SN74AUP1G240 www.ti.com SCES627C – MARCH 2005 – REVISED MAY 2010 LOW-POWER SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT Check for Samples: SN74AUP1G240 FEATURES 1 • • • • • • • Available in the Texas Instruments NanoStar™ Package Low Static-Power Consumption – ICC = 0.9 mA Max Low Dynamic-Power Consumption – Cpd = 4.2 pF at 3.3 V Typ Low Input Capacitance – CI = 1.5 pF Typ Low Noise – Overshoot and Undershoot <10% of VCC Input-Disable Feature Allows Floating Input Conditions Ioff Supports Partial Power-Down-Mode Operation • • • • • • • • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input Wide Operating VCC Range of 0.8 V to 3.6 V Optimized for 3.3-V Operation 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation tpd = 4.7 ns Max at 3.3 V Suitable for Point-to-Point Applications Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) DBV PACKAGE (TOP VIEW) OE 1 A 2 GND 3 1 6 VCC DSF PACKAGE (TOP VIEW) A 2 5 NC GND 3 4 Y 1 1 A 2 GND 3 5 VCC 4 Y Y 4 OE OE VCC 5 DRY PACKAGE (TOP VIEW) OE DCK PACKAGE (TOP VIEW) 6 VCC A 2 5 N.C. GND 3 4 Y YFP PACKAGE (TOP VIEW) OE A GND A1 1 6 A2 B1 2 5 B2 C1 3 4 C2 VCC N.C. Y YZP PACKAGE (TOP VIEW) OE A GND A1 1 B1 2 C1 3 5 A2 VCC 4 C2 Y See mechanical drawings for dimensions. N.C. – No internal connection DESCRIPTION/ORDERING INFORMATION The AUP family is TI's premier solution to the industry's low power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2010, Texas Instruments Incorporated SN74AUP1G240 SCES627C – MARCH 2005 – REVISED MAY 2010 Static-Power Consumption (mA) www.ti.com Switching Characteristics Dynamic-Power Consumption (pF) 100% 100% 80% 80% at 25 MHz † 3.5 60% 60% 3.3-V † Logic 40% 40% Voltage - V 3 3.3-V LVC † Logic 2.5 Input 2 1.5 1 Output 0.5 20% 20% AUP 0% † 0 -0.5 AUP 0% 0 † Single, dual, and triple gates. Figure 1. AUP – The Lowest-Power Family 5 10 15 20 25 Time - ns 30 35 40 45 AUP1G08 data at CL = 15 pF. Figure 2. Excellent Signal Integrity This buffer/driver is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high. This device has the input-disable feature, which allows floating input signals. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION (1) –40°C to 85°C (1) (2) (3) ORDERABLE PART NUMBER PACKAGE (2) TA TOP-SIDE MARKING (3) NanoStar – WCSP (DSBGA) 0.23-mm large bump – YFP Reel of 3000 SN74AUP1G240YFPR _ _ _HK_ NanoStar – WCSP (DSBGA) 0.23-mm large bump – YZP (Pb-free) Reel of 3000 SN74AUP1G240YZPR _ _ _HK_ QFN – DRY Reel of 5000 SN74AUP1G240DRYR HK uQFN – DSF Reel of 5000 SN74AUP1G240DSFR HK SOT (SOT-23) – DBV Reel of 3000 SN74AUP1G240DBVR H40_ SOT (SC-70) – DCK Reel of 3000 SN74AUP1G240DCKR HK_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YFP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE INPUTS (1) OUTPUT Y OE A L H L L L H H X (1) Z Floating inputs allowed. LOGIC DIAGRAM (POSITIVE LOGIC) 1 OE 2 4 A 2 Y Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G240 SN74AUP1G240 www.ti.com SCES627C – MARCH 2005 – REVISED MAY 2010 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VI Input voltage range (2) –0.5 4.6 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 4.6 V –0.5 VCC + 0.5 (2) UNIT VO Output voltage range in the high or low state IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±20 mA Continuous current through VCC or GND ±50 mA Package thermal impedance (3) qJA Tstg (1) (2) (3) DBV package 206 DCK package 252 DSF package 300 DRY package 234 YFP/YZP package 132 Storage temperature range –65 V °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 0.8 V VIH High-level input voltage VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V MIN MAX 0.8 3.6 VCC 3.6 0.65 × VCC 3.6 1.6 3.6 2 3.6 VCC = 0.8 V VIL Low-level input voltage VO Output voltage Δt/Δv Input transition rise or fall rate TA Operating free-air temperature (1) UNIT V V 0 VCC = 1.1 V to 1.95 V 0 0.35 × VCC VCC = 2.3 V to 2.7 V 0 VCC = 3 V to 3.6 V 0 0.9 Active state 0 VCC 3-state 0 3.6 VCC = 0.8 V to 3.6 V –40 0.7 V V 200 ns/V 85 °C The A data input pins may be floated if the OE is high and the outputs are disabled; otherwise, all unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G240 3 SN74AUP1G240 SCES627C – MARCH 2005 – REVISED MAY 2010 www.ti.com ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH TEST CONDITIONS VCC MIN 0.8 V to 3.6 V VCC – 0.1 VCC – 0.1 1.1 V 0.75 × VCC 0.7 × VCC IOH = –1.7 mA 1.4 V 1.11 1.03 IOH = –1.9 mA 1.65 V 1.32 1.3 2.05 1.97 2.3 V IOH = –2.7 mA 3V IOH = –4 mA 1.9 1.85 2.72 2.67 2.6 2.55 MAX UNIT V IOL = 20 mA 0.8 V to 3.6 V 0.1 0.1 IOL = 1.1 mA 1.1 V 0.3 × VCC 0.3 × VCC IOL = 1.7 mA 1.4 V 0.31 0.37 IOL = 1.9 mA 1.65 V 0.31 0.35 0.31 0.33 0.44 0.45 0.31 0.33 0.44 0.45 0 V to 3.6 V 0.1 0.5 mA IOL = 2.3 mA 2.3 V IOL = 3.1 mA IOL = 2.7 mA 3V IOL = 4 mA II TA = –40°C to 85°C MAX IOH = –1.1 mA IOH = –3.1 mA A or OE input TYP IOH = –20 mA IOH = –2.3 mA VOL TA = 25°C MIN VI = GND to 3.6 V V Ioff VI or VO = 0 V to 3.6 V 0V 0.2 0.6 mA ΔIoff VI or VO = 0 V to 3.6 V 0 V to 0.2 V 0.2 0.6 mA IOZ VO = VCC or GND 3.6 V 0.1 0.5 mA ICC VI = GND or (VCC to 3.6 V), OE = GND, IO = 0 0.8 V to 3.6 V 0.5 0.9 mA A input ΔICC OE input VI = VCC – 0.6 V, (1) IO = 0 All inputs VI = GND to 3.6 V, OE = VCC CI VI = VCC or GND Co VO = VCC or GND (1) (2) 4 3.3 V (2) 0.8 V to 3.6 V 0V 1.5 3.6 V 1.5 3.6 V 3 40 50 110 120 0 0 mA pF pF One input at VCC – 0.6 V, other input at VCC or GND To show ICC is very low when OE is high and the inputs and outputs are disabled Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G240 SN74AUP1G240 www.ti.com SCES627C – MARCH 2005 – REVISED MAY 2010 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 5 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN 0.8 V tpd A Y OE Y Y MIN MAX 4.4 7.5 10.3 3.5 15.5 1.5 V ± 0.1 V 3.3 5.4 6.9 2.3 10.3 1.8 V ± 0.15 V 2.6 4.4 5.8 1.8 8.3 2.5 V ± 0.2 V 1.9 3.3 4.3 1.3 5.8 3.3 V ± 0.3 V 1.6 2.7 3.6 1 4.7 ns 16.5 1.2 V ± 0.1 V 4.5 8.1 13.4 3 18.6 1.5 V ± 0.1 V 3.8 5.7 8.4 2.8 12.2 1.8 V ± 0.15 V 3.1 4.5 6.3 2.3 9.7 2.5 V ± 0.2 V 2.4 3.2 4.1 1.8 6.6 3.3 V ± 0.3 V 2.1 2.7 3.3 1.5 5.6 1.2 V ± 0.1 V OE UNIT MAX 1.2 V ± 0.1 V 0.8 V tdis TYP 17.1 0.8 V ten TA = –40°C to 85°C TA = 25°C ns 9 2.6 2.6 4.7 2.2 8.4 1.5 V ± 0.1 V 2 2.8 3.2 1.7 5.9 1.8 V ± 0.15 V 1.8 2.5 3.1 1.6 5.5 2.5 V ± 0.2 V 1.3 1.9 2.1 1.1 4 3.3 V ± 0.3 V 1.6 2.4 2.9 1.4 4.1 ns SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 10 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN 0.8 V tpd A Y OE Y OE Y MAX MIN MAX 1.2 V ± 0.1 V 5.4 8.6 11.5 4.4 17.3 1.5 V ± 0.1 V 4 6.2 7.7 3 11.3 1.8 V ± 0.15 V 3.3 5.1 6.5 2.4 9.1 2.5 V ± 0.2 V 2.5 3.8 4.9 1.8 6.3 3.3 V ± 0.3 V 2 3.2 4.1 1.5 5.2 1.2 V ± 0.1 V 5.1 8.9 14.4 3.7 20.9 1.5 V ± 0.1 V 4.3 6.3 9.1 3.3 13.7 1.8 V ± 0.15 V 3.6 5 6.8 2.8 10.9 2.5 V ± 0.2 V 2.8 3.7 4.6 2.2 7.7 3.3 V ± 0.3 V 2.5 3.1 3.7 1.9 6.3 12.9 4.1 5.3 6.6 3.9 1.5 V ± 0.1 V 2.4 3.7 4.6 2.1 9.6 1.8 V ± 0.15 V 2.7 3.6 3.9 2.4 10.1 2.5 V ± 0.2 V 1.7 2.5 2.8 1.5 7.3 3.3 V ± 0.3 V 2.5 3.2 3.8 2.2 9.1 Submit Documentation Feedback Product Folder Link(s): SN74AUP1G240 ns ns 9.7 1.2 V ± 0.1 V Copyright © 2005–2010, Texas Instruments Incorporated UNIT 18.7 0.8 V tdis TYP 19.5 0.8 V ten TA = –40°C to 85°C TA = 25°C ns 5 SN74AUP1G240 SCES627C – MARCH 2005 – REVISED MAY 2010 www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN 0.8 V tpd A Y OE Y OE Y UNIT MAX MIN MAX 1.2 V ± 0.1 V 6.4 9.7 12.9 5.4 19.8 1.5 V ± 0.1 V 4.8 7.1 8.7 3.8 13.3 1.8 V ± 0.15 V 3.9 5.8 7.2 3.1 10.8 2.5 V ± 0.2 V 2.9 4.4 5.4 2.3 7.6 3.3 V ± 0.3 V 2.4 3.6 4.5 1.9 6.1 10.1 15.8 4.6 22.9 ns 23.3 1.2 V ± 0.1 V 6 1.5 V ± 0.1 V 4.9 7 9.9 3.9 15 1.8 V ± 0.15 V 4 5.5 7.5 3.3 12.1 2.5 V ± 0.2 V 3.2 4 4.9 2.6 8.6 3.3 V ± 0.3 V 2.8 3.4 4 2.2 7 5.3 5.8 3 14 0.8 V tdis TYP 22.4 0.8 V ten TA = –40°C to 85°C TA = 25°C ns 11.1 1.2 V ± 0.1 V 4.1 1.5 V ± 0.1 V 2.7 4 5.5 2.4 10.1 1.8 V ± 0.15 V 3.1 4.5 5.4 2.9 10.9 2.5 V ± 0.2 V 2.4 3 3.2 1.6 7.9 3.3 V ± 0.3 V 3.3 4.7 5.4 3 10 ns SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN 0.8 V tpd A Y OE Y 6 OE Y MAX MIN MAX 1.2 V ± 0.1 V 8.9 12.6 16.1 7.3 25.7 1.5 V ± 0.1 V 6.8 9.2 11 5.5 17.1 1.8 V ± 0.15 V 5.5 7.6 9.2 4.5 13.8 2.5 V ± 0.2 V 4.2 5.7 6.8 3.5 9.7 3.3 V ± 0.3 V 3.5 4.7 5.7 2.3 7.8 27.4 1.2 V ± 0.1 V 8.2 12.6 18.5 6.8 1.5 V ± 0.1 V 6.6 8.8 11.8 5.6 18 1.8 V ± 0.15 V 5.5 7.1 9.1 4.7 14.2 2.5 V ± 0.2 V 4.4 5.3 6.2 3.8 10.2 3.3 V ± 0.3 V 3.9 4.5 5.1 3.1 8.2 ns ns 14 1.2 V ± 0.1 V 5 6.2 7.4 4.8 14.8 1.5 V ± 0.1 V 4.2 5.7 7.7 3.9 10.8 1.8 V ± 0.15 V 5.1 7.2 9 4.9 11.7 2.5 V ± 0.2 V 4.3 5.3 5.9 4.1 9.1 3.3 V ± 0.3 V 7.4 8.3 9.4 4.3 11.6 Submit Documentation Feedback UNIT 30.9 0.8 V tdis TYP 29 0.8 V ten TA = –40°C to 85°C TA = 25°C ns Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G240 SN74AUP1G240 www.ti.com SCES627C – MARCH 2005 – REVISED MAY 2010 OPERATING CHARACTERISTICS TA = 25°C PARAMETER TEST CONDITIONS VCC 0.8 V Outputs enabled Cpd Power dissipation capacitance f = 10 MHz Outputs disabled TYP 1.2 V ± 0.1 V 3.9 1.5 V ± 0.1 V 3.9 1.8 V ± 0.15 V 3.9 2.5 V ± 0.2 V 4 3.3 V ± 0.3 V 4.2 0.8 V 0 1.2 V ± 0.1 V 0 1.5 V ± 0.1 V 0 1.8 V ± 0.15 V 0 2.5 V ± 0.2 V 0 3.3 V ± 0.3 V 0 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G240 UNIT 4 pF 7 SN74AUP1G240 SCES627C – MARCH 2005 – REVISED MAY 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (Propagation Delays, Setup and Hold Times, and Pulse Width) From Output Under Test CL (see Note A) 1 MW LOAD CIRCUIT CL VM VI VCC = 0.8 V VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC tw VCC Input VCC/2 VCC/2 VI VM Input 0V VM VOLTAGE WAVEFORMS PULSE DURATION 0V tPHL tPLH VOH VM Output VM VOL tPHL VCC Timing Input 0V tPLH tsu VOH VM Output th VCC VM VOL Data Input VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS NOTES: A. B. C. D. E. VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W, tr/tf = 3 ns. The outputs are measured one at a time, with one transition per measurement. tPLH and tPHL are the same as tpd. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuit and Voltage Waveforms 8 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G240 SN74AUP1G240 www.ti.com SCES627C – MARCH 2005 – REVISED MAY 2010 PARAMETER MEASUREMENT INFORMATION (Enable and Disable Times) 2 ´ VCC S1 5 kW From Output Under Test GND CL (see Note A) 5 kW TEST S1 tPLZ/tPZL tPHZ/tPZH 2 ´ VCC GND LOAD CIRCUIT CL VM VI VD VCC = 0.8 V VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.15 V 5, 10, 15, 30 pF VCC/2 VCC 0.15 V 5, 10, 15, 30 pF VCC/2 VCC 0.3 V VCC Output Control Output Waveform 1 S1 at 2 ´ VCC (see Note B) VCC/2 0V tPZL tPLZ VCC VCC/2 tPZH Output Waveform 2 S1 at GND (see Note B) VCC/2 VOL + VD VOL tPHZ VCC/2 VOH - VD VOH »0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W, tr/tf = 3 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. All parameters and waveforms are not applicable to all devices. Figure 4. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G240 9 PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74AUP1G240DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AUP1G240DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AUP1G240DBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AUP1G240DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AUP1G240DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AUP1G240DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AUP1G240DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AUP1G240DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G240DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G240DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G240DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G240DCKT ACTIVE SC70 DCK 5 250 CU NIPDAU Level-1-260C-UNLIM SN74AUP1G240DRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM SN74AUP1G240DSFR ACTIVE SON DSF 6 5000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM SN74AUP1G240YFPR ACTIVE DSBGA YFP 6 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM SN74AUP1G240YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2010 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ SN74AUP1G240DBVR SOT-23 3000 180.0 9.2 DBV 5 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 SN74AUP1G240DBVT SOT-23 DBV 5 250 180.0 9.2 3.23 3.17 1.37 4.0 8.0 Q3 SN74AUP1G240DCKR SC70 DCK 5 3000 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3 SN74AUP1G240DCKT SC70 DCK 5 250 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3 SN74AUP1G240DRYR SON DRY 6 5000 180.0 8.4 1.25 1.6 0.7 4.0 8.0 Q1 SN74AUP1G240DSFR SON DSF 6 5000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 SN74AUP1G240YFPR DSBGA YFP 6 3000 178.0 9.2 0.89 1.29 0.62 4.0 8.0 Q1 SN74AUP1G240YZPR DSBGA YZP 5 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AUP1G240DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 SN74AUP1G240DBVT SOT-23 DBV 5 250 202.0 201.0 28.0 SN74AUP1G240DCKR SC70 DCK 5 3000 202.0 201.0 28.0 SN74AUP1G240DCKT SC70 DCK 5 250 202.0 201.0 28.0 SN74AUP1G240DRYR SON DRY 6 5000 202.0 201.0 28.0 SN74AUP1G240DSFR SON DSF 6 5000 202.0 201.0 28.0 SN74AUP1G240YFPR DSBGA YFP 6 3000 220.0 220.0 35.0 SN74AUP1G240YZPR DSBGA YZP 5 3000 220.0 220.0 34.0 Pack Materials-Page 2 X: Max = 1430 µm, Min = 1370 µm Y: Max = 930 µm, Min = 870 µm X: Max = 1430 µm, Min = 1370 µm Y: Max = 930 µm, Min = 870 µm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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