
–
Remark The number in parenthesis in the Pin No. column indicates the pin numbers of the 30-pin plastic SSOP.
8
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
1.2
Input/Output Circuits
The equivalent input/output circuit for each µPD17225 pin is shown below.
(1) P0A, P0B
(4) RESET
V DD
V DD
(Mask option)
Input buffer
(2) P0C, P0D
Input buffer
Schmitt trigger input with hysteresis
data
Output
latch
N-ch
characteristics
(5) INT
(3) P0E
V DD
Input buffer
data
Pull-up
register
P-ch
Schmitt trigger input with hysteresis
V DD
data
Output
latch
characteristics
P-ch
N-ch
output
disable
(6) REM
V DD
data
Selector
P-ch
Input buffer
N-ch
output
disable
(7) WDOUT
data
Data Sheet U12643EJ2V0DS00
N-ch
9
µPD17225, 17226, 17227, 17228
1.3
Processing of Unused Pins
Process the unused pins as follows:
Table 1-1. Processing of Unused Pins
Pin
10
Recommended Connection
P0A0-P0A3
Connect to VDD.
P0B0-P0B3
Connect to VDD.
P0C0-P0C3
Connect to GND.
P0D0-P0D3
Connect to GND.
P0E0-P0E3
Input : Individually connect to VDD or GND via resistor.
Output : Leave open.
REM
Leave open.
INT
Connect to GND.
WDOUT
Connect to VDD via resistor.
IC1, IC2
These pins cannot be used.
Leave open.
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
2.
MEMORY SPACE
2.1
Program Counter (PC)
The program counter (PC) specifies an address of the program memory (ROM).
The program counter is an 11/12/13-bit binary counter as shown in Figure 2-1.
Its contents are initialized to address 0000H at reset.
Figure 2-1. Configuration of Program Counter
Page
MSB
LSB
PC12 PC11 PC10
PC9
PC8
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
PC (µPD17225)
PC (µPD17226)
PC (µPD17227, 17228)
2.2
Program Memory (ROM)
The configuration of the program memory is as follows:
Part Number
Capacity
Address
µPD17225
2048 × 16 bits
0000H-07FFH
µPD17226
4096 × 16 bits
0000H-0FFFH
µPD17227
6144 × 16 bits
0000H-17FFH
µPD17228
8192 × 16 bits
0000H-1FFFH
The program memory stores a program, interrupt vector table, and fixed data table.
The program memory is addressed by the program counter.
Figure 2-2 shows the program memory map. The entire range of the program memory can be addressed by the BD
addr, BR @AR, CALL @AR, MOVT DBF, and @AR instructions. Note, however, that the subroutine entry addresses that
can be specified by the CALL addr instruction are from 0000H to 07FFH.
Data Sheet U12643EJ2V0DS00
11
µPD17225, 17226, 17227, 17228
Figure 2-2. Program Memory Map
Address
16 bits
0000H
Reset start address
0001H
Basic interval timer interrupt vector
0002H
External input (INT) interrupt vector
0003H
8-bit timer interrupt vector
Branch addresses for
BR addr instruction
Subroutine entry
Page 0 addresses for CALL
addr instruction
Branch addresses for
BR @AR instruction
( µPD17225)
07FFH
0FFFH
12
( µPD17226)
17FFH
( µPD17227)
1FFFH
( µPD17228)
Page 1
Page 2
Page 3
Data Sheet U12643EJ2V0DS00
Subroutine entry
addresses for CALL
@AR instruction
Table reference
addresses for MOVT
DBR, @AR instruction
µPD17225, 17226, 17227, 17228
2.3
Stack
A stack is a register to save a program return address and the contents of system registers (to be described later) when
a subroutine is called or when an interrupt is accepted.
2.3.1
Stack configuration
Figure 2-3 shows the stack configurarion.
A stack consists of a stack pointer (a 4-bit binary counter, the high-order 1 bit fixed to 0), five 11-bit (µPD17225)/12bit (µPD17226)/13-bit (µPD17227, 17228) address stack registers, and three 5-bit (µPD17225, 17226)/6-bit (µPD17227,
17228) interrupt stack registers.
Figure 2-3. Stack Configuration
Stack pointer
(SP)
b3
0
b2
b1
Address stack registers
(ASR)
b0
SPb 2 SPb 1 SPb 0
WDOUT pin goes low
when the contents
of the stack pinter
are 6H-7H.
b 12
b 11
b 10
b9
b8
b7
b6
b5
b4
0H
Address stack register 0
1H
Address stack register 1
2H
Address stack register 2
3H
Address stack register 3
4H
Address stack register 4
5H
Undefined
6H
Undefined
7H
Undefined
b3
b2
b1
b0
µ PD17225
µPD17226
µ PD17227, 17228
Interrupt stack registers
(INTSK)
b5
b4
b3
b2
b1
b0
0H BANKSK0
BCDSK0
CMPSK0
CYSK0
ZSK0
IXESK0
1H
BANKSK1
BCDSK1
CMPSK1
CYSK1
ZSK1
IXESK1
2H
BANKSK2
BCDSK2
CMPSK2
CYSK2
ZSK2
IXESK2
µ PD17225, 17226
µ PD17227, 17228
Data Sheet U12643EJ2V0DS00
13
µPD17225, 17226, 17227, 17228
2.3.2
Function of stack
The address stack register stores a return address when the subroutine call instruction or table reference instruction
(first instruction cycle) is executed or when an interrupt is accepted. It also stores the contents of the address registers
(ARs) when a stack manipulation instruction (PUSH AR) is executed.
The WDOUT pin goes low if a subroutine call or interrupt exceeding 5 levels is executed.
The interrupt stack register (INTSK) saves the contents of the bank register (BANK) and program status word
(PSWORD) when an interrupt is accepted. The saved contents are restored when an interrupt return (RETI) instruction
is executed.
INTSK saves data each time an interrupt is accepted, but the data stored first is lost if more than 3 levels of
interrupts occur.
2.3.3
Stack Pointer (SP) and Interrupt Stack Pointer
Table 2-1 shows the operations of the stack pointer (SP).
The stack pointer can take eight values, 0H-07. Because there are only five stack registers available, however, the
WDOUT pin goes low if the value of SP is 6 or greater.
Table 2-1. Operations of Stack Pointer
Instruction
Value of Stack Pointer (SP)
Counter of Interrupt Stack Register
–1
0
–1
–1
+1
0
+1
+1
CALL addr
CALL @AR
MOVT DBF, @AR
(1st Instruction Cycle)
PUSH AR
When Interrupt Is Accepted
RET
RETSK
MOVT DBF, @AR
(2nd Instruction Cycle)
POP AR
RETI
14
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
2.4
Data Memory (RAM)
Data memory (random access memory) stores data for operations and control. It can be read-/write-accessed by
instructions.
2.4.1
Memory configuration
Figure 2-4 shows the configuration of the data memory (RAM).
The data memory consists of two “banks”: BANK0 and BANK1.
In each bank, every 4 bits of data is assigned an address. The high-order 3 bits of the address indicate a “row address”
and the low-order 4 bits of the address indicate a “column address”. For example, a data memory location indicated by
row address 1H and column address 0AH is termed a data memory location at address 1AH. Each address stores data
of 4 bits (= a “nibble”).
In addition, the data memory is divided into following six functional blocks:
(1) System register (SYSREG)
A system register (SYSREG) is resident on addresses 74H to 7FH (12 nibbles long) of each bank. In other
nibbles, each bank has a system register at its addresses 74H to 7FH.
(2) Data buffer (DBF)
A data buffer is resident on addresses 0CH to 0FH (4 nibbles long) of bank 0 of data memory.
The reset value is 0320H.
(3) General register (GR)
A general register is resident on any row (16 nibbles long) of any bank of data memory.
The row address of the general register is pointed by the general pointer (RP) in the system register (SYSREG).
(4) Port register
A port data register is resident on addresses 6FH, and 70H to 73H (5 nibbles) of BANK0 of data memory.
No data can be written to the addresses 70H to 73H of BANK1 (the values of addresses 70H to 73H of BANK0
are read in this case).
µPD17225 and 17226 are not provided with BANK1.
Data Sheet U12643EJ2V0DS00
15
µPD17225, 17226, 17227, 17228
(5) General-purpose data memory
The general-purpose data memory area is an area of the data memory excluding the system register area,
and the port register area. This memory area has a total of 223 nibbles (111 nibbles in BANK0 and 112 nibbles
in BANK1).
µPD17225 and 17226 are not provided with BANK1.
Figure 2-4. Configuration of Data Memory
BANK 0
Column address
0
1
2
3
4
5
6
7
8
9
A
B
Row address
0
C
D
E
F
Data buffer (DBF)
1
Example
Address 1AH
in BANK 0
2
3
4
5
P0E
6
7
P0A P0B P0C P0D
System register (SYSREG)
1
Column address
2
3
4
5
6
BANK 1
7
8
9
A
B
C
D
E
F
Row address
0
System register (SYSREG)
Caution No data can be written to the addresses 70H to 73H of BANK1 (the value of P0A to P0D are read in
this case).
16
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
2.4.2
System registers (SYSREG)
The system registers are registers that are directly related to control of the CPU. These registers are mapped to
addresses 74H-7FH on the data memory and can be referenced regardless of bank specification.
The system registers include the following registers:
• Address registers (AR0-AR3)Note
• Window register (WR)
Note
• Bank register (BANK)
• Memory pointer enable flag (MPE)
• Memory pointers (MPH, MPL)
• Index registers (IXH, IXM, IXL)
• General register pointers (RPH, RPL)
• Program status word (PSWORD)
Note
The address register (AR3) and the bank register (BANK) are fixed to 0 in the µPD17225 and 17226.
Figure 2-5. Configuration of System Register
Address
74H
Bit
76H
77H
AR 3
AR 2
AR 1
78H
79H
Window Bank
register register
(WR)
(BANK)
Address register
(AR)
Name
Symbol
75H
AR 0
WR
BANK
7AH
7BH
7CH
Index register
(IX)
IXM
MPH
MPL
7EH
General
register
pointer
(RP)
Data memory
row address
pointer (MP)
IXH
7DH
IXL
RPH
7FH
Program
status
word
(PSWORD)
RPL
PSW
b3 b2 b1 b0 b3 b2 b1 b0 b3 b2 b1 b0 b3 b2 b1 b0 b3 b2 b1 b0 b3 b2 b1 b0 b3 b2 b1 b0 b3 b2 b1 b0 b3 b2 b1 b0 b3 b2 b1 b0 b3 b2 b1 b0 b3 b2 b1 b0
(WR)
Data
0 0 0
(AR) ( µ PD17227, 17228)
0 0 0 0
0 0 0 0 0
Initial
Value
At
Reset
Note
(AR) ( µ PD17226)
(AR) ( µ PD17225)
(BANK) M
0 0 0
P 0 0 0 *
* E
(MP)
(IX)
(RP)
0 0 0
*
I
BCC
CMY Z X
E
DP
*
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Undefined 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
*: This bit is fixed to 0 in the µPD17225 and 17226.
Data Sheet U12643EJ2V0DS00
17
µPD17225, 17226, 17227, 17228
2.4.3
General register (GR)
A general register is a 16-word register on the data memory and used for arithmetic operations and transfer of data
to and from the data memory.
(1) Configuration of general register
Figure 2-6 shows the configuration of the general register.
A general register occupies 16 nibbles (16 × 4 bits) on a selected row address of the data memory.
The row address is selected by the general register pointer (RP) of the system register. The RP having four
significant bits in the µPD17227 and 17228 can point to any row address in the range of 0H to 7H of each
bank (BANK0 and BANK1).
In the µPD17225 and 17226, 3 bits are available in the RP. These bits can point to any row address in the
range of 0H to 7H of BANK0.
(2) Functions of the general register
The general register enables an arithmetic operation and data transfer between the data memory and a
selected general register by a single instruction. As a general register is a part of the data memory, you can
say that the general register enables arithmetic operation and data transfer between two locations of the data
memory. Similarly, the general register can be accessed by a data memory manipulation instruction as it is
a part of the data memory.
Figure 2-6. Configuration of General Registers
General register pointer
(RP)
RPH
RPL
BANK0
b 3 b 2 b 1 b 0 b3 b 2 b 1 b 0
18
F
i
x
e
d
F
i
x
e
d
F
i
x
e
d
0
0
0
0
0
0
0
1
0
0
1
0
t
o
t
o
t
o
0
0
1
1
0
1
0
0
0
0
0
0
1
0
1
0
1
1
0
0
1
1
1
0
1
Column address
2
3
4
5
6
7
8
9
A
B
C
D
E
F
→ 0
→ 1
A
s
s
i
g
n
e
d
t
o
→ 2
← Example
General registers
when
RP = 0000010B
General registers (16 nibbles)
→ 3
→ 4
→ 5
Port
register
→ 6
→ 7
Port register
BANK1
System registers
RP
General register
settable range
→ 0
B
C → 1
D
→ 2
1
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
0
1
1
0
1
f → 3
l
a → 4
g → 5
1
1
1
0
→ 6
1
1
1
1
→ 7
Same system
registers exist
System registers
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
2.4.4
Data buffer (DBF)
The data buffer on the addresses 0CH to 0FH of data memory is used for data transfer to and from peripheral hardware
and for storage of data during table reference.
(1) Functions of the data buffer
The data buffer has two major functions: a function to transfer to and from hardware and a function to read
constant data from the program memory (for table reference). Figure 2-7 shows the relationship between the
data buffer and peripheral hardware.
Figure 2-7. Data Buffer and Peripheral Hardware
Data buffer
(DBF)
Peripheral
address
Internal bus
Peripheral hardware
05H, 06H
8-bit timer
(TMC, TMM)
03H, 04H
Carrier generator for
remote controller
(NRZLTMM, NRZHTMM)
40H
Address register (AR)
Program memory
(ROM)
Constant data
Data Sheet U12643EJ2V0DS00
19
µPD17225, 17226, 17227, 17228
Table 2-2. Relations between Hardware Peripherals and Data Buffer
Hardware
Peripheral Register Transferring Data with Data Buffer
Peripherals
8-Bit Timer
Remote Controller
Carrier Generator
Address Register
Name
Symbol
Peripheral
Address
Data
Buffer Used
PUT/GET
8-bit counter
TMC
05H
DBF0, DBF1
GET only
8-bit modulo
register
TMM
06H
DBF0, DBF1
PUT only
NRZ low-level
timer modulo
register
NRZLTMM
03H
DBF0, DBF1
PUT
GET
NRZ high-level
timer modulo
register
NRZHTMM
04H
DBF0, DBF1
PUT (clear bit 3
of DBF1 to 0)
GET (bits 3 of
DBF1 is always 0)
Address register
AR
40H
DBF0-DBF3
PUT (bits 0-3 of
AR3 and bit 3 of
AR2 are any)Note 1
GET (bits 0-3 of
AR3 and bit 3 of
AR2 are always 0)Note 2
Notes 1. In the µPD17226: bits 0 to 3 of AR3 are any, in the µPD17227, 17228: bits 1 to 3 of AR3 are any
2. In the µPD17226: bits 0 to 3 of AR3 are always 0, in the µPD17227, 17228: bits 1 to 3 of AR3 are always 0
(2) Table reference
A MOVT instruction reads constant data from a specified location of the program memory (ROM) and sets it
in the data buffer.
The function of the MOVT instruction is explained below.
MOVT DBF, @AR: Reads data from a program memory location pointed to by the address register (AR) and
sets it in the data buffer (DBF).
Data buffer
DBF 3
DBF 2
DBF 1
DBF 0
Program memory (ROM)
MOVT DBF, @ AR
16 bits
b15
20
Data Sheet U12643EJ2V0DS00
b0
µPD17225, 17226, 17227, 17228
(3) Note on using data buffer
When transferring data to/from the peripheral hardware via the data buffer, the unused peripheral addresses,
write-only peripheral registers (only when executing PUT), and read-only peripheral registers (only when
executing GET) must be handled as follows:
• When device operates
Nothing changes even if data is written to the read-only register.
If the unused address is read, an undefined value is read. Nothing changes even if data is written to that
address.
• Using assembler
An error occurs if an instruction is executed to read a write-only register.
Again, an error occurs if an instruction is executed to write data to a read-only register.
An error also occurs if an instruction is executed to read or write an unused address.
• If an in-circuit emulator (IE-17K or IE-17K-ET) is used (when instruction is executed for patch processing)
An undefined value is read if an attempt is made to read the data of a write-only register, but an error does
not occur.
Nothing changes even if data is written to a read-only register, and an error does not occur.
An undefined value is read if an unused address is read; nothing changes even if data is written to this
address. An error does not occur.
Data Sheet U12643EJ2V0DS00
21
µPD17225, 17226, 17227, 17228
2.5
Register File (RF)
The register file mainly consists of registers that set the conditions of the peripheral hardware.
These registers can be controlled by dedicated instructions PEEK and POKE, and the embedded macro instructions
of RA17K, SETn, CLRn, and INITFLG.
2.5.1
Configuration of register file
Figure 2-8 shows the configuration of the register file and how the register file is accessed by the PEEK and POKE
instructions.
The control registers are controlled by using dedicated instructions PEEK and POKE. Since the control registers are
assigned to addresses 00H-3FH regardless of the bank, the addresses 00H-3FH of the general-purpose data memory
cannot be accessed when the PEEK or POKE instruction is used.
The addresses that can be accessed by the PEEK and POKE instructions are the addresses 00H-3FH of the control
registers and 40H-7FH of the general-purpose data memory. The register file consists of these addresses.
The control registers are assigned to addresses 80H-BFH on the IE-17K to facilitate debugging.
Figure 2-8. Register File Access with PEEK or POKE Instructions
0
1
2
3
4
5
Column address
6
7
8
9
A
B
C
D
E
0
1
2
Data memory
3
4
5
POKE M063, WR
6
7
Row address
System register
0
1
PEEK WR, SP
2
POKE LCDMD, WR
3
Control register
Register file
22
Data Sheet U12643EJ2V0DS00
F
µPD17225, 17226, 17227, 17228
2.5.2
Control registers
The control registers consists of a total of 64 nibbles (64 x 4 bits) of the addresses 00H-3FH of the register file.
Of these, however, only 14 nibbles are actually used. The remaining 50 nibbles are unused registers that are inhibited
from being read or written.
When the “PEEK WR, rf” instruction is executed, the contents of the register file addressed by “rf” are read to the window
register.
When the “POKE rf, WR” instruction is executed, the contents of the window register are written to the register file
addressed by “rf”.
When using the assembler (RA17K), the macro instructions listed below, which are embedded as flag type symbol
manipulation instructions, can be used. The macro instructions allow the contents of the register file to be manipulated
in bit units.
For the configuration of the control register, refer to Figure 11-1 Register File List.
SETn
: Sets flag to “1”
CLRn
: Sets flag to “0”
SKTn
: Skips if all flags are “1”
SKFn
: Skips if all flags are “0”
NOTn
: Complements flag
INITFLG
: Initializes flag
INITFLGX : Initalizes flag
2.5.3
Notes on using register files
When using the register files, bear in mind the points described below. For details, refer to µPD172xx subseries
User’s Manual (U12795E).
(1) When manipulating control registers (read-only and unused registers)
When manipulating the write-only (W), the read-only (R) and unused control registers by using the assembler
or in-circuit emulator, keep in mind the following points:
• When device operates
Nothing changes even if data is written to the read-only register.
If the unused register is read, an undefined value is read; nothing is changed even if data is written to this
register.
• Using assembler
An error occurs if instruction is excecuted to read data to the write-only register.
An error occurs if an instruction is executed to write data to the read-only register.
An error also occurs if an instruction is executed to read or write the unused address.
• When an in-circuit emulator (IE-17K or IE-17K-ET) is used (when instruction is executed for patch
processing)
An undefined value is read if the write-only register is read, and an error does not occur.
Nothing changes even if data is written to the read-only register, and an error does not occur.
An undefined value is read if the unused address is read; nothing changes even if data is written to this
address. An error does not occur.
Data Sheet U12643EJ2V0DS00
23
µPD17225, 17226, 17227, 17228
(2) Symbol definition of register file
An error occurs if a register file address is directly specified as a numeral by the operand “rf” of the “PEEK
WR, rf” or “POKE rf, WR” instruction if the 17K Series Assembler (RA17K) is being used.
Therefore, the addresses of the register file must be defined in advance as symbols.
To define the addresses of the control registers as symbols, define them as the addresses 80H-BFH of BANK0.
The portion of the register file overlapping the data memory (40H-7FH), however, can be defined as symbols
as is.
24
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
3.
PORTS
3.1
Port 0A (P0A0-P0A3)
This is a 4-bit input port. Data is read through port register P0A (address 70H). This port is a CMOS input port with
a pull-up resistor, and can be used for key return input for a key matrix.
When a low-level signal is input to at least one of the pins in this port in the standby mode, the standby mode is released.
3.2
Port 0B (P0B0-P0B3)
This is a 4-bit input port. Data is read through port register P0B (address 71H). This port is a CMOS input port with
a pull-up resistor, and can be used for key return input for a key matrix.
When a low-level signal is input to at least one of the pins in this port in the standby mode, the standby mode is released.
3.3
Port 0C (P0C0-P0C3)
This is a 4-bit output port. The contents of the output latch are read and output data is set through port register P0C
(address 72H). This port is an N-ch open-drain output port, and can be used as the key source of a key matrix.
In the standby mode, this port outputs low-level signals.
3.4
Port 0D (P0D0-P0D3)
This is a 4-bit output port. The contents of the output latch are read and output data is set through port register P0D
(address 73H). This port is an N-ch open-drain output port, and can be used as the key source for a key matrix.
In the standby mode, this port outputs low-level signals.
3.5
Port 0E (P0E0-P0E3)
This is a 4-bit I/O port which can be set in either the input or output mode in 1-bit units by the P0EBIO (address 27H)
of the register file.
To read the input data or to set the output data, use the P0E register (address 6F). When data is read in the output
mode, the contents of the output latch are read.
Connection of a pull-up resistor can be specified in 1-bit units by the P0EBPU (address 17H) of the register file. (When
the pull-up resistor is connected, note that the pull-up resistor is not disconnected even when the output mode is set.)
On reset, this port functions as an input port.
Data Sheet U12643EJ2V0DS00
25
µPD17225, 17226, 17227, 17228
3.6
INT Pin
This pin inputs an external interrupt request signal. At either the rising or falling edge of the signal input to this pin, the
IRQ flag (RF: address 3EH, bit 0) is set.
The status of this pin can be read by using the INT flag (RF: address 0FH, bit 0). When the high level is input to the
pin, the INT flag is set to “1”; when the low level is input, the flag is reset to “0” (refer to 7.2.1 INT).
Figure 3-1. Relations between Port Register and Each Pin
Contents to Be Read
Bank Address
Port
Bit
Output Form
Input Mode
Contents to Be Written
Output Mode Input Mode
Output Mode
On Reset
b 3 P0A 3
b 2 P0A 2
70H
Port 0A
b 1 P0A 1
b 0 P0A 0
Input only
Pin status
N-ch
open-drain
(Output only)
–
–
–
–
b 3 P0B 3
Input mode
(w/pull-up resistor)
b 2 P0B 2
71H
Port 0B
b 1 P0B 1
b 0 P0B 0
b 3 P0C 3
b 2 P0C 2
0
72H
Port 0C
b 1 P0C 1
b 0 P0C 0
b 3 P0D 3
b 2 P0D 2
73H
Output
latch
Port 0D
Output mode
(Low level output)
–
Output
latch
b 1 P0D 1
b 0 P0D 0
b 3 P0E 3
b 2 P0E 2
6FH
Port 0E
b 1 P0E 1
COMS
push-pull
Pin status
b 0 P0E 0
26
Data Sheet U12643EJ2V0DS00
Output
latch
Input mode
(w/pull-up resistor)
µPD17225, 17226, 17227, 17228
3.7
Switching Bit I/O
The I/O which can be set in the input or output mode in bit units is called a bit I/O. P0E is a bit I/O port, which can be
set in the input or output mode in bit units by the register file shown below. When the mode is changed from input to output,
the P0E output latch contents are output to the port lines, as soon as the mode has been changed.
3
2
1
0
Address:
On reset:
R/W:
P0EBIO3
P0EBIO2
P0EBIO1
P0EBIO0
RF : 27H
0H
R/W
P0EBIO0
Sets P0E0 Input/Output Mode
0
Sets P0E0 in input mode
1
Sets P0E0 in output mode
P0EBIO1
Sets P0E1 Input/Output Mode
0
Sets P0E1 in input mode
1
Sets P0E1 in output mode
P0EBIO2
Sets P0E2 Input/Output Mode
0
Sets P0E2 in input mode
1
Sets P0E2 in output mode
P0EBIO3
Sets P0E3 Input/Output Mode
0
Sets P0E3 in input mode
1
Sets P0E3 in output mode
Data Sheet U12643EJ2V0DS00
27
µPD17225, 17226, 17227, 17228
3.8
Specifying Pull-up Resistor Connection
Whether or not a pull-up resistor is connected to port P0E can be specified by the following registers of the register
file in 1-bit units when the port is in the input modeNote.
3
2
1
0
P0EBPU3 P0EBPU2 P0EBPU1 P0EBPU0
Address:
On reset:
R/W:
RF : 17H
0H
R/W
P0EBPU0 Connects Pull-Up Resistor to P0E0
0
Not connected
1
Connected
P0EBPU1 Connects Pull-Up Resistor to P0E1
0
Not connected
1
Connected
P0EBPU2 Connects Pull-Up Resistor to P0E2
0
Not connected
1
Connected
P0EBPU3 Connects Pull-Up Resistor to P0E3
Note
28
0
Not connected
1
Connected
To disconnect the pull-up resistor in the output mode, clear the corresponding bit of the P0EBPU register.
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
4.
CLOCK GENERATOR CIRCUIT
4.1
Instruction Execution Time (CPU Clock) Selection
The µPD17225 is equipped with a clock oscillator that supplies clocks to the CPU and hardware peripherals. Instruction
execution time can be changed in two steps (ordinary mode and high-speed mode) without changing the oscillation
frequency.
To change the instruction execution time, change the mode of SYSCK (RF: address 02H) of the register file by using
the POKE instruction.
Note, that the mode is actually only changed when the instruction next to the POKE instruction has been executed.
When using the high-speed mode, pay attention to the supply voltage. (Refer to 13. ELECTRICAL SPECIFICATIONS.)
At reset, the ordinary mode is set.
3
2
1
0
Address:
On reset:
R/W:
0
0
0
SYSCK
RF : 02H
0H
R/W
SYSCK
Selects Instruction Execution Time
0
Ordinary mode 32/fX (8 µ s)
1
High-speed mode 16/fX (4 µ s)
Figures in ( ): indicate figures when system clock fX = 4 MHz.
Data Sheet U12643EJ2V0DS00
29
µPD17225, 17226, 17227, 17228
5.
8-BIT TIMER AND REMOTE CONTROLLER CARRIER GENERATOR CIRCUIT
The µPD17225 is equipped with the 8-bit timer which is mainly used to generate the leader pulse of the remote controller
signal, and to output codes.
5.1
Configuration of 8-bit Timer (with modulo function)
Figure 5-1 shows the configuration of the 8-bit timer.
As shown in this figure, the 8-bit timer consists of an 8-bit counter (TMC), an 8-bit modulo register (TMM), a comparator
that compares the value of the timer with the value of the modulo register, and a selector that selects the operation clock
of the 8-bit timer.
To start/stop the 8-bit timer, and to reset the 8-bit counter, TMEN (address 33H, bit 3) and TMRES (address 33H, bit
2) of the register file are used. To select the operation clock of the 8-bit timer, use TMCK1 (address 33H, bit 1) and TMCK0
(address 33H, bit 0) of the register file.
The value of the 8-bit counter is read by using the GET instruction through DBF (data buffer). No value can be set to
the 8-bit counter. A value is set to the modulo register by using the PUT instruction through DBF. The value of the modulo
register cannot be read.
When the value of the counter coincides with that of the modulo register, an interrupt flag (IRQTM: address 3FH, bit
0) of the register file is set.
TMC
7
6
5
4
3
2
1
Address
On reset
R/W
Peripheral register: 05H
00H
R
Address
On reset
R/W
Peripheral register: 06H
FFH
W
0
8-bit counter
TMM
7
6
5
4
3
2
8-bit modulo register
1
0
Caution Do not clear TMM to 0 (IRQTM is not set).
30
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
Figure 5-1. Configuration of 8-bit Timer and Remote Controller Carrier Generator Circuit
Data buffer
Internal bus
8-bit timer
RF : 33H
TMEN
TMRES
TMCK1
TMCK0
8-bit modulo register
TMM
fX/32
fX/64
fX/256
R
Selector
IRQTM
Comparator
Q
S
8-bit counter
TMC
Remote controller carrier generator circuit
fX/2 SW
7-bit counter
RF : 11H
Comparator
NRZBF
bit 7
×
RF : 12H
7-bit modulo register
NRZLTMM
NRZ
7-bit counter
Comparator
REM
bit 7
0
7-bit modulo register
NRZHTMM
fixed
Remark TMM, TMC, NRZLTMM, and NRZHTMM are peripheral registers.
Data Sheet U12643EJ2V0DS00
31
µPD17225, 17226, 17227, 17228
5.2
Function of 8-bit Timer (with modulo function)
3
2
TMEN
1
TMRES
0
TMCK1
Address
TMCK0
On reset
RF : 33H
8H
Note 1
R/W
R/W
Note 2
TMCK1
TMCK0
8-Bit Timer Clock Source Selection
0
0
Count clock: fX/32
(Measurement time range: 8 µ s to 2.048 ms)
0
1
Count clock: fX/64
(Measurement time range: 16 µ s to 4.096 ms)
1
0
Count clock : fX/256
(Measurement time range: 64 µ s to 16.384 ms)
1
1
Remote control carrier generation circuit output
Value indicated by parentheses is for when
( ): f SYS (system clock) = fX = 4MHz
TMRES
8-Bit Timer Reset Flag
0
Data read out is always "0"
1
Resets 8-bit counter and IRQTM
TMEN
8-Bit Timer Count Enable Flag
0
Stops 8-bit timer count operation
1
Enable 8-bit timer count operation (falling edge)
Notes 1. When the STOP mode is released, bit 3 must be set.
2. Bit 2 is a write-only bit.
NRZLTMM
7
6
5
×
4
3
2
1
Address
On reset
R/W
Peripheral register: 03H
Undefined
R/W
0
7-bit modulo register
Bit 7
Output Control of REM Pin
0
When NRZ = 1, carrier output to REM pin
1
When NRZ = 1, high-level output to REM pin
NRZHTMM
7
0
6
5
4
3
2
1
Address
On reset
R/W
Peripheral register: 04H
Undefined
R/W
0
7-bit modulo register
Bit 7
Fixed to 0
32
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
5.3
Carrier Generator Circuit for Remote Controller
µPD17225 is provided with a carrier generator circuit for the remote controller.
The remote controller carrier generator circuit consists of a 7-bit counter, NRZ high-level timer modulo register
(NRZHTMM), and NRZ low-level timer modulo register (NRZLTMM). The high-level and low-level periods are set in the
corresponding modulo registers through the DBF to determine the carrier duty factor and carrier frequency.
The system clock (fX) is divided by two and is input to the 7-bit counter. Therefore, when a 4-MHz resonator is used,
2 MHz (0.5 µs) is input to the counter as the clock; when a 32-kHz oscillator (fXT) is used, 16 kHz is input.
The NRZ high-level output timer modulo register is called NRZHTMM, and the NRZ low-level timer modulo register
is called NRZLTMM. Data is written to these registers by the PUT instruction. The contents for these register are read
by the GET instruction.
Bit 7 of NRZLTMM specifies whether the carrier or high level is output to the REM pin. To output the carrier, be sure
to clear bit 7 to 0.
5.3.1
Remote controller signal output control
The REM pin, which outputs the carrier, is controlled by bits NRZ and NRZBF for the register file and timer 0. While
the NRZ content is “1”, the clock generated by the remote controller carrier generator circuit is output to the REM pin; while
the NRZ content is “0”, the REM pin outputs a low level. The NRZBF content is automatically transferred to NRZ by the
interrupt signal generated by timer 0. If data is set in NRZBF in advance, the REM pin status changes in synchronization
with the timer 0 counting operation.
If the interrupt signal is generated from timer 0 with the REM pin at the high level, NRZ being “1”, and the carrier clock
at the high level, the REM pin output is not in accordance with the updated content of NRZ, until the carrier clock goes
low. This processing is useful for holding the high level pulse width from the output carrier constant (refer to the figure
below).
When the content of NRZ is “0”, the remote controller carrier generator circuit stops. However, if the clock for timer
0 is output from the remote controller carrier generator circuit, the clock continues to operate, even when the NRZ content
becomes “0”.
An actual example showing a remote controller signal output to the REM pin is presented below.
Data Sheet U12643EJ2V0DS00
33
µPD17225, 17226, 17227, 17228
When bit 7 of NRZLTMM is 0 (carrier output)
NRZ
REM
MAX. 500 ns (delay)Note
(fX = 4 MHz)
Note
REM pin does not go low
until carrier goes low
even if NRZ becomes 0
Value when (TMCK1, TMCK0) ≠ (1, 1).
When (TMCK1, TMCK0) = (1, 1), the value differs depending on how NRZ is manipulated. If NRZ is set
by an instruction, the width of the first high-level pulse may be shortened. If NRZ is set by data transferred
from NRZBF, the high-level pulse is delayed by the low-level pulse of the carrier clock.
When bit 7 of NRZLTMM is 0 (carrier not output)
NRZ
REM
3
2
1
0
Address
On reset
R/W
0
0
0
NRZ
RF : 12H
0H
R/W
NRZ
0
Outputs low level to REM pin
1
Outputs a carrier to REM pin or high level output
3
2
1
0
Address
On reset
R/W
0
0
0
NRZBF
RF : 11H
0H
R/W
NRZBF
0
1
34
NRZ Data
NRZ Data Output Next
NRZ buffer bit. Transfered to NRZ by interrupt
signal for 8-bit timer.
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
Setting carrier frequency and duty factor
Where the system clock frequency is fX and carrier frequency is fC:
(division ratio) = fX/(2 × fC)
is divided into m:n and is set in the modulo registers as follows:
High-level period set value = {
× m/(m + n)} – 1
Low-level period set value = {
× n/(m + n)} – 1
Example
Where fC = 38 kHz, duty factor (high-level period) = 1/3, and fX = 4 MHz,
= 4 MHz/(2 × 38 kHz) = 52.6
m:n = 1:2
From the above, the value of the modulo register is:
.
High-level period =. 17
Low-level period .=. 34
Therefore, the carrier frequency is 37.74 kHz.
Table 5-1. Carrier Frequency List (fX = 4 MHz)
Set value
tH (µs)
tL (µs)
1/fC (µs)
fC (kHz)
Duty
00H
0.5
0.5
1.0
1000
1/2
01H
02H
1.0
1.5
2.5
400
2/5
04H
04H
2.5
2.5
5.0
200
1/2
09H
09H
5.0
5.0
10.0
100
1/2
0FH
10H
8.0
8.0
16.5
60.6
1/2
0FH
21H
8.0
17.0
25.0
40.0
1/3
11H
21H
9.0
17.0
26.0
38.5
1/3
11H
22H
9.0
17.5
26.5
37.7
1/3
19H
35H
13.0
27.0
40.0
25.0
1/3
3FH
3FH
32.0
32.0
64.0
15.6
1/2
7FH
7FH
64.0
64.0
120.0
7.8
1/2
NRZHTMM
NRZLTMM
00H
tH
tL
REM
(fC)
1/fC
Data Sheet U12643EJ2V0DS00
35
µPD17225, 17226, 17227, 17228
5.3.2
Countermeasures against noise during transmission (carrier output)
When a signal is transmitted from the transmitter of a remote controller, a peak current of 0.5 to 1 A may flow through
the infrared LED. Since two batteries are usually used as the power source of the transmitter, several Ω of equivalent
resistance (r) exists in the power source as shown in Figure 5-2. This resistance increases to 10 to 20 Ω if the supply
voltage drops to 2 V. While the carrier is output from the REM pin (while the infrared LED lights), therefore, a highfrequency noise may be generated on the power lines due to the voltage fluctuation that may take place especially during
switching.
To minimize the influence on the microcontroller of this high-frequency noise, take the following measures:
<1> Separate the power lines of the microcontroller from the power lines of the infrared LED with the terminals of the
batteries at the center. Use thick power lines and keep the wiring short.
<2> Locate the resonator as close as possible to the microcontroller and shield it with GND lines (as indicated by the
shaded portion in the figure below).
<3> Locate the capacitor for stabilization of the power supply closely to the power lines of the microcontroller. Also,
use a capacitor to eliminate high-frequency noise.
<4> To prevent data from changing, do not execute an interrupt that requires read/write processing and stack, such
as key scan interrupt, and the CALL/RET instruction, while the carrier is output.
<5> To improve the reliability in case of program hang-up, use the watchdog timer (connect the WDOUT and RESET
pins).
Figure 5-2. Example of Countermeasures against Noise
0.5 to 1 A
Infrared LED
REM
VDD
Microcomputer
r
+
RESET
–
WDOUT
Batteries
VSS
Remark In this figure, the RESET pin is connected to a pull-up resistor by mask option.
36
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
6.
BASIC INTERVAL TIMER/WATCHDOG TIMER
The basic interval timer has a function to generate the interval timer interrupt signal and watchdog timer reset signal.
6.1
Source Clock for Basic Interval Timer
The system clock (fX) is divided, to generate the source clock for the basic interval timer. The input clock frequency
7
for the basic interval timer is fX/2 . When the CPU is set in the STOP mode, the basic interval timer also stops.
6.2
Controlling Basic Interval Timer
The basic interval timer is controlled by the bits on the register file. That is, the basic interval timer is reset by BTMRES.
The frequency for the interrupt signal, output by the basic interval timer, is selected by BTMMD, and the watchdog timer
is reset by WDTRES.
Selector B
Figure 6-1. Basic Interval Timer Configuration
fX /2 18
fX /2 20
System
clock fX
1/2 7
divider
1/2 11
divider
1/2
divider
1/2
divider
1/2
divider
WDOUT
BTMRES
Data Sheet U12643EJ2V0DS00
WDTRES
BTMCK
IRQBTM
37
µPD17225, 17226, 17227, 17228
3
2
1
0
Address
On reset
R/W
WDTRES
BTMCK
BTMRES
0
RF : 03H
0H
R/WNote
BTMRES
Basic Interval Timer Reset
0
Data read out is always "0"
1
Writing "1" resets basic interval timer
BTMCK
Basic Interval Timer Mode Selection
0
Generates interrupt signal IRQBTM every fX/220
1
Generates interrupt signal IRQBTM every fX/218
WDTRES
Note
38
Watchdog Timer Reset
0
Data read out is always "0"
1
Writing "1" resets watchdog timer (fX/221 counter)
Bits 1 and 3 are write-only bits.
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
6.3
Operation Timing for Watchdog Timer
The basic interval timer can be used as a watchdog timer.
Unless the watchdog timer is reset within a fixed timeNote, it judges that “the program has hung up”, and the µPD17225
is reset. It is therefore necessary to reset through programming the watchdog timer with in a fixed time.
The watchdog timer can be reset by setting WDTRES to 1.
Note
Fixed time: approx. 340 ms (at 4 MHz)
Cautions 1. The watchdog timer cannot be reset in the shaded range in Figure 6-2. Therefore, set
WDTRES before both the fX/2
21
20
and fX/2 signals go high.
2. Refer to 9. RESET for the WDOUT pin function.
Figure 6-2. Watchdog Timer Operation Timing
fX/218
fX/219
fX/220
fX/221
INTBTM (fX/220)
INTBTM (fX/218)
WDOUT
WDOUT output goes low
if WDTRES is not set
Watchdog timer
reset signal
WDTRES
Setting WDTRES at
this timing is invalid
Data Sheet U12643EJ2V0DS00
39
µPD17225, 17226, 17227, 17228
7.
INTERRUPT FUNCTIONS
7.1
Interrupt Sources
µPD17225 is provided with three interrupt sources.
When an interrupt has been accepted, the program execution automatically branches to a predetermined address,
which is called a vector address. A vector address is assigned to each interrupt source, as shown in Table 7-1.
Table 7-1. Vector Address
Priority
Interrupt Source
Ext/Int
Vector Address
1
8-bit timer
Internal
0003H
2
INT pin rising and falling edges
External
0002H
3
Basic interval timer
Internal
0001H
When more than one interrupt request is issued at the same time, the interrupts are accepted in sequence, starting
from the one with the highest priority.
Whether an interrupt is enabled or disabled is specified by the EI or DI instruction. The basic condition under which
an interrupt is accepted is that the interrupt is enabled by the EI instruction. While the DI instruction is executed, or while
an interrupt is accepted, the interrupt is disabled.
To enable accepting an interrupt after the interrupt has been processed, the EI instruction must be executed before
the RETI instruction. Accepting the interrupt is enabled by the EI instruction after the instruction next to the EI instruction
has been executed. Therefore, no interrupt can be accepted between the EI and RETI instructions.
Caution In interrupt processing, only the BCD, CMP, CY, Z, IXE flags are automatically saved to the stack
by the hardware, to a maximum of three levels. Also, within the interrupt processing contents, when
peripheral hardware (timer, A/D converter, etc. ) is accessed, the DBF and WR contents are not saved
by the hardware. Accordingly, it is recommended that at the beginning of interrupt processing DBF
and WR be saved by software to RAM, and immediately before finishing interrupt processing the
saved contents be returned to thier original location.
40
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
7.2
Hardware of Interrupt Control Circuit
This section describes the flags of the interrupt control circuit.
(1) Interrupt request flag and interrupt enable flag
The interrupt request flag (IRQ×××) is set to 1 when an interrupt request is generated, and is automatically
cleared to 0 when the interrupt processing is excuted.
An interrupt enable flag (IP×××) is provided to each interrupt request flag. When the IPxxx flag is 1, the interrupt
is enabled; when it is 0, the interrupt is disabled.
(2) EI/DI instruction
Whether an accepted interrupt is executed or not is specified by the EI or DI instruction.
When the EI instruction is executed, INTE (interrupt enable flag), which enables the interrupt, is set to 1. The
INTE flag is not registered on the register file. Consequently, the status of this flag cannot be checked by
an instruction.
The DI flag clears the INTE flag to 0 to disable all the interrupts.
The INTE flag is also cleared to 0 at reset, disabling all the interrupts.
Table 7-2. Interrupt Request Flags and Interrupt Enable Flag
Interrupt
Request Flag
7.2.1
Interrupt
Enable Flag
Signal Setting Interrupt Request Flag
IRQTM
Reset by 8-bit timer.
IPTM
IRQ
Set when edge of INT pin input signal is detected
IP
IRQBTM
Reset by basic interval timer.
IPBTM
INT
This flag reads the INT pin status.
When a high level is input to the INT pin, this flag is set to “1”; when a low level is input, the flag is reset to “0”.
3
2
1
0
Address
On reset
R/W
0
0
0
INT
RF : 0FH
Undefined
R
INT
INT Pin Level Detection
0
INT pin : Low level
1
INT pin : High level
Data Sheet U12643EJ2V0DS00
41
µPD17225, 17226, 17227, 17228
7.2.2
IEG
This pin selects the interrupt edge to be detected on the INT pin.
When this flag is “0”, the interrupt is detected at the rising edge; when it is “1”, the interrupt is detected at the falling
edge.
3
2
1
0
Address
On reset
R/W
0
0
0
IEG
RF : 1FH
0H
R/W
IEG
7.2.3
INT Pin Interrupt Detection Edge Selection
0
Rising edge of INT pin
1
Falling edge of INT pin
Interrupt enable flag
This flag enables each interrupt source. When this flag is “1”, the corresponding interrupt is enabled; when it is “0”,
the interrupt is disabled.
3
2
1
0
Address
On reset
R/W
0
IPBTM
IP
IPTM
RF : 2FH
0H
R/W
IPTM
0
Disables interrupt acceptance by 8-bit timer
1
Enables interrupt acceptance by 8-bit timer
IP
INT Pin Interrupt Enable Flag
0
Disables interrupt acceptance by INT pin input
1
Enables interrupt acceptance by INT pin input
IPBTM
42
8-Bit Timer Interrupt Enable Flag
Basic Interval Timer Interrupt Enable Flag
0
Disables interrupt acceptance by basic interval timer
1
Enables interrupt acceptance by basic interval timer
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
7.2.4
IRQ
This is an interrupt request flag that indicates the interrupt request status.
When an interrupt request is generated, this flag is set to “1”. When the interrupt has been accepted, the interrupt
request flag is reset to “0”.
The interrupt request flag can be read or written by the program. Therefore, when it is set to “1”, an interrupt can be
generated by the software. By writing “0” to the flag, the interrupt pending status can be canceled.
3
2
1
0
Address
On reset
R/W
0
0
0
IRQBTM
RF : 3DH
0H
R/W
IRQBTM
0
Interrupt request has not been made.
1
Basic interval timer interrupt request has been made.
3
2
1
0
Address
On reset
R/W
0
0
0
IRQ
RF : 3EH
0H
R/W
IRQ
3
0
2
0
1
0
0
Interrupt request has not been made.
1
Interrupt request has been made at rising edge or
falling edge of INT input.
Address
IRQTM
INT Pin Interrupt Request Flag
0
RF : 3FH
IRQTM
Note
Basic Interval Timer Interrupt Request Flag
On reset
1H
Note
R/W
R/W
8-Bit Timer Interrupt Request Flag
0
Interrupt request has not been made.
1
8-bit timer interrupt request has been made.
1H is also set after releasing STOP mode.
Data Sheet U12643EJ2V0DS00
43
µPD17225, 17226, 17227, 17228
7.3
Interrupt Sequence
If IRQ×× flag is set to “1” when IP×× flag is “1”, interrupt processing is started after the instruction cycle of the instruction
executed when IRQ×× flag was set has ended. Since the MOVT instruction, EI instruction, and the instruction which
matches the condition to skip use two instruction cycles, the interrupt enabled while this instruction is executed is
processed after the second instruction cycle is over.
If IP×× flag is “0”, the interrupt processing is not performed even if IRQ×× flag is set, until IP×× flag is set.
If two or more interrupts are enabled simultaneously, the interrupts are processed starting from the one with the highest
priority. The interrupt with the lower priority is kept pending until the processing of the interrupt with the higher priority is
finished.
7.3.1
Operations when interrupt is accepted
When an interrupt has been accepted, the CPU performs processing in the following sequence:
Clears IRQ××× corresponding to
INTE flag and accepted interrupt
Decrements value of stack pointer by 1
(SP – 1)
Saves contents of program counter to
stack addressed by stack pointer
Loads vector address to program counter
Save contents of PSWORD to interrupt stack register
One instruction cycle is required to perform the above processing.
44
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
7.3.2
Returning from interrupt processing routine
To return from an interrupt processing routine, use the RETI instruction.
Then the following processing is executed within an instruction cycle.
Loads contents of stack addressed by
stack pointer to program counter
Loads contents of interrupt
stack register to PSWORD
Increments value of stack pointer by 1
To enable an interrupt after the processing of an interrupt has been finished, the EI instruction must be
executed immediately before the RETI instruction.
Accepting the interrupt is enabled by the EI instruction after the instruction next to the EI instruction has been
executed. Therefore, the interrupt is not accepted between the EI and RETI instructions.
Data Sheet U12643EJ2V0DS00
45
µPD17225, 17226, 17227, 17228
8.
STANDBY FUNCTIONS
µPD17225 is provided with HALT and STOP modes as standby functions. By using the standby function, current
consumption can be reduced.
In the HALT mode, the program is not executed, but the system clock fX is not stopped. This mode is maintained, until the HALT mode release condition is satisfied.
In the STOP mode, the system clock is stopped and program execution is stopped. This mode is maintained, until the
STOP mode release condition is satisfied.
The HALT mode is set, when the HALT instruction has been executed. The STOP mode is set, when the STOP
instruction has been executed.
8.1
HALT Mode
In this mode, program execution is temporarily stopped, with the main clock continuing oscillating, to reduce current
consumption. Use the HALT instruction to set the HALT mode.
The HALT mode releasing condition can be specified by the operand for the HALT instruction, as shown in Table
8-1.
After the HALT mode has been released, the operation is performed as shown in Table 8-1 and Figure 8-2.
Caution Do not execute an instruction that clears the interrupt request flag (IRQ×××) for which the interrupt
enable flag (IP×××) is set immediately before the HALT 8H instruction; otherwise, the HALT mode
may not be set.
Table 8-1. HALT Mode Releasing Conditions
Operand Value
0010B (02H)
Releasing Conditions
When interrupt request (IRQTM) occurs for 8-bit timer
<1>
1000B (08H)
<2>
Other Than Above
When interrupt request (IRQTM, IRQWTM, or IRQ), whose interrupt enable flag (IPTM,
IPBTM, or IP) is set, occurs
When any of P0A0-P0A3 and P0B0-P0B3 pins goes low
Setting prohibited
Table 8-2. Operations After HALT Mode Release (1/2)
(a)
HALT 08H
HALT Mode Released by:
Low-Level Input of P0A0-P0A3,
P0B0-P0B3
When Release Condition Is
Interrupt Status
Interrupt Enable Flag
Don’t care
Don’t care
DI
Disabled
Standby mode is not released
Enabled
Instruction next to HALT is executed
Disabled
Standby mode is not released
Enabled
Branches to interrupt vector address
Satisfied by Interrupt
EI
46
Data Sheet U12643EJ2V0DS00
Operations after HALT Mode Release
Instruction next to HALT is executed
µPD17225, 17226, 17227, 17228
Table 8-2. Operations After HALT Mode Release (2/2)
(b)
HALT 02H
HALT Mode Released by:
Interrupt Status
Interrupt Enable Flag
DI
Disabled
Instructions are executed from the
Enabled
instruction next to the HALT instruction.
8-Bit Timer
EI
Disabled
Enabled
8.2
Operations after HALT Mode Release
Branches to interrupt vector address
HALT Instruction Execution Conditions
The HALT instruction can be executed, only under special conditions, as shown in Table 8-3, to prevent the program
from hangup.
If the conditions in Table 8-3 are not satisfied, the HALT instruction is treated as an NOP instruction.
Table 8-3. HALT Instruction Execution Conditions
Operand Value
Execution Conditions
0010B (02H)
When all interrupt request flags (IRQTM) of 8-bit timer are reset
1000B (08H)
<1>
<2>
Other Than Above
When interrupt request flag is reset, corresponding to interrupt whose interrupt enable flag
(IPTM, IPBTM, or IP) is set
When high level is input to all P0A0-P0A3 and P0B0-P0B3 pins
Setting prohibited
Data Sheet U12643EJ2V0DS00
47
µPD17225, 17226, 17227, 17228
8.3
STOP Mode
In the STOP mode, the system clock (fX) oscillation is stopped and the program execution is stopped to minimize current
consumption.
To set the STOP mode, use the STOP instruction.
The STOP mode releasing condition can be specified by the STOP instruction operand, as shown in Table 8-4.
After the STOP mode has released, the operation is performed as follows:
<1> Resets IRQTM.
<2> Starts the basic interval timer and watchdog timer (does not reset).
<3> Resets and starts the 8-bit timer.
<4> Executes the instruction next to [STOP 8H] when the current value of the 8-bit counter coincides with
the value of the modulo register (IRQTM is set).
The µPD17225 oscillator is stopped, when the STOP instruction has been executed (i.e., in the STOP mode).
Oscillation is not resumed, until the STOP mode is released. After the STOP mode has been released, the HALT mode
is set. Set the time required to release the HALT mode by using the timer with modulo function.
The time that elapses, after the STOP mode has been released by occurrence of an interrupt, until an operation mode
is set, is shown in the following table.
8-Bit Modulo Register Set Value
(TMM)
Time Required to Set Operation Mode
after STOP Mode Release
At 4 MHz
40H
4.160 ms (64 µs × 65)
FFH
16.384 ms (64 µs × 256)
Remark Set the 8-bit modulo timer before executing STOP instruction.
Caution Do not execute an instruction that clears the interrupt request flag (IRQ×××) for which the
interrupt enable flag (IP×××) is set immediately before the STOP 8H instruction; otherwise, the
STOP mode may not be set.
Table 8-4. STOP Mode Releasing Conditions
Operand Value
Releasing Conditions
1000B (08H)
When any of P0A0-P0A3 and P0B0-P0B3 pins goes low
Other Than Above
48
Setting prohibited
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
8.4
STOP Instruction Execution Conditions
The STOP instruction can be executed, only under special conditions, as shown in Table 8-5, to prevent the program
from hang-up.
If the conditions in Table 8-5 are not satisfied, the STOP instruction is treated as an NOP instruction.
Table 8-5. STOP Instruction Execution Conditions
Operand Value
1000B (08H)
Other Than Above
8.5
Execution Conditions
High level input for all P0A0-P0A3 and P0B0-P0B 3 pins
Setting prohibited
Releasing Standby Mode
Operations for releasing the STOP and HALT modes will be as shown in Figure 8-1.
Figure 8-1. Operations After Standby Mode Release
(a)
Releasing STOP mode by interrupt
Wait
(time set by TMM)
STOP
instruction
Stanby
release signal
Clock
(b)
Operation
mode
STOP mode
Oscillation
Oscillation stops
HALT mode
Operation
mode
Oscillation
Releasing HALT mode by interrupt
HALT
instruction
Stanby
release signal
Operation
mode
Clock
Operation
mode
HALT mode
Oscillation
Remark The dotted line indicates the operation to be performed when the interrupt request, releasing the standby
mode, has been accepted.
Data Sheet U12643EJ2V0DS00
49
µPD17225, 17226, 17227, 17228
9.
RESET
9.1
Reset by Reset Signal Input
When a low-level signal more than 50 µs is input to the RESET pin, µPD17225 is reset.
When the system is reset, the oscillator circuit remains in the HALT mode and then enters an operation mode, like when
the STOP mode has been released. The wait time, after the reset signal has been removed, is 16.384 ms (fX = 4 MHz).
On power application, input the reset signal at least once because the internal circuitry operations are not stable. When
µPD17225 is reset, the following initialization takes place:
(1)
Program counter is reset to 0.
(2)
Flags in the register file are initialized to their default values (for the default values, refer to Figure 11-1
Register Files).
(3)
The default value (0320H) is written to the data buffer (DBF).
(4)
The hardware peripherals are initialized.
(5)
The system clock (fX) stops oscillation.
When the RESET pin is made high, the system clock starts oscillating, and the program execution starts from address
0 about 16 ms (at 4 MHz) later.
Figure 9-1. Reset Operation by RESET Input
Wait
(about 16 ms at 4 MHz)
Starts from address 0H
RESET
Operation mode
or standby mode
HALT mode
Operation mode
Oscillation stops
9.2
Reset by Watchdog Timer (Connect RESET and WDOUT pins)
When the watchdog timer operates during program execution, a low level is output to the WDOUT pin, and the program
counter is reset to 0.
If the watchdog timer is not reset for a fixed period of time, the program can be restarted from address 0H.
Program so that the watchdog timer is reset at intervals of within 340 ms (at fX = 4 MHz) (set the WDTRES flag).
50
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
9.3
Reset by Stack Pointer (Connect RESET and WDOUT pins)
When the value of the stack pointer reaches 6H or 7H during program execution, a low level is output to the WDOUT
pin, and the program counter is reset to 0.
If the nesting level of the interrupt or subroutine call exceeds 5 (stack over flow), or if the return instruction is executed
without correspondence between CALL and return (RET) instructions established, then regardless of a stack level of 0
(stack underflow), the program can be restarted from address 0H.
Table 9-1. Status of Each Hardware After Reset
RESET Input During
Standby Mode
Hardware
Program Counter (PC)
Port
Data Memory (RAM)
0000H
0000H
Input/output
Input
Input
Output latch
0
0
General-purpose data memory
(Except DBF, port register)
Retains previous
status
Undefined
DBF
0320H
0320H
System register (SYSREG)
0
0
WR
Retains previous
status
Undefined
Control Register
8-bit Timer
Remote Controller Carrier
Generator
RESET Input
During Operation
Refer to Figure 11-1 Register Files
Counter (TMC)
00H
00H
Modulo register (TMM)
FFH
FFH
NRZ high-level timer modulo register (NRZHTMM) Retains previous
NRZ low-level timer modulo register (NRZLTMM)
Basic Interval Timer/Watchdog Timer Counter
00H
Data Sheet U12643EJ2V0DS00
Undefined
status
00H
51
µPD17225, 17226, 17227, 17228
10. LOW-VOLTAGE DETECTOR CIRCUIT (CONNECT RESET AND WDOUT PINS)
The low-voltage detector circuit outputs a low level from the WDOUT pin for initialization (reset) to prevent
program hang-up that may take place when the batteries are replaced, if the circuit detects a low voltage.
A drop in the supply voltage is detected if the status of VDD = 1.7 to 2.0 V lasts for 1 ms or longer. Note, however,
that 1 ms is the guaranteed value and that the microcontroller may be reset even if the above low-voltage condition
lasts for less than 1 ms.
Although the voltage at which the the reset function is effected ranges from 1.7 to 2.0 V, the program counter
is prevented from hang-up even if the supply voltage drops until the reset function is effected, if the instruction
execution time is from 4 to 32 µs. Note that some oscillators stop oscillating before the reset function is effected.
The low-voltage detector circuit can be set arbitrarily by the mask option.
Caution Connect a capacitor to the RESET pin as shown below to stabilize the operation.
Microcomputer
RESET
WDOUT
Remark In this figure, the RESET pin is connected to a pull-up resistor by the mask option.
52
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
11. ASSEMBLER RESERVED WORDS
11.1
Mask Option Directives
When developing the µ PD17225 program, mask options must be specified by using mask option directives in the
program.
The RESET pin for µ PD17225 requires a mask option to be specified.
11.1.1
OPTION and ENDOP directives
That portion of the program enclosed by the OPTION and ENDOP directives is called a mask option definition block.
This block is described in the following format:
Description format:
11.1.2
Symbol
Mnemonic
[Label: ]
OPTION
:
:
:
ENDOP
Operand
Comment
[;Comment]
Mask option definition directives
Table 11-1 lists the directives that can be used in the mask option definition block.
Here is an example of mask option definition:
Description example:
Symbol
Mnemonic
Operand
Comment
OPTION
OPTRES
PULLUP
; RESET pin has pull-up resistors.
OPTPOC
USEPOC
; Internal low-voltage detector circuit
ENDOP
Data Sheet U12643EJ2V0DS00
53
µPD17225, 17226, 17227, 17228
Table 11-1. Mask Option Definition Directives
Name
Directive
Operands
RESET
OPTRES
1
1st Operand
2nd Operand
3rd Operand
4th Operand
Mask option of
RESET
PULLUP
(w/pull-up resistor)
OPEN
(w/o pull-up resistor)
POC
OPTPOC
1
USEPOC
(low-voltage detector
circuit provided)
NOUSEPOC
(low-voltage detector
circuit not provided)
11.2
Reserved Symbols
The symbols defined by the µ PD17225 device file are listed in Table 11-2.
The defined symbols are the following register file names, port names, and peripheral hardware names.
11.2.1
Register file
The names of the symbols assigned to the register file are defined. These registers are accessed by the PEEK
and POKE instructions through the window register (WR). Figure 11-1 shows the register file.
11.2.2
Registers and ports on data memory
The names of the registers assigned at addresses 00H through 7FH on the data memory and the names of ports
assigned to address 70H and those that follow, and system register names are defined. Figure 11-2 shows the data
memory configuration.
11.2.3
Peripheral hardware
The names of peripheral hardware accessed by the GET and PUT instructions are defined. Table 11-3 shows
the peripheral hardware.
54
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
Table 11-2. Reserved Symbols (1/2)
Symbol Name
Attribute
Value
R/W
DBF3
MEM
0.0CH
R/W
Bits 15-12 of data buffer
DBF2
MEM
0.0DH
R/W
Bits 11-8 of data buffer
DBF1
MEM
0.0EH
R/W
Bits 7-4 of data buffer
DBF0
MEM
0.0FH
R/W
Bits 3-0 of data buffer
AR3
MEM
0.74H
Note
Bits 15-12 of address register
AR2
MEM
0.75H
R/W
Bits 11-8 of address register
AR1
MEM
0.76H
R/W
Bits 7-4 of address register
AR0
MEM
0.77H
R/W
Bits 3-0 of address register
WR
MEM
0.78H
R/W
Window register
BANK
MEM
0.79H
Note
Bank register
IXH
MEM
0.7AH
Note
Index register, high
MPH
MEM
0.7AH
Note
Data memory row address pointer, high
MPE
FLG
0.7AH.3
R/W
Memory pointer enable flag
IXM
MEM
0.7BH
R/W
Index register, middle
MPL
MEM
0.7BH
R/W
Data memory row address pointer, low
IXL
MEM
0.7CH
R/W
Index register, low
RPH
MEM
0.7DH
Note
General register pointer, high
RPL
MEM
0.7EH
R/W
General register pointer, low
PSW
MEM
0.7FH
R/W
Program status word
BCD
FLG
0.7EH.0
R/W
BCD flag
CMP
FLG
0.7FH.3
R/W
Compare flag
CY
FLG
0.7FH.2
R/W
Carry flag
Z
FLG
0.7FH.1
R/W
Zero flag
IXE
FLG
0.7FH.0
R/W
Index enable flag
P0A0
FLG
0.70H.0
R/W
Bit 0 of port 0A
P0A1
FLG
0.70H.1
R/W
Bit 1 of port 0A
P0A2
FLG
0.70H.2
R/W
Bit 2 of port 0A
P0A3
FLG
0.70H.3
R/W
Bit 3 of port 0A
P0B0
FLG
0.71H.0
R/W
Bit 0 of port 0B
P0B1
FLG
0.71H.1
R/W
Bit 1 of port 0B
P0B2
FLG
0.71H.2
R/W
Bit 2 of port 0B
P0B3
FLG
0.71H.3
R/W
Bit 3 of port 0B
P0C0
FLG
0.72H.0
R/W
Bit 0 of port 0C
P0C1
FLG
0.72H.1
R/W
Bit 1 of port 0C
P0C2
FLG
0.72H.2
R/W
Bit 2 of port 0C
P0C3
FLG
0.72H.3
R/W
Bit 3 of port 0C
P0D0
FLG
0.73H.0
R/W
Bit 0 of port 0D
P0D1
FLG
0.73H.1
R/W
Bit 1 of port 0D
P0D2
FLG
0.73H.2
R/W
Bit 2 of port 0D
P0D3
FLG
0.73H.3
R/W
Bit 3 of port 0D
Note
R: µPD17225, 17226
Description
R/W: µPD17227, 17228
Data Sheet U12643EJ2V0DS00
55
µPD17225, 17226, 17227, 17228
Table 11-2. Reserved Symbols (2/2)
Symbol Name
Attribute
Value
R/W
Description
P0E0
FLG
0.6FH.0
R/W
Bit 0 of port 0E
P0E1
FLG
0.6FH.1
R/W
Bit 1 of port 0E
P0E2
FLG
0.6FH.2
R/W
Bit 2 of port 0E
P0E3
FLG
0.6FH.3
R/W
Bit 3 of port 0E
SP
MEM
0.81H
R/W
Stack pointer
SYSCK
FLG
0.82H.0
R/W
System clock select flag
WDTRES
FLG
0.83H.3
R/W
Watchdog timer reset flag
BTMCK
FLG
0.83H.2
R/W
Basic interval timer mode select flag
BTMRES
FLG
0.83H.1
R/W
Basic interval timer mode reset flag
INT
FLG
0.8FH.0
R
NRZBF
FLG
0.91H.0
R/W
NRZ buffer data flag
NRZ
FLG
0.92H.0
R/W
NRZ data flag
P0EBPU0
FLG
0.97H.0
R/W
P0E0 pull-up setting flag
P0EBPU1
FLG
0.97H.1
R/W
P0E1 pull-up setting flag
P0EBPU2
FLG
0.97H.2
R/W
P0E2 pull-up setting flag
P0EBPU3
FLG
0.97H.3
R/W
P0E3 pull-up setting flag
IEG
FLG
0.9FH.0
R/W
INT pin interrupt edge flag
P0EBIO0
FLG
0.0A7H.0
R/W
P0E0 I/O setting flag
P0EBIO1
FLG
0.0A7H.1
R/W
P0E1 I/O setting flag
P0EBIO2
FLG
0.0A7H.2
R/W
P0E2 I/O setting flag
P0EBIO3
FLG
0.0A7H.3
R/W
P0E3 I/O setting flag
IPBTM
FLG
0.0AFH.2
R/W
Basic interval timer interrupt enable flag
IP
FLG
0.0AFH.1
R/W
INT pin interrupt enable flag
IPTM
FLG
0.0AFH.0
R/W
Timer interrupt enable flag
TMEN
FLG
0.0B3H.3
R/W
Timer enable flag
TMRES
FLG
0.0B3H.2
R/W
Timer reset flag
TMCK1
FLG
0.0B3H.1
R/W
Timer clock flag
TMCK0
FLG
0.0B3H.0
R/W
Timer clock flag
IRQBTM
FLG
0.0BDH.0
R/W
Basic interval timer interrupt request flag
IRQ
FLG
0.0BEH.0
R/W
INT pin interrupt request flag
IRQTM
FLG
0.0BFH.0
R/W
Timer interrupt request flag
TMC
DAT
05H
R
Timer count register
TMM
DAT
06H
W
Timer modulo register
NRZLTMM
DAT
03H
R/W
NRZ low-level timer modulo register
NRZHTMM
DAT
04H
R/W
NRZ high-level timer modulo register
AR
DAT
40H
R/W
Address register
DBF
DAT
0FH
—
Fixed operand value for PUT, GET, MOVT instruction
IX
DAT
01H
—
Fixed operand value for INC instruction
56
INT pin status flag
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
[MEMO]
Data Sheet U12643EJ2V0DS00
57
µPD17225, 17226, 17227, 17228
Figure 11-1. Register Files (1/2)
1
0
0
0 WDTRES 0
Bit 2
1
0
0 BTMCK 0
Bit 1
0
0
0 BTMRES 0
Bit 0
1 SYSCK 0
SP
0
6
Note
0
Bit 3
0
0
0
0
P0EBPU3 0
Bit 2
0
0
0
0
P0EBPU2 0
Bit 1
0
0
0
0
P0EBPU1 0
NRZ
0
P0EBPU0 0
NRZBF 0
Bit 3
P0EBIO3 0
Bit 2
P0EBIO2 0
Bit 1
P0EBIO1 0
P0EBIO0 0
Bit 0
3
Note
7
Note
5
Note
4
Bit 3
Bit 0
2
3
Note
Note
Row
Address
0
2
Note
1
Note
0
Note
Column
Address
Bit 3
TMEN 1
Bit 2
TMRES 0
Bit 1
TMCK1 0
Bit 0
TMCK0 0
On reset
Figure 11-2. Data Memory Configuration
0
1
2
3
4
5
6
Column address
7
8
9
A
B
0
C
D
E
F
DBF3DBF2DBF1DBF0
DBF
Row address
1
2
3
4
5
6
P0E0-P0E3
7
AR3 AR2 AR1 AR0 WR BANK IXH IXM IXL RPH RPL PSW
System register
P0D0-P0D3
P0C0-P0C3
P0B0-P0B3
P0A0-P0A3
58
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
Figure 11-1. Register Files (2/2)
1
E
F
Note
Bit 3
0
0
Bit 2
0
0
Bit 1
0
0
Bit 0
INT
P
Bit 3
0
0
Bit 2
0
0
Bit 1
0
0
Bit 0
IEG
0
Bit 3
0
0
IPBTM 0
Bit 2
2
Bit 1
0
IPTM
0
0
0
0
0
0
0
Bit 2
0
0
0
0
0
0
0
0
0
0
0
0
Bit 1
IRQBTM 0
Bit 0
Note
IP
Bit 3
Bit 0
3
Note
D
Note
C
Note
B
Note
A
Note
Row
Address
0
9
Note
8
Note
Column
Address
IRQ
0 IRQTM 1
On reset
P: When INT pin is high level, 1 or when INT pin is low level, 0.
Table 11-3. Peripheral Hardware
Name
Address
Valid Bit
Description
TMC
05H
8
Timer count register
TMM
06H
8
Timer modulo register
NRZLTMM
03H
8
Low-level timer modulo register for NRZ
NRZHTMM
04H
8
High-level timer modulo register for NRZ
AR
40H
16
Address register
Data Sheet U12643EJ2V0DS00
59
µPD17225, 17226, 17227, 17228
12. INSTRUCTION SET
12.1
Instruction Set Outline
b15
b14-b11
1
BIN.
HEX.
0000
0
ADD
r, m
ADD
m, #n4
0001
1
SUB
r, m
SUB
m, #n4
0010
2
ADDC
r, m
ADDC
m, #n4
0011
3
SUBC
r, m
SUBC
m, #n4
0100
4
AND
r, m
AND
m, #n4
0101
5
XOR
r, m
XOR
m, #n4
0110
6
OR
r, m
OR
m, #n4
INC
INC
MOVT
BR
CALL
AR
IX
DBF, @AR
@AR
@AR
0111
60
0
7
RET
RETSK
EI
DI
RETI
PUSH
POP
GET
PUT
PEEK
POKE
RORC
STOP
HALT
NOP
AR
AR
DBF, p
p, DBF
WR, rf
rf, WR
r
s
h
1000
8
LD
r, m
ST
m, r
1001
9
SKE
m, #n4
SKGE
m, #n4
1010
A
MOV
@r, m
MOV
m, @r
1011
B
SKNE
m, #n4
SKLT
m, #n4
1100
C
BR
addr (Page 0)
CALL
addr
1101
D
BR
addr (Page 1)
MOV
m, #n4
1110
E
BR
addr (Page 2)
SKT
m, #n
1111
F
BR
addr (Page 3)
SKF
m, #n
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
12.2
Legend
AR
: Address register
ASR
: Address stack register specified by stack pointer
addr
: Program memory address (low-order 11 bits)
BANK
: Bank register
CMP
: Compare register
CY
: Carry flag
DBF
: Data buffer
h
: Halt releasing condition
INTEF
: Interrupt enable flag
INTR
: Register automatically saved to stack in case of interrupt
INTSK
: Interrupt stack register
IX
: Index register
MP
: Data memory row address pointer
MPE
m
: Memory pointer enable flag
: Data memory address specified by mR, mC
mR
: Data memory row address (high)
mC
: Data memory column address (low)
n
: Bit position (4 bits)
n4
: Immediate data (4 bits)
PAGE
: Page (bit 11 and 12 of program counter)
PC
: Program counter
p
: Peripheral address
pH
: Peripheral address (high-order 3 bits)
pL
: Peripheral address (low-order 4 bits)
r
: General register column address
rf
: Register file address
rfR
: Register file row address (high-order 3 bits)
rfC
: Register file column address (low-order 4 bits)
SP
: Stack pointer
s
: Stop releasing condition
WR
: Window register
(×)
: Contents addressed by ×
Data Sheet U12643EJ2V0DS00
61
µPD17225, 17226, 17227, 17228
12.3
List of Instruction Sets
Group
Mnemonic
Operand
Instruction Code
Operation
OP Code
ADD
Addition
ADDC
INC
SUB
Subtraction
SUBC
r, m
(r) ← (r) + (m)
00000
mR
mC
r
m, #n4
(m) ← (m) + n4
10000
mR
mC
n4
r, m
(r) ← (r) + (m) + CY
00010
mR
mC
r
m, #n4
(m) ← (m) + n4 + CY
10010
mR
mC
n4
AR
AR ← AR + 1
00111
000
1001
0000
IX
IX ← IX + 1
00111
000
1000
0000
r, m
(r) ← (r) – (m)
00001
mR
mC
r
m, #n4
(m) ← (m) – n4
10001
mR
mC
n4
r, m
(r) ← (r) – (m) – CY
00011
mR
mC
r
m, #n4
(m) ← (m) – n4 – CY
10011
mR
mC
n4
r, m
(r) ← (r)
00110
mR
mC
r
10110
mR
mC
n4
00100
mR
mC
r
10100
mR
mC
n4
m, #n4
∨ (m)
(m) ← (m) ∨ n4
(r) ← (r) ∧ (m)
(m) ← (m) ∧ n4
r, m
(r) ← (r) ∀ (m)
00101
mR
mC
r
m, #n4
(m) ← (m) ∀ n4
10101
mR
mC
n4
SKT
m, #n
CMP ← 0, if (m)
11110
mR
mC
n
SKF
m, #n
∧ n = n, then skip
CMP ← 0, if (m) ∧ n = 0, then skip
11111
mR
mC
n
SKE
m, #n4
(m) – n4, skip if zero
01001
mR
mC
n4
SKNE
m, #n4
(m) – n4, skip if not zero
01011
mR
mC
n4
SKGE
m, #n4
(m) – n4, skip if not borrow
11001
mR
mC
n4
SKLT
m, #n4
(m) – n4, skip if borrow
11011
mR
mC
n4
RORC
r
00111
000
0111
r
LD
r, m
(r) ← (m)
01000
mR
mC
r
ST
m, r
(m) ← (r)
11000
mR
mC
r
@r, m
if MPE = 1 : (MP, (r)) ← (m)
if MPE = 0 : (BANK, mR, (r)) ← (m)
01010
mR
mC
r
m, @r
if MPE = 1 : (m) ← (MP, (r))
if MPE = 0 : (m) ← (BANK, mR, (r))
11010
mR
mC
r
m, #n4
(m) ← n4
11101
mR
mC
n4
DBF,
@AR
SP ← SP – 1, ASR ← PC, PC ← AR
DBF ← (PC), PC ← ASR, SP ← SP + 1
00111
000
0001
0000
OR
m, #n4
Logical
AND
XOR
Judge
Compare
Rotate
Transfer
MOV
MOVT
62
Operand
r, m
CY → (r)b3 → (r)b2 → (r)b1 → (r)b0
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
Group
Mnemonic
Operand
Instruction Code
Operation
OP Code
Transfer
Branch
PUSH
AR
SP ← SP – 1, ASR ← AR
00111
000
1101
0000
POP
AR
AR ← ASR, SP ← SP + 1
00111
000
1100
0000
PEEK
WR, rf
WR ← (rf)
00111
rfR
0011
rfC
POKE
rf, WR
(rf) ← WR
00111
rfR
0010
rfC
GET
DBF, p
(DBF) ← (p)
00111
pH
1011
pL
PUT
p, DBF
(p) ← (DBF)
00111
pH
1010
pL
addr
Note
01100
@AR
PC ← AR
00111
addr
SP ← SP – 1, ASR ← PC,
PC10–0 ← addr, PAGE ← 0
11100
@AR
SP ← SP – 1, ASR ← PC,
PC ← AR
00111
000
0101
0000
RET
PC ← ASR, SP ← SP + 1
00111
000
1110
0000
RETSK
PC ← ASR, SP ← SP + 1 and skip
00111
001
1110
0000
RETI
PC ← ASR, INTR ← INTSK, SP ← SP + 1
00111
100
1110
0000
EI
INTEF ← 1
00111
000
1111
0000
DI
INTEF ← 0
00111
001
1111
0000
BR
CALL
Subroutine
Interrupt
Other
addr
000
0100
0000
addr
STOP
s
STOP
00111
010
1111
s
HALT
h
HALT
00111
011
1111
h
No operation
00111
100
1111
0000
NOP
Note
Operand
The operation and OP code of “BR addr” of the µPD17225, 17226, 17227, and 17228 are as follows,
respectively.
(a) µPD17225
Operand
addr
Operation
PC10-0 ← addr
OP Code
01100
(b) µPD17226
Operand
addr
Operation
OP Code
PC10-0 ← addr, PAGE ← 0
01100
PC10-0 ← addr, PAGE ← 1
01101
(c) µPD17227
Operand
addr
Operation
OP Code
PC10-0 ← addr, PAGE ← 0
01100
PC10-0 ← addr, PAGE ← 1
01101
PC10-0 ← addr, PAGE ← 2
01110
Data Sheet U12643EJ2V0DS00
63
µPD17225, 17226, 17227, 17228
(d) µPD17228
Operand
addr
12.4
Operation
OP Code
PC10-0 ← addr, PAGE ← 0
01100
PC10-0 ← addr, PAGE ← 1
01101
PC10-0 ← addr, PAGE ← 2
01110
PC10-0 ← addr, PAGE ← 3
01111
Assembler (RA17K) Built-In Macro Instruction
Legend
flag n : FLG type symbol
n
: Bit number
<
> : Contents in <
> can be omitted
Mnemonic
Operand
n
Built-in
SKTn
flag 1, ...flag n
if (flag 1) to (flag n) = all “1”, then skip
1≤n≤4
macro
SKFn
flag 1, ...flag n
if (flag 1) to (flag n) = all “0”, then skip
1≤n≤4
SETn
flag 1, ...flag n
(flag 1) to (flag n) ← 1
1≤n≤4
CLRn
flag 1, ...flag n
(flag 1) to (flag n) ← 0
1≤n≤4
NOTn
flag 1, ...flag n
if (flag n) = “0”, then (flag n) ← 1
if (flag n) = “1”, then (flag n) ← 0
1≤n≤4
INITFLG
<NOT> flag 1,
if description = NOT flag n, then (flag n) ← 0
···<<NOT> flag n>
if description = flag n, then (flag n) ← 1
BANKn
1≤n≤4
(BANK) ← n
n = 0Note
Expantion
BRX
Label
Jump Label
—
instruction
CALLX
function-name
CALL sub-routine
—
INITFLGX
<NOT/INV> flag 1,
...<NOT/INV> flag n
if description = NOT (or INV)
flag, (flag) ← 0
if description = flag, (flag) ← 1
Note
64
Operation
µPD17227, 17228: n = 0, 1
Data Sheet U12643EJ2V0DS00
n≤4
µPD17225, 17226, 17227, 17228
13. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25°C)
Item
Symbol
Supply Voltage
Input Voltage
Output Voltage
High-Level Output Current
Note
Ratings
Unit
VDD
–0.3 to +3.8
V
VI
–0.3 to VDD + 0.3
V
VO
–0.3 to VDD + 0.3
V
Peak value
–36.0
mA
rms value
–24.0
mA
Peak value
–7.5
mA
rms value
–5.0
mA
Peak value
–22.5
mA
rms value
–15.0
mA
Peak value
7.5
mA
rms value
5.0
mA
Total of P0C, P0D,
Peak value
22.5
mA
WDOUT pins
rms value
15.0
mA
Total of P0E pins
Peak value
30.0
mA
rms value
20.0
mA
IOH
Conditions
REM pin
1 pin (P0E pin)
Total of P0E pins
Low-Level Output Current
Note
IOL
1 pin (P0C, P0D, P0E,
REM or WDOUT pin)
Operating Temperature
TA
–40 to +85
°C
Storage Temperature
Tstg
–65 to +150
°C
Power Dissipation
Pd
180
mW
Note
TA = 85 °C
Calculate rms value by this expression: [rms value] = [Peak value] × √ Duty
Caution Even if one of the parameters exceeds its absolute maximum rating even momentarily, the quality
of the product may be degraded. The absolute maximum rating therefore specifies the upper or
lower limit of the value at which the product can be used without physical damages. Be sure not
to exceed or fall below this value when using the product.
Data Sheet U12643EJ2V0DS00
65
µPD17225, 17226, 17227, 17228
Recommended Operating Ranges (TA = –40 to +85°C, VDD = 2.0 to 3.6 V)
Item
Symbol
Supply Voltage
Conditions
VDD1
fX = 1 MHz
High-speed mode
(Instruction execution time: 16 µs)
VDD2
fX = 4 MHz
Ordinary mode
(Instruction execution time: 4 µs)
VDD3
fX = 8 MHz
High-speed mode
(Instruction execution time: 4 µs)
VDD4
Oscillation Frequency
Operating Temperature
Low-Voltage Detector Circuit
(Mask Option)
Note
Note
MIN.
High-speed mode
(Instruction execution time: 2 µs)
TYP.
MAX.
Unit
2.0
3.6
V
2.2
3.6
V
fX
1.0
4.0
8.0
MHz
TA
–40
+25
+85
°C
TCY
4
32
µs
Reset if the status of VDD = 1.7 to 2.0 V lasts for 1 ms or longer. Program hang-up does not occur even
if the voltage drops, until the reset function is effected (when the RESET pin and WDOUT pin are
connected). Some oscillators stop oscillating before the reset function is effected.
fX vs VDD
(MHZ)
10
9
8
7
6
System clock: fX (MHz)
(Ordinary mode)
5
4
3
Operation
guaranteed area
2
1
0.4
0
2 2.2
3
3.6
4
Supply voltage: VDD (V)
Remark The region indicated by the broken line in the above figure is the guaranteed operating range in the highspeed mode.
66
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
System Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 2.0 to 3.6 V)
Resonator
Ceramic
resonator
Recommended
Constants
X IN
X OUT
Item
Conditions
Oscillation frequency
Note 1
(fX)
Oscillation
stabilization timeNote 2
MIN.
TYP.
MAX.
Unit
1.0
4.0
8.0
MHz
4
ms
After VDD reached MIN.
in oscillation voltage
range
Notes 1. The oscillation frequency only indicates the oscillator characteristics.
2. The oscillation stabilization time is necessary for oscillation to be stabilized, after VDD application or
STOP mode release.
Caution To use a system clock oscillator circuit, perform the wiring in the area enclosed by the dotted
line in the above figure as follows, to avoid adverse wiring capacitance influences:
• Keep wiring length as short as possible.
• Do not cross a signal line with some other signal lines. Do not route the wiring in the vicinity
of lines through which a large current flows.
• Always keep the oscillator circuit capacitor ground at the same potential as GND. Do not
ground the capacitor to a ground pattern, through which a large current flows.
• Do not extract signals from the oscillator circuit.
External circuit example
XIN
XOUT
R1
C1
C2
Data Sheet U12643EJ2V0DS00
67
µPD17225, 17226, 17227, 17228
Main System Clock: Ceramic Resonator (TA = –40 to +85 °C)
Manufacturer
Part Number
Recommended
Circuit Constants
Oscillation Voltage
Range
Remark
C1 (pF)
C2 (pF)
MIN. (V)
MAX. (V)
CSA2.00MG
30
30
2.0
3.6
CSA3.00MG
30
30
2.0
3.6
CSA4.00MG
30
30
2.0
3.6
CSA6.00MG
30
30
2.0
3.6
CSA8.00MTZ
30
30
2.2
3.6
CCR1000K2
100
100
2.0
3.6
CCR4.0MC3
—
—
2.0
3.6
Built-in capacitor
CCR6.0MC3
—
—
2.0
3.6
Built-in capacitor
CCR8.0MC5
—
—
2.0
3.6
Built-in capacitor
FCR4.0MC5
—
—
2.0
3.6
Built-in capacitor
FCR6.0MC5
—
—
2.0
3.6
Built-in capacitor
Matsushita Electronic
EF0EC2004A4
—
—
2.0
3.6
Built-in capacitor
Components Co., Ltd.
EF0EC3004A4
—
—
2.0
3.6
Built-in capacitor
EF0EC4004A4
—
—
2.0
3.6
Built-in capacitor
EF0EC6004A4
—
—
2.0
3.6
Built-in capacitor
EF0EC8004A4
—
—
2.0
3.6
Built-in capacitor
CRHF2.50
30
30
2.2
3.6
CRHF4.00
30
30
2.2
3.6
CRHF6.00
30
30
2.2
3.6
Murata Mfg. Co., Ltd.
TDK Corp.
Toko Ceramic Co., Ltd.
Caution The oscillation circuit constants and oscillation voltage range indicate conditions for stable
oscillation but do not guarantee accuracy of the oscillation frequency. If the application circuit
requires accuracy of the oscillation frequency, it is necessary to set the oscillation frequency of the
resonator in the application circuit. For this, it is necessary to directly contact the manufacturer
of the resonator being used.
68
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
DC Characteristics (TA = –40 to +85°C, VDD = 2.0 to 3.6 V)
Item
High-Level Input Voltage
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
VIH1
P0A, P0B
0.7VDD
VDD
V
VIH2
P0E, RESET, INT
0.8VDD
VDD
V
VIL1
P0A, P0B
0
0.3VDD
V
VIL2
P0E
0
0.35VDD
V
VIL3
RESET, INT pin
0
0.2VDD
V
High-Level Input Leakage
Current
ILIH
P0A, P0B, P0E,
RESET, INT
VI = VDD
3
µA
Low-Level Input Leakage
ILIL1
INT
VI = 0 V
–3
µA
Current
ILIL2
P0E, RESET
VI = 0 V w/o pull-up resistor
–3
µA
High-Level Output Leakage
Current
ILOH
P0C, P0D, P0E,
WDOUT
VO = VDD
3
µA
Low-Level Output Leakage
Current
ILOL
P0E, WDOUT
VO = 0 V w/o pull-up resistor
–3
µA
Internal Pull-Up Resistor
RU1
P0E, RESET
25
50
100
kΩ
RU2
P0A, P0B
100
200
400
kΩ
High-Level Output Current
IOH1
REM
VOH = 1.0 V, VDD = 3 V
–6
–13
–24
mA
High-Level Output Voltage
VOH
P0E, REM
IOH = –0.5 mA
VDD
V
Low-Level Output Voltage
VOL1
P0C, P0D, REM,
WDOUT
IOL = 0.5 mA
0.3
V
VOL2
P0E
IOL = 1.5 mA
0.3
V
VDT
WDOUT = low
level
VDT = VDD
2.0
V
Low-Level Input Voltage
Low-Voltage Detector Circuit
(Mask Option)
Data Retention Voltage
Supply Current
VDDDR
IDD1
Operating mode
VDD = 3 V ± 10 %
Operating mode
VDD = 3 V ± 10 %
(low-speed)
IDD3
IDD4
1.7
RESET = low level or STOP mode
(high-speed)
IDD2
VDD–0.3
HALT mode
STOP mode
VDD = 3 V ± 10 %
1.3
Data Sheet U12643EJ2V0DS00
V
fX = 1 MHz
0.6
1.2
mA
fX = 4 MHz
0.75
1.3
mA
fX = 8 MHz
0.9
1.8
mA
fX = 1 MHz
0.475
0.95
mA
fX = 4 MHz
0.6
1.1
mA
fX = 8 MHz
0.8
1.6
mA
fX = 1 MHz
0.4
0.8
mA
fX = 4 MHz
0.45
0.85
mA
fX = 8 MHz
0.5
1.0
mA
2.0
20.0
µA
2.0
5.0
µA
VDD = 3 V ± 10 %
built-in POC
1.85
TA = 25 °C
69
µPD17225, 17226, 17227, 17228
AC Characteristics (TA = –40 to +85°C, VDD = 2.0 to 3.6 V)
Item
Symbol
Note
CPU Clock Cycle Time
(Instruction Execution Time)
INT High/Low Level Width
RESET Low Level Width
Note
Conditions
MIN.
tCY1
tCY2
VDD = 2.2 to 3.6 V
TYP.
MAX.
Unit
3.8
33
µs
1.9
33
µs
tINTH, tINTL
20
µs
tRSL
10
µs
tCY vs VDD
The CPU clock cycle time (instruction execution time)
40
is determined by the oscillation frequency of the resonator connected and SYSCK (RF: address 02H) of the
33
register file.
tCY vs. supply voltage VDD characteristics (refer to 4.
CLOCK GENERATOR CIRCUIT).
CPU clock cycle time tcY (µ s)
The figure on the right shows the CPU clock cycle time
10
9
8
7
6
Operation
guaranteed
area
5
4
3.8
3
2
1.9
2.2
1
0
1
2
3.6
3
Supply voltage VDD (V)
70
Data Sheet U12643EJ2V0DS00
4
µPD17225, 17226, 17227, 17228
14. APPLICATION CIRCUIT EXAMPLE
P0D 2
P0D 3
INT
P0E 0
P0E 1
P0E 3
REM
3V
V DD
X OUT
4 MHz
X IN
GND
RESET
WDOUT
28
2
27
3
26
4
25
5
24
6
7
8
9
10
µ PD17225CT/GT- ×××
µ PD17226CT/GT- ×××
µ PD17227CT/GT- ×××
µ PD17228CT/GT- ×××
P0E 2
1
23
22
21
20
19
11
18
12
17
13
16
14
15
P0D 1
P0D 0
P0C 3
P0C 2
P0C 1
P0C 0
P0B 3
P0B 2
P0B 1
P0B 0
P0A 3
P0A 2
P0A 1
P0A 0
Remark The RESET pin can be connected to a pull-up resistor by the mask option.
Data Sheet U12643EJ2V0DS00
71
µPD17225, 17226, 17227, 17228
15. PACKAGE DRAWINGS
28 PIN PLASTIC SHRINK DIP (400 mil)
28
15
1
14
A
I
K
H
G
J
L
F
D
N
C
M
B
M
R
NOTES
1) Each lead centerline is located within 0.17 mm (0.007 inch)
of its true position (T.P.) at maximum material condition.
2) Item "K" to center of leads when formed parallel.
ITEM
MILLIMETERS
INCHES
A
28.46 MAX.
1.121 MAX.
B
2.67 MAX.
0.106 MAX.
C
1.778 (T.P.)
0.070 (T.P.)
D
0.50±0.10
0.020 +0.004
–0.005
F
0.85 MIN.
0.033 MIN.
G
3.2±0.3
0.126±0.012
H
0.51 MIN.
0.020 MIN.
I
4.31 MAX.
0.170 MAX.
J
5.08 MAX.
0.200 MAX.
K
L
10.16 (T.P.)
8.6
0.400 (T.P.)
0.339
M
0.25 +0.10
–0.05
0.010 +0.004
–0.003
N
0.17
0.007
R
0~15°
0~15°
S28C-70-400B-1
72
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
28-PIN PLASTIC SOP (375 mil)
28
15
detail of lead end
P
1
14
A
H
F
I
G
J
S
C
D
M
B
L
N
M
S
K
E
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
ITEM
MILLIMETERS
A
17.9±0.17
B
0.78 MAX.
C
1.27 (T.P.)
D
0.42 +0.08
−0.07
E
0.1±0.1
F
2.6±0.2
G
H
2.50
10.3±0.3
I
7.2±0.2
J
1.6±0.2
K
0.17 +0.08
−0.07
L
0.8±0.2
M
0.12
N
0.15
P
+7°
3° −3°
P28GM-50-375B-4
Data Sheet U12643EJ2V0DS00
73
µPD17225, 17226, 17227, 17228
30 PIN PLASTIC SSOP (300 mil)
30
16
detail of lead end
F
G
T
P
1
L
15
U
E
A
H
I
J
S
C
D
N
M
S
B
K
M
NOTE
ITEM
Each lead centerline is located within 0.10 mm of
its true position (T.P.) at maximum material condition.
9.85±0.15
B
0.45 MAX.
C
0.65 (T.P.)
D
0.24 +0.08
−0.07
E
0.1±0.05
F
1.3±0.1
G
1.2
H
8.1±0.2
I
6.1±0.2
J
1.0±0.2
K
0.17±0.03
L
0.5
M
0.13
N
0.10
P
3° +5°
−3°
T
0.25
U
74
Data Sheet U12643EJ2V0DS00
MILLIMETERS
A
0.6±0.15
S30MC-65-5A4-1
µPD17225, 17226, 17227, 17228
16. RECOMMENDED SOLDERING CONDITIONS
For the µPD17225 soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document "Semiconductor
Device Mounting Technology Manual" (C10535E).
For other soldering methods, please consult with NEC personnel.
Table 16-1. Soldering Conditions of Surface Mount Type
(1) µPD17225GT-×××:
µPD17226GT-×××:
µPD17227GT-×××:
µPD17228GT-×××:
28-pin
28-pin
28-pin
28-pin
plastic
plastic
plastic
plastic
SOP
SOP
SOP
SOP
Soldering Method
(375
(375
(375
(375
mil)
mil)
mil)
mil)
Soldering Conditions
Symbol
Infrated Reflow
Package peak temperature: 235 °C, Time: 30 seconds max. (210 °C min.),
Number of times: 2 max.
IR35-00-2
VPS
Package peak temperature: 215 °C, Time: 40 seconds max. (200 °C min.),
Number of times: 2 max.
VP15-00-2
Wave Soldering
Solder bath temperature: 260 °C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120 °C max. (package surface temperature)
WS66-00-1
Partial Heating
Pin temperature: 300 °C max., Time: 3 seconds max. (per side of device)
—
Caution Do not use two or more soldering methods in combination (except the partial heating method).
(2) µPD17225MC-×××-5A4:
µPD17226MC-×××-5A4:
µPD17227MC-×××-5A4:
µPD17228MC-×××-5A4:
30-pin
30-pin
30-pin
30-pin
plastic
plastic
plastic
plastic
Soldering Method
shrink
shrink
shrink
shrink
SOP
SOP
SOP
SOP
(300
(300
(300
(300
mil)
mil)
mil)
mil)
Soldering Conditions
Symbol
Infrated Reflow
Package peak temperature: 235 °C, Time: 30 seconds max. (210 °C min.),
Number of times: 3 max.
IR35-00-3
VPS
Package peak temperature: 215 °C, Time: 40 seconds max. (200 °C min.),
Number of times: 3 max.
VP15-00-3
Wave Soldering
Solder bath temperature: 260 °C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120 °C max. (package surface temperature)
WS66-00-1
Partial Heating
Pin temperature: 300 °C max., Time: 3 seconds max. (per side of device)
—
Caution Do not use two or more soldering methods in combination (except the partial heating method).
Table 16-2. Soldering Conditions of Through-Hole Type
µPD17225CT-×××:
µPD17226CT-×××:
µPD17227CT-×××:
µPD17228CT-×××:
28-pin
28-pin
28-pin
28-pin
plastic
plastic
plastic
plastic
shrink
shrink
shrink
shrink
Soldering Method
DIP
DIP
DIP
DIP
(400
(400
(400
(400
mil)
mil)
mil)
mil)
Soldering Conditions
Wave Soldering
(Only for pins)
Solder bath temperature: 260 °C max., Time: 10 seconds max.
Partial Heating
Pin temperature: 300 °C max., Time: 3 seconds max. (per pin)
Caution The wave solding must be performed at the lead part only. Note that the solder must not be directly
contacted to the package body.
Data Sheet U12643EJ2V0DS00
75
µPD17225, 17226, 17227, 17228
APPENDIX A. DIFFERENCES AMONG µPD17225, 17226, 17227, 17228 AND µPD17P218
µPD17P218 is equipped with PROM to which data can be written by the user instead of the internal mask ROM
(program memory) of the µPD17228.
Table A-1 shows the differences between the µPD17225, 17226, 17227, 17228 and µPD17P218.
The differences among these five models are the program memory and mask option, and their CPU functions and
internal hardware are identical. Therefore, the µPD17P218 can be used to evaluate the program developed for the
µPD17225, 17226, 17227, and 17228 system. Note, however, that some of the electrical specifications such
as supply current and low-voltage detection voltage of the µPD17P218 are different from those of the
µPD17225, 17226, 17227, and 17228.
Table A-1. Differences among µPD17225, 17226, 17227, 17228 and µPD17P218
Product Name
µPD17P218
µPD17225
µPD17226
µPD17227
µPD17228
Item
Program Memory
One-time PROM
Pull-Up Resistor of RESET Pin
Low-Voltage Detector Circuit
16 K bytes
4 K bytes
8 K bytes
12 K bytes
16 K bytes
(8192 × 16)
(2048 × 16)
(4096 × 16)
(6144 × 16)
(8192 × 16)
(0000H-1FFFH)
(0000H-07FFH)
(0000H-0FFFH)
(0000H-17FFH)
(0000H-1FFFH)
223 × 4 bits
Data Memory
Note
VPP Pin, Operation Mode Select Pin
Mask ROM
111 × 4 bits
Provided
Any (mask option)
Provided
Any (mask option)
Provided
Not provided
Handling of WDOUT Pin When Not Used Connect to GND
Instruction Execution Time (TCY)
223 × 4 bits
Connect to VDD via resistor
2 µs
2 µs (VDD = 2.2 to 3.6 V)
(VDD = 3.5 to 5.5 V)
4 µs (VDD = 2.0 to 3.6 V)
4 µs
(VDD = 2.2 to 5.5 V)
8 µs
(VDD = 2.0 to 5.5 V)
Operation When P0C, P0D Are Standby
Supply Voltage
Package
Retain output level immediately before standby mode
VDD = 2.0 to 5.5 V
VDD = 2.0 to 3.6 V
28-pin plastic SOP (375 mil)
28-pin plastic shrink DIP (400 mil)
30-pin plastic shrink SOP (300 mil)
Note
76
Although the circuit configuration is identical, its electrical characteristics differ depending on the product.
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
[MEMO]
Data Sheet U12643EJ2V0DS00
77
µPD17225, 17226, 17227, 17228
FUNCTIONAL COMPARISON OF µPD17225 SUBSERIES RELATED PRODUCTS
APPENDIX B.
Product Name µPD17201A µPD17207 µPD17202A µPD17215
µPD17216
µPD17217
µPD17218
4096 × 16
6144 × 16
8192 × 16
Item
3072 × 16
ROM Capacity (Bit)
Infrared Remote Controller
Carrier Generator (REM)
2048 × 16
336 × 4
112 × 4
136 segments max.
96 segments
max.
RAM Capacity (Bit)
LCD Controller/Driver
4096 × 16
111 × 4
Not provided
LED output is high-active LED output
is low-active
I/O Ports
19 lines
223 × 4
Provided (without LED output)
16 lines
20 lines
External Interrupt (INT)
1 line
(rising-edge detection)
1 line (rising-edge, falling-edge detection)
Analog Input
4 channels (8-bit A/D)
Not provided
Timer
2 channels



8-bit timer
Watch timer
Watchdog Timer
2 channels
Note
Not provided
Serial Interface
Provided (WDOUT output)
1 channel
Stack
Not provided
5 levels (3 levels for multiplexed interrupt)
Instruction
Execution Time
Main System
Clock
4 µs (4 MHz: with ceramic or
crystal resonator,
VDD = 2.2 to 5.5 V)
Subsystem
488 µs (32.768 kHz: with crystal
resonator, VDD = 2.0 to 5.5 V)
Not provided
VDD = 2.2 to 5.5 V (VDD = 2.0 to 5.5 V)
VDD = 2.0 to 5.5 V
Clock
Supply Voltage
(With Subsystem Clock)
Standby Function
Package
• 2 µs (8 MHz ceramic resonator:
in high-speed mode, VDD = 3.5 to 5.5 V)
• 4 µs (4 MHz ceramic resonator:
in high-speed mode, VDD = 2.2 to 5.5 V)
• 8 µs (2 MHz ceramic resonator:
in high-speed mode, VDD = 2.0 to 5.5 V)
STOP, HALT
80-pin plastic QFP
64-pin
plastic QFP
28-pin plastic SOP
28-pin plastic shrink DIP
µPD17P207
µPD17P202A
µPD17P218
One-Time PROM Products
Note that although all the products have the same circuit construction, the electrical specifications differ
dependant on each product.
78
8-bit timer
Basic interval timer
Provided (WDOUT output)
Low-Voltage Detector Circuit
Note



Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
µPD17225 µPD17226
µPD17227
µPD17228
2048 × 16
6144 × 16
8192 × 16
4096 × 16
111 × 4
223 × 4
Not provided
Provided (without LED output)
20 pins
1 pin (rising edge, falling edge detection)
Not provided
2 channels



8-bit timer
Basic interval timer
Provided (WDOUT output)
Provided (WDOUT output)
Not provided
5 levels (3 nesting levels)
• 2 µs (8-MHz ceramic resonator:
in high-speed mode, VDD = 2.2 to 3.6 V)
• 4 µs (4-MHz ceramic resonator:
in high-speed mode, VDD = 2.0 to 3.6 V)
Not provided
VDD = 2.0 to 3.6 V
STOP, HALT
28-pin plastic SOP
28-pin plastic shrink DIP
30-pin plastic shrink SOP
µPD17P218
Data Sheet U12643EJ2V0DS00
79
µPD17225, 17226, 17227, 17228
APPENDIX C. DEVELOPMENT TOOLS
To develop the programs for the µPD17225 subseries, the following development tools are available:
Hardware
Name
Remarks
IE-17K and IE-17K-ET are the in-circuit emulators used in common with the 17K series
microcontroller.
IE-17K and IE-17K-ET are connected to a PC-9800 series or IBM PC/ATTM compatible machines
as the host machine with RS-232C.
By using these in-circuit emulators with a system evaluation board corresponding to the
microcomputer, the emulators can emulate the microcomputer. A higher level debugging
environment can be provided by using man-machine interface SIMPLEHOST TM.
In-Circuit Emulator
IE-17K,
IE-17K-ETNote 1
SE Board
(SE-17225)
This is an SE board for µPD17225 subseries. It can be used alone to evaluate a system
or in combination with an in-circuit emulator for debugging.
Emulation Probe
(EP-17K28CT)
EP-17K28CT is an emulation probe for 17K series 28-pin shrink DIP (400mil).
Emulation Probe
(EP-17K28GT)
EP-17K28GT is an emulation probe for 17K series 28-pin SOP (375 mil). When used with
EV-9500GT-28Note 2, it connects an SE board to the target system.
Emulation Probe
(EP-17K30GS)
EP-17K30GS is an emulation probe for 17K series 30-pin shrink SOP (300 mil) (under
development).
Conversion Adapter
(EV-9500GT-28
Note 2
EV-9500GT-28 is a conversion adapter for 28-pin SOP (375 mil) and is used to connect
)
EP-17K28GT to the target system.
PROM Programmer
(AF-9703Note 3, AF-9704Note 3,
AF-9705Note 3, AF-9706Note 3)
AF-9703, AF-9704, AF-9705, and AF-9706 are PROM programmers corresponding to µPD17P218.
By connecting program adapter AF-9808J or AF-9808H to this PROM programmer,
µPD17P218 can be programmed.
Program Adapter
(AF-9808JNote 3,
AF-9808HNote 3)
AF-9808J and AF-9808H are adapters that is used to program µPD17P218CT and
µPD17P218GT respectively, and is used in combination with AF-9703, AF-9704, AF-9705,
or AF-9706.
Notes 1. Low-cost model: External power supply type
2. Two EV-9500GT-28s are supplied with the EP-17K28GT. Five EV-9500GT-28s are optionally available
as a set.
3. These are products from Ando Electric Co., Ltd. For details, consult Ando Electric Co., Ltd. (Tel: 03-37331163).
80
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
Software
Name
17K Assembler
(RA17K)
17K Series
C-like Compiler
TM
(emlC-17K )
Device File
(AS17225)
Support
Software
(SIMPLEHOST)
Outline
Host Machine
OS
Supply
Order Code
The RA17K is an assembler common to the 17K series products.
When developing the program of
devices, RA17K is used in
combination with a device file
(AS17225).
PC-9800
series
Japanese Windows
3.5" 2HD
µSAA13RA17K
IBM PC/AT
compatible
machine
Japanese Windows
3.5" 2HC
µSAB13RA17K
The emlC-17K is a C-like compiler
common to the 17K series.
Used in combination with the RA17K.
PC-9800
series
Japanese Windows
3.5” 2HD
µSAA13CC17K
IBM PC/AT
compatible
machine
Japanese Windows
3.5” 2HC
µSAB13CC17K
TM
µSBB13RA17K
English Windows
µSBB13CC17K
English Windows
The AS17225 is a device file for
µPD17225, 17226, 17227, and 17228
respectively, and are used in combination with an assembler for the
17K series (RA17K).
PC-9800
series
Japanese Windows
3.5" 2HD
µSAA13AS17225
IBM PC/AT
compatible
machine
Japanese Windows
3.5" 2HC
µSAB13AS17225
SIMPLEHOST is a software package that enables man-machine interface on the Windows when a
program is developed by using an
in-circuit emulator and a personal
computer.
PC-9800
series
Japanese Windows
3.5" 2HD
µSAA13ID17K
IBM PC/AT
compatible
machine
Japanese Windows
3.5" 2HC
µSAB13ID17K
µSBB13AS17225
English Windows
English Windows
Data Sheet U12643EJ2V0DS00
µSBB13ID17K
81
µPD17225, 17226, 17227, 17228
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation.
Steps must be taken to stop generation of static
electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental
control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid
using insulators that easily build static electricity. Semiconductor devices must be stored and
transported in an anti-static container, static shielding bag or conductive material. All test and
measurement tools including work bench and floor should be grounded. The operator should be
grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar
precautions need to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input
levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each
unused pin should be connected to V DD or GND with a resistor, if it is considered to have a
possibility of being an output pin. All handling related to the unused pins must be judged device
by device and related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until
the reset signal is received. Reset operation must be executed immediately after power-on for
devices having reset function.
82
Data Sheet U12643EJ2V0DS00
µPD17225, 17226, 17227, 17228
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, please contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
• Device availability
• Ordering information
• Product release schedule
• Availability of related technical literature
• Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
• Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
NEC Electronics (Germany) GmbH
NEC Electronics Hong Kong Ltd.
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
Benelux Office
Eindhoven, The Netherlands
Tel: 040-2445845
Fax: 040-2444580
Hong Kong
Tel: 2886-9318
Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
Fax: 01-30-67 58 99
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics (France) S.A.
NEC Electronics Singapore Pte. Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 01908-670-290
Spain Office
Madrid, Spain
Tel: 91-504-2787
Fax: 91-504-2860
United Square, Singapore 1130
Tel: 65-253-8311
Fax: 65-250-3583
NEC Electronics Italiana s.r.l.
NEC Electronics (Germany) GmbH
Milano, Italy
Tel: 02-66 75 41
Fax: 02-66 75 42 99
Scandinavia Office
Taeby, Sweden
Tel: 08-63 80 820
Fax: 08-63 80 388
NEC Electronics (France) S.A.
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-2719-2377
Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division
Rodovia Presidente Dutra, Km 214
07210-902-Guarulhos-SP Brasil
Tel: 55-11-6465-6810
Fax: 55-11-6465-6829
J99.1
Data Sheet U12643EJ2V0DS00
83
µPD17225, 17226, 17227, 17228
emlC-17K and SIMPLEHOST are trademarks of NEC Corporation.
Windows is either a registered trademark or a trademark of Microsoft
Corporation in the United States and/or other countries.
PC/AT is a trademark of IBM Corporation.
The export of this product from Japan is prohibited without governmental license. To export or re-export this product from
a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights
or other intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated “quality assurance program“ for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98.8