VISHAY 60CPH03PBF

VS-60CPH03PbF, VS-60CPH03-N3
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Vishay Semiconductors
Hyperfast Rectifier, 2 x 30 A FRED Pt®
FEATURES
Base
common
cathode
• Hyperfast recovery time
• Low forward voltage drop
2
• Low leakage current
• 175 °C operating junction temperature
• Compliant to RoHS Directive 2002/95/EC
TO-247AC
• Designed and
JEDEC-JESD47
1
3
Anode
Anode
2
1
2
Common
cathode
qualified
according
to
• Halogen-free according to IEC 61249-2-21
definition (-N3 only)
DESCRIPTIONS/APPLICATIONS
VS-60CPH03PbF, VS-60CPH03-N3 series are the state of
the art ultrafast recovery rectifiers designed with optimized
performance of forward voltage drop and ultrafast recovery
time.
The planar structure and the platinum doped life time control
guarantee the best overall performance, ruggedness and
reliability characteristics.
These devices are intended for use in the output rectification
stage of SMPS, UPS, DC/DC converters as well as
freewheeling diodes in low voltage inverters and chopper
motor drives.
Their extremely optimized stored charge and low recovery
current minimize the switching losses and reduce over
dissipation in the switching element and snubbers.
PRODUCT SUMMARY
Package
TO-247AC
IF(AV)
2 x 30 A
VR
300 V
VF at IF
1.25 V
trr typ.
See Recovery table
TJ max.
175 °C
Diode variation
Common cathode
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Average rectified forward current
TEST CONDITIONS
VRRM
Repetitive peak reverse voltage
per leg
total device
Non-repetitive peak surge current per leg
Operating junction and storage temperatures
IF(AV)
TC = 143 °C
IFSM
TJ = 25 °C
TJ, TStg
MAX.
UNITS
300
V
30
60
A
300
- 65 to 175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
Forward voltage
SYMBOL
VBR,
VR
VF
TEST CONDITIONS
IR = 100 μA
IF = 30 A
MIN.
TYP.
MAX.
300
-
-
-
1.08
1.25
IF = 30 A, TJ = 125 °C
-
0.92
1.00
VR = VR rated
-
0.05
60
TJ = 125 °C, VR = VR rated
-
20
300
UNITS
V
Reverse leakage current
IR
Junction capacitance
CT
VR = 300 V
-
70
-
pF
Series inductance
LS
Measured lead to lead 5 mm from package body
-
3.5
-
nH
Revision: 30-Sep-11
µA
Document Number: 94500
1
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VS-60CPH03PbF, VS-60CPH03-N3
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
IF = 1.0 A, dIF/dt = 50 A/μs, VR = 30 V
Reverse recovery time
Peak recovery current
trr
IRRM
MIN.
TYP.
MAX.
-
-
55
TJ = 25 °C
-
39
-
TJ = 125 °C
-
57
-
-
2.8
-
-
7.5
-
TJ = 25 °C
TJ = 125 °C
IF = 30 A
dIF/dt = - 200 A/μs
VR = 200 V
UNITS
ns
A
TJ = 25 °C
-
55
-
TJ = 125 °C
-
214
-
MIN.
TYP.
MAX.
UNITS
TJ, TStg
- 65
-
175
°C
Thermal resistance,
junction to case per leg
RthJC
-
0.5
0.9
Thermal resistance,
junction to ambient per leg
RthJA
Typical socket mount
-
-
40
Thermal resistance,
case to heatsink
RthCS
Mounting surface, flat, smooth and greased
-
0.4
-
-
6.0
-
g
-
0.22
-
oz.
6.0
(5.0)
-
12
(10)
kgf cm
(lbf in)
Reverse recovery charge
Qrr
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction and storage
temperature range
SYMBOL
TEST CONDITIONS
Weight
Mounting torque
Marking device
Revision: 30-Sep-11
Case style TO-247AC
°C/W
60CPH03
Document Number: 94500
2
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-60CPH03PbF, VS-60CPH03-N3
www.vishay.com
Vishay Semiconductors
1000
1000
IR - Reverse Current (µA)
IF - Instantaneous
Forward Current (A)
TJ = 175 °C
100
TJ = 175 °C
TJ = 125 °C
10
TJ = 25 °C
1
0.2
100
TJ = 150 °C
10
TJ = 125 °C
TJ = 100 °C
1
0.1
TJ = 25 °C
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
1.8
50
100
150
200
250
300
VR - Reverse Voltage (V)
VF - Forward Voltage Drop (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
CT - Junction Capacitance (pF)
1000
100
10
0
50
100
150
200
250
300
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
ZthJC - Thermal Impedance (°C/W)
1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.1
0.01
0.001
0.00001
Single pulse
(thermal resistance)
0.0001
0.001
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Revision: 30-Sep-11
Document Number: 94500
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-60CPH03PbF, VS-60CPH03-N3
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Vishay Semiconductors
50
45
Average Power Loss (W)
Allowable Case Temperature (°C)
180
160
DC
140
Square wave (D = 0.50)
Rated VR applied
RMS limit
40
35
30
D = 0.01
D = 0.02
D = 0.05
D = 0.10
D = 0.20
D = 0.50
DC
25
20
15
10
5
See note (1)
120
0
0
5
10
15
20
25
30
35
40
45
0
IF(AV) - Average Forward Current (A)
5
10
15
20
25
30
35
40
45
50
IF(AV) - Average Forward Current (A)
Fig. 7 - Forward Power Loss Characteristics
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
80
1000
70
IF = 30 A, 125 °C
60
Qrr (nC)
trr (ns)
IF = 30 A, 125 °C
50
40
30
100
IF = 30 A, 25 °C
IF = 30 A, 25 °C
20
10
100
1000
dIF/dt (A/µs)
Fig. 6 - Typical Reverse Recovery Time vs. dIF/dt
10
100
1000
dIF/dt (A/µs)
Fig. 8 - Typical Stored Charge vs. dIF/dt
Note
Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated VR
(1)
Revision: 30-Sep-11
Document Number: 94500
4
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-60CPH03PbF, VS-60CPH03-N3
www.vishay.com
Vishay Semiconductors
VR = 200 V
0.01 Ω
L = 70 μH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Revision: 30-Sep-11
Document Number: 94500
5
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-60CPH03PbF, VS-60CPH03-N3
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
60
C
P
H
03
PbF
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (60 = 60 A)
3
-
Circuit configuration:
C = Common cathode
4
-
Package:
P = TO-247AC (modified)
5
-
H = Hyperfast recovery
6
-
Voltage code (03 = 300 V)
7
-
Environmental digit:
PbF = Lead (Pb)-free and RoHS compliant
-N3 = Halogen-free, RoHS compliant and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
VS-60CPH03PbF
25
500
PACKAGING DESCRIPTION
Antistatic plastic tube
VS-60CPH03-N3
25
500
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
Revision: 30-Sep-11
www.vishay.com/doc?95223
TO-247ACPbF
www.vishay.com/doc?95226
TO-247AC-N3
www.vishay.com/doc?95007
Document Number: 94500
6
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
DIMENSIONS in millimeters and inches
A
A
(3)
(6) Ø P
E
B
(2) R/2
N
A2
S
(Datum B)
Ø K M DBM
FP1
A
D2
Q
2xR
(2)
D1 (4)
D
1
4
D
3
2
Thermal pad
(5) L1
C
L
A
See view B
2 x b2
3xb
0.10 M C A M
Planting
(4)
E1
0.01 M D B M
View A - A
C
2x e
A1
b4
(b1, b3, b5)
Lead assignments
Base metal
D DE
(c)
c1
E
C
C
Diodes
1. - Anode/open
2. - Cathode
3. - Anode
(b, b2, b4)
(4)
Section C - C, D - D, E - E
SYMBOL
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.50
2.49
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.37
2.59
3.43
2.59
3.38
0.38
0.86
0.38
0.76
19.71
20.70
13.08
-
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.059
0.098
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.094
0.102
0.135
0.102
0.133
0.015
0.034
0.015
0.030
0.776
0.815
0.515
-
View B
NOTES
SYMBOL
3
4
D2
E
E1
e
FK
L
L1
N
P
P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.30
15.29
15.87
13.72
5.46 BSC
2.54
14.20
16.10
3.71
4.29
7.62 BSC
3.56
3.66
6.98
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.051
0.602
0.625
0.540
0.215 BSC
0.010
0.559
0.634
0.146
0.169
0.3
0.14
0.144
0.275
0.209
0.224
1.78
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC outline TO-247 with exception of dimension c
Revision: 16-Jun-11
Document Number: 95223
1
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 12-Mar-12
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Document Number: 91000