PHILIPS 74LVC2G17GS

74LVC2G17
Dual non-inverting Schmitt trigger with 5 V tolerant input
Rev. 8 — 2 May 2013
Product data sheet
1. General description
The 74LVC2G17 provides two non-inverting buffers with Schmitt trigger input. It is capable
of transforming slowly changing input signals into sharply defined, jitter-free output
signals.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these
devices as translators in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using IOFF.
The IOFF circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits











Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
 JESD8-7 (1.65 V to 1.95 V)
 JESD8-5 (2.3 V to 2.7 V)
 JESD-8B/JESD36 (2.7 V to 3.6 V)
ESD protection:
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V
24 mA output drive (VCC = 3.0 V)
CMOS low-power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Multiple package options
Specified from 40 C to +85 C and 40 C to +125 C
3. Applications
 Wave and pulse shapers for highly noisy environments
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVC2G17GW
40 C to +125 C
SC-88
plastic surface-mounted package; 6 leads
SOT363
74LVC2G17GV
40 C to +125 C
TSOP6
plastic surface-mounted package (TSOP6); 6 leads SOT457
74LVC2G17GM
40 C to +125 C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1  1.45  0.5 mm
SOT886
74LVC2G17GF
40 C to +125 C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1  1  0.5 mm
SOT891
74LVC2G17GN
40 C to +125 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 0.9  1.0  0.35 mm
SOT1115
74LVC2G17GS
40 C to +125 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 1.0  1.0  0.35 mm
SOT1202
5. Marking
Table 2.
Marking codes
Type number
Marking code[1]
74LVC2G17GW
VV
74LVC2G17GV
VV
74LVC2G17GM
VV
74LVC2G17GF
VV
74LVC2G17GN
VV
74LVC2G17GS
VV
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
6. Functional diagram
1
1A
1Y
6
3
2A
2Y
4
1
6
3
4
mnb066
Fig 1.
Logic symbol
74LVC2G17
Product data sheet
mnb067
Fig 2.
IEC logic symbol
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Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
2 of 19
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
1A
1Y
2A
2Y
mnb068
Fig 3.
Logic diagram
7. Pinning information
7.1 Pinning
74LVC2G17
74LVC2G17
1A
1
6
1A
1
6
1Y
GND
2
5
VCC
1Y
GND
2
5
VCC
2A
3
4
2Y
2A
Pin configuration SOT363
and SOT457
3
4
2Y
Fig 5.
Pin configuration SOT886
1A
1
6
1Y
GND
2
5
VCC
2A
3
4
2Y
001aaf080
001aaf079
Transparent top view
Transparent top view
001aaf078
Fig 4.
74LVC2G17
Fig 6.
Pin configuration SOT891,
SOT1115 and SOT1202
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
1A
1
data input
GND
2
ground (0 V)
2A
3
data input
2Y
4
data output
VCC
5
supply voltage
1Y
6
data output
8. Functional description
Table 4.
Function table[1]
Input
Output
nA
nY
L
L
H
H
[1]
H = HIGH voltage level; L = LOW voltage level.
74LVC2G17
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
3 of 19
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
IIK
input clamping current
VI
input voltage
IOK
output clamping current
Conditions
VI < 0 V
[1]
Max
Unit
0.5
+6.5
V
-
50
mA
0.5
+6.5
V
-
50
mA
Active mode
[1][2]
0.5
VCC + 0.5
V
Power-down mode
[1][2]
0.5
+6.5
V
-
50
mA
VO < 0 V
output voltage
VO
Min
IO
output current
ICC
supply current
-
100
mA
IGND
ground current
-
100
mA
Tstg
storage temperature
65
+150
C
Ptot
total power dissipation
-
300
mW
[1]
VO = 0 V to VCC
Tamb = 40 C to +125 C
[3]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.
[3]
For SC-88 and SC-74 packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K.
For XSON6 packages: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
10. Recommended operating conditions
Table 6.
Recommended operating conditions
Symbol
Parameter
VCC
Conditions
Min
Typ
Max
Unit
supply voltage
1.65
-
5.5
V
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VCC
V
Tamb
ambient temperature
40
-
+125
C
11. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Tamb = 40 C to +85
VOL
Conditions
LOW-level output voltage
74LVC2G17
Product data sheet
Min
Typ
Max
Unit
IO = 100 A; VCC = 1.65 V to 5.5 V
-
-
0.1
V
IO = 4 mA; VCC = 1.65 V
-
-
0.45
V
IO = 8 mA; VCC = 2.3 V
-
-
0.3
V
IO = 12 mA; VCC = 2.7 V
-
-
0.4
V
IO = 24 mA; VCC = 3.0 V
-
-
0.55
V
IO = 32 mA; VCC = 4.5 V
-
-
0.55
V
C[1]
VI = VT+ or VT
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Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
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74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
VOH
VI = VT+ or VT
HIGH-level output voltage
Min
Typ
Max
Unit
IO = 100 A; VCC = 1.65 V to 5.5 V
VCC  0.1 -
-
V
IO = 4 mA; VCC = 1.65 V
1.2
-
-
V
IO = 8 mA; VCC = 2.3 V
1.9
-
-
V
IO = 12 mA; VCC = 2.7 V
2.2
-
-
V
IO = 24 mA; VCC = 3.0 V
2.3
-
-
V
IO = 32 mA; VCC = 4.5 V
3.8
-
-
V
II
input leakage current
VI = 5.5 V or GND; VCC = 5.5 V
-
0.1
5
A
IOFF
power-off leakage current
VI or VO = 5.5 V; VCC = 0 V
-
0.1
10
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
0.1
10
A
ICC
additional supply current
VI = VCC  0.6 V; IO = 0 A;
VCC = 2.3 V to 5.5 V
-
5
500
A
CI
input capacitance
-
3.5
-
pF
IO = 100 A; VCC = 1.65 V to 5.5 V
-
-
0.1
V
IO = 4 mA; VCC = 1.65 V
-
-
0.70
V
Tamb = 40 C to +125 C
LOW-level output voltage
VOL
VOH
HIGH-level output voltage
VI = VT+ or VT
IO = 8 mA; VCC = 2.3 V
-
-
0.45
V
IO = 12 mA; VCC = 2.7 V
-
-
0.60
V
IO = 24 mA; VCC = 3.0 V
-
-
0.80
V
IO = 32 mA; VCC = 4.5 V
-
-
0.80
V
VI = VT+ or VT
IO = 100 A; VCC = 1.65 V to 5.5 V
VCC  0.1 -
-
V
IO = 4 mA; VCC = 1.65 V
0.95
-
-
V
IO = 8 mA; VCC = 2.3 V
1.7
-
-
V
IO = 12 mA; VCC = 2.7 V
1.9
-
-
V
IO = 24 mA; VCC = 3.0 V
2.0
-
-
V
IO = 32 mA; VCC = 4.5 V
3.4
-
-
V
-
0.1
20
A
II
input leakage current
VI = 5.5 V or GND; VCC = 5.5 V
IOFF
power-off leakage current
VI or VO = 5.5 V; VCC = 0 V
-
-
20
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
40
A
ICC
additional supply current
VI = VCC  0.6 V; IO = 0 A;
VCC = 2.3 V to 5.5 V
-
-
5
mA
[1]
All typical values are measured at VCC = 3.3 V and Tamb = 25 C.
74LVC2G17
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
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74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
12. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8.
Symbol Parameter
40 C to +85 C
Conditions
power dissipation
capacitance
CPD
Unit
Min
Max
Min
Max
VCC = 1.65 V to 1.95 V
1.5
5.6
10.5
1.5
13.1
ns
VCC = 2.3 V to 2.7 V
1.0
3.7
6.5
1.0
8.5
ns
VCC = 2.7 V
1.0
3.8
6.5
1.0
8.5
ns
VCC = 3.0 V to 3.6 V
1.0
3.6
5.7
1.0
7.1
ns
VCC = 4.5 V to 5.5 V
1.0
2.7
4.3
1.0
5.4
ns
-
16.3
-
-
-
pF
propagation delay nA to nY; see Figure 7
tpd
40 C to +125 C
Typ[1]
per buffer; VCC = 3.3 V;
VI = GND to VCC
[2]
[3]
[1]
Typical values are measured at Tamb = 25 C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively.
[2]
tpd is the same as tPLH and tPHL.
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL  VCC2  fo) = sum of outputs.
13. Waveforms
VI
nA input
VM
VM
GND
tPLH
tPHL
VOH
VM
nY output
VM
VOL
mnb072
Measurement points are given in Table 9.
VOL and VOH are typical output voltage drop that occur with the output load.
Fig 7.
The input (nA) to output (nY) propagation delays and the output transition times
74LVC2G17
Product data sheet
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Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
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74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
Table 9.
Measurement points
Supply voltage
Input
Output
VCC
VM
VM
1.65 V to 1.95 V
0.5  VCC
0.5  VCC
2.3 V to 2.7 V
0.5  VCC
0.5  VCC
2.7 V
1.5 V
1.5 V
3.0 V to 3.6 V
1.5 V
1.5 V
4.5 V to 5.5 V
0.5  VCC
0.5  VCC
VEXT
VCC
VI
RL
VO
G
DUT
RT
CL
RL
mna616
Measurement points are given in Table 10.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 8.
Table 10.
Test circuit for measuring switching times
Test data
Supply voltage
Input
Load
VEXT
VCC
VI
tr, tf
CL
RL
tPLH, tPHL
1.65 V to 1.95 V
VCC
 2.0 ns
30 pF
1 k
open
2.3 V to 2.7 V
VCC
 2.0 ns
30 pF
500 
open
2.7 V
2.7 V
 2.5 ns
50 pF
500 
open
3.0 V to 3.6 V
2.7 V
 2.5 ns
50 pF
500 
open
4.5 V to 5.5 V
VCC
 2.5 ns
50 pF
500 
open
74LVC2G17
Product data sheet
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Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
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74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
14. Transfer characteristics
Table 11. Transfer characteristics
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
positive-going
threshold voltage
VT+
negative-going
threshold voltage
VT
40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
VCC = 1.8 V
0.70
1.10
1.50
0.70
1.70
V
VCC = 2.3 V
1.00
1.40
1.80
1.00
2.00
V
VCC = 3.0 V
1.30
1.76
2.20
1.30
2.40
V
VCC = 4.5 V
1.90
2.47
3.10
1.90
3.30
V
VCC = 5.5 V
2.20
2.91
3.60
2.20
3.80
V
VCC = 1.8 V
0.25
0.61
0.90
0.25
1.10
V
VCC = 2.3 V
0.40
0.80
1.15
0.40
1.35
V
VCC = 3.0 V
0.60
1.04
1.50
0.60
1.70
V
VCC = 4.5 V
1.00
1.55
2.00
1.00
2.20
V
VCC = 5.5 V
1.20
1.86
2.30
1.20
2.50
V
VCC = 1.8 V
0.15
0.49
1.00
0.15
1.20
V
VCC = 2.3 V
0.25
0.60
1.10
0.25
1.30
V
VCC = 3.0 V
0.40
0.73
1.20
0.40
1.40
V
VCC = 4.5 V
0.60
0.92
1.50
0.60
1.70
V
VCC = 5.5 V
0.70
1.02
1.70
0.70
1.90
V
see Figure 9 and Figure 10
see Figure 9 and Figure 10
hysteresis voltage (VT+  VT); see Figure 9,
Figure 10 and Figure 11
VH
[1]
40 C to +85 C
Conditions
All typical values are measured at Tamb = 25 C.
15. Waveforms transfer characteristics
VO
VI
VT+
VH
VT−
VO
VI
VH
VT−
Fig 9.
VT+
Transfer characteristic
74LVC2G17
Product data sheet
mnb155
mnb154
VT+ and VT limits at 70 % and 20 %.
Fig 10. Definition of VT+, VT and VH
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Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
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74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
mnb071
14
ICC
(mA)
12
10
8
6
4
2
0
0
0.5
1
1.5
2
VI (V)
VCC = 3.0 V.
Fig 11. Typical transfer characteristic
mnb156
50
ICC
(mA)
(1)
40
30
20
(2)
10
0
2
3
4
5
VCC (V)
6
(1) Positive-going edge
(2) Negative-going edge
Linear change of VI between 0.8 V to 2.0 V. All values given are typical unless otherwise specified.
Fig 12. Average ICC as a function of VCC
74LVC2G17
Product data sheet
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Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
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74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
16. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT363
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
Fig 13. Package outline SOT363 (SC-88)
74LVC2G17
Product data sheet
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Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
10 of 19
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
Plastic surface-mounted package (TSOP6); 6 leads
D
SOT457
E
B
y
A
HE
6
5
X
v M A
4
Q
pin 1
index
A
A1
c
1
2
3
Lp
bp
e
w M B
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.1
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT457
JEITA
SC-74
EUROPEAN
PROJECTION
ISSUE DATE
05-11-07
06-03-16
Fig 14. Package outline SOT457 (SC-74)
74LVC2G17
Product data sheet
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Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
11 of 19
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
SOT886
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
b
1
2
3
4x
(2)
L
L1
e
6
5
e1
4
e1
6x
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
max
nom
min
A(1)
0.5
A1
b
D
E
0.04 0.25 1.50 1.05
0.20 1.45 1.00
0.17 1.40 0.95
e
e1
0.6
0.5
L
L1
0.35 0.40
0.30 0.35
0.27 0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
Outline
version
SOT886
sot886_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
04-07-22
12-01-05
MO-252
Fig 15. Package outline SOT886 (XSON6)
74LVC2G17
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
12 of 19
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm
1
SOT891
b
3
2
4×
(1)
L
L1
e
6
5
e1
4
e1
6×
A
(1)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.20
0.12
1.05
0.95
1.05
0.95
0.55
0.35
0.35
0.27
0.40
0.32
Note
1. Can be visible in some manufacturing processes.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
05-04-06
07-05-15
SOT891
Fig 16. Package outline SOT891 (XSON6)
74LVC2G17
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
13 of 19
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
XSON6: extremely thin small outline package; no leads;
6 terminals; body 0.9 x 1.0 x 0.35 mm
1
SOT1115
b
3
2
(4×)(2)
L
L1
e
6
5
4
e1
e1
(6×)(2)
A1
A
D
E
terminal 1
index area
0
0.5
scale
Dimensions
Unit
mm
1 mm
A(1)
A1
b
D
E
e
e1
max 0.35 0.04 0.20 0.95 1.05
nom
0.15 0.90 1.00 0.55
min
0.12 0.85 0.95
0.3
L
L1
0.35 0.40
0.30 0.35
0.27 0.32
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
Outline
version
sot1115_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
10-04-02
10-04-07
SOT1115
Fig 17. Package outline SOT1115 (XSON6)
74LVC2G17
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
14 of 19
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
XSON6: extremely thin small outline package; no leads;
6 terminals; body 1.0 x 1.0 x 0.35 mm
1
SOT1202
b
3
2
(4×)(2)
L
L1
e
6
5
4
e1
e1
(6×)(2)
A1
A
D
E
terminal 1
index area
0
0.5
scale
Dimensions
Unit
mm
1 mm
A(1)
A1
b
D
E
e
e1
L
L1
max 0.35 0.04 0.20 1.05 1.05
0.35 0.40
nom
0.15 1.00 1.00 0.55 0.35 0.30 0.35
min
0.12 0.95 0.95
0.27 0.32
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
Outline
version
sot1202_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
10-04-02
10-04-06
SOT1202
Fig 18. Package outline SOT1202 (XSON6)
74LVC2G17
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
15 of 19
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
17. Abbreviations
Table 12.
Abbreviations
Acronym
Description
CMOS
Complementary Metal-Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
18. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74LVC2G17 v.8
20130502
Product data sheet
-
74LVC2G17 v.7
Modifications:
•
Table 3: the description of pin 6 changed from data input to data output.
74LVC2G17 v.6
20110921
Product data sheet
-
74LVC2G17 v.5
74LVC2G17 v.5
20100806
Product data sheet
-
74LVC2G17 v.4
74LVC2G17 v.4
20061009
Product data sheet
-
74LVC2G17 v.3
74LVC2G17 v.3
20050926
Product data sheet
-
74LVC2G17 v.2
74LVC2G17 v.2
20040908
Product specification
-
74LVC2G17 v.1
74LVC2G17 v.1
20030813
Product specification
-
-
74LVC2G17
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
16 of 19
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74LVC2G17
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
17 of 19
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74LVC2G17
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 2 May 2013
© NXP B.V. 2013. All rights reserved.
18 of 19
74LVC2G17
NXP Semiconductors
Dual non-inverting Schmitt trigger with 5 V tolerant input
21. Contents
1
2
3
4
5
6
7
7.1
7.2
8
9
10
11
12
13
14
15
16
17
18
19
19.1
19.2
19.3
19.4
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Transfer characteristics . . . . . . . . . . . . . . . . . . 8
Waveforms transfer characteristics. . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 2 May 2013
Document identifier: 74LVC2G17