PHILIPS 74AHCT1G125GF

74AHC1G125; 74AHCT1G125
Bus buffer/line driver; 3-state
Rev. 09 — 22 June 2009
Product data sheet
1. General description
74AHC1G125 and 74AHCT1G125 are high-speed Si-gate CMOS devices. They provide
one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by
the output enable input (OE). A HIGH at OE causes the output to assume a
high-impedance OFF-state.
The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.
The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
2. Features
n
n
n
n
n
n
Symmetrical output impedance
High noise immunity
Low power dissipation
Balanced propagation delays
Multiple package options
ESD protection:
u HBM JESD22-A114E: exceeds 2000 V
u MM JESD22-A115-A: exceeds 200 V
u CDM JESD22-C101C: exceeds 1000 V
n Specified from −40 °C to +125 °C
3. Ordering information
Table 1.
Ordering information
Type number
74AHC1G125GW
Package
Temperature range
Name
Description
Version
−40 °C to +125 °C
TSSOP5
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
SOT353-1
−40 °C to +125 °C
SC-74A
plastic surface-mounted package; 5 leads
SOT753
−40 °C to +125 °C
XSON6
plastic extremely thin small outline package; no SOT886
leads; 6 terminals; body 1 × 1.45 × 0.5 mm
−40 °C to +125 °C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1 × 1 × 0.5 mm
74AHCT1G125GW
74AHC1G125GV
74AHCT1G125GV
74AHC1G125GM
74AHCT1G125GM
74AHC1G125GF
74AHCT1G125GF
SOT891
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
4. Marking
Table 2.
Marking codes
Type number
Marking[1]
74AHC1G125GW
AM
74AHCT1G125GW
CM
74AHC1G125GV
A25
74AHCT1G125GV
C25
74AHC1G125GM
AM
74AHCT1G125GM
CM
74AHC1G125GF
AM
74AHCT1G125GF
CM
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
A
2
Y
4
Y
A
2
4
OE
1
1
EN
mna118
Fig 1.
OE
mna120
mna119
Logic symbol
Fig 2.
IEC logic symbol
Fig 3.
Logic diagram
6. Pinning information
6.1 Pinning
74AHC1G125
74AHCT1G125
74AHC1G125
74AHCT1G125
OE
1
A
2
GND
3
5
VCC
OE
1
6
VCC
A
2
5
n.c.
GND
4
Y
Pin configuration
SOT353-1 and SOT753
4
Y
001aaj971
Fig 5.
Pin configuration SOT886
74AHC_AHCT1G125_9
Product data sheet
OE
1
6
VCC
A
2
5
n.c.
GND
3
4
Y
001aaj972
Transparent top view
Transparent top view
001aaf101
Fig 4.
3
74AHC1G125
74AHCT1G125
Fig 6.
Pin configuration SOT891
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
2 of 16
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
SOT353-1/SOT753
SOT886/SOT891
OE
1
1
output enable input
A
2
2
data input
GND
3
3
ground (0 V)
Y
4
4
data output
n.c.
-
5
not connected
VCC
5
6
supply voltage
7. Functional description
Table 4.
Function table
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state
Inputs
Output
OE
A
Y
L
L
L
L
H
H
H
X
Z
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
VCC
supply voltage
VI
input voltage
IIK
input clamping current
VI < −0.5 V
[1]
IOK
output clamping current
VO < −0.5 V or VO > VCC + 0.5 V
[1]
IO
output current
−0.5 V < VO < VCC + 0.5 V
Min
Max
Unit
−0.5
+7.0
V
−0.5
+7.0
V
−20
-
mA
-
±20
mA
-
±25
mA
ICC
supply current
-
75
mA
IGND
ground current
−75
-
mA
Tstg
storage temperature
−65
+150
°C
-
250
mW
Ptot
total power dissipation
Tamb = −40 °C to +125 °C
[2]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.
For XSON6 packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K.
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
3 of 16
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
74AHC1G125
Min
Typ
74AHCT1G125
Max
Min
Typ
Unit
Max
VCC
supply voltage
2.0
5.0
5.5
4.5
5.0
5.5
V
VI
input voltage
0
-
5.5
0
-
5.5
V
VO
output voltage
0
-
VCC
0
-
VCC
V
Tamb
ambient temperature
−40
+25
+125
−40
+25
+125
°C
∆t/∆V
input transition rise
and fall rate
VCC = 3.3 V ± 0.3 V
-
-
100
-
-
-
ns/V
VCC = 5.0 V ± 0.5 V
-
-
20
-
-
20
ns/V
10. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
1.5
-
-
1.5
-
1.5
-
V
VCC = 3.0 V
2.1
-
-
2.1
-
2.1
-
V
VCC = 5.5 V
3.85
-
-
3.85
-
3.85
-
V
74AHC1G125
VIH
VIL
VOH
VOL
HIGH-level
input voltage
LOW-level
input voltage
VCC = 2.0 V
-
-
0.5
-
0.5
-
0.5
V
VCC = 3.0 V
-
-
0.9
-
0.9
-
0.9
V
VCC = 5.5 V
-
-
1.65
-
1.65
-
1.65
V
HIGH-level
VI = VIH or VIL
output voltage
IO = −50 µA; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = −50 µA; VCC = 3.0 V
2.9
3.0
-
2.9
-
2.9
-
V
IO = −50 µA; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = −4.0 mA; VCC = 3.0 V
2.58
-
-
2.48
-
2.40
-
V
IO = −8.0 mA; VCC = 4.5 V
3.94
-
-
3.8
-
3.70
-
V
LOW-level
VI = VIH or VIL
output voltage
IO = 50 µA; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 µA; VCC = 3.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 µA; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.36
-
0.44
-
0.55
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
-
0.44
-
0.55
V
IOZ
OFF-state
VI = VCC or GND;
output current VCC = 5.5 V
-
-
0.25
-
2.5
-
10
µA
II
input leakage
current
-
-
0.1
-
1.0
-
2.0
µA
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
40
µA
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
4 of 16
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
Table 7.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
CI
25 °C
Conditions
input
capacitance
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
-
1.5
10
-
10
-
10
pF
74AHCT1G125
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
2.0
-
-
2.0
-
2.0
-
V
VIL
LOW-level
input voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
-
0.8
-
0.8
V
VOH
HIGH-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = −50 µA
4.4
4.5
-
4.4
-
4.4
-
V
3.94
-
-
3.8
-
3.70
-
V
-
0
0.1
-
0.1
-
0.1
V
-
-
0.36
-
0.44
-
0.55
V
IO = −8.0 mA
VOL
LOW-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = 50 µA
IO = 8.0 mA
IOZ
OFF-state
VI = VCC or GND;
output current VCC = 5.5 V
-
-
0.25
-
2.5
-
10
µA
II
input leakage
current
-
-
0.1
-
1.0
-
2.0
µA
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
40
µA
∆ICC
additional
per input pin; VI = 3.4 V;
supply current other inputs at VCC or GND;
IO = 0 A; VCC = 5.5 V
-
-
1.35
-
1.5
-
1.5
mA
CI
input
capacitance
-
1.5
10
-
10
-
10
pF
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
11. Dynamic characteristics
Table 8.
Dynamic characteristics
GND = 0 V; For test circuit see Figure 9.
Symbol Parameter
25 °C
Conditions
Min
Typ
CL = 15 pF
-
CL = 50 pF
-
CL = 15 pF
CL = 50 pF
−40 °C to +85 °C −40 °C to +125 °C Unit
Max
Min
Max
Min
Max
4.7
8.0
6.6
11.5
1.0
9.5
1.0
11.5
ns
1.0
13.0
1.0
14.5
ns
-
3.4
5.5
1.0
6.5
1.0
7.0
ns
-
4.8
7.5
1.0
8.5
1.0
9.5
ns
74AHC1G125
tpd
propagation
delay
A to Y; see Figure 7
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
[1]
[2]
[3]
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
5 of 16
NXP Semiconductors
74AHC1G125; 74AHCT1G125
Bus buffer/line driver; 3-state
Table 8.
Dynamic characteristics …continued
GND = 0 V; For test circuit see Figure 9.
Symbol Parameter
ten
enable time
25 °C
Conditions
Min
Typ
Max
Min
Max
Min
Max
-
5.0
8.0
1.0
9.5
1.0
11.5
ns
-
6.9
11.5
1.0
13.0
1.0
14.5
ns
CL = 15 pF
-
3.6
5.1
1.0
6.0
1.0
6.5
ns
CL = 50 pF
-
4.9
7.5
1.0
8.5
1.0
9.5
ns
CL = 15 pF
-
6.0
9.7
1.0
11.5
1.0
12.5
ns
CL = 50 pF
-
8.3
13.2
1.0
15.0
1.0
16.5
ns
-
4.1
6.8
1.0
8.0
1.0
8.5
ns
-
5.7
8.8
1.0
10.0
1.0
11.0
ns
-
9
-
-
-
-
-
pF
-
3.4
5.5
1.0
6.5
1.0
7.0
ns
-
4.8
7.5
1.0
8.5
1.0
9.5
ns
-
3.9
5.1
1.0
6.0
1.0
6.5
ns
-
5.1
7.5
1.0
8.5
1.0
9.5
ns
CL = 15 pF
-
4.5
6.8
1.0
8.0
1.0
8.5
ns
CL = 50 pF
-
6.1
8.8
1.0
10.0
1.0
11.0
ns
OE to Y; see Figure 8
VCC = 3.0 V to 3.6 V
[1]
[2]
CL = 15 pF
CL = 50 pF
VCC = 4.5 V to 5.5 V
tdis
disable time
OE to Y; see Figure 8
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
[3]
[1]
[2]
[3]
CL = 15 pF
CL = 50 pF
CPD
−40 °C to +85 °C −40 °C to +125 °C Unit
power
per buffer;
dissipation
CL = 50 pF; f = 1 MHz;
capacitance VI = GND to VCC
[4]
74AHCT1G125
tpd
propagation
delay
A to Y; see Figure 7
VCC = 4.5 V to 5.5 V
[1]
[3]
CL = 15 pF
CL = 50 pF
ten
enable time
OE to Y; see Figure 8
VCC = 4.5 V to 5.5 V
[1]
[3]
CL = 15 pF
CL = 50 pF
tdis
disable time
OE to Y; see Figure 8
VCC = 4.5 V to 5.5 V
[1]
[3]
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
6 of 16
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
Table 8.
Dynamic characteristics …continued
GND = 0 V; For test circuit see Figure 9.
Symbol Parameter
25 °C
Conditions
Min
Typ
Max
Min
Max
Min
Max
-
11
-
-
-
-
-
[4]
per buffer;
power
CL = 50 pF; f = 1 MHz;
dissipation
capacitance VI = GND to VCC
CPD
−40 °C to +85 °C −40 °C to +125 °C Unit
[1]
tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
[2]
Typical values are measured at VCC = 3.3 V.
[3]
Typical values are measured at VCC = 5.0 V.
[4]
CPD is used to determine the dynamic power dissipation PD (µW).
PD = CPD × VCC2 × fi + ∑(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts.
pF
12. Waveforms
VI
VM
A input
GND
t PHL
t PLH
VOH
VM
Y output
VOL
mnb153
Measurement points are given in Table 9.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7.
Input (A) to output (Y) propagation delays
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
7 of 16
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
VI
OE input
VM
GND
tPLZ
tPZL
VCC
output
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
tPHZ
VOH
tPZH
VY
output
HIGH-to-OFF
OFF-to-HIGH
VM
GND
outputs
enabled
outputs
enabled
outputs
disabled
mna644
Measurement points are given in Table 9.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 8.
Table 9.
Enable and disable times
Measurement point
Type
Inputs
Output
VI
VM
VM
VX
VY
74AHC1G125
GND to VCC
0.5VCC
0.5VCC
VOL + 0.3 V
VOH − 0.3 V
74AHCT1G125
GND to 3.0 V
1.5 V
0.5VCC
VOL + 0.3 V
VOH − 0.3 V
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
8 of 16
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VCC
VCC
G
VI
VO
RL
S1
open
DUT
RT
CL
001aad983
Test data is given in Table 10.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 9.
Table 10.
Test circuit for measuring switching times
Test data
Type
Input
Load
S1 position
VI
tr, tf
CL
RL
tPHL, tPLH
tPZH, tPHZ
tPZL, tPLZ
74AHC1G125
VCC
≤ 3 ns
15 pF, 50 pF
1 kΩ
open
GND
VCC
74AHCT1G125
3V
≤ 3 ns
15 pF, 50 pF
1 kΩ
open
GND
VCC
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
9 of 16
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
E
D
SOT353-1
A
X
c
y
HE
v M A
Z
5
4
A2
A
(A3)
A1
θ
1
Lp
3
L
e
w M
bp
detail X
e1
0
1.5
3 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
e1
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.1
0
1.0
0.8
0.15
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
1.3
2.25
2.0
0.425
0.46
0.21
0.3
0.1
0.1
0.60
0.15
7°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT353-1
REFERENCES
IEC
JEDEC
JEITA
MO-203
SC-88A
EUROPEAN
PROJECTION
ISSUE DATE
00-09-01
03-02-19
Fig 10. Package outline SOT353-1 (TSSOP5)
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
10 of 16
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
Plastic surface-mounted package; 5 leads
SOT753
D
E
B
y
A
X
HE
5
v M A
4
Q
A
A1
c
1
2
3
Lp
detail X
bp
e
w M B
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.100
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT753
JEITA
SC-74A
EUROPEAN
PROJECTION
ISSUE DATE
02-04-16
06-03-16
Fig 11. Package outline SOT753 (SC-74A)
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
11 of 16
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
b
1
2
3
4×
(2)
L
L1
e
6
5
e1
4
e1
6×
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.25
0.17
1.5
1.4
1.05
0.95
0.6
0.5
0.35
0.27
0.40
0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
OUTLINE
VERSION
SOT886
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-07-15
04-07-22
MO-252
Fig 12. Package outline SOT886 (XSON6)
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
12 of 16
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm
1
SOT891
b
3
2
4×
(1)
L
L1
e
6
5
e1
4
e1
6×
A
(1)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.20
0.12
1.05
0.95
1.05
0.95
0.55
0.35
0.35
0.27
0.40
0.32
Note
1. Can be visible in some manufacturing processes.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
05-04-06
07-05-15
SOT891
Fig 13. Package outline SOT891 (XSON6)
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
13 of 16
74AHC1G125; 74AHCT1G125
NXP Semiconductors
Bus buffer/line driver; 3-state
14. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
CDM
Charged Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
15. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change
notice
Supersedes
74AHC_AHCT1G125_9
20090622
Product data sheet
-
74AHC_AHCT1G125_8
Modifications:
74AHC_AHCT1G125_8
Modifications:
•
Updated features with multiple package option in Section 2.
20090409
•
Product data sheet
-
74AHC_AHCT1G125_7
Package SOT886 and SOT891 added in Section 3, Section 4 and Section 13.
74AHC_AHCT1G125_7
20070707
Product data sheet
-
74AHC_AHCT1G125_6
74AHC_AHCT1G125_6
20020606
Product specification
-
74AHC_AHCT1G125_5
74AHC_AHCT1G125_5
20020322
Product specification
-
74AHC_AHCT1G125_4
74AHC_AHCT1G125_4
20010222
Product specification
-
74AHC_AHCT1G125_3
74AHC_AHCT1G125_3
19990615
Product specification
-
74AHC_AHCT1G125_N_2
74AHC_AHCT1G125_N_2
19981207
Preliminary specification
-
74AHC_AHCT1G125_N_1
74AHC_AHCT1G125_N_1
19981125
Preliminary specification
-
-
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
14 of 16
NXP Semiconductors
74AHC1G125; 74AHCT1G125
Bus buffer/line driver; 3-state
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74AHC_AHCT1G125_9
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 09 — 22 June 2009
15 of 16
NXP Semiconductors
74AHC1G125; 74AHCT1G125
Bus buffer/line driver; 3-state
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 22 June 2009
Document identifier: 74AHC_AHCT1G125_9