ZL60401 622 Mbps, 1310 nm Uncooled Fabry-Perot Laser Diode Module with Monitor Data Sheet December 2003 Ordering Information ZL60401TBD ZL60401TDD ZL60401TED ZL60401TFD TO-56 with lens ST type connector SC type connector FC type connector -40°C to +85°C Description The Fabry-Perot Laser Diode Receptacle type series is designed for use with SC, FC and ST type fiber connectors as source in telecom and datacom applications. Features • Uncooled 1300 nm Fabry-Perot Laser Diode • Wide operating temperature range -40°C to +85°C • High reliability • Built-in monitor diode • 622 Mbps • Ball lens or receptable type of packaging The ZL60401 is a 1310 nm MQW (Multiple Quantum Well) Fabry-Perot laser diode, integrated with a monitor diode. The hermatically sealed package includes a ball lens for improved coupling efficiency. Applications • Telecommunications applications, SONET OC-3, OC-12, SDH STM-1 and STM-4 • Optical communications systems LD anode case Monitor Cathode Monitor anode Monitor Anode LD Cathode Case LD Anode Bottom View LD Cathode Figure 1 - PIN Diagram Monitor cathode Figure 2 - Functional Schematic 1 Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2003, Zarlink Semiconductor Inc. All Rights Reserved. ZL60401 Data Sheet Electrical and Optical Characteristics (TC = 25°C) Parameter Symbol Conditions Threshold Current Ith Operating Voltage Typ. Max. Unit CW 10 15 mA Vop CW, If = Ith+20 mA 1.3 1.5 V Optical Output Power Pf CW, If = Ith+20 mA 0.6 Wavelength λ CW, Ith+20 mA ∆λ CW, Ith+20 mA tr , tf If = Ith+20 mA, 20-80% ∆ Pf / Pf APC, 0 - +70°C Spectral Width Rise and Fall Times Tracking Error Min. 1290 mW 1310 1330 nm 1 3 nm 500 ps -1.5 1.5 dB -40°C - +85°C -2.5 2.5 100 Monitor Current ID CW, Ith+20 mA, VRD = 1 V Monitor Dark Current ID VRD = 5 V Monitor Capacitance CD VRD = 5 V, f = 1 MHz µA 10 1 µA 15 pF Absolute Maximum Ratings Parameter Symbol Rating Unit LD Reverse Voltage VRL 2 V PD Reverse Voltage VRD 20 V PD Forward Current If 2.0 mA Operating Temperature Top -40 - +85 °C Storage Temperature Tstg -40 - +85 °C 2 Zarlink Semiconductor Inc. ZL60401 Data Sheet +25 degrees C 1.20 0.045 0.04 0.035 0.80 0.03 0.025 0.60 0.02 0.40 0.015 0.01 Slope Efficiency (mW/mA) Fiber Coupled Power (mW) 1.00 Power Slope efficiency 0.20 0.005 0.00 0 0 5 25 20 15 10 30 Forward Current (mA) Figure 3 - Typical Fiber Coupled Power and Slope Efficiency at Room Temperature -40 degrees C 1.20 0.05 Fiber Coupled Power (mW) 0.04 0.035 0.80 0.03 0.60 0.025 0.02 0.40 0.015 0.01 0.20 Slope Efficiency (mW/mA) 0.045 1.00 Power Slope efficiency 0.005 0.00 0 0 5 10 15 20 25 Forward Current (mA) Figure 4 - Typical Fiber Coupled Power and Slope Efficiency at Low Temperature 3 Zarlink Semiconductor Inc. ZL60401 Data Sheet 1.20 0.03 1.00 0.025 0.80 0.02 0.60 0.015 0.40 0.01 0.20 0.005 0.00 Slope Efficiency (mW/mA) Fiber Coupled Power (mW) +85 degrees C Power Slope efficiency 0 0 5 10 15 20 25 30 35 40 45 50 55 Forward Current (mA) Figure 5 - Typical Fiber Coupled Power and Slope Efficiency at High Temperature 4 Zarlink Semiconductor Inc. n2,501`0,001 12,8`0,1 2,1 SIDE VIEW BOTTOM VIEW n7 18 22,15`0,1 FRONT VIEW ( 2 : 1 ) A r 11,7`0,6 n2,3 THRU (2x) 8,9`0,1 n0.25 * A 6,75 12,2`0,1 7,85`1 * Slot side. 14,7 ISOMETRIC VIEW Connector housing (PA66, 13% Glass fibre) NOTES:- Component * 1. All dimensions in mm. 2. General tol. ISO-2768-mK. Housing (Stainless steel X10CrNiS18-9) * For details of the component, see separate data sheet and/or package drawing. Projection Package code © Zarlink Semiconductor 2002. All rights reserved. ISSUE 1 ACN 101512rev 1 DATE 17-NOV-03 APPRD. PD\US Previous package codes Drawing type TE TO-56 Package Outline in SC Connector housing Title 101512 FRONT VIEW ( 2 : 1 ) SIDE VIEW BOTTOM VIEW M8 x 0.75-6g n7 13,43 n2,501`0,001 A r n8,9 11,7`0,6 n2,2 THRU (2x) n0,25 * A 3,5 6,88`1 R9,5 5,95 * Slot side. 7,95 v n4 x 1,45 ISOMETRIC VIEW NOTES:- Component * 1. All dimensions in mm. 2. General tol. ISO-2768-mK. Housing (Stainless steel X10CrNiS18-9) * For details of the component, see separate data sheet and/or package drawing. Projection Package code © Zarlink Semiconductor 2002. All rights reserved. ISSUE 1 ACN 101513 rev1 DATE 17-NOV-03 APPRD. PD\US Previous package codes Drawing type TF TO-56 Package Outline in FC Connector housing Title 101513 SIDE VIEW BOTTOM VIEW ( 10 : 1 ) 11 +- 3 0 4,1 n0,89 Max n2 0,6 +0 n5,6 0,03 n1 (3x) Brazed n3,55`0,05 n0,45 +- 0,03 (4x) 0,04 0,38 Max * NOTES:- R0,3 Max 1,2`0,075 1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 3-7 µm. Header: Ni 2-4 µm / Au 0,5 µm. * Lens n1,5`0,002 Projection Method Package code © Zarlink Semiconductor 2002. All rights reserved. ISSUE 1 ACN 101615 rev1 DATE 21-NOV-03 APPRD. MD/MA Previous package codes TB Drawing type Package Drawing, TO-56 with lens Title 101615 FRONT VIEW ( 2 : 1 ) BOTTOM VIEW SIDE VIEW 2-56 UNC - 2B (2x) 3/8''-32 UNEF n7 9,5 A n7 7,6 i 0.2 i i 0.02 A 0.2 A r 1,3 12,7 n2,501`0,001 4,38`1 n0.25 * A * Slot side. 3,85 +- 0 0,05 11,7`0,6 A 6,65 ISOMETRIC VIEW 9,4 14,2 16,2 Component * 17,7 Connector housing (Stainless steel X10CrNiS18-9) NOTES:1. All dimensions in mm. 2. General tol. ±0.1 mm. * For details of the component, see separate data sheet and/or package drawing. Projection Package code © Zarlink Semiconductor 2002. All rights reserved. ISSUE 1 ACN 101514 rev1 DATE 17-NOV-03 APPRD. PD\US Previous package codes Drawing type TD TO-56 Package Outline in ST Connector housing Title 101514 For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request. Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE