AVX V3F09A200Y3DRP

TransFeed
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
GENERAL DESCRIPTION
Schematic Diagram
AVX has combined the best electrical characteristics of its
TransGuard Transient Voltage Suppressors (TVS) and its
Feedthru Capacitors into a single chip for state-of-the-art
overvoltage circuit protection and EMI reduction over a
broad range of frequencies. This unique combination of
multilayer ceramic construction in a feedthru configuration
gives the circuit designer a single 0805 chip that responds
to transient events faster than any TVS device on the market today, and provides significant EMI attenuation when in
the off-state.
The reduction in parallel inductance, typical of the feedthru
chip construction when compared to the construction of
standard TVS or ceramic capacitor chips, gives the
TransFeed product two very important electrical advantages: (1) faster “turn-on” time. Calculated response times
of <200 pSec are not unusual with this device, and measured response times range from 200 – 250 pSec. The
TransFeed “turn-on” characteristic is less than half that of
an equivalent TransGuard part — and TransGuards clamp
transient voltages faster than any other bipolar TVS solution
such as diodes; (2) the second electrical advantage of
lower parallel inductance, coupled with optimal series
inductance, is the enhanced attenuation characteristics of
the TransFeed product. Not only is there significantly
greater attenuation at a higher self-resonance frequency,
but the roll-off characteristic becomes much flatter, resulting in EMI filtering over a much broader frequency spectrum. Typical applications include filtering/protection on
Microcontroller I/O Lines, Interface I/O Lines, Power Line
Conditioning and Power Regulation.
IN
OUT
Electrical Model
IN
LS
LS
RV
OUT
RP
C
RON
LP
TYPICAL APPLICATIONS
• Fingerprint ID Circuit
• Magnetic Field Circuit
• LCD Dashboard Driver
Where designers are concerned with both transient voltage
protection and EMI attenuation, either due to the electrical
performance of their circuits or due to required compliance
to specific EMC regulations, the TransFeed product is an
ideal choice.
HOW TO ORDER
2
V
Varistor
F
Feedthru
Capacitor
Chip Size
2 = 0805
3 = 0612
38
1
05
A
Voltage
05 = 5.6VDC
09 = 9.0VDC
14 = 14.0VDC
18 = 18.0VDC
No. of
Elements
150
Varistor
Clamping
Voltage
150 = 18V
200 = 22V
300 = 32V
400 = 42V
500 = 50V
Y
2
E
DC
Resistance
D
P
Packaging
Code
Pcs./Reel
1 = 0.150 Ohms
2 = 0.200 Ohms
3 = 0.250 Ohms
D = 1,000
R = 4,000
T = 10,000
Energy
Rating
Capacitance
Tolerance
Feedthru
Current
X = 0.05J
A = 0.1J
C = 0.3J
Y = +100/-50%
D = 500 mA
E = 750 mA
F = 1.0 Amp
Termination Finish
P = Ni/Sn Alloy (Plated)
M = Ni/Sn Pb (Plated)
TransFeed
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
TRANSFEED ELECTRICAL SPECIFICATIONS (0805 CHIP SIZE)
AVX
Part Number
Working Working Breakdown Clamping Maximum
Voltage Voltage
Voltage
Voltage
Leakage
(DC)
(AC)
Current
Transient
Energy
Rating
Peak
Current
Rating
Typical
Cap
DC
Resistance
Maximum
Feedthru
Current
V2F105A150Y2E _ _
5.6
4.0
8.5±20%
18
35
0.10
30
800
0.200
0.75
V2F105C150Y1F _ _
5.6
4.0
8.5±20%
18
35
0.30
120
2500
0.150
1.00
V2F109A200Y2E _ _
9.0
6.4
12.7±15%
22
25
0.10
30
575
0.200
0.75
V2F109C200Y1F _ _
9.0
6.4
12.7±15%
22
25
0.30
120
1800
0.150
1.00
V2F114A300Y2E _ _
14.0
10.0
18.5±12%
32
15
0.10
30
300
0.200
0.75
V2F114C300Y1F _ _
14.0
10.0
18.5±12%
32
15
0.30
120
900
0.150
1.00
V2F118A400Y2E _ _
18.0
13.0
25.5±10%
42
10
0.10
30
200
0.200
0.75
V2F118C400Y1F _ _
18.0
13.0
25.5±10%
42
10
0.30
120
500
0.150
1.00
V2F118X500Y3D _ _
18.0
13.0
25.5±10%
50
10
0.05
20
75
0.250
0.50
V3F418A400Y3G _ _
18.0
13.0
25.5±10%
42
10
0.10
20
150
0.200
0.30
18.0
13.0
25.5±10%
50
10
0.05
15
65
0.250
0.20
V3F418C400Y3G _ _
Termination Finish Code
Packaging Code
VW (DC)
VW (AC)
VB
VB Tol
VC
IL
ET
IP
Cap
DCR
IFT
DC Working Voltage (V)
AC Working Voltage (V)
Typical Breakdown Voltage (V @ 1mADC)
VB Tolerance is ± from Typical Value
Clamping Voltage (V @ 1A 8x20µS )
Maximum Leakage Current at the Working Voltage (µA)
Transient Energy Rating (J, 10x1000µS)
Peak Current Rating (A, 8x20µS)
Typical Capacitance (pF) @ 1MHz and 0.5 V
DC Resistance (Ohms)
Maximum Feedthru Current (A)
dB Attenuation vs Frequency
0
0
TransFeed 0.1J
TransFeed 0.3J
18LC
-10
-10
18A
18C
-20
14A
-20
9A
14C
-30
9C
(dB)
(dB)
-30
5A
-40
-40
-50
-50
-60
-60
5C
-70
0.01
0.1
1
Frequency (GHz)
10
-70
0.01
0.1
1
10
Frequency (GHz)
39
TransFeed
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
DIMENSIONS
L
mm (inches)
W
2.01 ± 0.20
1.25 ± 0.20
0805
(0.079 ± 0.008) (0.049 ± 0.008)
T
BW
1.143 Max.
(0.045 Max.)
BL
EW
X
S
0.46 ± 0.10
0.18 + 0.25 -0.08
0.25 ± 0.13
1.02 ± 0.10
0.23 ± 0.05
(0.018 ± 0.004) (0.007 + 0.010 -0.003) (0.010 ± 0.005) (0.040 ± 0.004) (0.009 ± 0.002)
L
S
X
T
BW
CL
BL
W
EW
RECOMMENDED SOLDER PAD LAYOUT (Typical Dimensions)
0805
P
S
W
L
C
3.45 (0.136)
0.51 (0.020)
0.76 (0.030)
1.27 (0.050)
1.02 (0.040)
0.46 (0.018)
4 Pad Layout
T
P
P
W
S
INPUT
OUTPUT
C
40
mm (inches)
T
L
TransFeed Array - V3F4 Series
TVS Protection and EMI Attenuation in a 4-Element Array
E
W
P
D
A
T
B
C
BL
ES
D
L
F
A
BW
V3F4
DIMENSIONS
mm (inches)
L
W
T
BW
BL
ES
P
1.60 ± 0.20
(0.063 ± 0.008)
3.25 ± 0.15
(0.128 ± 0.006)
1.22 Max.
(0.048 Max.)
0.41 ± 0.10
(0.016 ± 0.004)
0.18 +0.25 -0.08
(0.007 +0.010 -0.003)
0.41 ± 0.10
(0.016 ± 0.004)
0.76 REF
(0.030 REF)
mm (inches)
A
B
C
D
E
F
0.60 (0.024)
1.60 (0.064)
2.20 (0.088)
0.35 (0.014)
0.76 (0.030)
2.60 (0.104)
41
TransFeed
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
PERFORMANCE CHARACTERISTICS
INSERTION LOSS COMPARISON
(TransFeed vs TransGuard)
0805 – dB vs Frequency
5.6V, 0.1J
0
-10
VC080514A300
-10
-20
-20
-30
(dB)
(dB)
14V, 0.1J
0
VC080505A150
-40
-30
-40
-50
V2F105A150Y2E
-60
-50
-70
0.01
-60
0.01
V2F114A300Y2E
0.1
10
1
0.1
Frequency (GHz)
18V, 0.1J
0
VC08LC18A500
-10
-20
(dB)
-20
(dB)
10
18V, 0.05J
0
VC080518A400
-10
-30
-40
-30
-40
-50
-50
0.1
1
V2F118X500Y3D
-60
V2F118A400Y2E
-60
0.01
1
Frequency (GHz)
-70
0.01
10
0.1
Frequency (GHz)
5.6V, 0.3J
0
1
10
Frequency (GHz)
14V, 0.3J
0
VC080514C300
-10
-10
-20
-20
-30
-30
(dB)
(dB)
VC080505C150
-40
-40
-50
-50
V2F105C150Y1F
-70
0.01
V2F114C300Y1F
-60
-60
0.1
-70
0.01
10
1
0.1
Frequency (GHz)
Frequency (GHz)
18V, 0.3J
0
VC080518C400
-10
(dB)
-20
-30
-40
-50
V2F118C400Y1F
-60
-70
0.01
0.1
Frequency (GHz)
42
1
10
1
10
TransFeed
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
PERFORMANCE CHARACTERISTICS
CURRENT vs TEMPERATURE
0805 – 0.1 Joule
Component Temperature (°C)
30
Note:
Dashed
Portions
Not Guaranteed
18V
14V
18LC
25
5V
9V
20
0.3
0.5
1
0.75
Current (Amps)
CURRENT vs TEMPERATURE
0805 – 0.3 Joule
Component Temperature (°C)
30
18V
25
14V
5V
20
0
0.25
0.5
Current (Amps)
0.75
1
43
TransFeed
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
PERFORMANCE CHARACTERISTICS
FEEDTHRU VARISTORS
AVX Multilayer Feedthru Varistors (MLVF) are an ideal choice
for system designers with transient strike and broadband
EMI/RFI concerns.
Feedthru Varistors utilize a ZnO varistor material and the
electrode pattern of a feedthru capacitor. This combination
allows the package advantage of the feedthru and material
advantages of the ZnO dielectric to be optimized.
ZnO MLV Feedthrus exhibit electrical and physical advantages
over standard ZnO MLVs. Among them are:
1. Faster Turn on Time
2. Broadband EMI attenuation
3. Small size (relative to discrete MLV and EMI filter schemes)
The electrical model for a ZnO MLV and a ZnO Feedthru MLV
are shown below. The key difference in the model for
the Feedthru is a transformation in parallel to series inductance. The added series inductance helps lower the injected
transient peak current (by 2πfL) resulting in an additional benefit of a lower clamping voltage. The lowered parallel inductance decreases the turn on time for the varistor to <250ps.
Discrete MLV Model
Discrete MLVF Model
To Device
Requiring
Protection
PCB
Trace
LS
Solder Pad
RV
RV
C
Rp
≥
C
=
Ron =
Lp =
44
RP
Ron
LP
Solder Pad
Solder Pad
=
C
RP
Ron
Where: Rv
LS
Solder Pad
LP
To Device
Requiring
Protection
Voltage Variable resistance
(per VI curve)
1012 Ω
defined by voltage rating and energy level
turn on resistance
parallel body inductance
Where: Rv
=
Rp
=
Voltage Variable resistance
(per VI curve)
Body IR
C
Ron
Lp
Ls
=
=
=
=
defined by voltage rating and energy level
turn on resistance
minimized parallel body inductance
series body inductance
TransFeed
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
PERFORMANCE CHARACTERISTICS
MARKET SEGMENTS
APPLICATIONS
• EMI Suppression
• Broadband I/O Filtering
• Vcc Line Conditioning
FEATURES
• Small Size
• Low ESR
• Ultra-fast Response Time
• Broad S21 Characteristics
• Computers
• Automotive
• Power Supplies
• Multimedia Add-On Cards
• Bar Code Scanners
• Remote Terminals
• Medical Instrumentation
• Test Equipment
• Transceivers
• Cellular Phones / Pagers
TYPICAL CIRCUITS REQUIRING
TRANSIENT VOLTAGE
PROTECTION AND EMI FILTERING
The following applications and schematic diagrams
show where TransFeed TVS/ EMI filtering devices might
be used:
• System Board Level Interfaces: (Fig. 1)
Digital to RF
Analog to Digital
Digital to Analog
• Voltage Regulation (Fig. 2)
• Power Conversion Circuits (Fig. 3)
• GaAs FET Protection (Fig. 4)
Fig. 1 – System Interface
Fig. 2 – Voltage Regulators
REGULATOR
Sensor/Keyboard/
Touchscreen Input
DIGITAL
BOARD
+
RF BOARD
By X Bus
Fig. 3 – Power Conversion Circuits/Power Switching Circuits
+3.3V
MAIN
POWER
Sensor Input
ANALOG
BOARD
POWER
MANAGEMENT +3.3V
CHIP
Display
DIGITAL
BOARD
INTERFACE
CARD
+5V
+1.8V
+12V
Keyboard
DIGITAL
BOARD
ASIC
ANALOG
BOARD
Fig. 4 – GaAs FET Protection
SPECIFICATION COMPARISON
MLVF
0805
5ph
<600nh
<0.025Ω
100pf to 2.5nf
see VI curves
>0.25 x 1012Ω
<250ps
INPUT
PARAMETER
MLV
0805
Ls
Lp
typical
N/A
typical
<1.5nh
Ron
C
typical
<0.1Ω
typical
100pf to 5.5nf
Rv
Rp
typical
see VI curves
typical
>1 x 1012Ω
Typical turn on time
Typical frequency response
OUTPUT
<500ps
A comparison table showing typical element parameters and resulting
performance features for MLV and MLVF is shown above.
45