FAIRCHILD 74VHC273SJ

74VHC273
Octal D-Type Flip-Flop
tm
Features
General Description
■ High Speed: fMAX = 165MHz (typ) at VCC = 5V
■ Low power dissipation: ICC = 4µA (max) at TA = 25°C
The VHC273 is an advanced high speed CMOS Octal
D-type flip-flop fabricated with silicon gate CMOS technology. It achieves the high speed operation similar to
equivalent Bipolar Schottky TTL while maintaining the
CMOS low power dissipation.
■ High noise immunity: VNIH = VNIL = 28% VCC (min)
■ Power down protection is provided on all inputs
■ Low noise: VOLP = 0.9V (max)
■ Pin and function compatible with 74HC273
■ Leadless DQFN Package
The register has a common buffered Clock (CP) which is
fully edge-triggered. The state of each D input, one setup
time before the LOW-to-HIGH clock transition, is transferred to the corresponding flip-flop's Q output. The
Master Reset (MR) input will clear all flip-flops simultaneously. All outputs will be forced LOW independently of
Clock or Data inputs by a LOW voltage level on the MR
input.
An input protection circuit insures that 0V to 7V can be
applied to the inputs pins without regard to the supply
voltage. This device can be used to interface 5V to 3V
systems and two supply systems such as battery
backup. This circuit prevents device destruction due to
mismatched supply and input voltages.
Ordering Information
Order Number
Package
Number
Package Description
74VHC273M
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74VHC273SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74VHC273BQ
(Preliminary)
MLP020B
(Preliminary)
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74VHC273MTC
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter “X” to the
ordering number. Pb-Free package per JEDEC J-STD-020B.
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
74VHC273 Octal D-Type Flip-Flop
April 2007
74VHC273 Octal D-Type Flip-Flop
Connection Diagrams
Logic Symbols
Pin Assignments for
PDIP, SOIC, SOP, and TSSOP
IEEE/IEC
Pad Assignments for DQFN
Function Table
Operating
Mode
Inputs
Outputs
MR
CP
Dn
Qn
Reset (Clear)
L
X
X
L
Load ‘1’
H
H
H
Load ‘0’
H
L
L
H = HIGH Voltage Level
L = LOW Voltage Level
(Top Through View)
X = Immaterial
= LOW-to-HIGH Transition
Pin Descriptions
Pin Names
Description
D0–D7
Data Inputs
MR
Master Reset
CP
Clock Pulse Input
Q0–Q7
Data Outputs
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
2
Please note that this diagram is provided only for the understanding of logic operations and should not be used to
estimate propagation delays.
Figure 1.
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
3
74VHC273 Octal D-Type Flip-Flop
Logic Diagram
Symbol
Parameter
Rating
VCC
Supply Voltage
–0.5V to +7.0V
VIN
DC Input Voltage
–0.5V to +7.0V
VOUT
DC Output Voltage
–0.5V to VCC + 0.5V
IIK
Input Diode Current
–20mA
IOK
Output Diode Current
±20mA
IOUT
DC Output Current
±25mA
ICC
DC VCC/GND Current
±75mA
TSTG
Storage Temperature
–65°C to +150°C
TL
Lead Temperature (Soldering, 10 seconds)
260°C
Recommended Operating Conditions(1)
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
VCC
Supply Voltage
VIN
Input Voltage
VOUT
Output Voltage
TOPR
Operating Temperature
tr , tf
Rating
2.0V to +5.5V
0V to +5.5V
0V to VCC
–40°C to +85°C
Input Rise and Fall Time,
VCC = 3.3V ± 0.3V
0ns/V ∼ 100ns/V
VCC = 5.0V ± 0.5V
0ns/V ∼ 20ns/V
Note:
1. Unused inputs must be held HIGH or LOW. They may not float.
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
4
74VHC273 Octal D-Type Flip-Flop
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
TA =
25°C
Symbol
Parameter
VIH
HIGH Level
Input Voltage
VIL
LOW Level Input
Voltage
VOH
HIGH Level
Output
Voltage
VCC (V)
Conditions
Min.
2.0
1.50
3.0–5.5
0.7 x VCC
3.0
LOW Level
Output Voltage
Min.
0.50
2.0
1.9
2.9
3.0
2.9
4.4
4.5
4.4
V
IOH = –4mA
2.58
2.48
IOH = –8mA
3.94
3.80
VIN = VIH IOL = 50µA
or VIL
4.5
3.0
4.5
0.0
0.1
0.1
0.0
0.1
0.1
0.0
IOL = 4mA
IOL = 8mA
V
0.3 x VCC
1.9
4.5
2.0
V
0.3 x VCC
VIN = VIH IOH = –50µA
or VIL
Units
0.7 x VCC
3.0
3.0
Max.
0.50
3.0–5.5
2.0
–40°C to +85°C
Max.
1.50
2.0
4.5
VOL
Typ.
0.1
0.1
0.36
0.44
V
0.36
0.44
IIN
Input Leakage
Current
0–5.5
VIN = 5.5V or GND
±0.1
±1.0
µA
ICC
Quiescent
Supply Current
5.5
VIN = VCC or GND
4.0
40.0
µA
Noise Characteristics
TA = 25°C
Symbol
Typ.
Limits
Units
VOLP(2)
Quiet Output Maximum
Dynamic VOL
Parameter
VCC (V)
5.0
CL = 50pF
Conditions
0.6
0.9
V
VOLV(2)
Quiet Output Minimum
Dynamic VOL
5.0
CL = 50pF
–0.6
–0.9
V
VIHD(2)
Minimum HIGH Level
Dynamic Input Voltage
5.0
CL = 50pF
3.5
V
VILD(2)
Maximum LOW Level
Dynamic Input Voltage
5.0
CL = 50pF
1.5
V
Note:
2. Parameter guaranteed by design.
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
5
74VHC273 Octal D-Type Flip-Flop
DC Electrical Characteristics
TA = –40°C
to +85°C
TA = 25°C
Symbol
fMAX
Parameter
VCC (V)
Maximum Clock
Frequency
3.3 ± 0.3
Conditions
5.0 ± 0.5
tPLH, tPHL
Propagation Delay
Time (CK – Q)
3.3 ± 0.3
5.0 ± 0.5
tPHL
Propagation Delay
Time (MR – Q)
3.3 ± 0.3
5.0 ± 0.5
tOSLH,
tOSHL
Output to Output
Skew
CIN
Input Capacitance
CPD
Power Dissipation
Capacitance
3.3 ± 0.3
(3)
5.0 ± 0.5
VCC
(4)
Min.
Typ.
Max.
Min.
CL = 15pF
75
120
65
CL = 50pF
50
75
45
CL = 15pF
120
165
100
CL = 50pF
80
110
70
Max. Units
MHz
MHz
CL = 15pF
8.7
13.6
1.0
16.0
CL = 50pF
11.2
17.1
1.0
19.5
CL = 15pF
5.8
9.0
1.0
10.5
CL = 50pF
7.3
11.0
1.0
12.5
CL = 15pF
8.9
13.6
1.0
16.0
CL = 50pF
11.4
17.1
1.0
19.5
CL = 15pF
5.2
8.5
1.0
10.0
CL = 50pF
6.7
10.5
1.0
12.0
CL = 50pF
1.5
1.5
CL = 50pF
1.0
1.0
10.0
10.0
= Open
4.0
31
ns
ns
ns
ns
ns
pF
pF
Notes:
3. Parameter guaranteed by design tOSLH = |tPLHmax – tPLHmin|; tOSHL = |tPHLmax – tPHLmin|.
4. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating
current consumption without load. Average operating current can be obtained from the equation:
ICC (opr.) = CPD • VCC • fIN + ICC / 8 (per F/F). The total CPD when n pieces of the Flip-Flop operates can be
calculated by the equation: CPD (total) = 22 + 9n.
AC Operating Requirements
TA = 25°C
Symbol
tW(L), tW(H)
tW(L)
tS
tH
tREC
Parameter
Minimum Pulse Width (CK)
Minimum Pulse Width (MR)
Minimum Setup Time
Minimum Hold Time
Minimum Removal Time (MR)
VCC
(V)(5)
Typ.
TA = –40°C to +85°C
Guaranteed Minimum
3.3
5.5
6.5
5.0
5.0
5.0
3.3
5.0
6.0
5.0
5.0
5.0
3.3
5.5
6.5
5.0
4.5
4.5
3.3
1.0
1.0
5.0
1.0
1.0
3.3
2.5
2.5
5.0
2.0
2.0
Units
ns
ns
ns
ns
ns
Note:
5. VCC is 3.3 ± 0.3V or 5.0 ± 0.5V
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
6
74VHC273 Octal D-Type Flip-Flop
AC Electrical Characteristics
Tape Format for DQFN
Package
Designator
Tape
Section
Number
Cavities
Cavity
Status
Cover Tape
Status
BQ
Leader (Start End)
125 (typ.)
Empty
Sealed
Carrier
2500/3000
Filled
Sealed
Trailer (Hub End)
75 (typ.)
Empty
Sealed
Tape Dimensions
Dimensions are in millimeters unless otherwise noted.
Figure 2.
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
7
74VHC273 Octal D-Type Flip-Flop
Tape and Reel Specification
74VHC273 Octal D-Type Flip-Flop
Tape and Reel Specification (Continued)
Reel Dimensions for DQFN
Dimensions are in inches (millimeters) unless otherwise noted.
Tape Size
A
B
C
D
N
W1
W2
12mm
13.0
(330)
0.059
(1.50)
0.512
(13.00)
0.795
(20.20)
7.008
(178)
0.488
(12.4)
0.724
(18.4)
Figure 3.
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
8
74VHC273 Octal D-Type Flip-Flop
Physical Dimensions
Dimensions are in inches (millimeters) unless otherwise noted.
Figure 4. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package Number M20B
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
9
74VHC273 Octal D-Type Flip-Flop
Physical Dimensions (Continued)
Dimensions are in millimeters unless otherwise noted.
Figure 5. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
10
74VHC273 Octal D-Type Flip-Flop
Physical Dimensions (Continued)
Dimensions are in millimeters unless otherwise noted.
Figure 6. 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm
Package Number MLP020B (Preliminary)
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
11
74VHC273 Octal D-Type Flip-Flop
Physical Dimensions (Continued)
Dimensions are in millimeters unless otherwise noted.
Figure 7. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
12
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER
ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support,
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative or In Design
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Definition
Preliminary
First Production
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
design.
Obsolete
Not In Production
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I24
©1994 Fairchild Semiconductor Corporation
74VHC273 Rev. 1.5
www.fairchildsemi.com
13
74VHC273 Octal D-Type Flip-Flop
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