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i.e., allow PCI masters from both PCI buses active at the same time − Zero wait state PCI master and slave burst transfer rate − PCI to system memory data streaming up to 132Mbyte/sec − Two lines (32 double-words) of CPU to PCI posted write buffers − Byte merging in the write buffers to reduce the number of PCI cycles and to create further PCI bursting possibilities − Enhanced PCI command optimization (MRL, MRM, MWI, etc.) − Thirty-two levels (double-words) of post write buffers from PCI masters to DRAM − − − − − − − (two cache lines / 16 double-words for PCI bus, two cache lines / 16 double-words for Athlon processor interface) Sixteen levels (double-words) of prefetch buffers from DRAM for access by PCI masters Delay transaction from PCI master accessing DRAM Read caching for PCI master reading DRAM Transaction timer for fair arbitration between PCI masters (granularity of two PCI clocks) Symmetric arbitration between Host/PCI bus for optimized system performance Complete steerable PCI interrupts PCI-2.2 compliant, 32 bit 3.3V PCI interface with 5V tolerant inputs Preliminary Revision 1.0, May 12, 2000 -2- Features 'HOLYHULQJ 9DOXH 7HFKQRORJLHV ,QF KT133 - VT8363 • Advanced High-Performance DRAM Controller − Supports PC133 and PC100 SDRAM and Virtual Channel Memory (VCM) SDRAM up to 3 DIMMs − Concurrent CPU, AGP, and PCI access − Different DRAM types may be used in mixed combinations − Different DRAM timing for each bank − Dynamic Clock Enable (CKE) control for SDRAM power reduction in high speed systems − Mixed 1M / 2M / 4M / 8M / 16M / 32MxN DRAMs − Support up to 1.5 GB memory space (256Mb DRAM technology) − Flexible row and column addresses − 64-bit data width and 3.3V DRAM interface − Programmable I/O drive capability for MA, command, and MD signals − Two-bank interleaving for 16Mbit SDRAM support − Two-bank and four bank interleaving for 64Mbit SDRAM support − Supports maximum 16-bank interleave (i.e., 16 pages open simultaneously); banks are allocated based on LRU − Independent SDRAM control for each bank − Seamless DRAM command scheduling for maximum DRAM bus utilization − − − − − − − (e.g., precharge other banks while accessing the current bank) Four cache lines (32 quadwords) of CPU to DRAM write buffers Four cache lines (32 quadwords) of CPU to DRAM read prefetch buffers Read around write capability for non-stalled CPU read Burst read and write operation BIOS shadow at 16KB increment Decoupled and burst DRAM refresh with staggered RAS timing CAS before RAS or self refresh • Advanced System Power Management Support − Dynamic power down of SDRAM (CKE) − PCI and AGP bus clock run and clock generator control − VTT suspend power plane preserves memory data − Suspend-to-DRAM and Self-Refresh operation − SDRAM self-refresh power down − 8 bytes of BIOS scratch registers − Low-leakage I/O pads • Built-in NAND-tree pin scan test capability • 3.3V, 0.35um, high speed / low power CMOS process • 35 x 35 mm, 552 pin BGA Package Preliminary Revision 1.0, May 12, 2000 -3- Features 'HOLYHULQJ 9DOXH 7HFKQRORJLHV ,QF KT133 - VT8363 OVERVIEW PROCRDY CONNECT CFWDRST The KT133 / VT8363 and VT82C686A chipset is a high performance, cost-effective and energy efficient system controller for the implementation of AGP / PCI / ISA desktop personal computer systems based on 64-bit Socket-A (AMD Athlon) processors. 3D Graphics Controller Athlon Host CPU Address Out GCLK AGP Bus GCKRUN# PCKRUN# PCLK PCI Bus BIOS ROM ATA 33 / 66 USB Ports 0-3 AC97 Audio Codec AC97 Link MC97 Modem Codec ISA Bus RTC Crystal Data SYSCLK, SYSCLK# INTR, NMI, SMI#, STPCLK#, IGNNE#, FERR#, A20M#, PWROK, INIT#, RESET# In CKE KT133 VT8363 North Bridge 552 BGA Memory Bus SDRAM MCLK HCLK PCLK Clock Buffer SUSCLK, SUSST1# Super South VT82C686A South Bridge 352 BGA CPUSTP# PCISTP# Clock Generator SMBus Power Plane & Peripheral Control GPIO and ACPI Events Hardware Monitoring Inputs Keyboard / PS2 Mouse Serial Ports 1 and 2 Parallel Port Floppy Drive Interface MIDI / Game Ports Figure 1. KT133 System Block Diagram Using the VT82C686A South Bridge The KT133 chip set consists of the VT8363 system controller (552 pin BGA) and the VT82C686A PCI to ISA bridge (352 pin BGA). The system controller provides superior performance between the CPU, DRAM, AGP bus, and PCI bus with pipelined, burst, and concurrent operation. The VT8363 supports eight banks of DRAMs up to 1.5 GB. The DRAM controller supports standard Synchronous DRAM (SDRAM) and Virtual Channel SDRAM (VC SDRAM), in a flexible mix / match manner. The Synchronous DRAM interface allows zero wait state bursting between the DRAM and the data buffers at 66/100/133 MHz. The six banks of DRAM can be composed of an arbitrary mixture of 1M / 2M / 4M / 8M / 16M / 32MxN DRAMs. The VT8363 system controller also supports full AGP v2.0 capability for maximum bus utilization including 1x, 2x and 4x mode transfers, SBA (SideBand Addressing), Flush/Fence commands, and pipelined grants. An eight level request queue plus a four level post-write request queue with thirty-two and sixteen quadwords of read and write data FIFO's respectively are included for deep pipelined and split AGP transactions. A single-level GART TLB with 16 full associative entries and flexible CPU / AGP / PCI remapping control is also provided for operation under protected mode operating environments. Both Windows-95 VXD and Windows-98 / Windows 2000 miniport drivers are supported for interoperability with major AGP-based 3D and DVD-capable multimedia accelerators. The VT8363 supports two 32-bit 3.3 / 5V system buses (one AGP and one PCI) that are synchronous / pseudo-synchronous to the CPU bus. The chip also contains a built-in bus-to-bus bridge to allow simultaneous concurrent operations on each bus. Five levels (doublewords) of post write buffers are included to allow for concurrent CPU and PCI operation. For PCI master operation, fortyeight levels (doublewords) of post write buffers and sixteen levels (doublewords) of prefetch buffers are included for concurrent PCI bus and DRAM/cache accesses. The chip also supports enhanced PCI bus commands such as Memory-Read-Line, Memory- Preliminary Revision 1.0, May 12, 2000 -4- Overview 'HOLYHULQJ 9DOXH 7HFKQRORJLHV ,QF KT133 - VT8363 Read-Multiple and Memory-Write-Invalid commands to minimize snoop overhead. In addition, advanced features are supported such as snoop ahead, snoop filtering, L1/L2 write-back forward to PCI master, and L1/L2 write-back merged with PCI post write buffers to minimize PCI master read latency and DRAM utilization. Delay transaction and read caching mechanisms are also implemented for further improvement of overall system performance. The 352-pin Ball Grid Array VT82C686A PCI to ISA bridge supports four levels (doublewords) of line buffers, type F DMA transfers and delay transaction to allow efficient PCI bus utilization and (PCI-2.1 compliant). The VT82C686A also includes an integrated keyboard controller with PS2 mouse support, integrated DS12885 style real time clock with extended 256 byte CMOS RAM, integrated master mode enhanced IDE controller with full scatter / gather capability and extension to UltraDMA-33/66 for 33/66 MB/sec transfer rate, integrated USB interface with root hub and four function ports with built-in physical layer transceivers, Distributed DMA support, and OnNow / ACPI compliant advanced configuration and power management interface. The VT82C686A also includes an AC97 / MC97 link for interface to external audio and modem codecs, and all “Super-I/O” functions (serial ports, parallel port, and floppy drive interface and game port). For sophisticated power management, KT133 provides independent clock stop control for the CPU / SDRAM, PCI, and AGP buses and Dynamic CKE control for powering down of the SDRAM. A separate suspend-well plane is implemented for the SDRAM control signals for Suspend-to-DRAM operation. The VT82C686A also includes a complete hardware monitoring subsystem for monitoring and control of internal and external (motherboard and system) conditions including voltages, temperatures, fan speeds, switch open/close states, etc. Coupled with the VT82C686A south bridge chip, a complete power conscious PC main board can be implemented with no external TTLs. The KT133 chipset is ideal for high performance, high quality, high energy efficient and high integration desktop AGP / PCI / ISA computer systems. Preliminary Revision 1.0, May 12, 2000 -5- Overview 'HOLYHULQJ 9DOXH KT133 - VT8363 7HFKQRORJLHV ,QF ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Parameter Min Max Unit Ambient operating temperature 0 55 oC Case operating temperature 0 110 oC Storage temperature -55 125 oC Input voltage -0.5 5.5 Volts Output voltage (VCC = 3.1 - 3.6V) -0.5 VCC + 0.5 Volts Note: Stress above the conditions listed may cause permanent damage to the device. Functional operation of this device should be restricted to the conditions described under operating conditions. DC Characteristics TA-0-55oC, VCC=5V+/-5%, GND=0V Symbol Parameter Min Max Unit VIL Input low voltage -0.50 0.8 V Condition VIH Input high voltage 2.0 VCC+0.5 V VOL Output low voltage - 0.45 V IOL=4.0mA VOH Output high voltage 2.4 - V IOH=-1.0mA IIL Input leakage current - +/-10 uA 0<VIN<VCC IOZ Tristate leakage current - +/-20 uA 0.45<VOUT<VCC ICC Power supply current - mA AC Timing Specifications AC timing specifications provided are based on external zero-pf capacitance load. Min/max cases are based on the following table: Table 8. AC Timing Min / Max Conditions Parameter Min Max Unit 3.3V Power (VCC, VCCI, VTT, AVCC, HVCC) 3.135 3.465 Volts 5V Reference (5VREF) 4.75 5.25 0 70 Volts oC Temperature Drive strength for each output pin is programmable. See Rx6D for details. Preliminary Revision 1.0, May 12, 2000 -46- Electrical Specifications 'HOLYHULQJ 9DOXH KT133 - VT8363 7HFKQRORJLHV ,QF MECHANICAL SPECIFICATIONS 3,1 &251(5 ; 5() Y W R L = Date Code Year = Date Code Week = Chip Revision = Lot Code 5() 97 <<::55 7$,:$1 & 0 ///////// $ % & ' ( ) * + . / 0 1 3 5 7 8 9 : < $$ $% $& $' $( $) ; 5() 6 & 6 & $ 6 % 6 [ 552-Pin BGA 35x35x2.33 mm JEDEC Spec MO-151 $ % & ' ( ) * + . / 0 1 3 5 7 8 9 : < $$ $% $& $' $( $) % $ & 6($7,1* 3/$1( & 7<3 5() 5() ; Figure 5. Mechanical Specifications - 552-Pin Ball Grid Array Package Preliminary Revision 1.0, May 12, 2000 -47- Mechanical Specifications