DATA SHEET MOS INTEGRATED CIRCUIT µPD9930 LINEAR CODEC FOR DIGITAL CELLULAR TELEPHONE The µPD9930 is a +3 V single power operation, low power consumption linear CODEC LSI developed for digital cellular telephone use. CODEC has a wide dynamic use. This IC also features a microphone/receiver amplifier, a tone generator, DAI (Digital Audio Interface: conforming to GSM11.10), and a power-saving function. These functions can be controlled by microcontroller. In addition, 21 mW (TYP.) low power consumption is enabled during 3 V operation. FEATURES • +3 V single power supply • Low power consumption In operation: 7 mA (TYP.) (VDD = 3 V) In stand-by mode: 50 µA (TYP.) (VDD = 3 V) • CODEC • 13-bit precision linear coding • Transmission level can be controlled by microcontroller. • Analog input/output funciton • Low noise microphone amplifier • High output receiver amplifier Piezo-electric receiver can be directly driven. Gain canbe controlled by microcontroller. • On-chip amplifier for accessory input/output • Tone generator • Frequency, generating pattern and gain can be controlled by microcontroller. • DTMF generation function • Various service tone generation function • GSM triple tone generation function • Desired tone frequency can be registered (0.3 to 3.4 kHz) • DAI • Conforming to GSM11.10 • Test mode can be set by terminal or microcontroller command. • Stand-by mode • Rise time at time of stand-by clearing: 30.5 ms (TYP.) • Master clock generation PLL (external clock input: 8 kHz) • Tone interrupt pattern output function • Ringer output function ORDERING INFORMATION Part Number µPD9930G-22 Package 44-pin plastic QFP (10 × 10 mm) The information in this document is subject to change without notice. Document No. S11616EJ2V0DS00 (2nd edition) (Previous No. IC-3342) Date Published November 1996 N Printed in Japan The mark shows major revised points. © 1994,1996 REQB MICO (15 to 33 dB) MICI– MICI+ (to XACOMO) XAUXO (0 to 10 dB) XAUXI– RAUXO Digital signal processor PLL Microphone amplifier – + Pre-Filter + Mixer 0 or –3 dB Voice send Digital Gain Cont. 0 to –2.8 dB (0.4 dB steps) A/D REC2I– DSP INTERFACE Receive LPF Post Filter 2 (Receiver amplifier 1) 0 to -31 dB (1 dB steps) Voice receive Digital Gain Cont. 0 to –2.4 dB (0.8 dB steps) Receiver drive amplifier (Receiver amplifier 2) – + MICROCONTROLLER INTERFACE Tone Gain Cont. 0 to –30 dB (1 dB steps) –38.5 dB Sign code output to Vref DSPSEL MSTR MDAT DCLK DO to Vref XACOMI XACOMO Tone Interval Generation Vcombuff MCLK Tone Generator – + REC2O+ SO SI Post Filter 1 (Accessory output amplifier) 0 dB fix REC2O– SCLK (256 kHz) SEN Accessory input amplifier – + to Vref D/A REC1O Transmit BPF FSYNC (8 kHz) BLOCK DIAGRAM 2 RESETB MIXI DAI (GSM11. 10) DI TC1 TC2 Vref RACOMO RACOMI DRSTB µPD9930 TIMER RINGER Low-current drive LED µPD9930 PIN CONFIGURATION (Top View) REC2I– ICNote REC2O– REC2O+ RACOMI RACOMO XACOMO XACOMI XAUXI– XAUXO MIXI 44-pin plastic QFP (10 x 10 mm) 33 32 31 30 29 28 27 26 25 24 23 MICI+ AVDD2 37 19 AGND4 DVDD 38 18 AGND3 SEN 39 17 AGND2 SI 40 16 AGND1 SO 41 15 DGND SCLK 42 14 FSYNC TEST 43 13 RESETB MSTR 44 12 REQB 1 2 3 4 5 6 7 8 9 10 11 DSPSEL 20 RINGER 36 TIMER AVDD1 TC2 MICI– TC1 21 DCLK 35 DO RAUXO DI MICO DRSTB 22 MCLK 34 MDAT REC1O Note Internal connection; leave unconnected 3 µPD9930 Pin Name AGND1-AGND4 4 : Analog Ground AV DD1, AV DD2 : Analog Power Supply DCLK : DAI (Digital Audio Interface) Clock Output DGND : Digital Ground DI : DAI Serial Input DO : DAI Serial Output DRSTB : DAI Reset DSPSEL : Digital Signal Processor Select DV DD : Digital Power Supply FSYNC : Frame Synchronization Signal Input IC : Internally Connected MCLK : Microcontroller Synchronous Clock MDAT : Microcontroller Serial Data MICI+ : Microphone Amplifier Input Non-Inverted MICI– : Microphone Amplifier Input Inverted MICO : Microphone Amplifier Output MIXI : Mixer Input MSTR : Microcontroller Strobe RACOMI : Receive Common Reference Voltage Input RACOMO : Receive Common Reference Voltage Output RAUXO : Receive Auxiliary Amplifier Output REC1O : Receive Amplifier 1 Output REC2I– : Receive Amplifier 2 Input Inverted REC2O+ : Receive Amplifier 2 Output Non-Inverted REC2O– : Receive Amplifier 2 Output Inverted REQB : Request RESETB : Reset RINGER : Ringer SCLK : Serial Data Synchronous Clock Output SEN : Serial Data Output Enable SI : Serial Data Input SO : Serial Data Output TC1, TC2 : DAI Mode Control TEST : Test TIMER : Timer XACOMI : Transmit Common Reference Voltage Input XACOMO : Transmit Common Reference Voltage Output XAUXI– : Transmit Auxiliary Amplifier Input Inverted XAUXO : Transmit Auxiliary Amplifier Output µPD9930 CONTENTS 1. PIN FUNCTIONS ........................................................................................................................... 6 1.1 LIST OF PIN FUNCTIONS ..................................................................................................................... 6 1.2 PIN EQUIVALENT CIRCUIT .................................................................................................................. 8 2. BLOCK FUNCTIONS ..................................................................................................................... 9 2.1 CODEC .................................................................................................................................................... 9 2.1.1 Audio Codec .............................................................................................................................. 9 2.1.2 Audio Analog Input .................................................................................................................. 9 2.1.3 Audio Analog Output ............................................................................................................. 10 2.1.4 Audio Digital Accessory Output ........................................................................................... 11 2.1.5 Audio Digital Signal Processor ............................................................................................ 11 2.1.6 Power Up/Down Control ........................................................................................................ 12 2.1.7 Microcontroller Interface ....................................................................................................... 18 2.1.8 DSP Interface .......................................................................................................................... 19 2.1.9 DAI (Digital Audio Interface) ................................................................................................. 22 3. TONE INTERVAL OUTPUT FUNCTION (TIMER TERMINAL) ................................................. 29 4. INTERNAL CONTROL FUNCTIONS ...........................................................................................30 4.1 SEND/RECEIVE GAIN CONTROL ...................................................................................................... 30 4.1.1 Voice Send Analog Gain/Receiver Amplifier 2 Control Register (TXGCR) .................... 32 4.1.2 Voice Receive Analog Gain Control Register (RXGCR) ................................................... 33 4.1.3 Voice Send/Receive Digital Gain Control Register (DGGSR) .......................................... 35 4.2 DIGITAL INPUT/OUTPUT CONTROL ................................................................................................. 37 4.2.1 Digital Signal Processing Control Register (DSPCR) ....................................................... 38 4.3 TONE CONTROL .................................................................................................................................. 40 4.3.1 Tone Frequency Selection Register (FRQSR) .................................................................... 43 4.3.2 Expanded Tone Registers (EXPR1, EXPR2) ....................................................................... 45 4.3.3 Tone Control Register (TONCR) ........................................................................................... 47 4.3.4 Tone Gain Control Register (TNGCR) ................................................................................. 48 4.4 TEST MODE CONTROL ...................................................................................................................... 50 4.4.1 Test Control Register (TSTCR) ............................................................................................. 52 5. ELECTRICAL CHARACTERISTICS ............................................................................................53 6. APPLIED CIRCUIT EXAMPLE .................................................................................................... 73 7. PACKAGE DRAWINGS ............................................................................................................... 74 8. RECOMMENDED SOLDERING CONDITIONS ......................................................................... 75 5 µPD9930 1. PIN FUNCTIONS 1.1 LIST OF PIN FUNCTIONS Table 1-1 List of Pin Functions (1/2) Pin No. Pin Name Input/Output 1 MDAT Input Microcontroller interface serial input Function 2 MCLK Input Microcontroller interface clock input 3 DRSTB Input DAI (Digital Audio Interface) reset input This is reset at low level. Internally pulled high. 4 DI Input DAI serial input Internally pulled high. 5 DO Output 6 DCLK Output 7 TC1 Input DAI serial output Hi-Z in normal operation (TC1 = TC2 = low level) 8 TC2 Input DAI clock output (104 kHz) Hi-Z in normal operation DAI mode control Selection of test mode specified by GSM11.10 in combination with TC1 and TC2 TC2 TC1 L L Normal operation L H Speech encoder test mode H L Speech decoder test mode H H Acoustic device test mode L: Low level H: High level Test mode specification TC1 and TC2 pins are internally pulled down. 6 9 TIMER Output Timer output. Output of rectangular wave synchronized with tone intermittent pattern. 10 RINGER Output Ringer tone output. Output of rectangular wave synchronized with tone frequency. 11 DSPSEL Input Selection of DSP interface input/output timing mode. Connect to VDD or GND. (VDD = mode 1, GND = mode 2) 12 REQB Input Input of DSP interface data transmit request signal. Serial data can be input/output at low level. 13 RESETB Input System reset input. This is reset at low level. Initializes all control registers. Reset when turning power on. 14 FSYNC Input Send/receive frame synchronization signal (8 kHz) input 15 DGND — Digital ground. Connect to a digital ground line near µPD9930 pins. 16 AGND1 — Analog ground. Connect to an analog ground line near µPD9930 pins. 17 AGND2 — 18 AGND3 — 19 AGND4 — 20 MICI+ Input Microphone amplifier non-inverted input 21 MICI– Input Microphone amplifier inverted input 22 MICO Output 23 MIXI Input 24 XAUXO Output Microphone amplifier output. Connect microphone amplifier gain adjust resistor. Outputs sidetone signal to REC2I- pin. Pre-filter + mixer input Accessory input amplifier output. Connect accessory input amplifier gain adjust resistor. µPD9930 Table 1-1 List of Pin Functions (2/2) Pin No. Pin Name Input/Output Function 25 XAUXI– Input Accessory input amplifier inverted input 26 XACOMI Input Voice send internal reference voltage input 27 XACOMO Output Voice send internal reference voltage (1.2 V) output 28 RACOMO Output Voice receive internal reference voltage (1.2 V) output 29 RACOMI Input 30 REC2O+ Output 31 REC2O– Output 32 IC — 33 REC2I– Input 34 REC1O Output 35 RAUXO Output 36 AVDD1 — 37 AVDD2 — 38 DVDD — 39 SEN Output 40 SI Input Voice receive internal reference voltage input Receiver amplifier 2 non-inverted output Receiver amplifier 2 inverted output Internal connection; leave unconnected Receiver amplifier 2 inverted input Connect sidetone gain adjust resistor. Receiver amplifier 1 output Accessory output amplifier output Analog power. Connect to an analog power supply line near µPD9930 pins. Digital power. Connect to a digital power supply line near µPD9930 pins. DSP interface enable signal output DSP interface serial input 41 SO Output DSP interface serial output 42 SCLK Output DSP interface clock output (256 kHz) 43 TEST Input Set at high level 44 MSTR Input Microcontroller interface strobe signal input Caution Short-circuit the XACOMI and XACOMO pins at a location as close to the pins of the µPD9930 as possible. Connect a capacitor (chip capacitor or electrolytic capacitor) between this short-circuited portion and analog ground. The same applies to the RACOMI and RACOMO pins. The transmission/reception level is determined by these reference pins. Therefore, make sure that these pins are not affected by noise or fluctuation of ground potential due to current. 7 µPD9930 1.2 PIN EQUIVALENT CIRCUIT Type 1 Type 2 AVDD AVDD Analog input Analog input To internal circuit To internal circuit AGND AGND Pin Name MICI+, MICI–, XAUXI–, REC2I– Pin Name MIXI, XACOMI, RACOMI AVDD Type 3 DVDD Type 4 Analog output CMOS input From internal circuit To internal circuit AGND DGND Pin Name MICO, XAUXO, XACOMO, RACOMO, REC2O+, REC2O–, REC1O, RAUXO Type 6 DVDD Type 5 Pin Name MDAT, MCLK, DSPSEL, REQB, RESETB, FSYNC, TEST, MSTR Note DVDD Mask input CMOS input To internal circuit CMOS input To internal circuit DGND DGND Pin Name SI Type 7 Note Pin Name TC1, TC2 Type 8 DVDD DVDD DVDD P CMOS output CMOS input To internal circuit N DGND DGND Pin Name DRSTB, DI Type 9 From internal circuit Pin Name TIMER, RINGER, SEN, SO, SCLK DVDD Enable signal P CMOS output From internal circuit N DGND Pin Name DO, DCLK Note In normal mode, set the output of drive IC side to high impedance for reducing power consumption. 8 µPD9930 2. BLOCK FUNCTIONS 2.1 CODEC 2.1.1 Audio Codec Audio analog signal and linear code conversion. • Input/output format: 16 bits (2's complement) • Accuracy: 13 bits 2.1.2 Audio Analog Input Includes microphone input and accessory input. (1) Microphone amplifier Amplifiers differential input signals from the microphone to the required gain. (2) Accessory input amplifier Amplifiers the accessory input signal to the required gain. (3) Pre-filter + mixer Selects the output signal of microphone amplifier and accessory input amplifier, and inputs these to A/D converter after controlled gain. Table 2-1 Analog Input Function Amplifier Microphone Amplifier Function Accessory Input Amplifier Pre-filter + Mixer Gain setting method External resistor External resistor Microcontroller command Gain setting range 15 to 33 dB R2 20 log (dB) R1 0 to 10 dB R3 20 log (dB) R4 0 or –3 dB Minimum resistive load 50 kΩ (Including gain setting resistance) 300 kΩ (Including gain setting resistance) — Maximum capacitive load 20 pF 20 pF — Maximum output level 0.6 V0-p 0.6 V0-p — Figure 2-1 Analog Input Block MIXI MICO (15 to 33 dB) R2 R1 MICI– Microphone amplifier MICI+ – + R1 (to XACOMO) (0 to 10 dB) R3 Pre-filter + mixer 0 or –3 dB XAUXO XAUXI– R4 – + Accessory input amplifier to Vref 9 µPD9930 2.1.3 Audio Analog Output Includes receiver output and accessory output. Sidetone addition is also possible. (1) Post filter 2 (receiver amplifier 1) This circuit adjusts the gain of D/A differential output signal (volume control), and then converts it to single output signal. (2) Receiver drive amplifier (receiver amplifier 2) This is differential output amplifier that can directly drive a piezo-electric receiver (when using a dynamic receiver, an additional external amplifier is necessary). The sidetone is added in this circuit. (3) Post filter 1 (accessory output amplifier) This circuit converts D/A differential output signal to single output signal. Connected to the earphone of the head set (capacitance load), etc. Table 2-2 Analog Output Functions Amplifier Function Receiver Amplifier 1 Receiver Amplifier 2 Accessory Output Amplifier Gain setting method Microcontroller command External resistor — Gain setting range 0 to –31 dB (1 dB steps) Voice receive signal gain: – ∞ to + 10 dB — 20 log R3 (dB) + 6 dBNote R2 Sidetone signal gain: – ∞ to + 3 dB R3 20 log (dB) + 6 dBNote R1 Minimum resistive load 100 kΩ 2 kΩ 100 kΩ Maximum capacitive load 20 pF 60 nF 100 pF Maximum output level 0.6 V0-p 4 Vp-p (Differential output) 0.6 V0-p Note Conversion result (single output → differential output) Figure 2-2 Analog Output Block RAUXO REC1O R2 Sidetone signal R1 REC2I– R3 REC2O– REC2O+ Post filter 1 (accessory output amplifier) 0 dB fix Post filter 2 (receive amplifier 1) 0 to –31 dB (1 dB steps) Receiver drive amplifier (receiver amplifier 2) – + to Vref – + to Vref 10 µPD9930 2.1.4 Audio Digital Accessory Output (1) Ringer output (RINGER pin) • Outputs rectangular waves of the same signal frequency as tone signal frequency. • The output is controlled by turning off power to the output buffer with a control register. Figure 2-3 RINGER Output RAUXO (Tone output) RINGER The RINGER signal tends to bounce when the tone output (RAUXO) signal crosses its zero level, and this tendency increases as the tone output gain decreases (lower than 0 dB). When using RINGER pin, tune the tone output gain by TNGCR (Tone gain control register) to 0 dB. (2) Timer (tone interval) output (TIMER pin) Outputs rectangular waves of the same pattern as the tone signal interrupt pattern. This is used to make the LED blink in synchronization with the ringer tone. Figure 2-4 Digital Accessory Output Waveform REC10 RAUXO (Tone output) RINGER TIMER 2.1.5 Audio Digital Signal Processor Send signal digital BPF processing, receive signal digital LPF processing, transmission level (digital gain) control, and tone generation processing. (1) Voice send signal digital gain fine adjustment function Performs gain fine adjustment for voice send signal by digital coefficient multiplication. Together with prefilter gain adjustment, fine adjustment is possible at a width of 5.8 dB. (2) Voice receive signal digital gain fine adjustment function Performs fine adjustment of gain for voice receive signal by digital coefficient multiplication. (3) Tone generation function Generates single-tone and dual-tone audible signals. Tone frequency, interrupt pattern, gain, generation/stop can be controlled by microcontroller command. GSM triple tone can be generated by special command. 11 µPD9930 Table 2-3 Digital Gain Control Functions Voice Send Signal Gain Control Voice Receive Signal Gain Control Tone Gain Control Gain setting method Microcontroller command Microcontroller command Microcontroller command Gain setting range 0 to –2.8 dB (0.4 dB steps) 0 to –2.4 dB (0.8 dB steps) 0 to –30 dB (1 dB steps), –38.5 dB 2.1.6 Power Up/Down Control The µ PD9930 includes a power down function for reducing power consumption. Power down control is by the two methods described below. (1) Input/output amplifier power up/down control Power up/down for both the input and output amplifiers can be controlled. When the power down function is used for all input amplifiers, both pre-filter and A/D enter the power down state. When the power down function is used for the accessory output amplifier and the receiver 1 amplifier, the D/A also enters power down state. (2) Stand-by mode Low power consumption can be realized in the mode in which all chip operation is stopped. The stand-by mode is set by power down command. Operation restarts by power up command. The following control registers are used to enable the control described above. Control Method Registers Used Power up/down control of input/output amplifier (not including receiver amplifier 2) Input/output amplifier control register (AMPCR) Power up/down control of receiver amplifier 2 Send analog gain/receiver amplifier 2 control register (TXGCR) Set/clear of standby mode Power up control command (PUPCMD) Power down control command (PDWCMD) An outline diagram of power down control is shown in Figure 2-5. 12 µPD9930 Figure 2-5 Power Down Control Register address 0 0 AMPCR 0 MICPDB XAUXPDB REC1PDB RAUXPDB RINGPDB Register address 0 0 0 TXGCR 1 1 0 REC2PDB TXAG HEXNote Power up command 0 1 1 1 1 0 — M L — 78H 1EH — M 70H HEXNote Power down command 0 1 1 1 0 0 — L 0EH Note M: HEX value with MSB first L: HEX value with LSB first PLL Microphone input – + Stand-by Stand-by "1" = Power ON MICPDB Pre-filter + mixer A/D to XACOMI Accessory input – + "1" = Power ON XAUXPDB to Vref Accessory output When all input amplifiers are in the power down state, these also enter power down state. Digital signal processor Stand-by – + "1" = Power ON RAUXPDB D/A Receiver 1 – + Stand-by "1" = Power ON REC1PDB Receiver 2 – + When both accessory output and receiver 1 amplifiers are in the power down state, these also enter power down state. Stand-by to Vref "1" = Power ON – + REC2PDB to Vref Ringer output Stand-by "1" = Ringer output RINGPDB Caution MICPDB and XAUXPDB cannot enter the power up state at the same time (MICPDB = XAUXPDB = "1"). 13 µPD9930 (3) Input/output amplifier control register (AMPCR) This is a 5-bit register for power up/down control of each input/output amplifier (not including receiver amplifier 2), and for ringer output ON/OFF control. Remark For information on power up/down control of receiver amplifier 2, refer to 4.1.1 Voice Send Analog Gain/ Receiver Amplifier 2 Control Register (TXGCR). Figure 2-6 Input/Output Amplifier Control Register Register address MICPDB AMPCR D7 D6 D5 0 0 0 D4 D3 D2 D1 D0 MICPDB XAUXPDB REC1PDB RAUXPDB RINGPDB Microphone amplifier power control 0 Power down 1 Power up XAUXPDB Accessory input amplifier power control 0 Power down 1 Power up REC1PDB Receiver amplifier 1 power control 0 Power down 1 Power up RAUXPDB Accessory output amplifier power control 0 Power down 1 Power up RINGPDB Ringer output control 0 Sets output at low level. 1 Output enable Remarks 1. In the stand-by mode, all amplifiers enter the power down state regardless of input/output control register settings. However, register contents are held unless reset or written, so when the stand-by mode is cleared by power up command, the command prior to the stand-by mode is resumed. 2. The microphone and accessory amplifiers cannot enter the power up (D4 = D3 = "1") state at the same time. 14 µPD9930 Table 2-4 Function Specification by Input/Output Amplifier Control Register Register address AMPCR D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 Microphone Accessory Receiver Accessory amplifier input amplifier amplifier 1 output amplifier Ringer output HEXNote M L 0 0 0 0 0 X X X X Stop 00H 00H 0 0 0 0 1 X X X X Output 01H 80H 0 0 0 1 0 X X X O Stop 02H 40H 0 0 0 1 1 X X X O Output 03H C0H 0 0 1 0 0 X X O X Stop 04H 20H 0 0 1 0 1 X X O X Output 05H A0H 0 0 1 1 0 X X O O Stop 06H 60H 0 0 1 1 1 X X O O Output 07H E0H 0 1 0 0 0 X O X X Stop 08H 10H 0 1 0 0 1 X O X X Output 09H 90H 0 1 0 1 0 X O X O Stop 0AH 50H 0 1 0 1 1 X O X O Output 0BH D0H 0 1 1 0 0 X O O X Stop 0CH 30H 0 1 1 0 1 X O O X Output 0DH B0H 0 1 1 1 0 X O O O Stop 0EH 70H 0 1 1 1 1 X O O O Output 0FH F0H 1 0 0 0 0 O X X X Stop 10H 08H 1 0 0 0 1 O X X X Output 11H 88H 1 0 0 1 0 O X X O Stop 12H 48H 1 0 0 1 1 O X X O Output 13H C8H 1 0 1 0 0 O X O X Stop 14H 28H 1 0 1 0 1 O X O X Output 15H A8H 1 0 1 1 0 O X O O Stop 16H 68H 1 0 1 1 1 O X O O Output 17H E8H Remarks At reset Note M: HEX value with MSB first L: HEX value with LSB first Remark O: Power up X: Power down 15 µPD9930 (4) Power up/down command (PUPCMD/PDWCMD) The stand-by mode is set and cleared by the following two special commands. When resetting, the stand-by mode is set. Figure 2-7 Power Down Command (Sets to stand-by mode) D7 D6 D5 D4 D3 D2 D1 D0 0 1 1 1 0 0 X X PDWCMD Remark X: Don't Care Figure 2-8 Power Up Command (Clears stand-by mode) D7 D6 D5 D4 D3 D2 D1 D0 0 1 1 1 1 0 X X PUPCMD Remark X: Don't Care Power up/down timing Power up command Power down command FSYNC COUNT 0 1 2 3 238 239 240 241 0 ANAPWD CLKPWD DSPPWD Remarks COUNT: Internal counter (counts with an 8-kHz internal clock) ANAPWD: Analog power down (power down when high) CLKPWD: Clock power down (power down when high) DSPPWD: Signal processing power down (power down when high) 16 0 µPD9930 (5) Power up/down sequence (a) Power down sequence Power down command execution Digital signal processing (filter operation, tone generation operation) operation stop Clock (internal clock, serial clock) power down Analog (PLL, all amplifiers) power down (b) Power up sequence Power up command execution Analog and PLL operation start PLL clock stabilization Clock operation start Digital signal operation start Remarks 1. The DSP interface serial input/output operation does not stop or start when switching to power up/down. 2. Rising time from standby mode to normal operation mode is about 30.5 ms after execution of the power up command. 3. FSYNC can be stopped at power down. However, input of the FSYNC clock is necessary during operation and in the above sequence. 17 µPD9930 2.1.7 Microcontroller Interface The µ PD9930 can control internal functions by microcontroller command. A clock synchronous serial I/O is incorporated to receive command. A clocked serial interface is provided to receive microcontroller commands. A microcontroller connection example is shown in Figure 2-9. 8-bit length data is received by the serial clock (MCLK), serial input (MDAT), and strobe input (MSTR) lines Note. The timing chart is shown in Figure 2-10. By reading data to the internal shift register and setting MSTR to high level at the MCLK rising point, it is latched to the internal control register. Data transfer must be made with LSB first. Note When 8 bits or more (9 MCLK clocks or more) data is input, the last 8-bit which is input immediately before the active edge of MSTR is recognized as a control command. Figure 2-9 Example of Connection with Microcontroller µ PD9930 Microcontroller Microcontroller I/F Serial I/O SO MDAT SCK MCLK PORT MSTR Figure 2-10 Microcontroller Interface Timing Chart MCLK MDAT MSTR 18 D0 D1 D2 D3 D4 D5 D6 D7 D0 D1 µPD9930 2.1.8 DSP Interface A clock synchronous serial I/O is built-in to exchange voice send/receive coding data with an external DSP. 16-bit data is transferred at 8 kHz by the serial clock (SCLK = 256 kHz), serial input (SI), serial output (SO), and enable output (SEN) lines. The REQB is a terminal for allowing/inhibiting data transmission. There are two modes for data input and output timing, and either can be selected by the DSPSEL terminal. Select the mode matching the DSP serial interface input/output timing. Data format is as follows: Both SO output and SI input are in 2's complement format with MSB first. Figure 2-11 Data Format in DSP Interface SO output D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Coding data (13 bits) Sign bit Invalid data Remark A full code is output when the SO pin is +3.17 dBm0 (A/D 1.2 Vp-p). SI input D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Coding data (15 bits) Sign bit Remark When a full code is input to the SI pin, the accessory output is 1.2 Vp-p. Table 2-5 DSP Input/Output Timing Mode Selection Pin input Mode DSPSEL H MODE1 L MODE2 Table 2-6 Allowing Data Transmission REQB pin Input Data Transmission L Data transmission is allowed. Enable signal (SEN) is output at rising edge of FSYNC (8 kHz), and data input/output is started. H Enable signal is not output and data are not input or output. 19 µPD9930 Figure 2-12 Example of Connection with DSP (Mode 1) µ PD9930 DSP DSP I/F Serial I/O SCK SCLK enable SEN SI SO SO SI PORT REQB VDD DSPSEL Note Note When using with mode 2, connect DSPSEL to GND. 20 FSYNC 8 kHz µPD9930 Figure 2-13 DSP Interface Timing Chart (a) Mode 1 (DSPSEL = VDD) REQB 125 µ s FSYNC (8 kHz) SEN SCLK (256 kHz) SO SI don't care D15 D14 D2 D1 D0 D15 D14 D2 D1 D0 don't care D15 D14 D13 D15 D14 D13 D15 D14 D13 (b) Mode 2 (DSPSEL = GND) REQB 125 µ s FSYNC (8 kHz) SEN SCLK (256 kHz) D15 SO SI don't care D14 D15 D14 D13 D2 D2 D1 D1 D0 D0 don't care D15 D14 D13 D12 21 µPD9930 2.1.9 DAI (Digital Audio Interface) Has a on-chip circuit enabling DAI functions specified in GSM11.10. The receive system has a on-chip LPF only. If a BPF is necessary, it should be mounted externally. System configuration at the time of DAI test mode is shown in Figure 2-15. The DAI terminal is connected to the system simulator via the pin 25 DSUB socket. The test mode can be selected by terminals TC1 or TC2, or by microcontroller command. DAI mode should be set after completing power-up operation (30.5 ms after executing power-up command). When changing the modes from DAI to normal, either of the following operations should be executed. • After specifying normal mode, input the DAI reset signal (DRSTB = low). • Input reset signal (RESETB = low). When specifying by command, test control register mode specification bits (ITC1, ITC2) are used (Refer to 4.4.1 Test Control Register (TSTCR).). Timing for each mode is shown in Figures 2-16 through 2-20. For operation at the time of each mode, refer to Figure 4-13 Test Mode Operation. Table 2-7 DAI Test Mode Specification TC2 TC1 (ITC2) (ITC1) Test mode specification Function 0 0 Normal operationNote Normal operation. This mode is set at system reset (when RESETB = low) regardless of status of TC1 and TC2. 0 1 Speech encoder test mode Outputs data input from DI pin to DSP (speech encoder) from SO pin. Input is started at rising edge of first FSYNC (8-kHz external clock input) after execution of mode specification, and outputting data to DSP is started at next rising edge of FSYNC. 1 0 Speech decoder test mode Outputs speech decoder output data input from SI pin from DO pin. Inputting data from DSP is started at rising edge of first FSYNC (8-kHz external clock input) after execution of mode specification, and data is output from DO pin at next rising edge of FSYNC. 1 1 Acoustic device, A/D, Outputs audio data converted into digital signal from DO pin. D/A test mode Also inputs audio data input from DI pin to D/A converter. Inputting/outputting data is started at rising edge of first FSYNC (8-kHz external clock input) after execution of mode specification. At this time, clock output to DSP (SCLK) is stopped. Note In the normal mode, do not set DRSTB to low level (during low period, serial interface with DSP is disabled). As well, set the output pins of driver IC to high-impedance state, because DRSTB input pin is connected with a pull-up resistor. Remark Analog loop back mode and DAI test mode cannot be specified at the same time. DAI test mode is set with TC1, TC2 (or ITC1, ITC2) and DRSTB pins. DAI test mode is entered at the rising edge of the DRSTB signal when both TC1 and TC2 pins (or ITC1 and ITC2 pins) are set as shown in Figure 2-14. 22 µPD9930 Figure 2-14 Latch Timing of TC1, TC2 (or ITC1, ITC2) TC1 (ITC1) TC2 (ITC2) DRSTB Figure 2-15 Example of System Configuration at Time of DAI Test Mode Mobile equipment µ PD9930 System simulator FSYNC 25-Pin DSUB socket DAI DCLK MCLK MSTR MDAT 8 kHz Test command Microcontroller DO DAI DI TC2 SCLK SEN SO DRSTB SI REQB TC1 DSP (SP-CODEC) Remark In the acoustic device test mode, REQB is ignored (both high and low levels). When DSPSEL = VDD (mode 1), SCLK and SEN are fixed to low, and when DSPSEL = GND (mode 2), fixed to high. 23 24 Figure 2-16 Speech Encoder Test Mode (DSP Interface = MODE 1) (TC1 = 1, TC2 = 0) TC1 (ITC1) TC2 (ITC2) "L" DRSTB REQB FSYNC (8 kHz) DCLK (104 kHz) DI don't care D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D12 D11 D10 D9 D8 D7 D6 D5 SCLK (256 kHz) SEN D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 µPD9930 SO Figure 2-17 Speech Encoder Test Mode (DSP Interface = Mode 2) (TC1 = 1, TC2 = 0) TC1 (ITC1) TC2 (ITC2) "L" DRSTB REQB FSYNC (8 kHz) DCLK (104 kHz) DI don't care D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D12 D11 D10 D9 D8 D7 D6 D5 SCLK (256 kHz) SEN D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 25 µPD9930 SO 26 Figure 2-18 Speech Decoder Test Mode (DSP Interface = Mode 1) (TC1 = 0, TC2 = 1) TC1 (ITC1) "L" TC2 (ITC2) DRSTB REQB FSYNC (8 kHz) SCLK (256 kHz) SEN SI D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 DCLK (104 kHz) D12 D11 D10 D9 D8 D7 D6 D5 µPD9930 DO Figure 2-19 Speech Decoder Test Mode (DSP Interface = Mode 2) (TC1 = 0, TC2 = 1) TC1 (ITC1) "L" TC2 (ITC2) DRSTB REQB FSYNC (8 kHz) SCLK (256 kHz) SEN SI D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 DCLK (104 kHz) D12 D11 D10 D9 D8 D7 D6 D5 27 µPD9930 DO 28 Figure 2-20 Acoustic Device Test Mode (DSP Interface = Mode 1) (TC1 = 1, TC2 = 1) TC1 (ITC1) TC2 (ITC2) DRSTB REQB FSYNC (8 kHz) SCLK (256 kHz) Note DCLK (104 kHz) D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D12 D11 D10 D9 D8 D7 D6 D5 DO D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D12 D11 D10 D9 D8 D7 D6 D5 Note In DSP Interface = Mode 2, SCLK is fixed to high. µPD9930 DI µPD9930 3. TONE INTERVAL OUTPUT FUNCTION (TIMER TERMINAL) When a tone is generated, an interval signal that indicates the tone intermittent state is output. The function is used, for example, to make the LED blink in synchronization with the ringer tone. Figure 3-1 Tone Interval Output Waveform Tone generation (1) Continuous tone Tone generation Tone stop (31.25 ms) (31.25 ms) (2) Intermittent tone (when 31.25 ms on/off) Tone generation (200 ms) (3) One-shot tone (200 ms one-shot) Tone generation Tone stop (1 s) (1 s) (4) GSM triple tone 29 µPD9930 4. INTERNAL CONTROL FUNCTIONS The µ PD9930 can control internal functions by commands from a microcontroller. Commands consist of 8bit data (D7 to D0) consisting of register address and setting data, and are written in the following internal registers. Register name Control (1) (2) (3) Voice send analog gain/receiver amplifier 2 control register (TXGCR) Voice receive analog gain control register (RXGCR) Voice send/receive digital gain control register (DGGSR) Voice send/receive gain control (4) Digital signal processing control register (DSPCR) Digital input/output control (5) Tone frequency selection register (FRQSR) Tone control (6) (7) (8) Expanded tone register (EXPR1/EXPR2) Tone control register (TONCR) Tone gain control register (TNGCR) (9) Input/output amplifier control register (AMPCR) (10) Power up control command (PUPCMD) (11) Power down control command (PDWCMD) Power up/down control (12) Test control register (TSTCR) Test mode control Remarks 1. In the case of registers (1), (2), and (9) to (11), written contents are executed instantly. 2. For registers (3) to (8) and (12), since fetch execution is made by the internal clock (125 µs interval), keep 125 µs or more interval for write-in to the same register. If the write-in to the same register is executed continuously, the previous command may be ignored. 3. Even when in the stand-by mode, write-in to each internal register is possible (can be held), but the command written in the register is executed only after clearing the stand-by mode. 4.1 SEND/RECEIVE GAIN CONTROL An outline of send/receive gain control is shown in Figure 4-1. With the µ PD9930, the following send and receive gain control is possible. Send/receive gain control Voice send gain control Voice receive gain control 30 Register used Pre-filter analog gain adjustment (0, –3 dB) Voice send analog gain/receiver amplifier 2 control register (TXGCR) Digital gain fine adjustment (0 to –2.8 dB, 0.4 dB steps) Voice send/receive digital gain control register (DGGSR) Receiver amplifier 1 analog gain adjustment (volume control) (0 to –31 dB, 1 dB steps) Voice receive analog gain control register (RXGCR) Digital gain fine adjustment (0 to –2.4 dB, 0.8 dB steps) Voice send/receive digital gain control register (DGGSR) µPD9930 Figure 4-1 Send/Receive Gain Control Register address 0 0 0 TXGCR 1 1 0 REC2PDB TXAG Digital signal-processor 0 to –2.8 dB (0.4 dB steps) Pre-filter/mixer Microphone input or Accessory input Voice send analog gain control Voice send digital gain control A/D BPF SO 0, –3 dB Register address 0 1 DGGSR 0 RXDG1 RXDG0 TXDG2 TXDG1 TXDG0 Receiver amplifier 1 Voice receive analog gain control Receiver output D/A LPF 0 to –31 dB (1 dB steps) 0 SI 0 to –2.4 dB (0.8 dB steps) Register address 0 Voice receive digital gain control RXGCR 1 RXAG4 RXAG3 RXAG2 RXAG1 RXAG0 31 µPD9930 4.1.1 Voice Send Analog Gain/Receiver Amplifier 2 Control Register (TXGCR) This register controls pre-filter gain. It also controls receiver amplifier 2 power up/down as shown in Table 4-1 (Refer to 2.1.6 Power Up/Down Control). When power is down, the contents of the register area retained. After power is up, control continues as before power was down. Figure 4-2 Voice Send Analog Gain/Receiver Amplifier 2 Control Register Register address REC2PDB D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 1 1 0 REC2PDB TXAG Receiver amplifier 2 power up/down specification 0 Power down 1 Power up TXAG TXGCR Pre-filter analog gain specification 0 Sets to 0 dB 1 Sets to –3 dB Table 4-1 Function Specification by Send Analog Gain/Receiver Amplifier 2 Control Register Register address HEXNote TXGCR D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 1 1 Voice send analog gain M L 0 0 0 Power down 0 dB 18H 18H 0 0 1 Power down –3 dB 19H 98H 0 1 0 Power up 0 dB 1AH 58H 0 1 1 Power up –3 dB 1BH D8H Note M: HEX value with MSB first L: HEX value with LSB first 32 Receiver amplifier 2 Remarks At reset µPD9930 4.1.2 Voice Receive Analog Gain Control Register (RXGCR) This is a 5-bit register for controlling the analog gain (volume) of receiver amplifier 1. Figure 4-3 Voice Receive Analog Gain Control Register Register address RXGCR D7 D6 D5 D4 D3 D2 D1 D0 0 0 1 RXAG4 RXAG3 RXAG2 RXAG1 RXAG0 RXAG4 to RXAG0 Receiver amplifier 1 gain specification 00000 to 11111 0 to –31 dB (1 dB steps) 33 µPD9930 Table 4-2 Function Specifications by Voice Receive Analog Gain Control Register Register address HEXNote RXGCR D7 D6 D5 D4 D3 D2 D1 D0 0 0 1 M L 0 0 0 0 0 0 dB 20H 04H 0 0 0 0 1 –1 dB 21H 84H 0 0 0 1 0 –2 dB 22H 44H 0 0 0 1 1 –3 dB 23H C4H 0 0 1 0 0 –4 dB 24H 24H 0 0 1 0 1 –5 dB 25H A4H 0 0 1 1 0 –6 dB 26H 64H 0 0 1 1 1 –7 dB 27H E4H 0 1 0 0 0 –8 dB 28H 14H 0 1 0 0 1 –9 dB 29H 94H 0 1 0 1 0 –10 dB 2AH 54H 0 1 0 1 1 –11 dB 2BH D4H 0 1 1 0 0 –12 dB 2CH 34H 0 1 1 0 1 –13 dB 2DH B4H 0 1 1 1 0 –14 dB 2EH 74H 0 1 1 1 1 –15 dB 2FH F4H 1 0 0 0 0 –16 dB 30H 0CH 1 0 0 0 1 –17 dB 31H 8CH 1 0 0 1 0 –18 dB 32H 4CH 1 0 0 1 1 –19 dB 33H CCH 1 0 1 0 0 –20 dB 34H 2CH 1 0 1 0 1 –21 dB 35H ACH 1 0 1 1 0 –22 dB 36H 6CH 1 0 1 1 1 –23 dB 37H ECH 1 1 0 0 0 –24 dB 38H 1CH 1 1 0 0 1 –25 dB 39H 9CH 1 1 0 1 0 –26 dB 3AH 5CH 1 1 0 1 1 –27 dB 3BH DCH 1 1 1 0 0 –28 dB 3CH 3CH 1 1 1 0 1 –29 dB 3DH BCH 1 1 1 1 0 –30 dB 3EH 7CH 1 1 1 1 1 –31 dB 3FH FCH Note M: HEX value with MSB first L: HEX value with LSB first 34 Voice receive analog gain Remarks At reset µPD9930 4.1.3 Voice Send/Receive Digital Gain Control Register (DGGSR) This is a 5-bit register for adjusting the gain of the digital signal processor. The gain of the send system and receive system can be fine-adjusted independently. Figure 4-4 Send/Receive Digital Gain Control Register Register address DGGSR D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 RXDG1 RXDG0 TXDG2 TXDG1 TXDG0 RXDG1 to RXDG0 Receive digital gain specification 00 to 11 0 to –2.4 dB (0.8 dB steps) TXDG2 to TXDG0 Send digital gain specification 000 to 111 0 to –2.8 dB (0.4 dB steps) 35 µPD9930 Table 4-3 Function Specifications by Voice Send/Receive Digital Gain Control Register Register address DGGSR D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 Voice send HEXNote digital gain digital gain M Remarks L 0 0 0 0 0 0 dB 0 dB 40H 02H 0 0 0 0 1 0 dB –0.4 dB 41H 82H 0 0 0 1 0 0 dB –0.8 dB 42H 42H 0 0 0 1 1 0 dB –1.2 dB 43H C2H 0 0 1 0 0 0 dB –1.6 dB 44H 22H 0 0 1 0 1 0 dB –2.0 dB 45H A2H 0 0 1 1 0 0 dB –2.4 dB 46H 62H 0 0 1 1 1 0 dB –2.8 dB 47H E2H 0 1 0 0 0 –0.8 dB 0 dB 48H 12H 0 1 0 0 1 –0.8 dB –0.4 dB 49H 92H 0 1 0 1 0 –0.8 dB –0.8 dB 4AH 52H 0 1 0 1 1 –0.8 dB –1.2 dB 4BH D2H 0 1 1 0 0 –0.8 dB –1.6 dB 4CH 32H 0 1 1 0 1 –0.8 dB –2.0 dB 4DH B2H 0 1 1 1 0 –0.8 dB –2.4 dB 4EH 72H 0 1 1 1 1 –0.8 dB –2.8 dB 4FH F2H 1 0 0 0 0 –1.6 dB 0 dB 50H 0AH 1 0 0 0 1 –1.6 dB –0.4 dB 51H 8AH 1 0 0 1 0 –1.6 dB –0.8 dB 52H 4AH 1 0 0 1 1 –1.6 dB –1.2 dB 53H CAH 1 0 1 0 0 –1.6 dB –1.6 dB 54H 2AH 1 0 1 0 1 –1.6 dB –2.0 dB 55H AAH 1 0 1 1 0 –1.6 dB –2.4 dB 56H 6AH 1 0 1 1 1 –1.6 dB –2.8 dB 57H EAH 1 1 0 0 0 –2.4 dB 0 dB 58H 1AH 1 1 0 0 1 –2.4 dB –0.4 dB 59H 9AH 1 1 0 1 0 –2.4 dB –0.8 dB 5AH 5AH 1 1 0 1 1 –2.4 dB –1.2 dB 5BH DAH 1 1 1 0 0 –2.4 dB –1.6 dB 5CH 3AH 1 1 1 0 1 –2.4 dB –2.0 dB 5DH BAH 1 1 1 1 0 –2.4 dB –2.4 dB 5EH 7AH 1 1 1 1 1 –2.4 dB –2.8 dB 5FH FAH Note M: HEX value with MSB first L: HEX value with LSB first 36 Voice receive At reset µPD9930 4.2 DIGITAL INPUT/OUTPUT CONTROL An outline of digital input/output control is shown in Figure 4-5. The µ PD9930 can control input and output of the digital signal processor as follows. Digital input/output control Registers used Voice send data BPF operation processing execution/stop Connection and disconnection to tone output Voice send/ receive system Digital signal processing control register (DSPCR) Serial output terminal (SO) control Serial input terminal (SI) control Caution You must not connect nor disconnect tone output voice send/receive system in the tone operation. It causes malfunction. Figure 4-5 Digital Input/Output Control DSPCR Register address 0 1 1 0 TXACT TNACT SOACT Digital signal processor DSP I/F SOACT TXACT A/D SIACT BPF 1 = ON SO 1 0 DGND SIACT LPF D/A 0 1 = ON SI DGND Note TNACT 1 Tone generator Note Connected when TXACT = 0 and TNACT = 1. 37 µPD9930 4.2.1 Digital Signal Processing Control Register (DSPCR) This is a 4-bit register for controlling digital signal processor input/output. Figure 4-6 Digital Signal Processing Control Register Register address TXACT DSPCR D7 D6 D5 D4 D3 D2 D1 D0 0 1 1 0 TXACT TNACT SOACT SIACT Voice send data processing control 0 Stops voice send data digital BPF processing. 1 Executes voice send data digital BPF processing. TNACT Tone output control 0 Disconnects tone output from voice send/receive systems. 1 Connects tone output to voice send/receive systems. SOACT DSP interface output control Note 0 Sets serial output (SO) at low level 1 Outputs send data (or tone data) to the serial output (SO). SIACT . DSP interface input control Note 0 Sets serial input (SI) at low level 1 Inputs receive data to serial input (SI). . Note Test Control Register can set serial input/output terminal at low level, too (refer to 4.4.1 Test Control Register (TSTCR)). Caution Before specification of SOACT bit, be sure to write "0" for SIOOFF bit of Test Control Register. If "0" isn't written for SIOOFF bit, serial output terminal is set at low level, regardless of SOACT bit. 38 µPD9930 Table 4-4 Function Specification by Digital Signal Processing Control Register Register address HEXNote DSPCR Serial output control D7 D6 D5 D4 D3 D2 D1 D0 0 1 1 0 Control of output to D/A M L 0 0 0 0 Note 2 Note 3 60H 06H 0 0 0 1 Note 2 Voice receive signal output 61H 86H 0 0 1 0 0 0 1 1 0 1 0 0 Note 2 0 1 0 1 Note 2 0 1 1 0 Tone output 0 1 1 1 Tone output 1 0 0 0 1 0 0 1 1 0 1 0 Voice send signal output Note 3 6AH 56H 1 0 1 1 Voice send signal output Voice receive signal output 6BH D6H 1 1 0 0 Inhibiting command — — 1 1 0 1 Inhibiting command — — 1 1 1 0 Voice send signal output 1 1 1 1 Voice send signal output Inhibiting command Inhibiting command Tone output — — — — Remarks At reset 64H 26H Voice receive signal + tone output 65H A6H Tone output 66H 66H Voice receive signal + tone output 67H E6H Inhibiting command Inhibiting command Tone output — — — — 6EH 76H Voice receive signal + tone output 6FH F6H Notes 1. M: HEX value with MSB first L: HEX value with LSB first 2. Stops voice send data processing and serial output. 3. Stops voice receive data serial input and tone output. 39 µPD9930 4.3 TONE CONTROL An outline diagram of the tone generator is shown in Figure 4-7. Tone generation is by the tone 1 oscillation circuit and the tone 2 oscillation circuit. The tone 1 oscillation circuit generates high group frequency for DTMF and four types of single tones (tone 1 frequency). The tone 2 oscillation circuit generates low group frequency (tone 2 frequency) for DTMF. Dual tone is output by adding tone 1 frequency. In addition to registered tones, other frequencies can be registered. Also, GSM triple tone can be generated by special command. Examples of tone generation are shown in Figure 4-8. Tone control items are shown below. Tone control Tone frequency Registered tone User registration tone Registers used Specification of DTMF Tone frequency selection register Single tone: 400 Hz, 425 Hz, 2 kHz, 2.6 kHz (FRQSR) Selection of GSM triple tone Tone control register (TONCR) Registration of desired tone in 0.3 to 3.4 kHz range. Tone frequency selection register (FRQSR) (Single tone, dual tone) Expanded tone register 1 (EXPR1) Expanded tone register 2 (EXPR2) Generation pattern Registered pattern Desired pattern Gain 40 31.25 ms intermittence, 200 ms intermittence, 250 ms intermittence, 500 ms intermittence, 1s intermittence, 200 ms one-shot tone Tone control register (TONCR) Interrupted at desired interval by START/STOP command Control of tone output gain 0 to –30 dB (1 dB steps), –38.5 dB Tone gain control register (TNGCR) Figure 4-7 Tone Control FRQSR Register address 1 0 0 FRQSEL4 FRQSEL3 FRQSEL2 FRQSEL1 FRQSEL0 TNGCR Register address Tone 1 oscillation circuit 1 1 1 TNGAIN4 TNGAIN3 TNGAIN2 TNGAIN1 TNGAIN0 Tone 1 frequency 1209 Hz 1336 Hz 1477 Hz 1633 Hz 400 Hz 425 Hz 2000 Hz 2600 Hz –6 dB 0 to –30 dB (1-dB steps) –38.5 dB 3.1 dBm0 LPF output (receive signal) (Only sign code) Expanded tone register 1 Ringer output Expanded tone 1 frequency TNACTNote To D/A START/ STOP Serial output Tone 2 oscillation circuit Timer output Tone 2 frequency 697 Hz 852 Hz Expanded tone 2 frequency 1 –9 dB 0 1 TNMODE TNP2 TNP1 TNP0 START/ STOP 41 µPD9930 TONCR Register address 1 Note Digital signal processing control register bit 2 (Refer to Figure 4-6). 0 3.1 dBm0 Expanded tone register 2 Tone interval generation – ∞ dB 770 Hz 941 Hz µPD9930 Figure 4-8 Tone Generation Examples (a) When generating a busy tone (b) When generating DTMF "7" with continuous tone (400 Hz single tone, 500 ms intermittence) Busy tone generation Tone gain control register DTMF "7" generation Tone gain control register Set tone gain. Set tone gain. Tone frequency selection register Tone frequency selection register Set frequency to 400 Hz. Set frequency to DTMF "7". Tone control register Tone control register Select single tone Select 500 ms intermittent pattern. START/STOP = "1" (start) Select dual tone. Select continuous tone. START/STOP = "1" (start) END END (c) When generating GSM triple tone (d) When generating 200 ms intermittent user register tone (480 Hz single tone; coefficient = 0111011100B) GSM triple tone generation User register tone generation Tone gain control register Tone gein control register Set tone gain. Tone control register Select single tone Select GSM triple tone START/STOP = "1" (start) Set tone gain. Tone frequency selection register Specify "user register" Expanded tone register 1 END "100110" (registration command) + registration data (lower order 2 bits) setting Expanded tone register 1 Registration data (higher-order 8 bits) setting Tone control register Select single tone. Select 200 ms intermittent pattern. START/STOP = "1" (start) 42 END µPD9930 4.3.1 Tone Frequency Selection Register (FRQSR) This is a 5-bit register for specifying tone 1 (high group frequency for DTMF and four types of single tones) and tone 2 (low group frequency for DTMF) frequency combinations. Figure 4-9 Tone Frequency Selection Register Register address FRQSEL4 to FRQSEL0 00000 to 10100 FRQSR D7 D6 D5 1 0 0 D4 D3 D2 D1 D0 FRQSEL4 FRQSEL3 FRQSEL2 FRQSEL1 FRQSEL0 Tone frequency selection Refer to Table 4-5 Function Specification by Tone Frequency Selection Register. Write operation in this register is instantaneously executed and retained when a command is received, but change of tone generation or generating tone is executed only when "1" is written for START/STOP control bit of the tone control register (refer to Figure 4-11 Tone Control Register). When a user registration tone is selected, the tone specified by the expanded tone register (refer to Figure 4-10 Expanded Tone Frequency Registration Procedure) is generated. Caution Do not input a command that sets a tone oscillation frequency after inputting a tone oscillation command (writing "1" to the START/STOP control bit of the tone control register). 43 µPD9930 Table 4-5 Function Specification by Tone Frequency Selection Register Register address HEXNote 1 FRQSR D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 DTMF function Tone 1 frequency Tone 2 frequency M L 0 0 0 0 0 DTMF “1” 1209 Hz 697 Hz 80H 01H 0 0 0 0 1 DTMF “2” 1336 Hz 697 Hz 81H 81H 0 0 0 1 0 DTMF “3” 1477 Hz 697 Hz 82H 41H 0 0 0 1 1 DTMF “A” 1633 Hz 697 Hz 83H C1H 0 0 1 0 0 DTMF “4” 1209 Hz 770 Hz 84H 21H 0 0 1 0 1 DTMF “5” 1336 Hz 770 Hz 85H A1H 0 0 1 1 0 DTMF “6” 1477 Hz 770 Hz 86H 61H 0 0 1 1 1 DTMF “B” 1633 Hz 770 Hz 87H E1H 0 1 0 0 0 DTMF “7” 1209 Hz 852 Hz 88H 11H 0 1 0 0 1 DTMF “8” 1336 Hz 852 Hz 89H 91H 0 1 0 1 0 DTMF “9” 1477 Hz 852 Hz 8AH 51H 0 1 0 1 1 DTMF “C” 1633 Hz 852 Hz 8BH D1H 0 1 1 0 0 DTMF “∗” 1209 Hz 941 Hz 8CH 31H 0 1 1 0 1 DTMF “0” 1336 Hz 941 Hz 8DH B1H 0 1 1 1 0 DTMF “#” 1477 Hz 941 Hz 8EH 71H 0 1 1 1 1 DTMF “D” 1633 Hz 941 Hz 8FH F1H 1 0 0 0 0 400 HzNote 2 Indefinite value 90H 09H 1 0 0 0 1 425 HzNote 2 Indefinite value 91H 89H 2 kHz Note 2 Remarks 1 0 0 1 0 Indefinite value 92H 49H 1 0 0 1 1 2.6 kHzNote 2 Indefinite value 93H C9H At reset 1 0 1 0 0 User registration User registration 94H 29H 1 0 1 0 1 Inhibiting command — — 1 0 1 1 0 Inhibiting command — — 1 0 1 1 1 Inhibiting command — — Notes 1. M: HEX value with MSB first L: HEX value with LSB first 2. This is single tone. When specifying this tone, be sure to specify the tone control register in the single tone mode (refer to Figure 4-11 Tone Control Register). Remark For DTMF tone generation, specify the tone control register in the dual tone mode (refer to Figure 4-11 Tone Control Register). If the register is specified in the single tone mode, only the high group tone (tone 1 frequency) is generated. 44 µPD9930 4.3.2 Expanded Tone Registers (EXPR1, EXPR2) (1) Expanded Tone Frequency Registration Procedure The µPD9930 can register desired tone frequencies (expanded tone frequencies) in 0.3 to 3.4 kHz range. Expanded tone register 1 (EXPR1) is for registering expanded tone 1 frequency (high group frequency for DTMF and single tone). Expanded tone register 2 (EXPR2) is for registering expanded tone 2 frequency (low frequency for DTMF). The frequency must be specified by 10-bit coefficient (2's complement). Registration of single tone is done with EXPR1 (single-tone generation is impossible by EXPR2) (refer to Figure 4-10 (a)). When registering dual tone, set high group in EXPR1 and low group in EXPR2. Write operation in this register can be executed by continuously writing the expanded tone registration command and expanded tone data command (refer to Figure 4-10). Once registered, the frequency is valid until reset or updated. Figure 4-10 Expanded Tone Frequency Registration Procedure (a) Expanded tone 1 frequency registration procedure <1> Set expanded tone 1 registration command in EXPR1. Expanded tone 1 registration command D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 1 1 0 EA1 EA0 EXPR1 <2> Set higher-order 8 bits of expanded tone coefficient (expanded tone 1 data command) in EXPR1. Expanded tone 1 data command D7 D6 D5 D4 D3 D2 D1 D0 EA9 EA8 EA7 EA6 EA5 EA4 EA3 EA2 EXPR1 Remark EA9 to EA0: Tone 1 frequency 10-bit coefficient (b) Expanded tone 2 frequency registration procedure <1> Set expanded tone 2 registration command in EXPR2. Expanded tone 2 registration command D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 1 1 1 EB1 EB0 EXPR2 <2> Set higher-order 8 bits of expanded tone coefficient (expanded tone 2 data command) in EXPR2. Expanded tone 2 data command D7 D6 D5 D4 D3 D2 D1 D0 EB9 EB8 EB7 EB6 EB5 EB4 EB3 EB2 EXPR2 Remark EB9 to EB0: Tone 2 frequency 10-bit coefficient Caution After executing the expanded tone registration command, the next command is written as expanded tone data, so continuously execute the expanded tone data command. 45 µPD9930 (2) Expanded Tone Data Determination Method The coefficient E of the tone frequency fe (0.3 to 3.4 kHz) to be generated is determined by the following formula. E = COS (2π fe/fs) fs = 8 kHz Coefficient E: Sign bit 1 bit + 9 bits below the decimal point (Coefficient: 2's complement) Example When specifying 400 Hz single tone COS (2π x 400/8000) = COS (π x 0.1) = COS (0.3141592653......) = 0.951056516...... = (0.11110011X) b (Higher-order 9 bits are determined.) Next, the least significant bit is determined. When (0.111100110) b = 0.94921875 2π fe' x fs = COS–1 (0.94921875) = 0.320052983 fe' = 0.320052983 x fs/(2π) fe' = 407.504115 When (0.111100111) b = 0.951071875 2π fe" x fs = COS–1 (0.951071875) = 0.314109559 fe" = 0.314109559 x fs/(2π) fe" = 399.524415 Since fe" is nearest to 400 Hz, the coefficient to be registered is (0.111100111) b = (1E7) H. 0 1 1 1 1 0 0 1 1 1 ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ EA9 EA8 EA7 EA6 EA5 EA4 EA3 EA2 EA1 EA0 The error of oscillation frequency by rounding 10-bit coefficient is below ±5 Hz (MAX. at 300 Hz → ±1.7 %) for all frequencies. About ±1.67 % near 300 Hz (±5 Hz) About ±1.00 % near 500 Hz (±5 Hz) About ±0.40 % near 1 kHz (±5 Hz) About ±0.25 % near 2 kHz (±5 Hz) About ±0.16 % near 3 kHz (±5 Hz) Coefficient is negative number in fe > 2.0 kHz. 46 µPD9930 4.3.3 Tone Control Register (TONCR) This is a 5-bit register for controlling single tone/dual tone specification, generation pattern selection, and generation and stopping. Figure 4-11 Tone Control Register Register address D7 D6 D5 D4 D3 D2 D1 D0 1 0 1 TNMODE TNP2 TNP1 TNP0 START /STOP TNMODE Single tone/dual tone specification 0 Single tone mode 1 Dual tone mode TONCR Remarks At reset TNP2 TNP1 TNP0 Generation pattern selection 0 0 0 Continuous tone generation 0 0 1 31.25 ms tone, 31.25 ms no tone repeated 0 1 0 200 ms tone, 200 ms no tone repeated 0 1 1 250 ms tone, 250 ms no tone repeated 1 0 0 500 ms tone, 500 ms no tone repeated 1 0 1 1 s tone, 1s no tone repeated 1 1 0 GSM triple tone generated Note 1 1 1 1 200 ms interval tone generated (one shot tone) Remarks At reset START/STOP Tone generation/stop control 0 Stop ("1" → "0", "0" → "0" both valid) Note 2 1 Validation of tone ferquency selection register setting data, start of generation ("1" → "1", "0" → "1" both valid) Remarks At reset Notes 1. 950 Hz tone 333 ms, 1400 Hz tone 333 ms, 1800 Hz tone 333 ms, 1 s no tone repeated. 2. Do not input a command that sets a tone oscillation frequency after inputting a tone oscillation command (writing "1" to the START/STOP control bit of the tone control register). Remark When the regeneration pattern is specified as "110", it becomes GSM triple tone command, so tone generation forcibly enters single tone mode. Tone generation and change of a tone that is being generated is executed only when "1" is written for START/ STOP control bit (D0 bit) (refer to Figure 4-11 and Table 4-6). 47 µPD9930 Table 4-6 Function Specification by Tone Control Register Register address HEXNote TONCR Tone control conditions D7 D6 D5 D4 D3 D2 D1 D0 1 0 1 M X X X X 0 Tone stop A0H 05H 0 0 0 0 1 Continuous single tone generation A1H 85H 0 0 0 1 1 31.25 ms intermittent single tone generation A3H C5H 0 0 1 0 1 200 ms intermittent single tone generation A5H A5H 0 0 1 1 1 250 ms intermittent single tone generation A7H E5H 0 1 0 0 1 500 ms intermittent single tone generation A9H 95H 0 1 0 1 1 1 s intermittent single tone generation ABH D5H 0 1 1 0 1 GSM triple tone generation ADH B5H 0 1 1 1 1 200 ms one-shot single tone generation AFH F5H 1 0 0 0 1 Continuous dual tone generation B1H 8DH 1 0 0 1 1 31.25 ms intermittent dual tone generation B3H CDH 1 0 1 0 1 200 ms intermittent dual tone generation B5H ADH 1 0 1 1 1 250 ms intermittent dual tone generation B7H EDH 1 1 0 0 1 500 ms intermittent dual tone generation B9H 9DH 1 1 0 1 1 1 s intermittent dual tone generation BDH BDH 1 1 1 1 1 200 ms one-shot dual tone generation BFH FDH Note M: HEX value with MSB first L: HEX value with LSB first Remark X: Don't care 4.3.4 Tone Gain Control Register (TNGCR) This is a 5-bit register for controlling the tone output gain. Figure 4-12 Tone Gain Control Register Register address TNGAIN4 to TNGAIN0 00000 to 11111 48 L TNGCR D7 D6 D5 1 1 1 D4 D3 D2 D1 D0 TNGAIN4 TNGAIN3 TNGAIN2 TNGAIN1 TNGAIN0 Tone gain selection (Refer to Table 4-7 Function Specification by Tone Gain Control Register). 0 to –30 dB (1 dB steps), –38.5 dB µPD9930 Table 4-7 Function Specification by Tone Gain Control Register Register address HEXNote TNGCR D7 D6 D5 D4 D3 D2 D1 D0 1 1 1 Tone gain M L 0 0 0 0 0 0 dB E0H 07H 0 0 0 0 1 –1 dB E1H 87H 0 0 0 1 0 –2 dB E2H 47H 0 0 0 1 1 –3 dB E3H C7H 0 0 1 0 0 –4 dB E4H 27H 0 0 1 0 1 –5 dB E5H A7H 0 0 1 1 0 –6 dB E6H 67H 0 0 1 1 1 –7 dB E7H E7H 0 1 0 0 0 –8 dB E8H 17H 0 1 0 0 1 –9 dB E9H 97H 0 1 0 1 0 –10 dB EAH 57H 0 1 0 1 1 –11 dB EBH D7H 0 1 1 0 0 –12 dB ECH 37H 0 1 1 0 1 –13 dB EDH B7H 0 1 1 1 0 –14 dB EEH 77H 0 1 1 1 1 –15 dB EFH F7H 1 0 0 0 0 –16 dB F0H 0FH 1 0 0 0 1 –17 dB F1H 8FH 1 0 0 1 0 –18 dB F2H 4FH 1 0 0 1 1 –19 dB F3H CFH 1 0 1 0 0 –20 dB F4H 2FH 1 0 1 0 1 –21 dB F5H AFH 1 0 1 1 0 –22 dB F6H 6FH 1 0 1 1 1 –23 dB F7H EFH 1 1 0 0 0 –24 dB F8H 1FH 1 1 0 0 1 –25 dB F9H 9FH 1 1 0 1 0 –26 dB FAH 5FH 1 1 0 1 1 –27 dB FBH DFH 1 1 1 0 0 –28 dB FCH 3FH 1 1 1 0 1 –29 dB FDH BFH 1 1 1 1 0 –30 dB FEH 7FH 1 1 1 1 1 –38.5 dB FFH FFH Remarks At reset Note M: HEX value with MSB first L: HEX value with LSB first 49 µPD9930 4.4 TEST MODE CONTROL The µ PD9930 has the following test functions. Test function DAI test function This test function is stipulated in GSM11.10. Test mode selection can be controlled by external terminal (TC1 or TC2) or internal register (ITC1, ITC2). Analog loopback function Send data after BPF processing is input to LPF. DSP interface input/ output control function SO, SI, SCLK and SEN terminals can be set at low level. An outline of test mode control is shown in Figure 4-13. 50 Registers used Test control register (TSTCR) µPD9930 Figure 4-13 Test Mode Operation (a) DAI (speech encoder test mode) (b) DAI (speech decoder test mode) Mobile Station Mobile Station µ PD9930 µ PD9930 DSP DSP I/F SO DSP DSP I/F speech encoder SI TX DAI speech decoder RX DAI DI DO System simulator 1 TC1 0 TC2 0 TC1 1 TC2 (c) DAI (A/D, D/A test mode) System simulator (d) Analog loopback mode µ PD9930 Mobile Station µ PD9930 DAI A/D D/A BPF LPF A/D BPF D/A LPF DO System simulator DI TC1 TC2 1 1 51 µPD9930 4.4.1 Test Control Register (TSTCR) This is a 5-bit control register for selecting the test mode. ITC1, ITC2 become valid at the rising edge of DRSTB. For the precautions when using DAI, refer to 2.1.9 DAI (Digital Audio Interface). Figure 4-14 Test Control Register Register address TSTCR D7 D6 D5 D4 D3 D2 D1 1 1 0 TCMODE ITC2 ITC1 LOOPBK 0 Specification of test mode by external terminals TC1 and TC2 At reset 1 Specification of test mode by test control registers ITC1 and ITC2 DAI test mode specification Remarks 0 Normal operation At reset 0 1 Speech encoder test mode 1 0 Speech decoder test mode 1 1 Acoustic device, A/D, D/A test mode ITC1 0 Analog loopback specification Remarks 0 Normal operation At reset 1 Analog loopback LOOPBK SIOOFF DSP interface input/output terminal control SIOOFF Remarks TCMODE DAI test mode control method selection ITC2 D0 Remarks 0 Normal operation 1 Setting of terminals SO, SI, SCLK, and SEN to low level At reset Remark The analog loopback mode and the DAI test mode cannot be specified at the same time. 52 µPD9930 5. ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS (T A = 25˚C, DGND = AGND1 to AGND4 = 0 V) Item Symbol Conditions Ratings Unit Supply Voltage VDD AVDD1, AVDD2, DVDD –0.3 to +5.5 V Analog Input Voltage VAIN All analog input pins –0.3 to VDD +0.3 V Digital Input Voltage VDIN All digital input pins –0.3 to VDD +0.3 V Analog Output Pin Applied Voltage VAOUT All analog output pins –0.3 to VDD +0.3 V Digital Output Pin Applied Voltage VDOUT All digital output pins –0.3 to VDD +0.3 V Operating Ambient Temperature TA –30 to +85 ˚C Storage Temperature Tstg –65 to +150 ˚C Cautions 1. Connect the AGND1 through AGND4 pins and DGND pin to an analog ground line near µPD9930 pins. Connect the DVDD, AVDD1, AVDD2 pins to an analog power supply line near µPD9930 pins. 2. Do not connect output (and bidirectional) pins each other. Do not connect output (or bidirectional) pins directly to the VDD, VCC, or GND line. However, open drain pin and open collector pin can be directly connected to VDD, VCC, or GND line. If timing design is made so that no signal conflict occurs, three-state pins can also be connected directly to three-state pins of external circuit. 3. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics. 53 µPD9930 RECOMMENDED OPERATING RANGE (T A = –30 to +85˚C) (1) DC Condition Item Symbol Conditions MIN. TYP. 3.0 MAX. Unit Supply Voltage VDD AVDD1, AVDD2, DVDD 2.7 3.6 V High Level Input Voltage VIH All digital input pins 0.7 VDD VDD V Low Level Input Voltage VIL All digital input pins 0 0.3 VDD V Analog Input Voltage VIA All analog input pins 0.6 1.8 V VMIC Differential: MICI+, MICI– 1.2 Vp-p Gain Setting Range GMIC Set with external resistor 15 Load Resistance RLMIC Includes gain setting resistance 50 Load Capacitance CLMIC Microphone Input Analog Input Voltage 33 dB kΩ 20 pF 1.2 Vp-p 10 dB Accessory Input Analog Input Voltage VAUXI XAUXI– Gain Setting Range GAUXI Set with external resistor Load Resistance RLAUXI Includes gain setting resistance Load Capacitance CLAUXI 0 300 kΩ 20 pF 1.2 Vp-p Pre-filter + Mixer Input Analog Input Voltage VMIXI MIXI Accessory Output Load Resistance RLAUXO Load Capacitance CLAUXO 100 kΩ 100 pF Receiver 1 Output Load Resistance RLREC1 Load Capacitance CLREC1 100 kΩ 20 pF 1.2 Vp-p Receiver 2 Output Analog Input Voltage VREC2 REC2I- Gain Setting Range GREC2 Set with external resistor Load Resistance RLREC2 60 nF series Load Capacitance CLREC2 2 kΩ series CLACOM XACOMO, RACOMO –∞ +10 2 dB kΩ 60 nF 10 µF Reference Voltage Output Load Capacitance 0.2 (2) Frame Signal (FSYNC) and Reset Signal (RESETB) Item MIN. TYP. fs 7.995 8.000 FSYNC High Level Width tWHS 2.0 µs FSYNC Low Level Width tWLS 2.0 µs FSYNC Frequency Symbol Conditions MAX. 8.005 Unit kHz FSYNC Rise Time tr 20 ns FSYNC Fall Time tf 20 ns RESETB Low Level Width 54 tRSL 260 ns µPD9930 (3) Microcontroller Interface Item Symbol Conditions MIN. TYP. MAX. Unit MCLK Cycle Time tMCY 240 ns MCLK High Level Width tMCH 100 ns MCLK Low Level Width tMCL 100 ns MCLK Rise Time tMR 20 ns MCLK Fall Time tMF 20 ns MDAT Setup Time to MSTR ↑ tSUMDA 50 ns MDAT Hold Time from MCLK ↑ tHMDA 50 ns MSTR High Level Width tWMST 320 ns MCLK Setup Time to MSTR ↑ tSUMCK 0 ns MSTR Setup Time to MCLK ↑ tSUMST 100 ns (4) DSP Interface Item Symbol Conditions MIN. TYP. MAX. Unit SI Setup Time to SCLK ↓ tSUSI 200 ns SI Hold Time from SCLK ↓ tHSI 200 ns (5) DAI Item Symbol Conditions MIN. TYP. MAX. Unit DI Setup Time to DCLK ↑ tSUDI 200 ns DI Hold Time from DCLK ↑ tHDI 200 ns TC1, TC2 Rise Time tTR 50 ns TC1, TC2 Fall Time tTF 50 ns DRSTB Low Level Width tDRSL 130 µs DRSTB Rise Time tDRR 20 ns DRSTB Fall Time tDRF 20 ns DAI Mode Setting Time 1 tTCF 60 ms DAI Mode Setting Time 2 tTCR 260 µs REQB Low Level Width tDRQL 130 µs REQB High Level Width tDRQH 130 µs REQB Rise Time tDRQR 20 ns REQB Fall Time tDRQF 20 ns 55 µPD9930 CAPACITANCE (TA = 25˚C) Item Symbol Conditions MIN. TYP. MAX. Unit Digital Output Pin Capacitance COD f = 1 MHz 20 pF Digital Input Pin Capacitance CID f = 1 MHz 20 pF DC CHARACTERISTICS (TA = 25˚C, V DD = 2.7 to 3.6 V (GND standard)) (1) Current Consumption Item Symbol Conditions MIN. TYP. MAX. Unit Circuit Current in Normal Mode IDD1 Microphone input (1020 Hz: –10 dBm0) Accessory input: Power down serial input (1020 Hz: –10 dBm0) Accessory output: Power up Receiver 1, 2: Power up 7.0 9.0 mA Circuit Current in DAI Operation IDD2 Microphone input (1020 Hz: –10 dBm0) Accessory input: Power down serial input (1020 Hz: –10 dBm0) Accessory output: Power up Receiver 1, 2: Power up 7.5 10.0 mA Circuit Current in Standby Mode IDD3 DI, DRSTB, TC1, TC2: Open FSYNC: 8 kHz Other digital input pins: 0 or VDD 50 100 µA TYP. MAX. Unit 1.0 µA (2) Digital Part Item Digital Input Leak Current Pull-Up/Down Current Symbol Conditions ILH VI = VDD ILL VI = 0 IIL VDD = 3.3 V, 0 ≤ VI ≤ VDD 100 µA 0.4 V Low Level Output Voltage VOL IOL = 2.0 mA High Level Output Voltage VOH IOH = –2.0 mA 56 MIN. µA –1.0 2.4 V µPD9930 (3) Analog Part Item Symbol Conditions MIN. TYP. MAX. Unit 0 dB –3.0 –2.8 dB Pre-filter + Mixer Volume Range GPRF –3 Volume Accuracy ∆GPRF Volume 0 dB standard Cross-Talk 1 between Input Channels CTIN1 Microphone input amplifier: Power down MICI = 1.2 Vp-p XAUXI– = 0 Vp-p Accessory input gain setting: 0 dB –45 dB Cross-Talk 2 between Input Channels CTIN2 Accessory input amplifier: Power down MICI = 0 Vp-p XAUXI– = 1.2 Vp-p Accessory input gain setting: 0 dB –45 dB VAMAX 1.2 Vp-p Maximum Output Voltage VR1MAX 1.2 Vp-p Volume Range GREC1 0 dB –3.2 Accessory Output Maximum Output Voltage Receiver 1 Output Volume Accuracy ∆GREC1 –31 Volume: 0 to –16 dB –1.5 –1.0 –0.5 dB VolumeNote: –17 to –31 dB –2.0 –1.0 0.0 dB 4 Vp-p Receiver 2 Output Maximum Output Voltage VR2MAX Distortion factor 4 % (MAX.) VACOM XACOMO, RACOMO Reference Voltage Output Output Voltage 1.2 V Note Simple decrease in the gain due to drop of volume is guaranteed. (4) Tone Generator Item Output Signal Level Frequency Deviation Distortion Factor Tone Volume Range Tone Volume Accuracy Symbol Conditions MIN. TYP. MAX. VTN1 Tone 1 –2.93 –2.73 VTN2 Tone 2 –5.93 –5.73 ∆FTN 0.3 to 3.4 kHz –5 +5 Accessory output 30 TNSD GTN ∆GTN –1.4 dBm0 Hz dB –38.5 Volume: 0 to –30 dB (1 dB steps) Unit –1.0 0 dB –0.8 dB 57 µPD9930 AC CHARACTERISTICS (1) DSP Interface (TA = –30 to +85˚C, V Item DD = 2.7 to 3.6 V, CL = 100 pF) Symbol Conditions MIN. TYP. MAX. Unit SCLK Cycle Time tSCY 3906 ns SCLK High Level Width tSCH 1953 ns SCLK Low Level Width tSCL 1953 ns SCLK Rise Time tSR 20 ns SCLK Fall Time tSF 20 ns SCLK Delay Time from FSYNC ↑ tDSCLK 1.0 µs SEN ↑ Delay Time from FSYNC ↑ tDSENR 80 ns SEN ↓ Delay Time from SCLK ↑: Mode 1 SEN ↓ Delay Time from SCLK ↓: Mode 2 tDSENF 80 ns SO Output Delay Time tDSO 40 ns from SCLK ↑: Mode 1 SO Output Delay Time from SCLK ↓: Mode 2 (2) DAI (TA = –30 to +85˚C, V Item DD = 2.7 to 3.6 V, CL = 100 pF) Symbol Conditions MIN. TYP. MAX. Unit DCLK Cycle Time tDCY 9615 ns DCLK High Level Width tDCH 4808 ns DCLK Low Level Width tDCL 4808 ns DCLK Rise Time tDR 20 ns DCLK Fall Time tDF 20 ns DCLK Delay Time from FSYNC ↑ tDDCLK 200 ns DO Output Delay Time from DCLK ↓ tDDO 200 ns (3) Others (Digital Output) (TA = –30 to +85˚C, V Item Symbol DD = 2.7 to 3.6 V, CL = 100 pF) Conditions MIN. TYP. MAX. Unit TIMER/RINGER Rise Time tDDR TIMER pin and RINGER pin 50 ns TIMER/RINGER Fall Time tDDF TIMER pin and RINGER pin 50 ns 58 µPD9930 Frame signal (FSYNC) 1/fs tWHS tr FSYNC tf tWLS Remark During normal operation or the power up/down sequence, be sure to input the frame signal. Reset signal (RESETB) RESETB tRSL Remarks 1. The reset signal is input as it is without shaping, so take full precautions against noise. 2. A power on reset circuit is not incorporated, so be sure to set RESET to low after turning the power on. Microcontroller interface timing tWMST MSTR tMCY tMCH tSUMCK tSUMST MCLK tMR tSUMDA MDAT D0 tMCL tMF tHMDA D1 D2 D6 D7 D0 Remark D0 to D7: Microcontroller command (LSB first) 59 µPD9930 DSP interface timing (mode 1) SCLK tDSCLK tSCY tSCL tSF tSCH tSR FSYNC tDSENR tDSENF SEN tDSO SO D15 D14 tSUSI SI don't care D15 D13 D1 D0 tHSI D14 D13 don't care D0 DSP interface timing (mode 2) SCLK tSCY tDSCLK tSCH tSR tSCL tSF FSYNC tDSENF tDSENR SEN tDSO D15 SO tSUSI SI 60 don't care D15 D14 D13 D1 D0 tHSI D14 D13 D0 don't care µPD9930 DAI input timing FSYNC tDDCLK tDCH tDCY tDR DCLK tSUDI DI D12 tHDI tDCL D11 D10 tDF D9 D8 D7 Remark D12 to D0: Input data (MSB first) DAI output timing FSYNC tDCY tDDCLK tDCH tDR DCLK tDCL tDDO DO D12 D11 D10 tDF D9 D8 D7 Remark D12 to D0: Output data (MSB first) 61 µPD9930 TC1, TC2, DRSTB input timing TC1, TC2 tTR, tTF tTCR tTCF tDRF tTR, tTF tDRR DRSTB tDRSL TIMER, RINGER output timing tDDR tDDF TIMER, RINGER REQB input timing tDRQF tDRQR tDRQH REQB tDRQL 62 µPD9930 TRANSMISSION CHARACTERISTICS Transmission characteristics are as indicated below unless otherwise specified. • Analog input Analog input signal (–10 dBm0, 1020 Hz) → accessory input part Accessory input: Set gain 0 dB Microphone input: Power down Pre-filter + mixer: Set gain 0 dB • Analog output Analog output signal → accessory output part Receiver output: Power down • Digital gain set Send and receive: 0 dB • Digital input signal level: 0 dBm0 • TA = 25˚C, V DD = 2.7 to 3.6 V (GND standard) (1) Send/Receive Zero Transmission Level (0 dBm0 level) Item Symbol Conditions MIN. TYP. MAX. Unit Send Zero Transmission Level V0TLPX 600 Ω standard –8.4 dBm Receive Zero Transmission V0TLPR 600 Ω standard –8.4 dBm Level (2) Gain Characteristics Item Symbol Conditions MIN. TYP. MAX. Unit Send Gain Deviation GX –0.5 +0.5 dB Receive Gain Deviation GR –0.5 +0.5 dB Send Gain Deviation Temperature Power Fluctuation ∆GX –0.4 +0.4 dB Receive Gain Deviation Temperature Power Fluctuation ∆GR –0.4 +0.4 dB MAX. Unit (3) Transmission Loss Level Item Send Transmission Loss Level Receive Transmission Loss Level Symbol GTX GTR Conditions MIN. TYP. +3 to –40 dBm0 –0.4 +0.4 dB –40 to –50 dBm0 –0.6 +0.6 dB –50 to –55 dBm0 –1.2 +1.2 dB +3 to –40 dBm0 –0.4 +0.4 dB –40 to –50 dBm0 –0.6 +0.6 dB –50 to –55 dBm0 –1.2 +1.2 dB 63 µPD9930 (4) Transmission Gain Frequency Characteristics Item Send Transmission Gain Frequency Characteristics Receive Transmission Gain Frequency Characteristics Symbol Conditions MIN. TYP. MAX. –23 Unit GRX1 60 Hz dB GRX2 200 Hz –2.5 0 dB GRX3 0.3 to 3.0 kHz –0.3 +0.3 dB GRX4 3.2 kHz –0.65 +0.3 dB GRX5 3.4 kHz –0.8 0 dB GRX6 4.0 kHz –14 dB GRX7 4.6 kHz or more –28 dB GRR3 0.3 to 3.0 kHz –0.3 +0.3 dB GRR4 3.2 kHz –0.65 +0.3 dB GRR5 3.4 kHz –0.8 0 dB GRR6 4.0 kHz –14 dB GRR7 4.6 kHz or more –28 dB (5) Noise Characteristics Item Send Noise Symbol MIN. Microphone power down, XAUXI– → ACOM, gain 0 dB, C message filter TYP. MAX. Unit 25 dBrnc0 –65 dBm0c 25 dBrnc0 –65 dBm0c Send input → Receive output –50 dBm0 CTTR No sidetone pass, microphone power down input 0 dBm0 and 1020 Hz from XAUXI– input +0 code from SI –60 dB Cross-Talk between Receive and Send Channels CTRT No sidetone pass, microphone power down XAUXI– → ACOM input 0 dBm0 and 1020 Hz from SI –60 dB Power Supply Voltage Variation Rejection PSRR VDD ±100 mV0-p signal application f = 0 to 3.4 kHz Receive Noise Single Frequency Noise Cross-Talk between Send NXC Conditions NRC1 NSF and Receive Channels 64 C message filter, input +0 code from SI 30 dB µPD9930 (6) Distortion Factor Characteristics Item Symbol Send Channel Total Power Distortion Factor SDX Receive Channel Total SDR Power Distortion Factor Conditions MIN. 0 to –10 dBm0 35 –40 dBm0 25 –45 dBm0 20 0 to –10 dBm0 35 –40 dBm0 25 –45 dBm0 20 Absolute Delay DA XAUXI– → RAUXO Delay Distortion Frequency Characteristics DO XAUXI– → RAUXO TYP. MAX. Unit dB dB 550 µs 500 Hz 1.40 ms 600 Hz 0.70 1 kHz 0.20 2.6 kHz 0.20 2.8 kHz 1.40 Send Transmission Gain Frequency Characteristics 1 (GRX) 5 0 –5 –10 Send transmission gain (dB) –15 –20 –25 –30 –35 –40 –45 –50 –55 –60 –65 –70 –75 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Frequency (kHz) 65 µPD9930 Send Transmission Gain Frequency Characteristics 2 (GRX) 0.1 0 –0.1 Send transmission gain (dB) –0.2 –0.3 –0.4 –0.5 –0.6 –0.7 –0.8 –0.9 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 Frequency (kHz) Receive Transmission Gain Frequency Characteristics 1 (GRR) 5 0 –5 –10 –15 Receive transmission gain (dB) –20 –25 –30 –35 –40 –45 –50 –55 –60 –65 –70 –75 0 66 1 2 3 4 5 6 7 8 9 Frequency (kHz) 10 11 12 13 14 15 16 µPD9930 Receive Transmission Gain Frequency Characteristics 2 (GRR) 0.1 0 –0.1 Receive transmission gain (dB) –0.2 –0.3 –0.4 –0.5 –0.6 –0.7 –0.8 –0.9 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 Frequency (kHz) 67 µPD9930 Send/receive zero transmission level (0 dBm0 level) is explained below for your reference. (a) Send zero transmission level Analog output signal level at which the digital input signal level of the D/A converter becomes 0 dBm0. (b) Receive zero transmission level Analog input signal level at which the digital output signal level of the A/D converter becomes 0 dBm0. (c) Analog signal level (dBm) The conversion expression of the amplitude voltage of a signal and an analog signal level is as follows: X = 10 logW X: analog signal level (dBm) W: analog signal power (mW) W = (V2/R) x 103 V: effective value of analog signal (AC) (Vrms) R: resistance (Ω) With the µPD9930, the signal voltage (effective value) can be calculated if R = 600 Ω and X = –8.4 dBm are substituted. W = 0.1445 (mW) V = 0.294 (Vrms) To calculate V0-p, multiply the signal voltage (effective value) by √2. V0-p = 0.416 (V) (d) Digital signal level (dBm0) Signal level where the level of the full swing of the digital output value of the A/D converter and the digital input value of the D/A converter is considered to be 3.17 dBm0 (the amplitude of the analog signal is 1.2 Vp-p where the gain of the microphone input or accessory input is 0 dB). <Level diagram> This diagram indicates the range in which adjustments can be made by using each amplifier and gain control function. Example: Input level at which digital output of linear codec is –10 dBm0 is –33 dBm. (Conditions) Microphone amplifier gain during microphone input: 15 dB Analog gain control: 0 dB Digital gain control: 0 dB Output level at which digital input of linear codec is –10 dBm0 is –18.4 dBm. (Conditions) During receiver output Analog gain control: 0 dB Digital gain control: 0 dB 68 µPD9930 Voice send level diagram (microphone input) + Vref – Analog gain control A/D Digital gain control [dBm] 0 [dBm0] 15 to 33 dB 0 dB or –3 dB –10 0 to –2.8 dB (0.4 dB steps) 0 –10 dBm0 –10 –20 –30 –33.4 dBm –15.8 dBm0 –20 –30 –40 –41.4 dBm –40 –50 –50 –60 –60 Remarks 1. Thick line: Indicates case where gain of microphone amplifier is set to 15 dB, gain of analog gain control to 0 dB, and gain of digital gain control to 0 dB. Thin line: Indicates case where gain of microphone amplifier is set to 33 dB, gain of analog gain control to –3 dB, and gain of digital gain control to –2.8 dB. 2. Overload level: 3.17 dBm0. 69 µPD9930 Voice receive level diagram (receiver output) Receiver 1 [dBm] 0 Analog gain control 0 to –31 dB (1 dB steps) D/A Digital gain control 0 to –2.4 dB (0.8 dB steps) [dBm0] 0 –10 –18.4 dBm –10 dBm0 –10 –20 –20 –30 –30 –40 –40 –50 –51.8 dBm –50 –60 –60 Remarks 1. Thick line: Indicates case where gain of analog gain control is set to 0 dB and gain of digital gain control to 0 dB. Thin line: Indicates case where gain of analog gain control is set to –31 dB and gain of digital gain control to –2.4 dB. 2. Overload level: 3.17 dBm0. 70 µPD9930 Voice send level diagram (accessory input) + Vref – Analog gain control A/D Digital gain control [dBm] 0 [dBm0] 0 to 10 dB 0 dB or –3 dB –10 –18.4 dBm 0 to –2.8 dB (0.4 dB steps) –10 dBm0 –10 –20 –15.8 dBm0 –30 0 –20 –28.4 dBm –30 –40 –40 –50 –50 –60 –60 Remarks 1. Thick line: Indicates case where gain of microphone amplifier is set to 0 dB, gain of analog gain control to 0 dB, and gain of digital gain control to 0 dB. Thin line: Indicates case where gain of microphone amplifier is set to 10 dB, gain of analog gain control to –3 dB, and gain of digital gain control to –2.8 dB. 2. Overload level: 3.17 dBm0. 71 µPD9930 Voice receive level diagram (accessory output) Accessory output [dBm] 0 0 dB (fix) D/A Digital gain control 0 to –2.4 dB (0.8 dB steps) [dBm0] 0 –10 –18.4 dBm –10 dBm0 –10 –20 –20.8 dBm –20 –30 –30 –40 –40 –50 –50 –60 –60 Remarks 1. Thick line: Indicates case where gain of digital gain control is set to 0 dB. Thin line: Indicates case where gain of digital gain control is set to –2.4 dB. 2. Overload level: 3.17 dBm0. 72 1 µF 8 kHz From RESET circuit From DSP 12 kΩ 100 kΩ to 500 kΩ 21 20 19 18 17 16 15 14 13 MICI– MICI+ AGND4 AGND3 AGND2 AGND1 DGND FSYNC RESETB 23 MIXI 300 kΩ 12 REQB 22 MICO 0.1 µF DSPSEL 11 24 XAUXO 100 kΩ to 300 kΩ Accessory input VDD (mode 1) or GND (mode 2) RINGER 10 6. APPLIED CIRCUIT EXAMPLE 1 µF 25 XAUXI– 2.2 µ F Low-current drive LED 26 XACOMI + TIMER 9 TC2 8 TC1 7 DCLK 6 DO 5 DI 4 DRSTB 3 MCLK 2 MDAT 1 0.1 µ F – 27 XACOMO + 2.2 µF – 28 RACOMO 0.1 µF Note µ PD9930G-22 29 RACOMI 30 REC2O+ 31 REC2O– 100 kΩ to 900 kΩ DSUB socket (25 pin) 32 IC 0.1 µF 33 REC2I– REC1O RAUXO AVDD1 AVDD2 DVDD SEN SI SO SCLK TEST MSTR 100 kΩ to 300 kΩ 34 35 36 37 38 39 40 41 42 43 44 Microcontroller 300 kΩ Accessory output + 4.7 µF – + 4.7 µ F – 0.1 µ F 0.1 µ F 73 Note When connecting a dynamic receiver, use a drive amplifier. DSP To REQB µPD9930 0.1 µF µPD9930 7. PACKAGE DRAWINGS 44 PIN PLASTIC QFP ( 10) A B Q F G H I M 5˚±5˚ 12 11 S 44 1 detail of lead end D 23 22 C 33 34 J M P K N L NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition. 74 P44G-80-22-2 ITEM MILLIMETERS INCHES A 13.6 ± 0.4 0.535+0.017 –0.016 B 10.0 ± 0.2 0.394+0.008 –0.009 C 10.0 ± 0.2 0.394+0.008 –0.009 D 13.6 ± 0.4 0.535+0.017 –0.016 F 1.0 0.039 G 1.0 0.039 H 0.35 ± 0.10 0.014+0.004 –0.005 I 0.15 0.006 J 0.8 (T.P.) 0.031 (T.P.) K 1.8 ± 0.2 0.071+0.008 –0.009 L 1.0 ± 0.2 0.039+0.009 –0.008 M 0.15+0.10 –0.05 0.006+0.004 –0.003 N 0.15 0.006 P 1.45 ± 0.1 0.057+0.005 –0.004 Q 0.05 ± 0.05 0.002 ± 0.002 S 1.65 MAX. 0.065 MAX. µPD9930 8. RECOMMENDED SOLDERING CONDITIONS The following conditions must be met for soldering conditions of the µPD9930. For more details, refer to our document "Semiconductor Device Mounting Technology Manual" (C10535E). Please consult with our sales offices in case other soldering process is used, or in case the soldering is done under different conditions. Type of Surface Mount Device µPD9930G-22: 44-pin plastic QFP (10 x 10 mm) Soldering process Soldering conditions Symbol Infrared ray reflow Peak temperature of package surface: 235˚C or below, Reflow time: 30 seconds or below (210˚C or higher), Number of reflow processes: MAX. 2 Exposure limitNote: 7 days (10 hours pre-baking is required at 125˚C afterwards) IR35-107-2 VPS Peak temperature of package surface: 215˚C or below, Reflow time: 40 seconds or below (200˚C or higher), Number of reflow processes: MAX. 2 Exposure limitNote: 7 days VP15-107-2 (10 hours pre-baking is required at 125˚C afterwards) Wave soldering Soldering bath temperature: 260˚C or below, Reflow time: 10 seconds or below, Number of reflow processes: 1 Preheating temperature: 120˚C MAX. (package surface temperature) Exposure limitNote: 7 days (10 hours pre-baking is required at 125˚C afterwards) Partial heating method Terminal temperature: 300˚C or below, Time: 3 seconds or below (Per one side of the device). WS60-107-1 — Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25˚C and relative humidity at 65 % or less. Caution Do not apply more than one soldering method at any one time, except for "Partial heating method". 75 µPD9930 [MEMO] 76 µPD9930 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS device behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. 77 µPD9930 [MEMO] The export of this product from Japan is prohibited without governmental license. To export or re-export this product from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales representative. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 78