74HC1G14; 74HCT1G14 Inverting Schmitt trigger Rev. 6 — 27 December 2012 Product data sheet 1. General description 74HC1G14 and 74HCT1G14 are high-speed Si-gate CMOS devices. They provide an inverting buffer function with Schmitt trigger action. These devices are capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V. The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V. The standard output currents are half of those of the 74HC14 and 74HCT14. 2. Features and benefits Symmetrical output impedance High noise immunity Low power dissipation Balanced propagation delays SOT353-1 and SOT753 package options Specified from 40 C to +125 C 3. Applications Wave and pulse shapers Astable multivibrators Monostable multivibrators 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC1G14GW 40 C to +125 C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 40 C to +125 C SC-74A plastic surface-mounted package; 5 leads SOT753 74HCT1G14GW 74HC1G14GV 74HCT1G14GV 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger 5. Marking Table 2. Marking codes Type number Marking code[1] 74HC1G14GW HF 74HCT1G14GW TF 74HC1G14GV H14 74HCT1G14GV T14 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 6. Functional diagram 2 A Y 4 2 4 mna023 Fig 1. Logic symbol A Y mna024 mna025 Fig 2. IEC logic symbol Fig 3. Logic diagram 7. Pinning information 7.1 Pinning 74HC1G14 74HCT1G14 n.c. 1 A 2 GND 3 5 VCC 4 Y 001aaf106 Fig 4. Pin configuration 7.2 Pin description Table 3. Pin description Symbol Pin Description n.c. 1 not connected A 2 data input GND 3 ground (0 V) Y 4 data output VCC 5 supply voltage 74HC_HCT1G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 2 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger 8. Functional description Table 4. Function table H = HIGH voltage level; L = LOW voltage level Input Output A Y L H H L 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). [1] Symbol Parameter VCC supply voltage Conditions Min Max Unit 0.5 +7.0 V IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V - 20 mA IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V - 20 mA IO output current 0.5 V < VO < VCC + 0.5 V - 12.5 mA ICC supply current - 25 mA IGND ground current 25 - mA Tstg storage temperature 65 +150 C - 200 mW total power dissipation Ptot Tamb = 40 C to +125 C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] Above 55 C, the value of Ptot derates linearly with 2.5 mW/K. 10. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74HC1G14 74HCT1G14 Unit Min Typ Max Min Typ Max 2.0 5.0 6.0 4.5 5.0 5.5 V VCC supply voltage VI input voltage 0 - VCC 0 - VCC V VO output voltage 0 - VCC 0 - VCC V Tamb ambient temperature 40 +25 +125 40 +25 +125 C 74HC_HCT1G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 3 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger 11. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 C. Symbol Parameter 40 C to +85 C Conditions 40 C to +125 C Unit Min Typ Max Min Max IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - V For type 74HC1G14 VOH VOL HIGH-level output voltage LOW-level output voltage VI = VT+ or VT IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - V IO = 2.0 mA; VCC = 4.5 V 4.13 4.32 - 3.7 - V IO = 2.6 mA; VCC = 6.0 V 5.63 5.81 - 5.2 - V VI = VT+ or VT IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 V IO = 2.0 mA; VCC = 4.5 V - 0.15 0.33 - 0.4 V IO = 2.6 mA; VCC = 6.0 V - 0.16 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 6.0 V - - 1.0 - 1.0 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 10 - 20 A CI input capacitance - 1.5 - - - pF VT+ positive-going threshold voltage VCC = 2.0 V 0.7 1.09 1.5 0.7 1.5 V VCC = 4.5 V 1.7 2.36 3.15 1.7 3.15 V VCC = 6.0 V 2.1 3.12 4.2 2.1 4.2 V VCC = 2.0 V 0.3 0.60 0.9 0.3 0.9 V VCC = 4.5 V 0.9 1.53 2.0 0.9 2.0 V VCC = 6.0 V 1.2 2.08 2.6 1.2 2.6 V VCC = 2.0 V 0.2 0.48 1.0 0.2 1.0 V VCC = 4.5 V 0.4 0.83 1.4 0.4 1.4 V VCC = 6.0 V 0.6 1.04 1.6 0.6 1.6 V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - V IO = 2.0 mA; VCC = 4.5 V 4.13 4.32 - 3.7 - V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 V IO = 2.0 mA; VCC = 4.5 V - 0.15 0.33 - 0.4 V VI = VCC or GND; VCC = 5.5 V - - 1.0 - 1.0 A VT VH negative-going threshold voltage hysteresis voltage see Figure 7 and Figure 8 see Figure 7 and Figure 8 see Figure 7 and Figure 8 For type 74HCT1G14 VOH VOL II HIGH-level output voltage VI = VT+ or VT LOW-level output voltage VI = VT+ or VT input leakage current 74HC_HCT1G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 4 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger Table 7. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 C. Symbol Parameter 40 C to +85 C Conditions 40 C to +125 C Min Typ Max Min Max Unit ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 10 - 20 A ICC additional supply current per input; VCC = 4.5 V to 5.5 V; VI = VCC 2.1 V; IO = 0 A - - 500 - 850 A CI input capacitance - 1.5 - - - pF VT+ positive-going threshold voltage VCC = 4.5 V 1.2 1.55 1.9 1.2 1.9 V VCC = 5.5 V 1.4 1.80 2.1 1.4 2.1 V VCC = 4.5 V 0.5 0.76 1.2 0.5 1.2 V VCC = 5.5 V 0.6 0.90 1.4 0.6 1.4 V VCC = 4.5 V 0.4 0.80 - 0.4 - V VCC = 5.5 V 0.4 0.90 - 0.4 - V see Figure 7 and Figure 8 negative-going threshold voltage VT see Figure 7 and Figure 8 hysteresis voltage VH see Figure 7 and Figure 8 12. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V; tr = tf 6.0 ns; All typical values are measured at Tamb = 25 C. For test circuit see Figure 6 Symbol Parameter 40 C to +85 C Conditions 40 C to +125 C Unit Min Typ Max Min Max VCC = 2.0 V; CL = 50 pF - 25 155 - 190 ns VCC = 4.5 V; CL = 50 pF - 12 31 - 38 ns VCC = 5.0 V; CL = 15 pF - 10 - - - ns - 11 26 - 32 ns - 20 - - - pF - 17 43 - 51 ns - 15 - - - ns - 22 - - - pF For type 74HC1G14 propagation delay A to Y; see Figure 5 tpd [1] VCC = 6.0 V; CL = 50 pF [2] power dissipation VI = GND to VCC capacitance CPD For type 74HCT1G14 propagation delay A to Y; see Figure 5 tpd [1] VCC = 4.5 V; CL = 50 pF VCC = 5.0 V; CL = 15 pF power dissipation VI = GND to VCC 1.5 V capacitance CPD [1] [2] [2] tpd is the same as tPLH and tPHL. CPD is used to determine the dynamic power dissipation PD (W). PD = CPD VCC2 fi + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz CL = output load capacitance in pF; VCC = supply voltage in Volts (CL VCC2 fo) = sum of outputs 74HC_HCT1G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 5 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger 13. Waveforms VM A input tPHL tPLH VM Y output mna033 Measurement points are given in Table 9. Fig 5. The input (A) to output (Y) propagation delays Table 9. Measurement points Type number Input Output VI VM VM 74HC1G14 GND to VCC 0.5 VCC 0.5 VCC 74HCT1G14 GND to 3.0 V 1.5 V 0.5 VCC VCC PULSE GENERATOR VI VO DUT RT CL 50 pF mna034 Test data is given in Table 8. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 6. Load circuitry for switching times 74HC_HCT1G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 6 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger 14. Transfer characteristics waveforms VO VI VT+ VH VT− VO VH VT− VI VT+ mna027 mna026 Fig 7. Transfer characteristic Fig 8. mna028 100 The definitions of VT+, VT and VH; where VT+ and VT are between limits of 20 % and 70 % mna029 1.0 ICC (mA) ICC (μA) 0.8 0.6 50 0.4 0.2 0 0 0 Fig 9. 1.0 VI (V) 2.0 Typical 74HC1G14 transfer characteristics; VCC = 2.0 V 74HC_HCT1G14 Product data sheet 0 2.5 VI (V) 5.0 Fig 10. Typical 74HC1G14 transfer characteristics; VCC = 4.5 V All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 7 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger mna030 1.6 ICC (mA) 0.8 0 0 3.0 VI (V) 6.0 Fig 11. Typical 74HC1G14 transfer characteristics; VCC = 6.0 V mna031 2.0 mna032 3.0 ICC (mA) ICC (mA) 2.0 1.0 1.0 0 0 0 2.5 VI (V) 0 5.0 Fig 12. Typical 74HCT1G14 transfer characteristics; VCC = 4.5 V 3.0 VI (V) 6.0 Fig 13. Typical 74HCT1G14 transfer characteristics; VCC = 5.5 V 15. Application information The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula: Padd = fi (tr ICC(AV) + tf ICC(AV)) VCC Where: Padd = additional power dissipation (W) fi = input frequency (MHz) tr = rise time (ns); 10 % to 90 % 74HC_HCT1G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 8 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger tf = fall time (ns); 90 % to 10 % ICC(AV) = average additional supply current (A) ICC(AV) differs with positive or negative input transitions, as shown in Figure 14 and Figure 15. 74HC1G14 and 74HCT1G14 used in relaxation oscillator circuit, see Figure 16. Remark: All values given are typical unless otherwise specified. mna036 200 mna058 200 ΔICC(AV) (μA) ΔICC(AV) (μA) 150 150 positive-going edge positive-going edge 100 100 50 50 negative-going edge negative-going edge 0 0 0 2.0 4.0 VCC (V) 6.0 Fig 14. ICC(AV) for 74HC1G14 devices; linear change of VI between 0.1 VCC to 0.9 VCC 74HC_HCT1G14 Product data sheet 0 2 4 VCC (V) 6 Fig 15. ICC(AV) for 74HCT1G14 devices; linear change of VI between 0.1 VCC to 0.9 VCC All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 9 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger R C mna035 1 1 f = --- -----------------T K RC For 74HC1G14 and 74HCT1G14: For K-factor, see Figure 17 Fig 16. Relaxation oscillator using 74HC1G14 and 74HCT1G14 DDD . DDD . 9&&9 K-factor for 74HC1G14 9&&9 K-factor for 74HCT1G14 Fig 17. Typical K-factor for relaxation oscillator 74HC_HCT1G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 10 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger 16. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.425 0.46 0.21 0.3 0.1 0.1 0.60 0.15 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC JEITA MO-203 SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 18. Package outline SOT353-1 (TSSOP5) 74HC_HCT1G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 11 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT753 JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 19. Package outline SOT753 (SC-74A) 74HC_HCT1G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 12 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger 17. Abbreviations Table 10. Abbreviations Acronym Description DUT Device Under Test TTL Transistor-Transistor Logic 18. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT1G14 v.6 20121227 Product data sheet - 74HC_HCT1G14 v.5 Modifications: 74HC_HCT1G14 v.5 Modifications: • Table 3: Pin number Y output changed from 5 to 4 (errata). 20120924 • • Product data sheet - 74HC_HCT1G14 v.4 Figure 17 added (typical K-factor for relaxation oscillator). Legal page updated. 74HC_HCT1G14 v.4 20070717 Product data sheet - 74HC_HCT1G14 v.3 74HC_HCT1G14 v.3 20020515 Product specification - 74HC_HCT1G14 v.2 74HC_HCT1G14 v.2 20010302 Product specification - 74HC_HCT1G14 v.1 74HC_HCT1G14 v.1 19980805 Product specification - - 74HC_HCT1G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 13 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger 19. Legal information 19.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 19.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74HC_HCT1G14 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 14 of 16 74HC1G14; 74HCT1G14 NXP Semiconductors Inverting Schmitt trigger Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74HC_HCT1G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 27 December 2012 © NXP B.V. 2012. All rights reserved. 15 of 16 NXP Semiconductors 74HC1G14; 74HCT1G14 Inverting Schmitt trigger 21. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 12 13 14 15 16 17 18 19 19.1 19.2 19.3 19.4 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Transfer characteristics waveforms. . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 December 2012 Document identifier: 74HC_HCT1G14