MOSEL VITELIC V436532S04VATG-75PC 3.3 VOLT 32M x 64 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM MODULE PRELIMINARY Features Description ■ 168 Pin Unbuffered 33,554,432 x 64 bit Oganization SDRAM Modules ■ Utilizes High Performance 128Mbit, 16M x 8 SDRAM in TSOPII-54 Packages ■ Fully PC Board Layout Compatible to INTEL’S Rev 1.0 Module Specification ■ Single +3.3V (± 0.3V) Power Supply ■ Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave) ■ Auto Refresh (CBR) and Self Refresh ■ All Inputs, Outputs are LVTTL Compatible ■ 4096 Refresh Cycles every 64 ms ■ Serial Present Detect (SPD) ■ SDRAM Performance The V436532S04VATG-75PC memory module is organized 33,554,432 x 64 bits in a 168 pin dual in line memory module (DIMM). The 32M x 64 memory module uses 16 Mosel-Vitelic 128 Mbit, 16M x 8 SDRAM. The x64 modules are ideal for use in high performance computer systems where increased memory density and fast access times are required. Component Used tCK tAC Clock Frequency (max.) Clock Access Time CAS Latency -7 Units CL=3 143 MHz CL=2 133 MHz CL=3 5.4 ns CL=2 5.4 ns ■ Supported Latencies at 133 MHz Operation CL tRCD tRP tRC 3 3 3 8 CLK 2 2 2 8 CLK V436532S04VATG-75PC Rev. 1.3 September 2001 1 MOSEL VITELIC V436532S04VATG-75PC Pin Configurations (Front Side/Back Side) Pin Front Pin Front Pin Front Pin Back Pin Back Pin Back 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 VSS I/O1 I/O2 I/O3 I/O4 VCC I/O5 I/O6 I/O7 I/O8 I/O9 VSS I/O10 I/O11 I/O12 I/O13 I/O14 VCC I/O15 I/O16 CBO* CB1* VSS NC NC VCC WE DQM0 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 DQM1 CS0 DU VSS A0 A2 A4 A6 A8 A10(AP) BA1 VCC VCC CLK0 VSS DU CS2 DQM2 DQM3 DU VCC NC NC CB2* CB3* VSS I/O17 I/O18 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 I/O19 I/O20 VCC I/O21 NC DU CKE1 VSS I/O22 I/O23 I/O24 VSS I/O25 I/O26 I/O27 I/O28 VCC I/O29 I/O30 I/O31 I/O32 VSS CLK2 NC WP SDA SCL VCC 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 VSS I/O33 I/O34 I/O35 I/O36 VCC I/O37 I/O38 I/O39 I/O40 I/O41 VSS I/O42 I/O43 I/O44 I/O45 I/O46 VCC I/O47 I/O48 CB4* CB5* VSS NC NC VCC CAS DQM4 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 DQM5 CS1 RAS VSS A1 A3 A5 A7 A9 BA0 A11 VCC CLK1 NC VSS CKE0 CS3 DQM6 DQM7 DU VCC NC NC CB6* CB7* VSS I/O49 I/O50 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 I/O51 I/O52 VCC I/O53 NC DU NC VSS I/O54 I/O55 I/O56 VSS I/O57 I/O58 I/O59 I/O60 VCC I/O61 I/O62 I/O63 I/O64 VSS CLK3 NC SA0 SA1 SA2 VCC Notes: * These pins are not used in this module. Pin Names VSS Ground Address Inputs SCL Clock for Presence Detect I/O1–I/O64 Data Inputs/Outputs SDA RAS Row Address Strobe Serial Data OUT for Presence Detect CAS Column Address Strobe SA0–A2 WE Read/Write Input Serial Data IN for Presence Detect BA0, BA1 Bank Selects CB0–CB7 Check Bits (x72 Organization) CKE0, CKE1 Clock Enable A0–A11 CS0–CS3 Chip Select CLK0–CLK3 Clock Input DQM0–DQM7 Data Mask VCC Power (+3.3 Volts) V436532S04VATG-75PC Rev. 1.3 September 2 NC No Connection DU Don’t Use MOSEL VITELIC V436532S04VATG-75PC Part Number Information V 4 3 65 32 S 0 4 V G T A - 75PC MOSEL-VITELIC MANUFACTURED GOLD SDRAM TSOP 3.3V -75 133 MHz 75PC (PC133 3-3-3) (PC133 2-2-2) A VERSION WIDTH (x64 using 128 Mbit) LVTTL 4 BANKS DEPTH 168 PIN UNBUFFERED DIMM X 8 COMPONENT REFRESH RATE 4K Block Diagram CS1 CS0 DQM CS I/O1–I/O8 D0 DQM0 I/O1–I/O8 DQM CS I/O1–I/O8 D8 DQM4 I/O33–I/O40 10Ω DQM CS I/O1–I/O8 D12 DQM CS I/O1–I/O8 D5 DQM CS I/O1–I/O8 D13 CS DQM I/O1–I/O8 D6 CS DQM I/O1–I/O8 D14 CS DQM I/O1–I/O8 D7 CS DQM I/O1–I/O8 D15 10Ω DQM CS I/O1–I/O8 D1 DQM1 I/O9–I/O16 DQM CS I/O1–I/O8 D4 DQM CS I/O1–I/O8 D9 DQM5 I/O41–I/O48 10Ω 10Ω CS3 CS2 CS DQM I/O1–I/O8 D2 DQM2 I/O17–I/O24 CS DQM I/O1–I/O8 D10 DQM6 I/O49–I/O56 10Ω 10Ω CS DQM3 I/O25–I/O32 DQM I/O1–I/O8 CS DQM I/O1–I/O8 D11 D3 DQM7 I/O57–I/O64 10Ω 10Ω E2PROM SPD (256 WORD X 8 BIT) SA0 SA1 SA2 SCL SA0 SA1 SA2 SCL A11-A0, BA0, BA1 D0-D15 SDA VDD VSS WP C0-C31 RAS, CAS, WE 47K D0-D15 D0-D7 D0-D15 D0-D7 CKE0 VCC 10K CKE1 CLOCK WIRING 32M X 64 CLK0 CLK1 CLK2 CLK3 4 SDRAM +3.3pF 4 SDRAM +3.3pF 4 SDRAM +3.3pF 4 SDRAM +3.3pF V436532S04VATG-75PC Rev. 1.3 September 2001 3 D9-D15 MOSEL VITELIC V436532S04VATG-75PC Serial Presence Detect Information written into the E2PROM device during module production using a serial presence detect protocol (I2C synchronous 2-wire bus) A serial presence detect storage device - is assembled onto the module. Information about the module configuration, speed, etc. is E2PROM SPD-Table for 75 modules: Hex Value Byte Number Function Described SPD Entry Value 32Mx64 0 Number of SPD bytes 128 80 1 Total bytes in Serial PD 256 08 2 Memory Type SDRAM 04 3 Number of Row Addresses (without BS bits) 12 0C 4 Number of Column Addresses (for x8 SDRAM) 10 0A 5 Number of DIMM Banks 2 02 6 Module Data Width 64 40 7 Module Data Width (continued) 0 00 8 Module Interface Levels LVTTL 01 9 SDRAM Cycle Time at CL=3 7.5 ns 75 10 SDRAM Access Time from Clock at CL=3 5.4 ns 54 11 Dimm Config (Error Det/Corr.) none 00 12 Refresh Rate/Type Self-Refresh, 15.6µs 80 13 SDRAM width, Primary x8 08 14 Error Checking SDRAM Data Width n/a / x8 00 15 Minimum Clock Delay from Back to Back Random Column Address tccd = 1 CLK 01 16 Burst Length Supported 1, 2, 4, 8 0F 17 Number of SDRAM Banks 4 04 18 Supported CAS Latencies CL = 2,3 06 19 CS Latencies CS Latency = 0 01 20 WE Latencies WL = 0 01 21 SDRAM DIMM Module Attributes Non Buffered/Non Reg. 00 22 SDRAM Device Attributes: General Vcc tol ± 10% 0E 23 Minimum Clock Cycle Time at CAS Latency = 2 7.5 ns 75 24 Maximum Data Access Time from Clock for CL = 2 5.4 ns 54 25 Minimum Clock Cycle Time at CL = 1 Not Supported 00 26 Maximum Data Access Time from Clock at CL = 1 Not Supported 00 27 Minimum Row Precharge Time 15 ns 14 28 Minimum Row Active to Row Active Delay tRRD 14 ns 0F 29 Minimum RAS to CAS Delay tRCD 15 ns 14 30 Minimum RAS Pulse Width tRAS 42 ns 2D V436532S04VATG-75PC Rev. 1.3 September 4 MOSEL VITELIC V436532S04VATG-75PC SPD-Table for 75 modules: (Continued) Hex Value Byte Number Function Described SPD Entry Value 32Mx64 128 MByte 20 31 Module Bank Density (Per Bank) 32 SDRAM Input Setup Time 1.5 ns 15 33 SDRAM Input Hold Time 0.8 ns 08 34 SDRAM Data Input Setup Time 1.5 ns 15 35 SDRAM Data Input Hold Time 0.8 ns 08 62-61 Superset Information (May be used in Future) 62 SPD Revision 63 Checksum for Bytes 0 - 62 64 Manufacturer’s JEDEC ID Code 65-71 72 00 Revision 2 02 DB Mosel Vitelic 40 Manufacturer’s JEDEC ID Code (cont.) 00 Manufacturing Location 73-90 Module Part Number (ASCII) 91-92 PCB Identification Code 93 Assembly Manufacturing Date (Year) 94 Assembly Manufacturing Date (Week) V436532S04VATG-75PC 95-98 Assembly Serial Number 99-125 Reserved 00 126 Intel Specification for Frequency 64 127 Reserved FD 128+ Unused Storage Location 00 DC Characteristics TA = 0°C to 70°C; VSS = 0 V; VDD, VDDQ = 3.3V ± 0.3V Limit Values Symbol Parameter Min. Max. Unit VIH Input High Voltage 2.0 VCC +0.3 V V IL Input Low Voltage –0.5 0.8 V V OH Output High Voltage (IOUT = –2.0 mA) 2.4 — V VOL Output Low Voltage (IOUT = 2.0 mA) — 0.4 V II(L) Input Leakage Current, any input (0 V < VIN < 3.6 V, all other inputs = 0V) –40 40 µA V436532S04VATG-75PC Rev. 1.3 September 2001 5 MOSEL VITELIC V436532S04VATG-75PC Limit Values Symbol Parameter IO(L) Output leakage current (DQ is disabled, 0V < VOUT < VCC) Min. Max. Unit –40 40 µA Capacitance TA = 0°C to 70°C; VDD = 3.3V ± 0.3V, f = 1 MHz Limit Values Symbol Parameter Max. 32M x 64 Unit CI1 Input Capacitance (A0 to A11, RAS, CAS, WE) 80 pF CI2 Input Capacitance (CS0-CS3) 30 pF CICL Input Capacitance (CLK0-CLK3) 22 pF CI3 Input Capacitance (CKE0, CKE1) 50 pF CI4 Input Capacitance (DQM0-DQM7) 20 pF CIO Input/Output Capacitance (I/O1-I/064) 20 pF CSC Input Capacitance (SCL, SA0-2) 8 pF CSD Input/Output Capacitance (SA0-SA2) 10 pF Operating Currents TA = 0°C to 70°C, VCC = 3.3V ± 0.3V (Recommended operating conditions otherwise noted) Max. Symbol ICC1 ICC2P Parameter & Test Condition ICC3P ICC4 Note 1700 mA 7 1 bank operation Precharge Standby Current in Power Down Mode CS =VIH , CKE≤ VIL(max) tCK = min. 60 mA 7 tCK = Infinity 40 mA 7 400 mA 60 mA 700 mA 64 mA 1700 mA Precharge Standby Current in Non-Power Down Mode CS =VIH , CKE≥ VIL(max) tCK = min. tCK = Infinity ICC2NS ICC3 Unit Operating Current tRC = tRCMIN., tRC = tCKMIN. Active-precharge command cycling, without Burst Operation ICC2PS ICC2N -75 CKE ≥ VIH(MIN.) No Operating Current tCK = min, CS = VIH(min) bank ; active state ( 4 banks) CKE ≥ VIL(MAX.) (Power down mode) Burst Operating Current tCK = min Read/Write command cycling V436532S04VATG-75PC Rev. 1.3 September 6 7,8 MOSEL VITELIC V436532S04VATG-75PC Max. Symbol Parameter & Test Condition -75 Unit Note ICC5 Auto Refresh Current tCK = min Auto Refresh command cycling 1800 mA 7 ICC6 Self Refresh Current Self Refresh Mode, CKE=0.2V 32 mA 13 mA L-version Notes: 1. These parameters depend on the cycle rate and these values are measured by the cycle rate under the minimum value of tCK and tRC. Input signals are changed one time during tCK. 2. These parameter depend on output loading. Specified values are obtained with output open. V436532S04VATG-75PC Rev. 1.3 September 2001 7 MOSEL VITELIC V436532S04VATG-75PC AC Characteristics TA = 0° to 70°C; VSS = 0V; VCC = 3.3V ± 0.3V, tT = 1 ns Limit Values -75 # Symbol Parameter Min. Max. Unit Clock Cycle Time CAS Latency = 3 CAS Latency = 2 7.5 7.5 – – s ns ns Clock Frequency CAS Latency = 3 CAS Latency = 2 – – 133 133 MHz MHz Access Time from Clock CAS Latency = 3 CAS Latency = 2 – _ 5.4 5.4 ns ns Note Clock and Clock Enable 1 2 3 tCK tCK tAC 2, 4 4 tCH Clock High Pulse Width 2.5 – ns 5 tCL Clock Low Pulse Width 2.5 – ns 6 tT Transition Tim 0.3 1.2 ns Setup and Hold Times 7 tIS Input Setup Time 1.5 – ns 5 8 tIH Input Hold Time 0.8 – ns 5 9 tCKS Input Setup Time 1.5 – ns 5 10 tCKH CKE Hold Time 0.8 – ns 5 11 tRSC Mode Register Set-up Time 15 – ns 12 tSB 0 7.5 ns Row to Column Delay Time 15 – ns 6 Power Down Mode Entry Time Common Parameters 13 tRCD 14 tRP Row Precharge Time 15 – ns 6 15 tRAS Row Active Time 42 100K ns 6 16 tRC Row Cycle Time 60 – ns 6 17 tRRD Activate(a) to Activate(b) Command Period 14 – ns 6 18 tCCD CAS(a) to CAS(b) Command Period 1 – CLK Refresh Period (4096 cycles) — 64 ms Self Refresh Exit Time 1 Refresh Cycle 19 tREF 20 tSREX CLK Read Cycle 21 tOH Data Out Hold Time 3 – ns 22 tLZ Data Out to Low Impedance Time 1 – ns V436532S04VATG-75PC Rev. 1.3 September 8 2 MOSEL VITELIC V436532S04VATG-75PC AC Characteristics TA = 0° to 70°C; VSS = 0V; VCC = 3.3V ± 0.3V, tT = 1 ns (Continued) Limit Values -75 # Symbol 23 tHZ 24 Parameter Min. Max. Unit Note Data Out to High Impedance Time 3 7 ns 7 tDQZ DQM Data Out Disable Latency – 2 CLK 25 tWR Write Recovery Time 2 – CLK 26 tDQW DQM Write Mask Latency 0 – CLK Write Cycle V436532S04VATG-75PC Rev. 1.3 September 2001 9 MOSEL VITELIC V436532S04VATG-75PC Notes: 1. The specified values are valid when addresses are changed no more than once during tCK(min.) and when No Operation commands are registered on every rising clock edge during tRC(min). Values are shown per module bank. 2. The specified values are valid when data inputs (DQ’s) are stable during tRC(min.). 3. All AC characteristics are shown for device level. An initial pause of 100 µs is required after power-up, then a Precharge All Banks command must be given followed by 8 Auto Refresh (CBR) cycles before the Mode Register Set Operation can begin. 4. AC timing tests have VIL = 0.4V and V IH = 2.4V with the timing referenced to the 1.4V crossover point. The transition time is measured between VIH and VIL. All AC measurements assume tT = 1 ns with the AC output load circuit shown. Specific tac and toh parameters are measured with a 50 pF only, without any resistive termination and with a input signal of 1V / ns edge rate between 0.8V and 2.0V. + 1.4 V tCH 2.4V CLOCK 50 Ohm 0.4V tCL tSETUP Z=50 Ohm tT I/O tHOLD 50 pF 1.4V INPUT tAC tAC tLZ I/O tOH 50 pF 1.4V OUTPUT Measurement conditions for tac and toh tHZ 5. If clock rising time is longer than 1 ns, a time (tT/2 -0.5) ns has to be added to this parameter. 6. Rated at 1.5V 7. If tT is longer than 1 ns, a time (tT -1) ns has to be added to this parameter. 8. Any time that the refresh Period has been exceeded, a minimum of two Auto (CBR) Refresh commands must be given to “wake-up” the device. 9. Self Refresh Exit is a synchronous operation and begins on the 2nd positive clock edge after CKE returns high. Self Refresh Exit is not complete until a time period equal to tRC is satisfied once the Self Refresh Exit command is registered. 10. Referenced to the time which the output achieves the open circuit condition, not to output voltage levels. 11. tDAL is equivalent to tDPL + tRP. V436532S04VATG-75PC Rev. 1.3 September 10 MOSEL VITELIC V436532S04VATG-75PC Package Diagram L-DIM-168-30 SDRAM DIMM Module Package All measurements in mm 133.37 127.35 17.80 35.00 (4.0 max) 10 11 40 41 84 3.0 1 42.18 1.27 ± 0.100 63.68 A 94 95 124 125 168 4.0 85 B D 6.35 2.50 2.0 4.45 Detail B 2.26 RADIUS 1.27 + 0.10 Tolerances: ± (0.13) unless otherwise specified. V436532S04VATG-75PC Rev. 1.3 September 2001 0.2 ± 0.15 2.0 3.175 Detail A 1.0 ± 0.05 1.27 3.125 3.125 6.35 11 Detail C MOSEL VITELIC V436532S04VATG-75PC Label Information MOSEL VITELIC Part Number Criteria of PC100 or PC133 (refer to MVI datasheet) V436532S04VATG-75PC PC133U-222-542-A Taiwan XXXX-XXXXXXX DIMM manufacture date code Trace Code PC133 U - 222 - 54 2 - A UNBUFFERED DIMM Gerberfile Intel® PC100 x 8 Based CL = 2 (CLK) tRCD = 2 (CLK) tRP = 2 (CLK) V436532S04VATG-75PC Rev. 1.3 September JEDEC SPD Revision 2 tAC = 5.4 ns 12 MOSEL VITELIC WORLDWIDE OFFICES V436532S04VATG-75PC U.S.A. TAIWAN SINGAPORE UK & IRELAND 3910 NORTH FIRST STREET SAN JOSE, CA 95134 PHONE: 408-433-6000 FAX: 408-433-0952 7F, NO. 102 MIN-CHUAN E. ROAD, SEC. 3 TAIPEI PHONE: 886-2-2545-1213 FAX: 886-2-2545-1209 10 ANSON ROAD #23-13 INTERNATIONAL PLAZA SINGAPORE 079903 PHONE: 65-3231801 FAX: 65-3237013 NO 19 LI HSIN ROAD SCIENCE BASED IND. PARK HSIN CHU, TAIWAN, R.O.C. PHONE: 886-3-579-5888 FAX: 886-3-566-5888 JAPAN SUITE 50, GROVEWOOD BUSINESS CENTRE STRATHCLYDE BUSINESS PARK BELLSHILL, LANARKSHIRE, SCOTLAND, ML4 3NQ PHONE: 44-1698-748515 FAX: 44-1698-748516 ONZE 1852 BUILDING 6F 2-14-6 SHINTOMI, CHUO-KU TOKYO 104-0041 PHONE: 03-3537-1400 FAX: 03-3537-1402 GERMANY (CONTINENTAL EUROPE & ISRAEL) BENZSTRASSE 32 71083 HERRENBERG GERMANY PHONE: +49 7032 2796-0 FAX: +49 7032 2796 22 U.S. SALES OFFICES NORTHWESTERN SOUTHWESTERN 3910 NORTH FIRST STREET SAN JOSE, CA 95134 PHONE: 408-433-6000 FAX: 408-433-0952 302 N. EL CAMINO REAL #200 SAN CLEMENTE, CA 92672 PHONE: 949-361-7873 FAX: 949-361-7807 © Copyright 2001, MOSEL VITELIC Inc. The information in this document is subject to change without notice. MOSEL VITELIC makes no commitment to update or keep current the information contained in this document. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of MOSEL-VITELIC. MOSEL VITELIC CENTRAL, NORTHEASTERN & SOUTHEASTERN 604 FIELDWOOD CIRCLE RICHARDSON, TX 75081 PHONE: 214-352-3775 FAX: 214-904-9029 9/01 Printed in U.S.A. MOSEL VITELIC subjects its products to normal quality control sampling techniques which are intended to provide an assurance of high quality products suitable for usual commercial applications. MOSEL VITELIC does not do testing appropriate to provide 100% product quality assurance and does not assume any liability for consequential or incidental arising from any use of its products. If such products are to be used in applications in which personal injury might occur from failure, purchaser must do its own quality assurance testing appropriate to such applications. 3910 N. First Street, San Jose, CA 95134-1501 Ph: (408) 433-6000 Fax: (408) 433-0952 Tlx: 371-9461