Si5540 P R E L I M I N A R Y D A TA S H E E T SiPHY ™ OC-192/STM-64 TRANSMITTER Features Complete SONET/SDH transmitter for OC-192/STM-64 data rates with integrated 16:1 multiplexer and DSPLL™ based clock multiplier unit: Data Rates Supported: OC-192/STM-64, 10GbE, and 10.7 Gbps FEC Low Power Operation 0.6 W (typ) Small Footprint: 99-Pin BGA Package (11 x 11 mm) DSPLL™ Based Clock Multiplier Unit w/ selectable loop filter bandwidths OIF SFI-4 Compliant Interface Output Clock Powerdown Operates with 155 or 622 MHz Reference Sources Optional 3.3 V Supply Pin for LVTTL Compatible Outputs Single 1.8 V Supply Operation Applications Si5364 Bottom View Ordering Information: Sonet/SDH/ATM Routers Add/Drop Multiplexers Digital Cross Connects See page 17. Optical Transceiver Modules Sonet/SDH Test Equipment Description The Si5540 is a fully integrated low-power transmitter for high-speed serial communication systems. It combines high speed clock generation with a 16:1 multiplexer to serialize data for OC-192/STM-64 applications. The Si5540 is based on Silicon Laboratories’ DSPLL™ technology which eliminates the external loop filter components required by traditional clock multiplier units. In addition, selectable loop filter bandwidths are provided to ensure superior jitter performance while relaxing the jitter requirements on external clock distribution subsystems. Support for data streams up to 10.7 Gbps is also provided for applications that employ forward error correction (FEC). The Si5540 represents a new standard in low jitter, low power and small size for 10 Gbps serial transmitters. It operates from a single 1.8 V supply over the industrial temperature range (–40°C to 85°C). Functional Block Diagram R EFSEL R EFC LK 2 R EFRATE TXC LK16IN TXLOL BW SEL D SPLL TM CMU 2 ÷ 16 TXC LKD SBL 2 B ias R eset Con trol R EXT RES ET Preliminary Rev. 0.31 8/01 FIFO TXDOU T 2 2 16:1 MUX TXCL KOUT 32 TXCL K16OU T TXCL K16IN TXDIN [15:0] FIF ORST F IFOER R TXSQLC H TX M SBSEL Copyright © 2001 by Silicon Laboratories Si5540-DS031 This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Si 5540 2 Preliminary Rev. 0.31 Si5540 TA B L E O F C O N T E N TS Section Page Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSPLL™ Clock Multiplier Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Serialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bias Generation Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Differential Output Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Si5540 Pinout: 99-Pin BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Descriptions: Si5540 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Preliminary Rev. 0.31 4 9 9 9 9 10 10 10 11 12 14 17 18 20 3 Si 5540 Electrical Specifications Table 1. Recommended Operating Conditions Parameter Symbol Ambient Temperature LVTTL Output Supply Voltage Si5540 Supply Voltage Test Condition Min* Typ Max* Unit TA –40 25 85 °C VDD33 1.71 — 3.47 V VDD 1.71 1.8 1.89 V *Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical values apply at nominal supply voltages and an operating temperature of 25°C unless otherwise stated. V SIGNAL + Differential VICM, VOCM I/Os SIGNAL – VIS Single Ended Voltage (SIGNAL +) – (SIGNAL –) VID,VOD (VID = 2VIS) Differential Voltage Swing Differential Peak-to-Peak Voltage t Figure 1. Differential Voltage Measurement (TXDIN, TXDOUT, TXCLK16IN, TXCLK16OUT) tsu thd TXDOUT, TXDIN tCH TXCLKOUT, TXCLK16IN Figure 2. Data to Clock Delay 80% All Differential IOs 20% tF tR Figure 3. Rise/Fall Time Measurement 4 Preliminary Rev. 0.31 tCP Si5540 Table 2. DC Characteristics, VDD = 1.8 V (VDD = 1.8 V ±5%, TA = –40°C to 85°C) Parameter Symbol Test Condition Min Typ Max Unit Supply Current IDD — 333 TBD mA Power Dissipation PD — 0.6 TBD W VOCM .8 0.9 1.0 V 800 1000 1200 mV (pk-pk) Common Mode Output Voltage (TXDOUT,TXCLKOUT) See Figure 1 Differential Output Voltage Swing (TXDOUT,TXCLKOUT), Differential pk-pk VOD LVPECL Input Voltage High (REFCLK) VIH 1.975 2.3 2.59 V LVPECL Input Voltage Low (REFCLK) VIL 1.32 1.6 1.99 V LVPECL Input Voltage Swing (REFCLK), Differential pk-pk VID 250 — 2600 mV (pk-pk) LVPECL Input Common Mode (REFCLK) VICM 1.65 1.95 2.30 V 42 50 58 Ω Each input to common mode Input Impedance (REFCLK, TXDIN, TXCLK16IN) RIN LVDS Input High Voltage (TXDIN, TXCLK16IN) LVDS Input Low Voltage (TXDIN, TXCLK16IN) VIH — — 2.4 V VIL 0.0 — — V LVDS Input Voltage, Single Ended pk-pk (TXDIN, TXCLK16IN) VISE 100 — 600 mV (pk-pk) LVDS Input Common Mode Voltage (TXDIN, TXCLK16IN) LVDS Output High Voltage (TXCLK16OUT) VICM .8 2.0 2.4 V VOH 100 Ω Load Line-to-Line TBD — 1.475 V LVDS Output Low Voltage (TXCLK16OUT) VOL 100 Ω Load Line-to-Line 0.925 — TBD V LVDS Output Voltage, Single Ended pk-pk (TXCLK16OUT) VOSE 100 Ω Load Line-to-Line, See Figure 1 250 400 550 mV (pk-pk) LVDS Output Common Mode Voltage (TXCLK16OUT) VOCM 1.125 1.20 1.275 V Output Short to GND (TXCLK16OUT, TXDOUT, TXCLKOUT) ISC– — 25 TBD mA Output Short to VDD (TXCLK16OUT, TXDOUT, TXCLKOUT) LVTTL Input Voltage Low (TXCLKDSBL, FIFORST, TXSQLCH, BWSEL, REFRATE, REFSEL, TXMSBSEL, RESET) ISC+ TBD –100 — µA VIL2 — — 0.8 V Preliminary Rev. 0.31 5 Si 5540 Table 2. DC Characteristics, VDD = 1.8 V (Continued) (VDD = 1.8 V ±5%, TA = –40°C to 85°C) Parameter Symbol Test Condition Min Typ Max Unit Input Voltage High (TXCLKDSBL, FIFORST, TXSQLCH, BWSEL, REFRATE, REFSEL, TXMSBSEL, RESET) VIH2 2.0 — — V Input Low Current (TXCLKDSBL, FIFORST, TXSQLCH, BWSEL, REFRATE, REFSEL, TXMSBSEL, RESET) IIL — — 10 µA Input High Current (TXCLKDSBL, FIFORST, TXSQLCH, BWSEL, REFRATE, REFSEL, TXMSBSEL, RESET) Input Impedance (TXCLKDSBL, FIFORST, TXSQLCH, BWSEL, REFRATE, REFSEL, TXMSBSEL, RESET) IIH — — 10 µA RIN 10 — — kΩ VDD33 = 1.8 V — — 0.4 V VDD33 = 3.3 V — — 0.4 VDD33 = 1.8 V 1.4 — — VDD33 = 3.3 V 2.4 — — LVTTL Output Voltage Low (FIFOERR, TXLOL) VOL2 LVTTL Output Voltage High (FIFOERR, TXLOL) VOH2 6 Preliminary Rev. 0.31 V Si5540 Table 3. AC Characteristics (TXCLK16OUT, TXCLK16IN, TXCLKOUT, TXDIN, TXDOUT) (VDD = 1.8 V ±5%, TA = –40°C to 85°C) Parameter TXCLKOUT Frequency Symbol Test Condition Min Typ Max Unit — 9.95 10.7 GHz tch/tcp, Figure 2 45 — 55 % fclkout TXCLKOUT Duty Cycle Output Rise Time (TXCLKOUT, TXDOUT) tR Figure 3 — 25 — ps Output Fall Time (TXCLKOUT, TXDOUT) tF Figure 3 — 25 — ps TXCLKOUT Setup to TXDOUT tsu Figure 2 25 — — ps TXCLKOUT Hold From TXDOUT thd Figure 2 25 — — ps 400 kHz–10 GHz 10 GHz–16 GHz TBD TBD — — — — dB dB Figure 2 — 622 667 MHz tch/tcp, Figure 2 40 — 60 % Output Return Loss TXCLK16OUT Frequency fCLKIN TXCLK16OUT Duty Cycle TXCLK16OUT Rise & Fall Times tR, tF 100 — 300 ps TXDIN Setup to TXCLK16IN tDSIN — — 300 ps TXDIN Hold from TXCLK16IN tDHIN — — 300 ps TXCLK16IN Frequency fCLKIN — 622 667 MHz 40 — 60 % 100 — 300 ps TXCLK16IN Duty Cycle TXCLK16IN Rise & Fall Times tch/tcp, Figure 2 tR, tF Table 4. AC Characteristics (Clock Multiplier Characteristics) (VDD = 1.8 V ±5%, TA = –40°C to 85°C) Parameter Symbol Test Condition Min Typ Max Unit Jitter Generation—Deterministic JDET(PP) PRBS-23 — 0.020 TBD UIPP — 0.005 TBD UIRMS BWSEL = 0 — — 12 kHz BWSEL = 1 — — 50 kHz — 0.05 0.1 dB Jitter Generation—Random Jitter Transfer Bandwidth JGEN(RMS) JBW Jitter Transfer Peaking Acquisition Time Input Reference Clock Frequency Input Reference Clock Duty Cycle Input Reference Clock Frequency Tolerance TAQ Valid REFCLK — 15 20 ms RCFREQ REFRATE = 1 — 622 667 MHz REFRATE = 0 — 155 167 MHz RCDUTY 40 — 60 % RCTOL –100 — 100 ppm Note: Bellcore specifications: GR-1377-CORE, Issue 5, December 1998. Preliminary Rev. 0.31 7 Si 5540 Table 5. Absolute Maximum Ratings Parameter Symbol Value Unit VDD –0.5 to 3.0 V VDD33 –0.5 to 3.6 V VDIF –0.3 to (VDD+ 0.3) V ±50 mA DC Supply Voltage LVTTL Input Voltage Differential Input Voltages Maximum Current any output PIN Operating Junction Temperature TJCT –55 to 150 °C Storage Temperature Range TSTG –55 to 150 °C Package Temperature (soldering 10 seconds) 275 °C ESD HBM Tolerance (100 pf, 1.5 kΩ) TBD V Note: Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 6. Thermal Characteristics Parameter Thermal Resistance Junction to Ambient 8 Symbol Test Condition Value Unit ϕ JA Still Air 35 °C/W Preliminary Rev. 0.31 Si5540 Functional Description The Si5540 is a fully integrated, low power, SONET/ SDH transmitter for OC-192/STM-64 applications. It combines a high performance clock multiplier unit (CMU) with a 16:1 serializer that has a low-speed interface compliant with the Optical Interface Forum (OIF) SFI-4 standard. The CMU uses a phase-locked loop (PLL) architecture based on Silicon Laboratories’ proprietary DSPLL™ technology. This technology is used to generate ultralow jitter clock and data outputs that provide significant margin to the SONET/SDH specifications. The DSPLL architecture also utilizes a digitally implemented loop filter that eliminates the need for external loop filter components. As a result, sensitive noise coupling nodes that typically cause degraded jitter performance in crowded PCB environments are removed. The DSPLL also reduces the complexity and performance requirements of reference clock distribution strategies for OC-192/STM-64 optical port cards. This is possible because the DSPLL provides selectable wideband and narrowband loop filter settings that allow the user to set the jitter attenuation characteristics of the CMU to accommodate reference clock sources that have a high jitter content. Unlike traditional analog PLL implementations, the loop filter bandwidth is controlled by a digital filter inside the DSPLL and can be changed without any modification to external components. DSPLL™ Clock Multiplier Unit The Si5540’s clock multiplier unit (CMU) uses Silicon Laboratories’ proprietary DSPLL technology to generate a low jitter, high frequency clock source capable of producing a high speed serial clock and data output with significant margin to the SONET/SDH specifications. This is achieved by using a digital signal processing (DSP) algorithm to replace the loop filter commonly found in analog PLL designs. This algorithm processes the phase detector error term and generates a digital control value to adjust the frequency of the voltage controlled oscillator (VCO). Because external loop filter components are not required, sensitive noise entry points are eliminated, thus making the DSPLL less susceptible to board-level noise sources. Therefore, SONET/SDH jitter compliance is easier to attain in the application. Programmable Loop Filter Bandwidth The digital loop filter in the Si5530 provides two bandwidth settings that support either wideband or narrowband jitter transfer characteristics. The filter bandwidth is selected via the BWSEL control input. In traditional PLL implementations, changing the loop filter bandwidth would require changing the values of external loop filter components. In narrowband mode, a loop filter cutoff of 12 kHz is provided. This setting makes the Si5540 more tolerant of jitter on the reference clock source. As a result, the complexity of the clock distribution circuitry used to generate the physical layer reference clocks can be simplified without compromising jitter margin to the SONET/SDH specification. In wideband mode, the loop filter provides a cutoff of 50 kHz. This setting is desirable in applications where the reference clock is provided by a low jitter source like the Si5364 Clock Synchronization IC or Si5320 Precision Clock Multiplier/Jitter Attenuator IC. This allows the DSPLL to more closely track the precision reference source resulting in the best possible jitter performance. Reference Clock The CMU within the Si5530 is designed to operate with reference clock sources that are either 1/16th or 1/64th the desired output data rate. The CMU will support operation with data rates between 9.9 Gbps and 10.7 Gbps and the reference clock should be scaled accordingly. For example, to support 10.66 Gbps operation the reference clock source would be approximately 167 MHz or 666 MHz. The REFRATE input pin is used to configure the device for operation with one of the two supported reference clock submultiples of the data rate. The Si5540 supports operation with two selectable reference clock sources. The first configuration uses an externally provided reference clock that is input via REFCLK. The second configuration uses the parallel data clock, TXCLK16IN, as the reference clock source. When using TXCLK16IN as the reference source, the narrowband loop filter setting may be preferable to remove jitter that may be present on the data clock. The selection of reference clock configuration is controlled via the REFSEL input. The Si5540 will drive the TXLOL output high to indicate the DSPLL has locked to the selected reference source. Serialization The Si5540 includes serialization circuitry that combines a FIFO with a parallel to serial shift register. Low speed data on the parallel input bus, TXDIN[15:0], is latched into the FIFO on the rising edge of TXCLK16IN. The data in the FIFO is clocked into the Preliminary Rev. 0.31 9 Si 5540 shift register by an output clock, TXCLK16OUT, that is produced by dividing down the high speed transmit clock, TXCLKOUT, by a factor of 16. The TXCLK16OUT clock output is provided to support 16 bit word transfers between the Si5540 and upstream devices using a counter clocking scheme. The high-speed serial data stream is clocked out of the shift register using TXCLKOUT. Input FIFO The Si5540 integrates a FIFO to decouple data transferred into the FIFO via TXCLK16IN from data transferred into the shift register via TXCLK16OUT. The FIFO is eight parallel words deep and accommodates any static phase delay that may be introduced between TXCLK16OUT and TXCLK16IN in counter clocking schemes. Further, the FIFO will accommodate a phase drift or wander between TXCLK16IN and TXCLK16OUT of up to three parallel data words. The FIFO circuitry indicates an overflow or underflow condition by asserting FIFOERR high. This output can be used to recenter the FIFO read/write pointers by tieing it directly to the FIFORST input. The Si5540 will also recenter the read/write pointers after the device’s power on reset, external reset via RESET, and each time the DSPLL transitions from an out of lock state to a locked state (TXLOL transitions from low to high). Clock Disable The Si5540 provides a clock disable pin, TXCLKDSBL, that is used to disable the high-speed serial data clock output, TXCLKOUT. When the TXCLKDSBL pin is asserted, the positive and negative terminals of CLKOUT are tied to 1.5 V through 50 Ω on-chip resistors. This feature is used to reduce power consumption in applications that do not use the high speed transmit data clock. Bias Generation Circuitry The Si5540 makes use of an external resistor to set internal bias currents. The external resistor allows precise generation of bias currents which significantly reduces power consumption versus traditional implementations that use an internal resistor. The bias generation circuitry requires a 3.09 kΩ (1%) resistor connected between REXT and GND. Parallel Input To Serial Output Relationship The Si5540 provides the capability to select the order in which data on the parallel input bus is transmitted serially. Data on this bus can be transmitted MSB first or LSB first depending on the setting of TXMSBSEL. If TXMSBSEL is tied low, TXDIN0 is transmitted first followed in order by TXDIN1 through TXDIN15. If TXMSBSEL is tied high, TXDIN15 is transmitted first followed in order by TXDIN14 through TXDIN0. This feature simplifies board routing when ICs are mounted on both sides of the PCB. Transmit Data Squelch To prevent the transmission of corrupted data into the network, the Si5540 provides a control pin that can be used to force the high speed data output, TXDOUT, to 0. By driving TXSQLCH low TXDOUT will be forced to 0. Reset A device reset can be forced by holding the RESET pin low for at least 1 µs. When RESET is asserted low, the input FIFO pointers reset and the digital control circuitry initializes. When RESET transitions high to start normal operation, the DSPLL will be calibrated. 10 Preliminary Rev. 0.31 Si5540 Differential Output Circuitry The Si5540 utilizes a current-mode logic (CML) architecture to drive the high speed serial output clock and data on TXCLKOUT and TXDOUT. An example of output termination with ac coupling is shown in Figure 4. In applications where direct dc coupling is possible, the 250 nF capacitors may be omitted. The differential peak-to-peak voltage swing of the CML architecture is listed in Table 2 on page 5. 1.5 V 50 Ω VDD 50 Ω 50 Ω 250 nF Zo = 50 Ω 250 nF Zo = 50 Ω 50 Ω VDD 24 mA Figure 4. CML Output Driver Termination (TXCLKOUT, TXDOUT) Preliminary Rev. 0.31 11 Si 5540 Si5540 Pinout: 99 BGA 10 9 8 7 6 5 4 3 2 TXDIN[12]– TXDIN[12]+ TXDIN[14]– TXDIN[14]+ REFCLK– REFCLK+ TXSQLCH RSVD_ VDD33 REFRATE TXDIN[10]+ TXDIN[11]+ TXDIN[13]– TXDIN[13]+ TXDIN[15]– TXDIN[15]+ TXCLKDSBL REFSEL RSVD_ VDD33 GND B TXDIN[10]– TXDIN[11]– GND GND GND GND RESET VDD33 GND TXCLKOUT+ C TXDIN[8]+ TXDIN[9]+ GND VDD VDD VDD VDD RSVD_ GND GND TXCLKOUT– D TXDIN[8]– TXDIN[9]– GND VDD VDD VDD VDD RSVD_ GND GND GND E TXDIN[6]+ TXDIN[7]+ GND VDD VDD VDD VDD RSVD_ GND GND TXDOUT+ F TXDIN[6]– TXDIN[7]– GND VDD VDD VDD VDD RSVD_ GND GND TXDOUT– G TXDIN[4]+ TXDIN[5]+ GND GND GND GND GND BWSEL NC GND H TXDIN[4]– TXDIN[5]– TXDIN[3]+ TXDIN[3]– TXDIN[1]+ TXDIN[1]– TXMSBSEL RSVD_ GND TXLOL REXT J TXDIN[2]+ TXDIN[2]– TXDIN[0]+ TXDIN[0]– TXCLK16 IN+ TXCLK16 IN– TXCLK16 OUT+ TXCLK16 OUT– FIFORST FIFOERR K Bottom View Figure 5. Si5540 Pin Configuration (Bottom View) 12 Preliminary Rev. 0.31 1 A Si5540 1 A 2 3 4 5 6 7 8 9 10 REFRATE RSVD_ VDD33 TXSQLCH REFCLK+ REFCLK- TXDIN[14]+ TXDIN[14]– TXDIN[12]+ TXDIN[12]– B GND RSVD_ VDD33 REFSEL TXCLKDSBL TXDIN[15]+ TXDIN[15]– TXDIN[13]+ TXDIN[13]– TXDIN[11]+ TXDIN[10]+ C TXCLKOUT+ GND VDD33 RESET GND GND GND GND TXDIN[11]– TXDIN[10]– D TXCLKOUT– GND RSVD_ GND VDD VDD VDD VDD GND TXDIN[9]+ TXDIN[8]+ E GND GND RSVD_ GND VDD VDD VDD VDD GND TXDIN[9]– TXDIN[8]– F TXDOUT+ GND RSVD_ GND VDD VDD VDD VDD GND TXDIN[7]+ TXDIN[6]+ G TXDOUT– GND RSVD_ GND VDD VDD VDD VDD GND TXDIN[7]– TXDIN[6]– H GND NC BWSEL GND GND GND GND GND TXDIN[5]+ TXDIN[4]+ J REXT TXLOL RSVD_ GND TXMSBSEL TXDIN[1]– TXDIN[1]+ TXDIN[3]– TXDIN[3]+ TXDIN[5]– TXDIN[4]– K FIFOERR FIFORST TXCLK16 OUT– TXCLK16 OUT+ TXCLK16 IN– TXCLK16 IN+ TXDIN[0]– TXDIN[0]+ TXDIN[2]– TXDIN[2]+ Top View Figure 6. Si5540 Pin Configuration (Transparent Top View) Preliminary Rev. 0.31 13 Si 5540 Pin Descriptions: Si5540 Pin Number(s) Pin Name I/O Signal Level Description H3 BWSEL I LVTTL Bandwidth Select DSPLL. This input selects loop bandwidth of the DSPLL. BWSEL = 0: Loop bandwidth set to 12 kHz BWSEL = 1: Loop bandwidth set to 50 kHz. K1 FIFOERR O LVTTL FIFO Error. This output is driven high when a FIFO overflow/underflow has occurred. This output will stick high until reset by asserting FIFORST. K2 FIFORST I LVTTL FIFO Reset. This input, when asserted high, resets the read/ write FIFO pointers to their initial state. B1, C5–8, C2, D8, D2, E8, E1–2, F8, F2, G8, G2, H4– 8, H1 GND GND H2 NC — A5–6 REFCLK+, REFCLK– I LVPECL Differential Reference Clock. The reference clock sets the operating frequency of the PLL used to generate the output clock frequency. The Si5540 will operate with reference clock frequencies that are either 1/ 16th or 1/64th the output clock rate. A2 REFRATE I LVTTL Reference Frequency Select. This input configures the CMU to operate with one of two possible reference clock frequencies. When REFRATE = 1, the CMU will operate with a reference that is 1/16th the output clock rate. When REFRATE = 0, the CMU will operate with a reference that is 1/64th the output clock rate. B3 REFSEL I LVTTL Reference Clock Selection. This inputs selects the reference clock source used by the CMU. When REFSEL = 0, the low speed data input clock, TXCLK16IN, is used as the CMU reference. When REFSEL = 1, the reference clock provided on REFCLK is used. C4 RESET I LVTTL Device Reset. Forcing this input low for at least 1 µs will cause a device reset. For normal operation, this pin should be held high. 14 GND. No Connect. Reserved for device testing; leave electrically unconnected. Preliminary Rev. 0.31 Si5540 Pin Number(s) Pin Name I/O Signal Level Description J1 REXT D3, E3, F3, G3, J3 RSVD_GND — Reserved Tie to Ground. Must tie directly to GND for proper operation. A3, B2 RSVD_VDD33 — Reserved Tie to VDD33. Must tie directly to VDD33 for proper operation. K5–6 TXCLK16IN–, TXCLK16IN+ I LVDS Differential Data Clock Input. The rising edge of this input clocks data present on TXDIN into the device. K3–4 TXCLK16OUT+, TXCLK16OUT– O LVDS Divided Down Output Clock. This clock output is generated by dividing down the high speed output clock, TXCLKOUT, by a factor of 16. It is intended for use in counter clocking schemes that transfer data between the system ASIC and the Si5540. B4 TXCLKDSBL I LVTTL High Speed Clock Disable. When this input is high, the output driver for TXCLKOUT is disabled. In applications that do not require the output data clock, the output clock driver should be disabled to save power. C1, D1 TXCLKOUT+, TXCLKOUT– O CML High Speed Clock Output. The high speed output clock, TXCLKOUT, is generated by the PLL in the clock multiplier unit. It’s frequency is nominally 16 or 64 times the selected reference source. A7–10, B5–10, C9–10, D9–10, E9–10, F9–10, G9–10, H9–10, J5–10, K7–10 TXDIN[15:0]–, TXDIN[15:0]+ I LVDS Differential Parallel Data Input. The 16-bit data word present on these pins is multiplexed into a high speed serial stream and output on TXDOUT. The data on these inputs is clocked into the device by the rising edge of TXCLKIN. F1, G1 TXDOUT+, TXDOUT– O CML Differential High Speed Data Output. The 16-bit word input on TXDIN[15:0] is multiplexed into a high speed serial stream that is output on these pins. This output is updated by the rising edge of TXCLKOUT. J2 TXLOL O LVTTL CMU Loss-of-Lock. The output is asserted low when the CMU is not phase locked to the selected reference source. External Bias Resistor. This resistor is used by onboard circuitry to establish bias currents within the device. This pin must be connected to GND through a 3.09 kΩ (1%) resistor. Preliminary Rev. 0.31 15 Si 5540 Pin Number(s) Pin Name I/O Signal Level Description J4 TXMSBSEL I LVTTL Data Bus Transmit Order. For TXMSBSEL = 0, data on TXDIN[0] is transmitted first followed by TXDIN[1] through TXDIN[15]. For TXMSBSEL = 1, TXDIN[15] is transmitted first followed by TXDIN[14] through TXDIN[0]. A4 TXSQLCH I LVTTL Transmit Data Squelch. If TXSQLCH is asserted low, the output data stream on TXDOUT will be forced to 0. If TXSQLCH = 1, TX squelching is turned off. D4–7, E4–7, F4–7, G4–7, VDD VDD 1.8 V Supply Voltage. Nominally 1.8 V. C3 VDD33 VDD33 16 1.8 V or 3.3 V Digital Output Supply. Must be tied to either 1.8 V or 3.3 V. When tied to 3.3 V, LVTTL compatible output voltage swings on TXLOL and FIFOERR are supported. Preliminary Rev. 0.31 Si5540 Ordering Guide Table 7. Ordering Guide Part Number Package Temperature Si5540-BC 99 BGA –40°C to 85°C Preliminary Rev. 0.31 17 Si 5540 Package Outline Figure 7 illustrates the package details for the Si5540. Table 8 lists the values for the dimensions shown in the illustration. A1 Ball Pad Corner A1 Ball Pad Corner A D 10 A1 9 8 7 6 5 4 3 2 1 A e B C D E E b 1.00 Ref F G H J K 1.00 Ref A2 Top View Seating Plane Side View Bottom View Figure 7. 99-Ball Grid Array (BGA) Table 8. Package Diagram Dimensions Symbol A A1 A2 b D E e 18 Min 1.30 0.31 0.65 — — — — Millimeters Nom 1.40 0.36 0.70 0.46 11.00 11.00 1.00 Preliminary Rev. 0.31 Max 1.50 0.41 0.75 — — — — e Si5540 NOTES: Preliminary Rev. 0.31 19 Si 5540 Contact Information Silicon Laboratories Inc. 4635 Boston Lane Austin, TX 78735 Tel: 1+(512) 416-8500 Fax: 1+(512) 416-9669 Toll Free: 1+(877) 444-3032 Email: [email protected] Internet: www.silabs.com The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages. Silicon Laboratories, Silicon Labs, SiPHY, and DSPLL are trademarks of Silicon Laboratories Inc. Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders. 20 Preliminary Rev. 0.31